KR100833399B1 - 광반도체 소자 봉지용 에폭시 수지 조성물 및 이를 사용한광반도체 장치 - Google Patents
광반도체 소자 봉지용 에폭시 수지 조성물 및 이를 사용한광반도체 장치 Download PDFInfo
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- KR100833399B1 KR100833399B1 KR1020040082488A KR20040082488A KR100833399B1 KR 100833399 B1 KR100833399 B1 KR 100833399B1 KR 1020040082488 A KR1020040082488 A KR 1020040082488A KR 20040082488 A KR20040082488 A KR 20040082488A KR 100833399 B1 KR100833399 B1 KR 100833399B1
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- South Korea
- Prior art keywords
- epoxy resin
- optical semiconductor
- resin composition
- component
- formula
- Prior art date
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 88
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 88
- 239000000203 mixture Substances 0.000 title claims abstract description 42
- 230000003287 optical effect Effects 0.000 title claims description 34
- 239000004065 semiconductor Substances 0.000 title claims description 34
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 29
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000003063 flame retardant Substances 0.000 claims abstract description 23
- 239000005011 phenolic resin Substances 0.000 claims abstract description 21
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims abstract description 20
- 235000010290 biphenyl Nutrition 0.000 claims abstract description 10
- 239000004305 biphenyl Substances 0.000 claims abstract description 10
- 125000001624 naphthyl group Chemical group 0.000 claims abstract description 10
- 239000003054 catalyst Substances 0.000 claims abstract description 9
- -1 cyclic phosphazene compound Chemical class 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 3
- 125000000524 functional group Chemical group 0.000 claims description 2
- 125000000962 organic group Chemical group 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000011256 inorganic filler Substances 0.000 claims 1
- 229910003475 inorganic filler Inorganic materials 0.000 claims 1
- 239000011342 resin composition Substances 0.000 abstract description 2
- 238000002834 transmittance Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 229920001568 phenolic resin Polymers 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000003878 thermal aging Methods 0.000 description 5
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000001588 bifunctional effect Effects 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- 239000012796 inorganic flame retardant Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- FKBMTBAXDISZGN-UHFFFAOYSA-N 5-methyl-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1C(C)CCC2C(=O)OC(=O)C12 FKBMTBAXDISZGN-UHFFFAOYSA-N 0.000 description 3
- 239000002518 antifoaming agent Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000003398 denaturant Substances 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- LYWVNPSVLAFTFX-UHFFFAOYSA-N 4-methylbenzenesulfonate;morpholin-4-ium Chemical compound C1COCCN1.CC1=CC=C(S(O)(=O)=O)C=C1 LYWVNPSVLAFTFX-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical group CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 1
- 150000002898 organic sulfur compounds Chemical class 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/5399—Phosphorus bound to nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/16—Addition or condensation polymers of aldehydes or ketones according to C08L59/00 - C08L61/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (6)
- 하기 (A) 내지 (D) 성분을 포함하고, 무기 충전제를 포함하지 않으며, 이 때 (C) 성분인 유기 인계 난연제의 함유량이 에폭시 수지 조성물의 총 중량을 기준으로 1.5 내지 10중량%인 광반도체 소자 봉지용 에폭시 수지 조성물:(A) 1 분자중에 바이페닐 골격 및 나프탈렌 골격중 하나 이상을 갖는 노볼락형 에폭시 수지를 에폭시 수지 성분의 총 중량을 기준으로 50 내지 100중량%의 양으로 포함하는 에폭시 수지 성분,(B) 1 분자중에 바이페닐 골격 및 나프탈렌 골격중 하나 이상을 갖는 노볼락형 페놀 수지를 경화제 성분의 총 중량을 기준으로 50 내지 100중량%의 양으로 포함하는 경화제 성분,(C) 유기 인계 난연제, 및(D) 경화 촉매.
- 제 1 항에 있어서,경화제 성분(B)으로부터 유도된 페놀 작용기에 대한 에폭시 수지 성분(A)으로부터 유도된 에폭시 작용기 수의 당량비가 0.7 내지 1.5인 광반도체 소자 봉지용 에폭시 수지 조성물.
- 제 1 항 내지 제 5 항중 어느 한 항에 따른 광반도체 소자 봉지용 에폭시 수지 조성물을 사용하여 광반도체 소자를 봉지함으로써 제조된 광반도체 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2003-00356772 | 2003-10-16 | ||
JP2003356772A JP2005120228A (ja) | 2003-10-16 | 2003-10-16 | 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050036808A KR20050036808A (ko) | 2005-04-20 |
KR100833399B1 true KR100833399B1 (ko) | 2008-05-28 |
Family
ID=34373612
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020040082488A KR100833399B1 (ko) | 2003-10-16 | 2004-10-15 | 광반도체 소자 봉지용 에폭시 수지 조성물 및 이를 사용한광반도체 장치 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7345102B2 (ko) |
EP (1) | EP1524285B1 (ko) |
JP (1) | JP2005120228A (ko) |
KR (1) | KR100833399B1 (ko) |
CN (1) | CN1621481B (ko) |
TW (1) | TWI333965B (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100861324B1 (ko) * | 2005-12-29 | 2008-10-01 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 |
JP2007224162A (ja) * | 2006-02-23 | 2007-09-06 | Matsushita Electric Works Ltd | 難燃性樹脂組成物、プリプレグ、樹脂シート、成形品 |
US20070269586A1 (en) * | 2006-05-17 | 2007-11-22 | 3M Innovative Properties Company | Method of making light emitting device with silicon-containing composition |
JP4950770B2 (ja) | 2006-09-21 | 2012-06-13 | 日東電工株式会社 | 光半導体封止用エポキシ樹脂組成物およびその硬化体ならびにそれを用いた光半導体装置 |
CN101302326B (zh) * | 2007-05-10 | 2010-09-08 | 长春人造树脂厂股份有限公司 | 阻燃性树脂组合物 |
KR20090078051A (ko) * | 2008-01-14 | 2009-07-17 | 도레이새한 주식회사 | 할로겐프리 커버레이 필름용 접착제 조성물 및 이를구비하는 커버레이 필름 |
JP5615521B2 (ja) * | 2009-08-07 | 2014-10-29 | 日東電工株式会社 | 感光性樹脂組成物およびそれを用いたフレキシブル回路基板、ならびにその回路基板の製法 |
US8916655B2 (en) | 2010-04-30 | 2014-12-23 | Dow Global Technologies Llc | Phosphazene blocked imidazole as latent catalyst for epoxy resins |
JP5442529B2 (ja) * | 2010-05-10 | 2014-03-12 | 日東電工株式会社 | 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置。 |
CN102633990A (zh) * | 2012-04-05 | 2012-08-15 | 广东生益科技股份有限公司 | 环氧树脂组合物及使用其制作的半固化片与覆铜箔层压板 |
CN104804378A (zh) * | 2015-04-29 | 2015-07-29 | 海太半导体(无锡)有限公司 | 一种半导体塑封材料 |
CN105384781B (zh) * | 2015-11-02 | 2018-02-09 | 中北大学 | 苯酚基桥连环磷腈添加型阻燃剂及其制备方法 |
Citations (1)
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EP0915118A1 (en) * | 1997-11-10 | 1999-05-12 | Sumitomo Bakelite Company Limited | Epoxy resin composition and semiconductor device encupsulated therewith |
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JPH0593038A (ja) * | 1991-07-30 | 1993-04-16 | Dai Ichi Kogyo Seiyaku Co Ltd | エポキシ樹脂組成物 |
CN1073127C (zh) * | 1995-09-29 | 2001-10-17 | 东芝化学株式会社 | 无卤素的阻燃性环氧树脂组合物及含有此树脂组合物的预浸料和叠层板 |
JPH09100337A (ja) | 1995-10-04 | 1997-04-15 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物及びこれを用いた半導体装置 |
US5869553A (en) * | 1995-12-22 | 1999-02-09 | Sumitomo Bakelite Company Limited | Epoxy resin composition comprising red phosphorus |
CN1150597A (zh) * | 1996-04-29 | 1997-05-28 | 无锡市化工研究设计院 | 电器封装用增强型环氧模塑料的制备方法 |
CN1099441C (zh) * | 1997-07-02 | 2003-01-22 | 住友电木株式会社 | 半导体密封用的环氧树脂组合物和半导体器件 |
JP3432445B2 (ja) * | 1999-03-30 | 2003-08-04 | 住友ベークライト株式会社 | 光半導体用エポキシ樹脂組成物及び半導体装置 |
JP3489025B2 (ja) * | 2000-01-14 | 2004-01-19 | 大塚化学ホールディングス株式会社 | エポキシ樹脂組成物及びそれを用いた電子部品 |
JP3394736B2 (ja) * | 2000-02-04 | 2003-04-07 | 日東電工株式会社 | エポキシ樹脂組成物および半導体装置 |
JP3394029B2 (ja) * | 2000-03-21 | 2003-04-07 | 大塚化学株式会社 | 難燃性エポキシ樹脂組成物、及びその成形物、及び電子部品 |
JP2001329142A (ja) * | 2000-05-22 | 2001-11-27 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP4765151B2 (ja) * | 2000-08-23 | 2011-09-07 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
WO2002090434A1 (en) | 2001-04-23 | 2002-11-14 | Sumitomo Bakelite Company Limited | Epoxy resin composition and semiconductor device |
JP2003138098A (ja) | 2001-10-30 | 2003-05-14 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2003268208A (ja) | 2002-01-11 | 2003-09-25 | Shin Etsu Chem Co Ltd | 半導体封止用難燃性エポキシ樹脂組成物及び半導体装置 |
JP2003206394A (ja) * | 2002-01-16 | 2003-07-22 | Otsuka Chemical Holdings Co Ltd | エポキシ樹脂組成物 |
JP2003226796A (ja) * | 2002-02-07 | 2003-08-12 | Shin Etsu Chem Co Ltd | 半導体封止用難燃性エポキシ樹脂組成物及び半導体装置 |
KR100584069B1 (ko) * | 2002-10-10 | 2006-05-29 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 반도체 밀봉용 난연성 에폭시 수지 조성물 및 반도체 장치 |
JP2005008835A (ja) * | 2003-06-23 | 2005-01-13 | Kyocera Chemical Corp | 封止用樹脂組成物および半導体封止装置 |
-
2003
- 2003-10-16 JP JP2003356772A patent/JP2005120228A/ja active Pending
-
2004
- 2004-10-14 EP EP04024529A patent/EP1524285B1/en not_active Not-in-force
- 2004-10-15 KR KR1020040082488A patent/KR100833399B1/ko active IP Right Grant
- 2004-10-15 TW TW093131333A patent/TWI333965B/zh not_active IP Right Cessation
- 2004-10-15 US US10/965,023 patent/US7345102B2/en not_active Expired - Fee Related
- 2004-10-18 CN CN2004100857730A patent/CN1621481B/zh not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0915118A1 (en) * | 1997-11-10 | 1999-05-12 | Sumitomo Bakelite Company Limited | Epoxy resin composition and semiconductor device encupsulated therewith |
Non-Patent Citations (1)
Title |
---|
유럽공개특허공보 0 915 118 A1 |
Also Published As
Publication number | Publication date |
---|---|
CN1621481B (zh) | 2010-05-26 |
KR20050036808A (ko) | 2005-04-20 |
CN1621481A (zh) | 2005-06-01 |
US7345102B2 (en) | 2008-03-18 |
JP2005120228A (ja) | 2005-05-12 |
TWI333965B (en) | 2010-12-01 |
EP1524285A1 (en) | 2005-04-20 |
TW200519135A (en) | 2005-06-16 |
EP1524285B1 (en) | 2012-12-12 |
US20050101709A1 (en) | 2005-05-12 |
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