KR100838460B1 - 서포트 플레이트의 첩합도구와 첩합장치, 및 서포트 플레이트의 첩합방법 - Google Patents

서포트 플레이트의 첩합도구와 첩합장치, 및 서포트 플레이트의 첩합방법 Download PDF

Info

Publication number
KR100838460B1
KR100838460B1 KR1020060122163A KR20060122163A KR100838460B1 KR 100838460 B1 KR100838460 B1 KR 100838460B1 KR 1020060122163 A KR1020060122163 A KR 1020060122163A KR 20060122163 A KR20060122163 A KR 20060122163A KR 100838460 B1 KR100838460 B1 KR 100838460B1
Authority
KR
South Korea
Prior art keywords
support plate
substrate
plate
bonding
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020060122163A
Other languages
English (en)
Korean (ko)
Other versions
KR20070059994A (ko
Inventor
아키히코 나카무라
아쯔시 미야나리
요시히로 이나오
Original Assignee
도쿄 오카 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄 오카 고교 가부시키가이샤 filed Critical 도쿄 오카 고교 가부시키가이샤
Publication of KR20070059994A publication Critical patent/KR20070059994A/ko
Application granted granted Critical
Publication of KR100838460B1 publication Critical patent/KR100838460B1/ko
Assigned to 아이메카테크 가부시키가이샤 reassignment 아이메카테크 가부시키가이샤 권리의 전부이전등록 Assignors: 도쿄 오카 고교 가부시키가이샤
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B32B38/1841—Positioning, e.g. registration or centering during laying up
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B2038/1891—Using a robot for handling the layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020060122163A 2005-12-06 2006-12-05 서포트 플레이트의 첩합도구와 첩합장치, 및 서포트 플레이트의 첩합방법 Active KR100838460B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005352594A JP4781802B2 (ja) 2005-12-06 2005-12-06 サポートプレートの貼り合わせ手段及び貼り合わせ装置、並びにサポートプレートの貼り合わせ方法
JPJP-P-2005-00352594 2005-12-06

Publications (2)

Publication Number Publication Date
KR20070059994A KR20070059994A (ko) 2007-06-12
KR100838460B1 true KR100838460B1 (ko) 2008-06-16

Family

ID=38117556

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060122163A Active KR100838460B1 (ko) 2005-12-06 2006-12-05 서포트 플레이트의 첩합도구와 첩합장치, 및 서포트 플레이트의 첩합방법

Country Status (4)

Country Link
US (2) US8136564B2 (https=)
JP (1) JP4781802B2 (https=)
KR (1) KR100838460B1 (https=)
TW (1) TW200731447A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170044216A (ko) * 2012-02-09 2017-04-24 도오꾜오까고오교 가부시끼가이샤 첩부 방법 및 첩부 장치

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100034450A (ko) * 2008-09-24 2010-04-01 삼성전자주식회사 기판접합장치
JP5149207B2 (ja) * 2009-01-13 2013-02-20 株式会社荏原製作所 基板搭載装置
US8267143B2 (en) * 2009-04-16 2012-09-18 Suss Microtec Lithography, Gmbh Apparatus for mechanically debonding temporary bonded semiconductor wafers
JP5449239B2 (ja) * 2010-05-12 2014-03-19 東京エレクトロン株式会社 基板処理装置、基板処理方法及びプログラムを記録した記憶媒体
JP5572575B2 (ja) * 2010-05-12 2014-08-13 東京エレクトロン株式会社 基板位置決め装置、基板処理装置、基板位置決め方法及びプログラムを記録した記憶媒体
SG179299A1 (en) * 2010-09-13 2012-04-27 Trimech Technology Pte Ltd A display panel substrate assembly, an apparatus and a method for forming a display panel substrate assembly
JP6018732B2 (ja) * 2011-03-25 2016-11-02 不二越機械工業株式会社 ワーク貼着方法およびワーク貼着装置
DE102011113292A1 (de) * 2011-09-05 2013-03-07 Schmid Vacuum Technology Gmbh Vakuumdurchführung und Vakuumbeschichtungsvorrichtung mit Vakuumdurchführungen
JP5427856B2 (ja) * 2011-09-07 2014-02-26 東京エレクトロン株式会社 接合方法、プログラム、コンピュータ記憶媒体及び接合システム
JP5913914B2 (ja) 2011-11-08 2016-04-27 東京応化工業株式会社 基板処理装置及び基板処理方法
JP5639617B2 (ja) * 2012-05-11 2014-12-10 東京応化工業株式会社 貼付装置および貼付方法
JP6001934B2 (ja) 2012-06-25 2016-10-05 東京応化工業株式会社 重ね合わせ装置および重ね合わせ方法
JP6088835B2 (ja) 2012-09-28 2017-03-01 東京応化工業株式会社 貼合装置および貼り合わせ方法
WO2014157082A1 (ja) 2013-03-29 2014-10-02 東京応化工業株式会社 貼付方法
CN103273719B (zh) * 2013-06-07 2015-09-09 无锡隆盛科技股份有限公司 氧传感器芯片叠压装置
JP5585689B2 (ja) * 2013-06-13 2014-09-10 株式会社ニコン 基板ホルダおよび貼り合せ装置
JP6374680B2 (ja) * 2013-12-13 2018-08-15 東京応化工業株式会社 貼付方法
WO2017066418A1 (en) * 2015-10-15 2017-04-20 Applied Materials, Inc. Substrate carrier system
CN106739424B (zh) * 2015-11-20 2020-02-14 财团法人工业技术研究院 取下贴合装置及应用此装置的取下方法与贴合方法
JP6612670B2 (ja) * 2016-03-31 2019-11-27 東京応化工業株式会社 基板処理装置、及び、基板処理方法
US10730276B2 (en) * 2017-01-17 2020-08-04 Maven Optronics Co., Ltd. System and method for vacuum film lamination
CN108110096B (zh) * 2018-02-10 2024-09-06 江苏应材微机电科技有限公司 一种led生产设备用新型扩晶机
CN108711556B (zh) * 2018-05-25 2020-06-19 北京北方华创微电子装备有限公司 去气腔室以及去气方法
CN109473380A (zh) * 2018-10-26 2019-03-15 志圣科技（广州）有限公司 晶圆加工机台及其加工方法
CN111029292B (zh) * 2019-12-25 2022-08-02 山东天岳先进科技股份有限公司 一种晶锭的粘结分离装置及方法
KR102377036B1 (ko) * 2020-02-24 2022-03-22 피에스케이홀딩스 (주) 정렬 장치, 그리고 이를 포함하는 기판 처리 장치
KR102515863B1 (ko) * 2020-03-24 2023-03-31 주식회사 히타치하이테크 진공 처리 장치
JP7688884B2 (ja) * 2020-08-28 2025-06-05 Ａｉメカテック株式会社 基板処理装置、及び基板処理方法
KR102840203B1 (ko) 2020-09-01 2025-08-01 삼성전자주식회사 기판 정렬 장치 및 이를 구비하는 기판 본딩 설비
JP2022087393A (ja) * 2020-12-01 2022-06-13 ウシオ電機株式会社 Ｌｅｄ素子及びその製造方法
JP7578905B2 (ja) * 2020-12-01 2024-11-07 ウシオ電機株式会社 Ｌｅｄ素子及びその製造方法
CN113263820A (zh) * 2021-05-19 2021-08-17 曹健 一种复合结构铁粉芯胚体堆叠均匀压制装置
JP7580129B2 (ja) 2022-04-12 2024-11-11 Ａｉメカテック株式会社 基板重ね合わせ装置及び基板重ね合わせ方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950031408A (ko) * 1994-04-19 1995-12-18 하르트무트 디에크위쉬 막 프레스와 가공편 상승방법
JP2002192394A (ja) * 2000-12-28 2002-07-10 Mitsubishi Gas Chem Co Inc 無機基板のプレス加工法およびプレス装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3902255A1 (de) * 1989-01-26 1990-08-02 Nokia Unterhaltungselektronik Verfahren und vorrichtung zum herstellen einer fluessigkristallzelle
JP2945089B2 (ja) * 1990-07-05 1999-09-06 古河電気工業株式会社 ウエハへのテープ貼付装置
JPH065109A (ja) 1992-06-23 1994-01-14 Matsushita Electric Works Ltd 太陽光採光装置
JP4689797B2 (ja) * 2000-07-19 2011-05-25 Ｎｅｃ液晶テクノロジー株式会社 液晶表示装置の製造装置及びその製造方法
JP2002137352A (ja) * 2000-08-25 2002-05-14 Internatl Business Mach Corp <Ibm> シート材の積層方法、シート材の積層装置、液晶表示パネルの製造方法および液晶表示パネルの製造装置
JP3742000B2 (ja) * 2000-11-30 2006-02-01 富士通株式会社 プレス装置
US6808566B2 (en) * 2001-09-19 2004-10-26 Tokyo Electron Limited Reduced-pressure drying unit and coating film forming method
US6845779B2 (en) 2001-11-13 2005-01-25 Fsi International, Inc. Edge gripping device for handling a set of semiconductor wafers in an immersion processing system
JP2004165403A (ja) * 2002-11-13 2004-06-10 Ricoh Co Ltd アライメント接着方法およびアライメント接着装置
JP2005191535A (ja) * 2003-12-01 2005-07-14 Tokyo Ohka Kogyo Co Ltd 貼り付け装置および貼り付け方法
WO2005055312A1 (ja) * 2003-12-04 2005-06-16 Hirata Corporation 基板位置決めシステム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950031408A (ko) * 1994-04-19 1995-12-18 하르트무트 디에크위쉬 막 프레스와 가공편 상승방법
JP2002192394A (ja) * 2000-12-28 2002-07-10 Mitsubishi Gas Chem Co Inc 無機基板のプレス加工法およびプレス装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170044216A (ko) * 2012-02-09 2017-04-24 도오꾜오까고오교 가부시끼가이샤 첩부 방법 및 첩부 장치
KR101959151B1 (ko) * 2012-02-09 2019-03-15 도오꾜오까고오교 가부시끼가이샤 첩부 방법 및 첩부 장치

Also Published As

Publication number Publication date
KR20070059994A (ko) 2007-06-12
US8136564B2 (en) 2012-03-20
US20070125495A1 (en) 2007-06-07
TW200731447A (en) 2007-08-16
TWI323923B (https=) 2010-04-21
US8931535B2 (en) 2015-01-13
JP2007158122A (ja) 2007-06-21
US20120132359A1 (en) 2012-05-31
JP4781802B2 (ja) 2011-09-28

Similar Documents

Publication Publication Date Title
KR100838460B1 (ko) 서포트 플레이트의 첩합도구와 첩합장치, 및 서포트 플레이트의 첩합방법
KR101303384B1 (ko) 적층 장치
KR101553801B1 (ko) 첩부 방법
US20110214809A1 (en) Bonding apparatus and bonding method
US8999758B2 (en) Fixing semiconductor die in dry and pressure supported assembly processes
US20090008802A1 (en) Flexible carrier for high volume electronic package fabrication
KR20120027237A (ko) 웨이퍼 가접합 및 분리를 위한 개선된 장치
TWI629754B (zh) Manufacturing apparatus and manufacturing method of metal-ceramic plate laminate, manufacturing apparatus of substrate for power module, and manufacturing method
KR101193308B1 (ko) 서포트플레이트의 첩부장치
CN110678288B (zh) 用于产生焊接连接部的方法
CN110858552B (zh) 一种键合设备和键合方法
JP2011151264A (ja) 加熱装置および実装体の製造方法
KR20050053008A (ko) 첩부장치 및 첩부방법
KR20060059826A (ko) 서포트플레이트의 첩부방법
TW201448062A (zh) 半導體裝置之製造方法
TW202236451A (zh) 基板黏貼裝置及基板黏貼方法
TW201501215A (zh) 密封片貼附方法及密封片貼附裝置
WO2015087763A1 (ja) 封止シート貼付け方法
CN112992736A (zh) 扇出型芯片封装装置以及方法
JPH11111875A (ja) 仮固定治具及びキャップ接着装置
JP7782990B2 (ja) 半導体装置の製造方法、ワーク一体化装置、およびフィルム積層体
CN110476234A (zh) 基板固定治具和使用基板固定治具的半导体装置的制造方法
KR20010063393A (ko) 열 압착 원리를 이용한 필름의 완전 평면 접착 방법 및 그장치
JP2008084994A (ja) 固体撮像装置の製造方法および製造装置、並びに貼付装置
WO2015105149A1 (ja) 半導体装置の実装方法および実装装置

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20130524

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20140530

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20150515

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20160517

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20170522

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

FPAY Annual fee payment

Payment date: 20180516

Year of fee payment: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

FPAY Annual fee payment

Payment date: 20190515

Year of fee payment: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 15

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 16

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 17

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000