TWI505397B - Chamber and processing device - Google Patents

Chamber and processing device Download PDF

Info

Publication number
TWI505397B
TWI505397B TW098119214A TW98119214A TWI505397B TW I505397 B TWI505397 B TW I505397B TW 098119214 A TW098119214 A TW 098119214A TW 98119214 A TW98119214 A TW 98119214A TW I505397 B TWI505397 B TW I505397B
Authority
TW
Taiwan
Prior art keywords
chamber
processing chamber
chamber according
side plate
processing
Prior art date
Application number
TW098119214A
Other languages
English (en)
Chinese (zh)
Other versions
TW201011855A (en
Inventor
Yoshihiko Sasaki
Masato Minami
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201011855A publication Critical patent/TW201011855A/zh
Application granted granted Critical
Publication of TWI505397B publication Critical patent/TWI505397B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
TW098119214A 2008-06-10 2009-06-09 Chamber and processing device TWI505397B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008151533A JP5551346B2 (ja) 2008-06-10 2008-06-10 チャンバ及び処理装置

Publications (2)

Publication Number Publication Date
TW201011855A TW201011855A (en) 2010-03-16
TWI505397B true TWI505397B (zh) 2015-10-21

Family

ID=41470288

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098119214A TWI505397B (zh) 2008-06-10 2009-06-09 Chamber and processing device

Country Status (4)

Country Link
JP (1) JP5551346B2 (ja)
KR (2) KR101148393B1 (ja)
CN (1) CN101604610B (ja)
TW (1) TWI505397B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101338629B1 (ko) * 2009-01-14 2013-12-06 가부시키가이샤 아루박 플라스마 ｃｖｄ 장치
CN102007575A (zh) * 2009-02-06 2011-04-06 株式会社爱发科 工作腔及其制作方法
US11049740B1 (en) 2019-12-05 2021-06-29 Applied Materials, Inc. Reconfigurable mainframe with replaceable interface plate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09209150A (ja) * 1996-02-06 1997-08-12 Tokyo Electron Ltd 真空チャンバ及びその製造方法
JP2007073542A (ja) * 2005-09-02 2007-03-22 Tokyo Electron Ltd 真空チャンバおよび真空処理装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521581A (ja) * 1991-07-15 1993-01-29 Tokyo Electron Ltd 真空処理装置
JPH09129697A (ja) * 1995-10-27 1997-05-16 Sony Corp 物品処理装置
JP2001073138A (ja) * 1999-09-07 2001-03-21 Shimadzu Corp 基板処理装置
CN2445640Y (zh) * 2000-10-11 2001-09-05 陈安军 能自由调节宽窄的家具
KR100544896B1 (ko) * 2004-07-27 2006-01-24 (주)아이씨디 일체형 실링부재를 구비한 알루미늄 플라즈마 챔버
KR100595418B1 (ko) * 2004-07-27 2006-07-03 (주)아이씨디 알루미늄 플라즈마 챔버 및 그 제조 방법
JP4587784B2 (ja) * 2004-11-12 2010-11-24 株式会社アルバック 真空チャンバ
JP4903013B2 (ja) * 2006-05-17 2012-03-21 東京エレクトロン株式会社 減圧容器、減圧処理装置および減圧容器の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09209150A (ja) * 1996-02-06 1997-08-12 Tokyo Electron Ltd 真空チャンバ及びその製造方法
JP2007073542A (ja) * 2005-09-02 2007-03-22 Tokyo Electron Ltd 真空チャンバおよび真空処理装置

Also Published As

Publication number Publication date
KR101148393B1 (ko) 2012-05-21
TW201011855A (en) 2010-03-16
CN101604610A (zh) 2009-12-16
JP5551346B2 (ja) 2014-07-16
CN101604610B (zh) 2013-02-13
JP2009302106A (ja) 2009-12-24
KR20090128339A (ko) 2009-12-15
KR101514108B1 (ko) 2015-04-22
KR20110069748A (ko) 2011-06-23

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