CN100421212C - 真空腔室和真空处理装置 - Google Patents

真空腔室和真空处理装置 Download PDF

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Publication number
CN100421212C
CN100421212C CNB2006101289226A CN200610128922A CN100421212C CN 100421212 C CN100421212 C CN 100421212C CN B2006101289226 A CNB2006101289226 A CN B2006101289226A CN 200610128922 A CN200610128922 A CN 200610128922A CN 100421212 C CN100421212 C CN 100421212C
Authority
CN
China
Prior art keywords
main frame
vacuum chamber
vacuum
frame body
reinforcement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2006101289226A
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English (en)
Chinese (zh)
Other versions
CN1925111A (zh
Inventor
冈部星儿
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Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN1925111A publication Critical patent/CN1925111A/zh
Application granted granted Critical
Publication of CN100421212C publication Critical patent/CN100421212C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
CNB2006101289226A 2005-09-02 2006-09-04 真空腔室和真空处理装置 Expired - Fee Related CN100421212C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005255294A JP4791110B2 (ja) 2005-09-02 2005-09-02 真空チャンバおよび真空処理装置
JP2005-255294 2005-09-02
JP2005255294 2005-09-02

Publications (2)

Publication Number Publication Date
CN1925111A CN1925111A (zh) 2007-03-07
CN100421212C true CN100421212C (zh) 2008-09-24

Family

ID=37817679

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2006101289226A Expired - Fee Related CN100421212C (zh) 2005-09-02 2006-09-04 真空腔室和真空处理装置

Country Status (4)

Country Link
JP (1) JP4791110B2 (enExample)
KR (1) KR100856145B1 (enExample)
CN (1) CN100421212C (enExample)
TW (1) TWI406332B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8033772B2 (en) 2002-06-21 2011-10-11 Applied Materials, Inc. Transfer chamber for vacuum processing system

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101101757B1 (ko) * 2005-11-07 2012-01-05 주성엔지니어링(주) 제조비용을 절감한 진공챔버
JP5232801B2 (ja) * 2007-12-14 2013-07-10 株式会社アルバック チャンバ及び成膜装置
JP5551346B2 (ja) * 2008-06-10 2014-07-16 東京エレクトロン株式会社 チャンバ及び処理装置
CN102272350B (zh) * 2009-01-14 2014-12-24 株式会社爱发科 等离子cvd装置
FI122940B (fi) * 2009-02-09 2012-09-14 Beneq Oy Reaktiokammio
KR20110067939A (ko) * 2009-12-15 2011-06-22 주식회사 테스 로드락 챔버
KR101598176B1 (ko) * 2010-03-30 2016-02-26 주식회사 원익아이피에스 진공챔버
JP5526988B2 (ja) * 2010-04-28 2014-06-18 東京エレクトロン株式会社 基板処理装置及び基板処理システム
KR101363064B1 (ko) * 2012-05-22 2014-02-14 박종민 진공 챔버 구조
KR102161685B1 (ko) * 2013-09-26 2020-10-05 어플라이드 머티어리얼스, 인코포레이티드 기판 프로세싱을 위한 혼합형-플랫폼 장치, 시스템들, 및 방법들
JP7023097B2 (ja) * 2016-12-28 2022-02-21 東京エレクトロン株式会社 真空チャンバおよび真空チャンバの扉の施錠方法
JP6625597B2 (ja) * 2017-11-13 2019-12-25 平田機工株式会社 搬送チャンバ
JP7277137B2 (ja) * 2018-12-28 2023-05-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および搬送モジュール
KR102193096B1 (ko) 2019-01-31 2020-12-21 (주)에프티엘 진공챔버의 리브를 용접하기 위한 용접지그장치
KR102720200B1 (ko) * 2019-10-10 2024-10-21 주성엔지니어링(주) 클러스터형 기판처리장치
WO2025047616A1 (ja) * 2023-08-31 2025-03-06 キヤノントッキ株式会社 真空チャンバ及び成膜装置
KR102785109B1 (ko) 2024-08-30 2025-03-26 주식회사 창하이앤지 리브를 용접하기 위한 용접 테이블 장치
KR102785110B1 (ko) 2024-08-30 2025-03-26 주식회사 창하이앤지 용접용 지그

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10135231A (ja) * 1996-10-31 1998-05-22 Tokyo Electron Ltd 縦型熱処理装置およびそのボートと保温筒のメンテナンス方法
US5914493A (en) * 1997-02-21 1999-06-22 Nikon Corporation Charged-particle-beam exposure apparatus and methods with substrate-temperature control
US6241117B1 (en) * 1997-11-26 2001-06-05 Steven R. Wickins Pressure differential containment structure
JP2004089872A (ja) * 2002-08-30 2004-03-25 Tsukishima Kikai Co Ltd 真空装置
CN1574270A (zh) * 2003-06-24 2005-02-02 东京毅力科创株式会社 处理设备、处理方法、压力控制方法、传送方法以及传送设备

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4253107B2 (ja) * 2000-08-24 2009-04-08 キヤノンアネルバ株式会社 基板処理装置及びその増設方法
JP4003412B2 (ja) * 2001-06-20 2007-11-07 株式会社島津製作所 真空チャンバ及びその真空チャンバを用いた液晶注入装置
JP2003077974A (ja) * 2001-08-31 2003-03-14 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
JP2003188226A (ja) * 2001-12-18 2003-07-04 Anelva Corp 真空搬送処理装置
JP2004311640A (ja) * 2003-04-04 2004-11-04 Tokyo Electron Ltd 処理容器
DE602004019835D1 (de) * 2003-04-22 2009-04-23 Asml Netherlands Bv Träger und Verfahren zur Herstellung eines Trägers
JP2004335743A (ja) * 2003-05-08 2004-11-25 Ulvac Japan Ltd 真空処理装置用真空チャンバー
KR100441875B1 (ko) * 2003-06-02 2004-07-27 주성엔지니어링(주) 분리형 이송 챔버
JP4767574B2 (ja) * 2005-03-31 2011-09-07 東京エレクトロン株式会社 処理チャンバおよび処理装置
JP4079157B2 (ja) * 2005-04-12 2008-04-23 東京エレクトロン株式会社 ゲートバルブ装置及び処理システム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10135231A (ja) * 1996-10-31 1998-05-22 Tokyo Electron Ltd 縦型熱処理装置およびそのボートと保温筒のメンテナンス方法
US5914493A (en) * 1997-02-21 1999-06-22 Nikon Corporation Charged-particle-beam exposure apparatus and methods with substrate-temperature control
US6241117B1 (en) * 1997-11-26 2001-06-05 Steven R. Wickins Pressure differential containment structure
JP2004089872A (ja) * 2002-08-30 2004-03-25 Tsukishima Kikai Co Ltd 真空装置
CN1574270A (zh) * 2003-06-24 2005-02-02 东京毅力科创株式会社 处理设备、处理方法、压力控制方法、传送方法以及传送设备

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8033772B2 (en) 2002-06-21 2011-10-11 Applied Materials, Inc. Transfer chamber for vacuum processing system

Also Published As

Publication number Publication date
KR20070026215A (ko) 2007-03-08
TWI406332B (zh) 2013-08-21
JP2007073542A (ja) 2007-03-22
JP4791110B2 (ja) 2011-10-12
TW200731391A (en) 2007-08-16
CN1925111A (zh) 2007-03-07
KR100856145B1 (ko) 2008-09-03

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