TW200731391A - Vacuum chamber and vacuum processing apparatus - Google Patents

Vacuum chamber and vacuum processing apparatus

Info

Publication number
TW200731391A
TW200731391A TW095132454A TW95132454A TW200731391A TW 200731391 A TW200731391 A TW 200731391A TW 095132454 A TW095132454 A TW 095132454A TW 95132454 A TW95132454 A TW 95132454A TW 200731391 A TW200731391 A TW 200731391A
Authority
TW
Taiwan
Prior art keywords
vacuum
main frame
vacuum chamber
chamber
processing apparatus
Prior art date
Application number
TW095132454A
Other languages
Chinese (zh)
Other versions
TWI406332B (en
Inventor
Seiji Okabe
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200731391A publication Critical patent/TW200731391A/en
Application granted granted Critical
Publication of TWI406332B publication Critical patent/TWI406332B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

To provide a vacuum chamber in which strength as a vacuum container can be ensured while employing a division structure, and to provide a vacuum processing device equipped with the vacuum chamber. A vacuum chamber, i.e. a conveyance chamber 20, comprises a main frame 201 formed in rectangle, a pair of reinforcing frames 202a and 202b joined to the opposing long sides of the main frame 201, a top plate 203 joined removably to the upper surface of the main frame 201, and a conveyance mechanism (not shown) wherein the main frame 201 and the reinforcing frames 202a and 202b form a space for conveying a substrate S integrally.
TW095132454A 2005-09-02 2006-09-01 Vacuum chamber and vacuum treatment device TWI406332B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005255294A JP4791110B2 (en) 2005-09-02 2005-09-02 Vacuum chamber and vacuum processing equipment

Publications (2)

Publication Number Publication Date
TW200731391A true TW200731391A (en) 2007-08-16
TWI406332B TWI406332B (en) 2013-08-21

Family

ID=37817679

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095132454A TWI406332B (en) 2005-09-02 2006-09-01 Vacuum chamber and vacuum treatment device

Country Status (4)

Country Link
JP (1) JP4791110B2 (en)
KR (1) KR100856145B1 (en)
CN (1) CN100421212C (en)
TW (1) TWI406332B (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7018517B2 (en) 2002-06-21 2006-03-28 Applied Materials, Inc. Transfer chamber for vacuum processing system
KR101101757B1 (en) * 2005-11-07 2012-01-05 주성엔지니어링(주) Vacuum chamber which economizes manufacturing cost
WO2009078351A1 (en) * 2007-12-14 2009-06-25 Ulvac, Inc. Chamber and film-forming apparatus
JP5551346B2 (en) * 2008-06-10 2014-07-16 東京エレクトロン株式会社 Chamber and processing apparatus
CN102272350B (en) * 2009-01-14 2014-12-24 株式会社爱发科 Plasma cvd apparatus
FI122940B (en) * 2009-02-09 2012-09-14 Beneq Oy reaction chamber
KR20110067939A (en) * 2009-12-15 2011-06-22 주식회사 테스 Load lock chamber
KR101598176B1 (en) * 2010-03-30 2016-02-26 주식회사 원익아이피에스 Vacuum chamber
JP5526988B2 (en) * 2010-04-28 2014-06-18 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing system
KR101363064B1 (en) * 2012-05-22 2014-02-14 박종민 Vacuum chamber structure
US9717147B2 (en) * 2013-09-26 2017-07-25 Applied Materials, Inc. Electronic device manufacturing system
JP7023097B2 (en) * 2016-12-28 2022-02-21 東京エレクトロン株式会社 How to lock the vacuum chamber and the door of the vacuum chamber
JP6625597B2 (en) * 2017-11-13 2019-12-25 平田機工株式会社 Transfer chamber
JP7277137B2 (en) * 2018-12-28 2023-05-18 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing equipment and transfer module
KR102193096B1 (en) 2019-01-31 2020-12-21 (주)에프티엘 Jig apparatus for welding for rib of vaccum chamber

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3608065B2 (en) * 1996-10-31 2005-01-05 東京エレクトロン株式会社 Vertical heat treatment apparatus and maintenance method for boat and heat insulation cylinder
US5914493A (en) * 1997-02-21 1999-06-22 Nikon Corporation Charged-particle-beam exposure apparatus and methods with substrate-temperature control
US6241117B1 (en) * 1997-11-26 2001-06-05 Steven R. Wickins Pressure differential containment structure
JP4253107B2 (en) * 2000-08-24 2009-04-08 キヤノンアネルバ株式会社 Substrate processing apparatus and expansion method thereof
JP4003412B2 (en) * 2001-06-20 2007-11-07 株式会社島津製作所 Vacuum chamber and liquid crystal injection apparatus using the vacuum chamber
JP2003077974A (en) * 2001-08-31 2003-03-14 Hitachi Kokusai Electric Inc Substrate processing device and manufacturing method of semiconductor device
JP2003188226A (en) * 2001-12-18 2003-07-04 Anelva Corp Vacuum conveyance treating apparatus
JP2004089872A (en) * 2002-08-30 2004-03-25 Tsukishima Kikai Co Ltd Vacuum device
JP2004311640A (en) * 2003-04-04 2004-11-04 Tokyo Electron Ltd Treatment vessel
SG115678A1 (en) * 2003-04-22 2005-10-28 Asml Netherlands Bv Substrate carrier and method for making a substrate carrier
JP2004335743A (en) * 2003-05-08 2004-11-25 Ulvac Japan Ltd Vacuum chamber for vacuum processing apparatus
KR100441875B1 (en) * 2003-06-02 2004-07-27 주성엔지니어링(주) Separable type transfer chamber
JP4833512B2 (en) * 2003-06-24 2011-12-07 東京エレクトロン株式会社 To-be-processed object processing apparatus, to-be-processed object processing method, and to-be-processed object conveyance method
JP4767574B2 (en) * 2005-03-31 2011-09-07 東京エレクトロン株式会社 Processing chamber and processing apparatus
JP4079157B2 (en) * 2005-04-12 2008-04-23 東京エレクトロン株式会社 Gate valve device and processing system

Also Published As

Publication number Publication date
CN100421212C (en) 2008-09-24
KR20070026215A (en) 2007-03-08
TWI406332B (en) 2013-08-21
KR100856145B1 (en) 2008-09-03
JP4791110B2 (en) 2011-10-12
JP2007073542A (en) 2007-03-22
CN1925111A (en) 2007-03-07

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