JP4791110B2 - Vacuum chamber and vacuum processing equipment - Google Patents

Vacuum chamber and vacuum processing equipment Download PDF

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JP4791110B2
JP4791110B2 JP2005255294A JP2005255294A JP4791110B2 JP 4791110 B2 JP4791110 B2 JP 4791110B2 JP 2005255294 A JP2005255294 A JP 2005255294A JP 2005255294 A JP2005255294 A JP 2005255294A JP 4791110 B2 JP4791110 B2 JP 4791110B2
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main frame
vacuum chamber
reinforcing
substrate
vacuum
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JP2007073542A (en
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星児 岡部
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Tokyo Electron Ltd
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Priority to CNB2006101289226A priority patent/CN100421212C/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

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Description

本発明は、真空チャンバおよび真空処理装置に関し、詳細には、フラットパネルディスプレイ（ＦＰＤ）等の製造過程において、ガラス基板などの被処理基板の処理に使用される真空チャンバおよび真空処理装置に関する。   The present invention relates to a vacuum chamber and a vacuum processing apparatus, and more particularly to a vacuum chamber and a vacuum processing apparatus used for processing a substrate to be processed such as a glass substrate in a manufacturing process of a flat panel display (FPD) or the like.

ＦＰＤの製造過程では、一辺の長さが２ｍを超える矩形の大型ガラス基板を処理チャンバ内に収容し、真空状態でエッチングやアッシング、成膜などの処理が行なわれる。近年では、ガラス基板の大型化に伴い処理チャンバ自体も大型化している。特に、大型ガラス基板に対し真空状態で処理を行なう真空チャンバにおいては、アルミニウムなどの金属製の処理チャンバの内部を真空にした状態で大気圧に耐え得るだけの充分な剛性を確保する必要がある。このため、従来の一体型構造の処理チャンバでは、チャンバ壁を充分に厚くしなければならず、重量の増大を伴うとともに、大型機械による加工が必要になるので製造コストが増大してしまうという問題があった。   In the FPD manufacturing process, a rectangular large glass substrate having a side length exceeding 2 m is accommodated in a processing chamber, and processing such as etching, ashing, and film formation is performed in a vacuum state. In recent years, the processing chamber itself has also increased in size as the glass substrate has increased in size. In particular, in a vacuum chamber for processing a large glass substrate in a vacuum state, it is necessary to ensure sufficient rigidity to withstand atmospheric pressure in a vacuum state inside a metal processing chamber such as aluminum. . For this reason, in the conventional integrated structure processing chamber, the chamber wall must be made sufficiently thick, which increases the weight and requires processing by a large machine, resulting in an increase in manufacturing cost. was there.

また、処理チャンバが所定のサイズを超えて大型化すると、その運搬に法令上の制約が生じたり、経費が増大するという問題もある。なお、真空チャンバの構成部材に薄板を使用して軽量化を図ることも考えられるが、この場合、真空に耐え得る剛性を保つことが困難である。   In addition, when the processing chamber becomes larger than a predetermined size, there are problems that legal restrictions are imposed on the transportation of the processing chamber and costs increase. Although it may be possible to reduce the weight by using a thin plate as a constituent member of the vacuum chamber, in this case, it is difficult to maintain rigidity that can withstand vacuum.

ところで、真空チャンバに関する従来例として、真空チャンバを設置後も、その形状や大きさを容易に変更できるようにするため、多角形状に形成された枠状の本体と、その側面に取外し自在に接合される側面枠と、上板と、底板と、に分割自在に構成された真空チャンバが提案されている（例えば、特許文献１）。
特開２００４−３３５７４３号公報（図２など） By the way, as a conventional example related to a vacuum chamber, a frame-shaped main body formed in a polygonal shape and a detachable joint are attached to the side surface so that the shape and size can be easily changed even after the vacuum chamber is installed. There has been proposed a vacuum chamber configured to be divided into a side frame, an upper plate, and a bottom plate (for example, Patent Document 1).
JP 2004-335743 A (FIG. 2 etc.)

上記特許文献１の分割構造の真空チャンバの場合、上面に大きな開口部を有するため、開口部周囲の強度が不足し、真空チャンバとしての剛性を確保することが困難である。しかし、特許文献1では、真空チャンバとしての剛性の確保については全く考慮されていない。   In the case of the vacuum chamber having the divided structure of Patent Document 1, since the upper surface has a large opening, the strength around the opening is insufficient, and it is difficult to ensure the rigidity of the vacuum chamber. However, in Patent Document 1, no consideration is given to ensuring rigidity as a vacuum chamber.

本発明は、上記実情に鑑みてなされたものであり、分割構造を採用しながら真空容器としての強度を確保することが可能な真空チャンバおよび該真空チャンバを備えた真空処理装置を提供することを課題とする。   The present invention has been made in view of the above circumstances, and provides a vacuum chamber capable of securing strength as a vacuum container while adopting a divided structure, and a vacuum processing apparatus including the vacuum chamber. Let it be an issue.

上記課題を解決するため、本発明の第１の観点は、多角形状に形成され、底部をなす底板を有し、該底板に対向する上面が開口した主枠体と、
前記主枠体の対向する側部にそれぞれ接合される少なくとも一対の補強枠体と、
前記主枠体の上部に着脱自在に接合される部材と、
を備え、
前記主枠体と前記補強枠体とが接合され、一体となって被処理基板を収容する空間を形成するとともに、前記主枠体の側部と、前記補強枠体の側部には、それぞれ側部開口が形成され、該側部開口を介して前記主枠体の内部と前記補強枠体の内部が連通し、前記被処理基板を収容する空間を形成し、
前記主枠体の内壁面に、前記主枠体の上端近傍において前記開口の内側に向けて突設されたフランジと、前記主枠体の壁面と、に接合される断面Ｌ字型の補強部材である内部補強部材を配設したことを特徴とする、真空チャンバを提供する。 In order to solve the above-described problem, a first aspect of the present invention is a main frame body that is formed in a polygonal shape and has a bottom plate that forms a bottom portion, and an upper surface that faces the bottom plate is opened.
At least a pair of reinforcing frames respectively joined to opposite sides of the main frame;
A member detachably joined to the upper part of the main frame;
With
The main frame and the reinforcing frame are joined to form a space for accommodating the substrate to be processed, and the side of the main frame and the side of the reinforcing frame are respectively A side opening is formed, and the inside of the main frame body and the inside of the reinforcing frame body communicate with each other through the side opening to form a space for accommodating the substrate to be processed .
A reinforcing member having an L-shaped cross section joined to the inner wall surface of the main frame body and a flange projecting toward the inside of the opening in the vicinity of the upper end of the main frame body and the wall surface of the main frame body A vacuum chamber is provided in which an internal reinforcing member is provided.

上記第１の観点によれば、補強枠体を主枠体と接合することにより、上面に開口を有し、剛性を保ちにくい主枠体の耐真空強度を向上させることが可能になる。すなわち、補強枠体は、主枠体の側部に接合されて補強用部材として機能するので、真空チャンバに全体として十分な耐真空強度を持たせることができる。また、主枠体の内壁面に、主枠体の上端近傍において開口の内側に向けて突設されたフランジと、主枠体の壁面と、に接合される断面Ｌ字型の補強部材である内部補強部材を配設して剛性を高める構成としたので、主枠体を構成する板材の厚さを薄くして軽量化を図っても、高真空状態で主枠体に歪みが生じることを回避できる。また、主枠体上部の開口の拡大を図っても、高真空状態で主枠体に歪みが生じることを回避できるので、主枠体内に設置される搬送装置のメンテナンス性を向上させることができる。 According to the first aspect, by joining the reinforcing frame to the main frame, it is possible to improve the vacuum resistance of the main frame having an opening on the upper surface and difficult to maintain rigidity. That is, since the reinforcing frame is joined to the side portion of the main frame and functions as a reinforcing member, the vacuum chamber as a whole can have sufficient vacuum resistance. Further, the reinforcing member having an L-shaped cross section is joined to the inner wall surface of the main frame body and to the flange projecting toward the inside of the opening in the vicinity of the upper end of the main frame body and the wall surface of the main frame body. Since the internal reinforcing member is arranged to increase the rigidity, the main frame body is distorted in a high vacuum state even if the thickness of the plate material constituting the main frame body is reduced to reduce the weight. Can be avoided. Further, even if the opening of the upper part of the main frame is enlarged, it is possible to avoid the main frame from being distorted in a high vacuum state, so that it is possible to improve the maintainability of the transfer device installed in the main frame. .

上記第１の観点において、前記主枠体の側部と、前記補強枠体の側部には、それぞれ側部開口が形成され、該側部開口を介して前記主枠体の内部と前記補強枠体の内部が連通し、被処理基板を収容する空間を形成することが好ましい。
The first Oite the viewpoint, and the side of the main frame, on the side of the reinforcing frame member are respectively side opening is formed, inside of the main frame through the said side opening It is preferable that the interior of the reinforcing frame body communicates with each other to form a space for accommodating the substrate to be processed.

また、前記補強枠体の外壁面に、外部補強部材を配設することが好ましい。このように、補強枠体の外壁面に、外部補強部材を配備して剛性を保つ構成としたので、補強枠体を構成する板材の厚さを薄くし、軽量化を図ることが可能になる。   Moreover, it is preferable to arrange an external reinforcing member on the outer wall surface of the reinforcing frame. As described above, since the external reinforcing member is provided on the outer wall surface of the reinforcing frame to maintain the rigidity, the thickness of the plate material constituting the reinforcing frame can be reduced and the weight can be reduced. .

また、前記外部補強部材として、前記外壁面に対して垂直なリブを格子状に立設することが好ましい。また、前記リブを、前記補強枠体の上下に対向する壁の外壁面に設けることが好ましい。   Further, it is preferable that ribs perpendicular to the outer wall surface are erected in a lattice shape as the external reinforcing member. Moreover, it is preferable to provide the said rib in the outer wall surface of the wall facing the upper and lower sides of the said reinforcement frame.

また、前記接合される部材は、前記フランジの上面に載置され、接合されるものであることが好ましい。 Also, members to be the joint is placed on the upper surface of the flange, it is preferable that the bonding.

また、前記主枠体と前記補強枠体とを接合する連結板を備えていることが好ましい。この場合、前記連結板は、前記主枠体の上端と、前記補強枠体の上端とを接合するものであることが好ましい。   Moreover, it is preferable to provide the connection board which joins the said main frame and the said reinforcement frame. In this case, it is preferable that the connecting plate joins the upper end of the main frame and the upper end of the reinforcing frame.

また、前記底板の外壁面に、底部補強部材を配設することが好ましい。これにより、主枠体の底板の板厚を薄くしても必要な剛性を確保できるようになり、真空チャンバ全体の軽量化を図ることが可能になる。   Moreover, it is preferable to arrange a bottom reinforcing member on the outer wall surface of the bottom plate. As a result, the required rigidity can be ensured even if the thickness of the bottom plate of the main frame is reduced, and the weight of the entire vacuum chamber can be reduced.

また、前記真空チャンバは、その内部に被処理基板を真空状態で搬送する搬送装置を備えた搬送チャンバであることが好ましい。この場合、前記主枠体の対向する一対の側壁に、被処理基板を搬入出する搬入出用開口を形成することが好ましい。さらに、前記補強枠体の側壁に、被処理基板を搬入出する搬入出用開口を形成することが好ましい。また、前記補強枠体の側部に、メンテナンス用開口を形成することが好ましい。また、前記被処理基板が、フラットパネルディスプレイ用基板であることが好ましい。   Moreover, it is preferable that the said vacuum chamber is a conveyance chamber provided with the conveying apparatus which conveys a to-be-processed substrate in a vacuum state inside. In this case, it is preferable to form a loading / unloading opening for loading / unloading the substrate to be processed on a pair of opposing side walls of the main frame. Furthermore, it is preferable to form a loading / unloading opening for loading / unloading the substrate to be processed on the side wall of the reinforcing frame. Moreover, it is preferable to form a maintenance opening in a side portion of the reinforcing frame. The substrate to be processed is preferably a flat panel display substrate.

本発明の第２の観点は、上記第１の観点の真空チャンバと、
前記真空チャンバに連結され、被処理基板の処理を行う複数の真空処理室と、
を備えたことを特徴とする、真空処理装置を提供する。 The second aspect of the present invention comprises a vacuum chamber of the first viewpoint,
A plurality of vacuum processing chambers connected to the vacuum chamber for processing a substrate to be processed;
A vacuum processing apparatus is provided.

本発明によれば、主枠体と補強枠体とを接合して真空チャンバを構成することにより、簡易な構造でありながら、真空チャンバとして必要な剛性を保ちつつ、製造や移送、取り扱いが格段に容易になり、搬送チャンバ内の搬送装置のメンテナンス性も向上し、基板の大型化への対応を図ることが可能になる。
すなわち、補強枠体自体を主枠体の補強部材として機能させることにより、主枠体および補強枠体の板厚を削減することができるので、加工が容易になるとともに軽量化が図られる。従って、従来の一体型真空チャンバに比較して素材コスト、加工コスト等の製作コストを削減できるだけでなく、運送コストも低減できる。 According to the present invention, the vacuum chamber is configured by joining the main frame body and the reinforcing frame body, so that the manufacturing, transportation, and handling are remarkably performed while maintaining the rigidity necessary for the vacuum chamber while having a simple structure. This makes it easy to maintain, improves the maintainability of the transfer apparatus in the transfer chamber, and can cope with an increase in the size of the substrate.
That is, by making the reinforcing frame itself function as a reinforcing member for the main frame, the plate thickness of the main frame and the reinforcing frame can be reduced, so that the processing is facilitated and the weight is reduced. Therefore, the manufacturing cost such as the material cost and the processing cost can be reduced as compared with the conventional integrated vacuum chamber, and the transportation cost can be reduced.

以下、図面を参照しながら、本発明の好ましい形態について説明する。ここでは、ＦＰＤ用ガラス基板（以下、単に「基板」と記す）Ｓに対してエッチング処理を行なうためのマルチチャンバータイプの真空処理装置を例に挙げて説明を行なう。ここで、ＦＰＤとしては、液晶ディスプレイ（ＬＣＤ）、発光ダイオード（ＬＥＤ）ディスプレイ、エレクトロルミネセンス（Electro Luminescence；ＥＬ）ディスプレイ、蛍光表示管（Vacuum Fluorescent Display；ＶＦＤ）、プラズマディスプレイパネル（ＰＤＰ）等が例示される。   Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. Here, a multi-chamber type vacuum processing apparatus for performing an etching process on an FPD glass substrate (hereinafter simply referred to as “substrate”) S will be described as an example. Here, as the FPD, a liquid crystal display (LCD), a light emitting diode (LED) display, an electro luminescence (EL) display, a fluorescent display tube (VFD), a plasma display panel (PDP), and the like. Illustrated.

図１はこの真空処理装置の概観を示す斜視図、図２はその内部を示す水平断面図である。なお、図１および図２では細部は図示を省略している。この真空処理装置１は、その中央部に搬送チャンバ２０とロードロック室３０とが連設されている。搬送チャンバ２０の周囲には、３つのプロセスチャンバ１０ａ，１０ｂ，１０ｃが配設されている。このように、真空処理装置１は３つのプロセスチャンバ１０ａ，１０ｂ，１０ｃを有しているから、例えば、そのうち２つのプロセスチャンバをエッチング処理室として構成し、残りの１つのプロセスチャンバをアッシング処理室として構成したり、３つのプロセスチャンバ全てを、同一の処理を行なうエッチング処理室やアッシグ処理室として構成することができる。なお、プロセスチャンバの数は３つに限らず、搬送チャンバ２０の周囲に、例えば２つ、もしくは４つ以上配備することもできる。   FIG. 1 is a perspective view showing an overview of the vacuum processing apparatus, and FIG. 2 is a horizontal sectional view showing the inside thereof. In FIG. 1 and FIG. 2, details are not shown. The vacuum processing apparatus 1 has a transfer chamber 20 and a load lock chamber 30 connected to each other at the center. Around the transfer chamber 20, three process chambers 10a, 10b, and 10c are disposed. Thus, since the vacuum processing apparatus 1 has the three process chambers 10a, 10b, and 10c, for example, two of the process chambers are configured as an etching process chamber, and the remaining one process chamber is an ashing process chamber. Or all three process chambers can be configured as an etching process chamber or an ashing process chamber for performing the same processing. Note that the number of process chambers is not limited to three, and two or four or more process chambers can be provided around the transfer chamber 20, for example.

搬送チャンバ２０とロードロック室３０との間、搬送チャンバ２０と各プロセスチャンバ１０ａ，１０ｂ，１０ｃとの間、およびロードロック室３０と外側の大気雰囲気とを連通する開口部には、これらの間を気密にシールし、かつ開閉可能に構成されたゲートバルブ２２がそれぞれ介挿されている。   Between the transfer chamber 20 and the load lock chamber 30, between the transfer chamber 20 and the process chambers 10 a, 10 b, and 10 c, and in the opening that communicates the load lock chamber 30 and the outside air atmosphere, there is a space between them. The gate valves 22 are hermetically sealed and configured to be openable and closable.

ロードロック室３０の外側には、２つのカセットインデクサ４１が設けられており、その上にそれぞれ基板Ｓを収容するカセット４０が載置されている。これらカセット４０の一方には、例えば未処理基板を収容し、他方には処理済み基板を収容できる。これらカセット４０は、昇降機構４２により昇降可能となっている。   Two cassette indexers 41 are provided outside the load lock chamber 30, and cassettes 40 for accommodating the substrates S are placed thereon. One of these cassettes 40 can store, for example, an unprocessed substrate, and the other can store a processed substrate. These cassettes 40 can be moved up and down by a lifting mechanism 42.

これら２つのカセット４０の間には、支持台４４上に基板搬送手段４３が設けられており、この基板搬送手段４３は上下２段に設けられたアーム４５，４６、ならびにこれらを一体的に進出退避および回転可能に支持するベース４７を具備している。   Between these two cassettes 40, a substrate transfer means 43 is provided on a support base 44. This substrate transfer means 43 is provided with arms 45 and 46 provided in two upper and lower stages, and these are integrally advanced. A base 47 is provided to support the retraction and rotation.

アーム４５，４６上には基板Ｓを支持する４つの突起４８が形成されている。突起４８は摩擦係数の高い合成ゴム製の弾性体からなり、基板支持中に基板Ｓがずれたり、落下したりすることが防止される。   Four protrusions 48 that support the substrate S are formed on the arms 45 and 46. The protrusion 48 is made of an elastic body made of a synthetic rubber having a high friction coefficient, and prevents the substrate S from being displaced or dropped during substrate support.

前記プロセスチャンバ１０ａ，１０ｂ，１０ｃは、その内部空間が所定の減圧雰囲気に保持されることが可能であり、その内部で例えばプラズマエッチングなどの処理が行なわれる。なお、プロセスチャンバ１０ａ，１０ｂ，１０ｃの基本的構成は略同じである。   The process chambers 10a, 10b, and 10c can have their internal spaces held in a predetermined reduced-pressure atmosphere, and a process such as plasma etching is performed therein. The basic configuration of the process chambers 10a, 10b, and 10c is substantially the same.

搬送チャンバ２０は、分割構造を有しており、プロセスチャンバ１０ａ，１０ｂ，１０ｃと同様に所定の減圧雰囲気に保持することが可能になっている。なお、搬送チャンバ２０の詳細な構造については、後述する。   The transfer chamber 20 has a divided structure and can be maintained in a predetermined reduced-pressure atmosphere in the same manner as the process chambers 10a, 10b, and 10c. The detailed structure of the transfer chamber 20 will be described later.

搬送チャンバ２０の中には、図２に示すように、搬送機構５０が配設されている。そして、この搬送機構５０により、ロードロック室３０および３つのプロセスチャンバ１０ａ，１０ｂ，１０ｃの間で基板Ｓが搬送される。搬送機構５０は、ベース５１の一端に設けられ、ベース５１に回動可能に設けられた第１アーム５２と、第１アーム５２の先端部に回動可能に設けられた第２アーム５３と、第２アーム５３に回動可能に設けられ、基板Ｓを支持するフォーク状の基板支持プレート５４とを有しており、ベース５１に内蔵された駆動機構により第１アーム５２、第２アーム５３および基板支持プレート５４を駆動させることにより、基板Ｓを搬送することが可能となっている。また、ベース５１は上下動が可能であるとともに回転可能となっている。   As shown in FIG. 2, a transport mechanism 50 is disposed in the transport chamber 20. The transport mechanism 50 transports the substrate S between the load lock chamber 30 and the three process chambers 10a, 10b, and 10c. The transport mechanism 50 is provided at one end of the base 51, a first arm 52 that is rotatably provided on the base 51, a second arm 53 that is rotatably provided at the tip of the first arm 52, The second arm 53 is rotatably provided and has a fork-like substrate support plate 54 that supports the substrate S. The drive mechanism built in the base 51 allows the first arm 52, the second arm 53, and The substrate S can be transported by driving the substrate support plate 54. The base 51 can move up and down and can rotate.

ロードロック室３０は、各プロセスチャンバ１０ａ〜１０ｂおよび搬送チャンバ２０と同様に、所定の減圧雰囲気に保持されることが可能であり、その中には基板Ｓを支持するための一対のバッファラック３１，３２が多段、例えば２段に設けられている。なお、図２では最上部のバッファラック３１，３２のみを図示している。また、ロードロック室３０には、矩形をした基板Ｓの互いに対向する角部付近において位置合わせを行なうポジショナー（図示せず）が配設されている。   Like the process chambers 10a to 10b and the transfer chamber 20, the load lock chamber 30 can be held in a predetermined reduced-pressure atmosphere, and a pair of buffer racks 31 for supporting the substrate S therein. , 32 are provided in multiple stages, for example, two stages. In FIG. 2, only the uppermost buffer racks 31 and 32 are shown. The load lock chamber 30 is provided with a positioner (not shown) for positioning in the vicinity of the corners of the rectangular substrate S facing each other.

次に、図３〜図８を参照して、本実施形態に係る搬送チャンバ２０について説明を行なう。図３は、搬送チャンバ２０の外観を示す斜視図であり、図４は、搬送チャンバ２０の分解斜視図であり、図５は、搬送チャンバ２０の下部構造を示す斜視図である。   Next, the transfer chamber 20 according to the present embodiment will be described with reference to FIGS. 3 is a perspective view showing an appearance of the transfer chamber 20, FIG. 4 is an exploded perspective view of the transfer chamber 20, and FIG. 5 is a perspective view showing a lower structure of the transfer chamber 20. As shown in FIG.

真空チャンバである搬送チャンバ２０は、主要な構成として平面視および側面視が長方形に形成された主枠体２０１と、この主枠体２０１の長辺の対向する側部に接合される一対の補強枠体２０２ａ，２０２ｂと、主枠体２０１の上面に着脱自在に接合される天板２０３と、を備えている。つまり、主枠体２０１と補強枠体２０２ａ，２０２ｂとは、一体となって基板Ｓを搬送する搬送空間を形成する。なお、図３〜図５では図示を省略しているが、搬送チャンバ２０内には搬送機構５０が配備される。   The transfer chamber 20, which is a vacuum chamber, includes a main frame 201 that is rectangular in plan view and side view as a main configuration, and a pair of reinforcements that are joined to opposite sides of the long side of the main frame 201. Frame bodies 202a and 202b and a top plate 203 detachably joined to the upper surface of the main frame body 201 are provided. That is, the main frame 201 and the reinforcement frames 202a and 202b integrally form a transport space for transporting the substrate S. Although not shown in FIGS. 3 to 5, a transport mechanism 50 is provided in the transport chamber 20.

主枠体２０１は、例えばアルミニウム、ステンレス、鉄鋼材料などの金属で構成されている。この主枠体２０１は、搬送チャンバ２０の底部をなす底板２０４と、該底板２０４に対して垂直に形成された長辺の側壁２０８ａ，２０８ｂと、短辺の側壁２０６，２０７とを備えている。また、底板２０４に対向して上部開口２０５が形成され、補強枠体２０２ａ，２０２ｂと接合される長辺の側壁２０８ａ，２０８ｂには、側部開口２１０ａ，２１０ｂが形成されている。この側部開口２１０ａ，２１０ｂを介して、主枠体２０１により区画される内部空間と、補強枠体２０２ａ，２０２ｂとによって区画される内部空間とが連通し、一つの搬送用空間が形成される。   The main frame 201 is made of a metal such as aluminum, stainless steel, or steel material. The main frame 201 includes a bottom plate 204 that forms the bottom of the transfer chamber 20, long side walls 208 a and 208 b that are formed perpendicular to the bottom plate 204, and short side walls 206 and 207. . Further, an upper opening 205 is formed to face the bottom plate 204, and side openings 210a and 210b are formed in long side walls 208a and 208b joined to the reinforcing frame bodies 202a and 202b. Via these side openings 210a and 210b, the internal space defined by the main frame 201 and the internal space defined by the reinforcing frame 202a and 202b communicate with each other to form one transport space. .

また、主枠体２０１の短辺側の側壁２０６には、ロードロック室３０（図１および図２参照）から基板Ｓを搬入するための搬送用開口２１１，２１２が上下に２段に形成されている。この搬送用開口２１１，２１２は、ロードロック室３０で二段に形成されたバッファラック３１，３２から基板Ｓを搬入出できるような位置に形成されている。また、主枠体２０１の前記搬送用開口２１１，２１２が設けられた側壁２０６と対向する側壁２０７には、真空処理室であるプロセスチャンバ１０ｂとの間で基板Ｓを搬入出するための搬送用開口２１３が形成されている。   In addition, on the side wall 206 on the short side of the main frame 201, transfer openings 211 and 212 for loading the substrate S from the load lock chamber 30 (see FIGS. 1 and 2) are formed in two stages in the vertical direction. ing. The transfer openings 211 and 212 are formed at positions where the substrate S can be loaded and unloaded from the buffer racks 31 and 32 formed in two stages in the load lock chamber 30. Further, the side wall 207 opposite to the side wall 206 provided with the transfer openings 211 and 212 of the main frame 201 is used for carrying the substrate S in and out of the process chamber 10b serving as a vacuum processing chamber. An opening 213 is formed.

図６は、主枠体２０１の要部斜視図であり、図７は、要部断面図である。主枠体２０１の上端付近には、上部開口２０５の中央へ向けて内周フランジ２０９が突設されている。内周フランジ２０９は、主枠体２０１の各側壁２０６，２０７，２０８ａ，２０８ｂに対して垂直に設けられ、各側壁２０６，２０７，２０８ａ，２０８ｂの剛性を高めている。   6 is a perspective view of a main part of the main frame 201, and FIG. 7 is a cross-sectional view of the main part. In the vicinity of the upper end of the main frame 201, an inner peripheral flange 209 protrudes toward the center of the upper opening 205. The inner peripheral flange 209 is provided perpendicular to the side walls 206, 207, 208a, 208b of the main frame 201, and increases the rigidity of the side walls 206, 207, 208a, 208b.

また、内周フランジ２０９の下部には、内部補強部材としてのＬ字型補強具２２１が、仕切り壁２２１ａにより区切られつつ、横方向に内壁面を略１周するように配設されている。Ｌ字型補強具２２１は、内周フランジ２０９の下面と、主枠体２０１の各側壁２０６，２０７，２０８ａ，２０８ｂとに、例えば溶接により接合されている。なお、配備されたＬ字型補強具２２１と、内周フランジ２０９の下面と、主枠体２０１の各側壁２０６，２０７，２０８ａ，２０８ｂとの間には、空間が形成されており、この空間は、Ｌ字型補強具２２１に形成された開口２２１ｂによって、搬送チャンバ２０内の搬送空間と連通している。   In addition, an L-shaped reinforcing member 221 as an internal reinforcing member is disposed below the inner peripheral flange 209 so as to make one round of the inner wall surface in the lateral direction while being partitioned by the partition wall 221a. The L-shaped reinforcing member 221 is joined to the lower surface of the inner peripheral flange 209 and the side walls 206, 207, 208a, 208b of the main frame 201 by welding, for example. A space is formed between the deployed L-shaped reinforcing member 221, the lower surface of the inner peripheral flange 209, and the side walls 206, 207, 208 a, 208 b of the main frame 201. Is in communication with the transfer space in the transfer chamber 20 through an opening 221b formed in the L-shaped reinforcing tool 221.

Ｌ字型補強具２２１は、例えばステンレス、アルミニウムなどの金属製の板材をＬ字型に折曲することによって形成されている。そして、Ｌ字型補強具２２１を主枠体２０１の内壁面に配備することにより、主枠体２０１に耐真空剛性を付与し、主枠体２０１が負圧によって内側に歪むことを防止するように作用する。なお、内部補強部材の形状としては、Ｌ字型に限らず、主枠体２０１に必要な剛性を付与できるものであればよく、任意の形状とすることができる。   The L-shaped reinforcing member 221 is formed, for example, by bending a metal plate material such as stainless steel or aluminum into an L-shape. Then, by providing the L-shaped reinforcing member 221 on the inner wall surface of the main frame body 201, the main frame body 201 is given vacuum resistance rigidity, and the main frame body 201 is prevented from being distorted inward by negative pressure. Act on. The shape of the internal reinforcing member is not limited to the L shape, and any shape can be used as long as it can provide the main frame 201 with the necessary rigidity.

主枠体２０１の底板２０４には、搬送機構５０（図２参照）を設置するための開口２１８が形成されている。   An opening 218 for installing the transport mechanism 50 (see FIG. 2) is formed in the bottom plate 204 of the main frame body 201.

主枠体２０１に設けられた内周フランジ２０９の上面には、上部開口２０５を封止する天板２０３が着脱自在に接合される。天板２０３は、例えば、アルミニウム、ステンレスなどの金属で構成されており、内周フランジ２０９に、例えばボルト２３１等の固定手段により固定される。   A top plate 203 for sealing the upper opening 205 is detachably joined to the upper surface of the inner peripheral flange 209 provided in the main frame 201. The top plate 203 is made of a metal such as aluminum or stainless steel, for example, and is fixed to the inner peripheral flange 209 by a fixing means such as a bolt 231.

補強枠体２０２ａ，２０２ｂは、例えばアルミニウム、ステンレス、鉄鋼材料などの金属で構成されている。各補強枠体２０２ａ，２０２ｂには、主枠体２０１と接合する接合面に、開口２１４が形成されている。各開口２１４は、主枠体２０１の長辺側の一対の側壁２０８ａ，２０８ｂにそれぞれ形成された側部開口２１０ａ，２１０ｂに対応する大きさで形成されている。   The reinforcement frame bodies 202a and 202b are comprised, for example with metals, such as aluminum, stainless steel, and steel materials. Each of the reinforcing frame bodies 202a and 202b has an opening 214 formed on a joint surface that joins the main frame body 201. Each opening 214 is formed in a size corresponding to the side openings 210 a and 210 b formed in the pair of side walls 208 a and 208 b on the long side of the main frame 201.

補強枠体２０２ａ，２０２ｂの側壁２２０，２２０には、プロセスチャンバ１０ａ，１０ｃとの間で基板の搬入出を行う搬送用開口２１５，２１５が形成されている。また、補強枠体２０２ａ，２０２ｂの各側壁２２０，２２０を間に挟み、そこから拡開するように斜方形成された一対の壁の片方には、搬送チャンバ２０内に配備された搬送機構５０などのメンテナンスを行うためのメンテナンス用開口２１６が設けられ、このメンテナンス用開口２１６は扉２１７によって気密に封止できるように構成されている。   In the side walls 220 and 220 of the reinforcing frame bodies 202a and 202b, openings 215 and 215 for carrying the substrate in and out of the process chambers 10a and 10c are formed. In addition, a conveyance mechanism 50 provided in the conveyance chamber 20 is provided on one of the pair of walls formed obliquely so as to sandwich the side walls 220 and 220 of the reinforcing frame bodies 202a and 202b and expand from there. A maintenance opening 216 for performing maintenance such as the above is provided, and the maintenance opening 216 is configured to be hermetically sealed by a door 217.

図８に断面構造を示すように、各補強枠体２０２ａ，２０２ｂの上下の外壁２１９には、外部補強部材としての複数のリブ２２２が格子状に、かつ前記上下の外壁２１９の壁面に対して垂直に立設されている。リブ２２２は、例えば鉄、ステンレス、鉄鋼材料などの金属によって構成され、補強枠体２０２ａ，２０２ｂの耐真空剛性を高めるとともに、補強枠体２０２ａ，２０２ｂを主枠体２０１に接合した状態で、搬送チャンバ２０全体としての剛性をも高めるように配置されている。なお、リブ２２２の形状は、格子状に限らず、補強枠体２０２ａ，２０２ｂの強度を保つことが可能な任意の形状を採用することが可能である。   As shown in the cross-sectional structure of FIG. 8, a plurality of ribs 222 as external reinforcing members are formed in a lattice shape on the upper and lower outer walls 219 of the reinforcing frame bodies 202 a and 202 b and to the wall surfaces of the upper and lower outer walls 219. Stands vertically. The rib 222 is made of, for example, a metal such as iron, stainless steel, or a steel material. The rib 222 increases the vacuum resistance rigidity of the reinforcement frames 202a and 202b, and is transported in a state where the reinforcement frames 202a and 202b are joined to the main frame 201. It arrange | positions so that the rigidity as the whole chamber 20 may also be improved. The shape of the rib 222 is not limited to a lattice shape, and any shape that can maintain the strength of the reinforcing frame bodies 202a and 202b can be employed.

また、主枠体２０１の底板２０４には、底板２０４を外部から補強する底部補強材２２３が配備されている。底部補強材２２３は、例えばＨ鋼などの鋼材によって構成されており、高真空状態で底板２０４が負圧によって主枠体２０１の内側へ引き込まれ、湾曲することを防止している。これにより、主枠体２０１の底板２０４の板厚を薄くしても、耐真空強度を確保することが可能になる。   Further, the bottom plate 204 of the main frame 201 is provided with a bottom reinforcing member 223 that reinforces the bottom plate 204 from the outside. The bottom reinforcing member 223 is made of, for example, a steel material such as H steel, and prevents the bottom plate 204 from being pulled into the main frame body 201 by a negative pressure and bent in a high vacuum state. As a result, even if the thickness of the bottom plate 204 of the main frame 201 is reduced, it is possible to ensure vacuum resistance.

主枠体２０１と補強枠体２０２ａ，２０２ｂとの接合は、例えば図７に示すように、主枠体２０１と補強枠体２０２ａ，２０２ｂの上端を面一に揃えた状態で、水平方向に長尺な板材である連結補強板２２４ａ，２２４ｂを当接し、例えばボルト２３２，２３２等の固定手段によって連結固定することによって行われる。連結補強板２２４ａ，２２４ｂは、例えば鉄、ステンレス、アルミニウム等の材質で構成されている。   For example, as shown in FIG. 7, the main frame 201 and the reinforcing frame bodies 202a and 202b are joined in the horizontal direction with the upper ends of the main frame 201 and the reinforcing frame bodies 202a and 202b being flush with each other. The connecting reinforcing plates 224a and 224b, which are long plate materials, are brought into contact with each other, and are connected and fixed by fixing means such as bolts 232 and 232, for example. The connection reinforcing plates 224a and 224b are made of a material such as iron, stainless steel, or aluminum.

また、補強枠体２０２ａ，２０２ｂは、主枠体２０１の側壁２０８ａ，２０８ｂにも、例えばボルト２３３，２３３等の固定手段を用いて接合される。このようにして、主枠体２０１と補強枠体２０２ａ，２０２ｂとが連結されるとともに、連結補強板２２４ａ，２２４ｂによって、主枠体２０１の長辺方向の補強がなされるので、搬送チャンバ２０の耐真空剛性が確保される。   The reinforcing frame bodies 202a and 202b are also joined to the side walls 208a and 208b of the main frame body 201 by using fixing means such as bolts 233 and 233, for example. In this manner, the main frame 201 and the reinforcing frame bodies 202a and 202b are connected to each other, and the main frame body 201 is reinforced in the long side direction by the connection reinforcing plates 224a and 224b. Vacuum resistance is ensured.

主枠体２０１に補強枠体２０２ａ，２０２ｂが両側から接合された状態で、主枠体２０１の側壁２０８ａにおける側部開口２１０ａと補強枠体２０２ａの開口２１４、および主枠体２０１の側壁２０８ｂにおける側部開口２１０ｂと補強枠体２０２ｂの開口２１４とを介して、主枠体２０１の内部と補強枠体２０２ａ，２０２ｂの内部が連通し、一体化された基板搬送空間が形成される。つまり、従来の搬送チャンバにおける搬送空間のうち、長辺方向の両側部付近の空間が、補強枠体２０２ａ，２０２ｂの内部空間によって代替される。このように主枠体２０１と補強枠体２０２ａ，２０２ｂの内部に一体的に基板搬送空間が形成されるようにすることによって、その中に設置された搬送機構５０の基板支持プレート５４に基板Ｓを載置支持した状態で、各プロセスチャンバ１０ａ，１０ｂ，１０ｃおよびロードロック室３０との間で基板搬送を行う際に、十分な旋回半径（搬送空間）を確保することができる。   With the reinforcing frame bodies 202a and 202b joined to the main frame 201 from both sides, the side opening 210a in the side wall 208a of the main frame body 201, the opening 214 of the reinforcing frame body 202a, and the side wall 208b of the main frame body 201 Via the side opening 210b and the opening 214 of the reinforcing frame 202b, the inside of the main frame 201 and the inside of the reinforcing frames 202a and 202b are communicated to form an integrated substrate transport space. That is, among the transfer spaces in the conventional transfer chamber, the spaces near both side portions in the long side direction are replaced by the internal spaces of the reinforcing frame bodies 202a and 202b. As described above, the substrate transport space is integrally formed in the main frame 201 and the reinforcing frames 202a and 202b, so that the substrate S is placed on the substrate support plate 54 of the transport mechanism 50 installed therein. When the substrate is transferred between the process chambers 10a, 10b, 10c and the load lock chamber 30 in a state where the substrate is placed and supported, a sufficient turning radius (transfer space) can be ensured.

そして、主枠体２０１と補強枠体２０２ａ，２０２ｂとが接合され一体化した搬送チャンバ２０は、プロセスチャンバ１０ａ，１０ｂ，１０ｃの中央部に配置され、ゲートバルブ２２を介して各プロセスチャンバ１０ａ，１０ｂ，１０ｃおよびロードロック室３０との間で基板Ｓを受渡し可能に連結される。   The transfer chamber 20 in which the main frame 201 and the reinforcement frames 202a and 202b are joined and integrated is disposed at the center of the process chambers 10a, 10b, and 10c, and the process chambers 10a, The substrate S is connected so as to be able to be delivered between 10 b and 10 c and the load lock chamber 30.

このように本実施形態では、３つに分割された各構成部分（主枠体２０１と、その両側の補強枠体２０２ａ，２０２ｂ）を接合して真空チャンバを構成することにより、基板Ｓの大型化にも容易に対応することが可能になる。
すなわち、従来の一体構造の真空チャンバの場合には、真空チャンバとして必要な剛性を保ちながら大型化を図るためには、加工に大型の切削機械を必要とするなどの製造上の制約や、重量の増大による移送や取り扱いの困難を伴うが、分割構造とすることにより、各部をそれぞれ別々に加工することが可能になるため、製造や移送、取り扱いが格段に容易になる。 As described above, in this embodiment, each of the component parts divided into three (the main frame body 201 and the reinforcing frame bodies 202a and 202b on both sides thereof) are joined to form a vacuum chamber, thereby forming a large-sized substrate S. It is possible to easily cope with this.
That is, in the case of a conventional integrated vacuum chamber, in order to increase the size while maintaining the rigidity required as a vacuum chamber, manufacturing restrictions such as the need for a large cutting machine for processing, and weight However, by using a split structure, it is possible to process each part separately, so that manufacturing, transportation, and handling become much easier.

また、搬送チャンバ２０を設置する前は主枠体２０１と補強枠体２０２ａ，２０２ｂを３つに分割した状態で移送することができるので、法令上の運行制限なども受けにくくなる。   Further, before the transfer chamber 20 is installed, the main frame 201 and the reinforcing frame 202a, 202b can be transferred in a state of being divided into three, so that it is difficult to be subject to legal restrictions on operation.

また、補強枠体２０２ａ，２０２ｂを主枠体２０１に連結補強板２２４ａ，２２４ｂを用いて接合することにより、上面に大きな上部開口２０５を有し、剛性を保ちにくい主枠体２０１の耐真空強度を向上させることが可能になる。すなわち、補強枠体２０２ａ，２０２ｂは、主枠体２０１の長辺方向の側部に接合されて補強用部材として機能するので、搬送チャンバ２０全体として十分な耐真空強度を得ることが可能になる。   Further, by joining the reinforcing frame bodies 202a and 202b to the main frame body 201 using the connection reinforcing plates 224a and 224b, the vacuum resistance strength of the main frame body 201 having a large upper opening 205 on the upper surface and difficult to maintain rigidity. It becomes possible to improve. That is, since the reinforcing frame bodies 202a and 202b are joined to the side portions of the main frame body 201 in the long side direction and function as reinforcing members, it is possible to obtain a sufficient vacuum resistance strength for the entire transfer chamber 20. .

また、主枠体２０１の内周面にＬ字型補強具２２１を配設して剛性を高めることにより、主枠体２０１を構成する板材の厚さを薄くしても、高真空状態での主枠体２０１の歪みを抑えることが可能になる。   Moreover, even if the thickness of the plate material constituting the main frame 201 is reduced by disposing the L-shaped reinforcing tool 221 on the inner peripheral surface of the main frame 201 to increase the rigidity, Distortion of the main frame 201 can be suppressed.

また、補強枠体２０２ａ，２０２ｂの外壁面に、格子状のリブ２２２を配備して剛性を保つ構成としたので、補強枠体２０２ａ，２０２ｂを構成する板材の厚さを薄くし、軽量化を図ることが可能になる。   In addition, since the grid-like ribs 222 are provided on the outer wall surfaces of the reinforcing frame bodies 202a and 202b to maintain rigidity, the thickness of the plate members constituting the reinforcing frame bodies 202a and 202b is reduced, thereby reducing the weight. It becomes possible to plan.

また、以上のように、主枠体２０１と補強枠体２０２ａ，２０２ｂとの板厚を削減できることにより、加工が容易になるとともに軽量化を図ることが可能になるから、従来の一体型真空チャンバに比較して素材コスト、加工コスト等の製作コストを削減できるだけでなく、運送コストも低減できる。   In addition, as described above, since the plate thickness of the main frame 201 and the reinforcing frame bodies 202a and 202b can be reduced, the processing becomes easy and the weight can be reduced. Compared to the above, not only production costs such as material costs and processing costs can be reduced, but also transportation costs can be reduced.

なお、本発明は上記実施形態に限定されるものではなく、種々の変形が可能である。例えば、被処理体としては、ＦＰＤ用のガラス基板に限られず、半導体ウエハであってもよい。   In addition, this invention is not limited to the said embodiment, A various deformation | transformation is possible. For example, the object to be processed is not limited to a glass substrate for FPD, and may be a semiconductor wafer.

また、上記実施形態では、補強枠体２０２ａ，２０２ｂとして、外壁面にリブ２２２を配備して剛性を高めたが、補強枠体自体の板厚を厚く形成して剛性を高めたものを使用することも可能である。   Moreover, in the said embodiment, although the rib 222 was arrange | positioned in the outer wall surface and rigidity was raised as reinforcement frame 202a, 202b, what formed the board | plate thickness of reinforcement frame itself thickly and used rigidity is used. It is also possible.

さらに、上記実施形態では、平面視が四角形状の主枠体２０１を例に挙げて説明を行ったが、主枠体２０１の平面形状は四角形に限るものではなく、例えば６角形、８角形等の多角形状であってもよい。また、補強枠体も２つに限るものではなく、３つ以上を主枠体に接合させることが可能である。   Furthermore, in the above-described embodiment, the main frame body 201 having a quadrangular shape in plan view has been described as an example. The polygonal shape may be sufficient. Further, the number of reinforcing frames is not limited to two, and three or more reinforcing frames can be joined to the main frame.

また、上記実施形態では、搬送チャンバ２０に分割構造を適用したが、チャンバの分割構造は、搬送チャンバに限らず、例えば真空予備室であるロードロック室や、真空処理室であるプロセスチャンバにも適用することができる。   In the above-described embodiment, the divided structure is applied to the transfer chamber 20, but the divided structure of the chamber is not limited to the transfer chamber, and for example, a load lock chamber that is a vacuum preparatory chamber or a process chamber that is a vacuum processing chamber. Can be applied.

本発明の一実施形態に係る真空処理装置の概要を示す斜視図である。It is a perspective view which shows the outline | summary of the vacuum processing apparatus which concerns on one Embodiment of this invention. 図１の真空処理装置の水平断面図である。It is a horizontal sectional view of the vacuum processing apparatus of FIG. 搬送チャンバの外観構成を示す図面である。It is drawing which shows the external appearance structure of a conveyance chamber. 搬送チャンバの分解斜視図である。It is a disassembled perspective view of a conveyance chamber. 搬送チャンバを底面側からみた斜視図である。It is the perspective view which looked at the conveyance chamber from the bottom face side. 主枠体の要部斜視図である。It is a principal part perspective view of a main frame. 主枠体にＬ字型補強具および連結補強板を装着した状態を説明する要部断面図である。It is principal part sectional drawing explaining the state which mounted | wore with the L-shaped reinforcement tool and the connection reinforcement board in the main frame. 補強枠体の断面図である。It is sectional drawing of a reinforcement frame.

符号の説明Explanation of symbols

１；真空処理装置
１０ａ，１０ｂ，１０ｃ；プロセスチャンバ
２０；搬送チャンバ
３０；ロードロック室
３１，３２；バッファ
５０；搬送機構
２０１；主枠体
２０２ａ，２０２ｂ；補強枠体
２０３；天板
２０４；底板
２０５；上部開口
２１０ｂ，２１０ｂ；側部開口
２１１，２１２、２１３；搬送用開口
２１４；開口
２１５；搬送用開口
２１６；メンテナンス用開口
２１７；扉
２２１；Ｌ字型補強具
２２２；リブ
２２３；底部補強材
２２４ａ，２２４ｂ；連結補強板 DESCRIPTION OF SYMBOLS 1; Vacuum processing apparatus 10a, 10b, 10c; Process chamber 20; Transfer chamber 30; Load lock chamber 31, 32; Buffer 50; Transfer mechanism 201; Main frame body 202a, 202b; Reinforcement frame body 203; 205; upper opening 210b, 210b; side opening 211, 212, 213; transfer opening 214; opening 215; transfer opening 216; maintenance opening 217; door 221; L-shaped reinforcement 222; rib 223; Material 224a, 224b; connecting reinforcing plate

Claims (15)

多角形状に形成され、底部をなす底板を有し、該底板に対向する上面が開口した主枠体と、
前記主枠体の対向する側部にそれぞれ接合される少なくとも一対の補強枠体と、
前記主枠体の上部に着脱自在に接合される部材と、
を備え、
前記主枠体と前記補強枠体とが接合され、一体となって被処理基板を収容する空間を形成するとともに、前記主枠体の側部と、前記補強枠体の側部には、それぞれ側部開口が形成され、該側部開口を介して前記主枠体の内部と前記補強枠体の内部が連通し、前記被処理基板を収容する空間を形成し、
前記主枠体の内壁面に、前記主枠体の上端近傍において前記開口の内側に向けて突設されたフランジと、前記主枠体の壁面と、に接合される断面Ｌ字型の補強部材である内部補強部材を配設したことを特徴とする、真空チャンバ。 A main frame body that is formed in a polygonal shape and has a bottom plate that forms the bottom, and an upper surface that faces the bottom plate is opened;
At least a pair of reinforcing frames respectively joined to opposite sides of the main frame;
A member detachably joined to the upper part of the main frame;
With
The main frame and the reinforcing frame are joined to form a space for accommodating the substrate to be processed, and the side of the main frame and the side of the reinforcing frame are respectively A side opening is formed, and the inside of the main frame body and the inside of the reinforcing frame body communicate with each other through the side opening to form a space for accommodating the substrate to be processed .
A reinforcing member having an L-shaped cross section joined to the inner wall surface of the main frame body and a flange projecting toward the inside of the opening in the vicinity of the upper end of the main frame body and the wall surface of the main frame body A vacuum chamber, characterized in that an internal reinforcing member is provided . 前記主枠体と前記補強枠体とを接合することにより、前記主枠体の耐真空強度を向上させていることを特徴とする、請求項１に記載の真空チャンバ。   The vacuum chamber according to claim 1, wherein the vacuum resistance of the main frame is improved by joining the main frame and the reinforcing frame. 前記補強枠体の外壁面に、外部補強部材を配設したことを特徴とする、請求項１または請求項２に記載の真空チャンバ。   The vacuum chamber according to claim 1 or 2, wherein an external reinforcing member is disposed on an outer wall surface of the reinforcing frame. 前記外部補強部材として、前記外壁面に対して垂直なリブを格子状に立設したことを特徴とする、請求項３に記載の真空チャンバ。   The vacuum chamber according to claim 3, wherein ribs perpendicular to the outer wall surface are erected in a lattice shape as the external reinforcing member. 前記リブを、前記補強枠体の上下に対向する壁の外壁面に設けたことを特徴とする、請求項４に記載の真空チャンバ。   The vacuum chamber according to claim 4, wherein the rib is provided on an outer wall surface of a wall facing the upper and lower sides of the reinforcing frame. 前記接合される部材は、前記フランジの上面に載置され、接合されるものであることを特徴とする、請求項１から請求項５のいずれか１項に記載の真空チャンバ。 The vacuum chamber according to any one of claims 1 to 5 , wherein the member to be joined is placed on and joined to the upper surface of the flange. 前記主枠体と前記補強枠体とを接合する連結板を備えたことを特徴とする、請求項１から請求項６のいずれか１項に記載の真空チャンバ。 The vacuum chamber according to any one of claims 1 to 6 , further comprising a connecting plate that joins the main frame and the reinforcing frame. 前記連結板は、前記主枠体の上端と、前記補強枠体の上端とを接合するものであることを特徴とする、請求項７に記載の真空チャンバ。 The vacuum chamber according to claim 7 , wherein the connecting plate joins an upper end of the main frame and an upper end of the reinforcing frame. 前記底板の外壁面に、底部補強部材を配設したことを特徴とする、請求項１から請求項８のいずれか１項に記載の真空チャンバ。 The vacuum chamber according to any one of claims 1 to 8 , wherein a bottom reinforcing member is disposed on an outer wall surface of the bottom plate. 前記真空チャンバは、その内部に被処理基板を真空状態で搬送する搬送装置を備えた搬送チャンバであることを特徴とする、請求項１から請求項９のいずれか１項に記載の真空チャンバ。 The vacuum chamber according to any one of claims 1 to 9 , wherein the vacuum chamber is a transfer chamber provided with a transfer device for transferring a substrate to be processed in a vacuum state. 前記主枠体の対向する一対の側壁に、被処理基板を搬入出する搬入出用開口を形成したことを特徴とする、請求項１０に記載の真空チャンバ。 The vacuum chamber according to claim 10 , wherein a loading / unloading opening for loading / unloading a substrate to be processed is formed on a pair of opposing side walls of the main frame. 前記補強枠体の側壁に、被処理基板を搬入出する搬入出用開口を形成したことを特徴とする、請求項１０または請求項１１に記載の真空チャンバ。 The vacuum chamber according to claim 10 or 11 , wherein a loading / unloading opening for loading / unloading a substrate to be processed is formed on a side wall of the reinforcing frame. 前記補強枠体の側部に、メンテナンス用開口を形成したことを特徴とする、請求項１から請求項１２のいずれか１項に記載の真空チャンバ。 The vacuum chamber according to any one of claims 1 to 12 , wherein a maintenance opening is formed in a side portion of the reinforcing frame. 被処理基板が、フラットパネルディスプレイ用基板であることを特徴とする、請求項１から請求項１３のいずれか１項に記載の真空チャンバ。 Target substrate, characterized in that it is a substrate for a flat panel display, a vacuum chamber as claimed in any one of claims 13. 請求項１から請求項１４のいずれか１項に記載の真空チャンバと、
前記真空チャンバに連結され、被処理基板の処理を行う複数の真空処理室と、
を備えたことを特徴とする、真空処理装置。 A vacuum chamber according to any one of claims 1 to 14 ,
A plurality of vacuum processing chambers connected to the vacuum chamber for processing a substrate to be processed;
A vacuum processing apparatus comprising:
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