KR100794544B1 - 범프가 부착된 배선회로 기판 및 그 제조방법 - Google Patents
범프가 부착된 배선회로 기판 및 그 제조방법 Download PDFInfo
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- KR100794544B1 KR100794544B1 KR1020010060759A KR20010060759A KR100794544B1 KR 100794544 B1 KR100794544 B1 KR 100794544B1 KR 1020010060759 A KR1020010060759 A KR 1020010060759A KR 20010060759 A KR20010060759 A KR 20010060759A KR 100794544 B1 KR100794544 B1 KR 100794544B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (11)
- 삭제
- 삭제
- 삭제
- 삭제
- 배선회로 상에 선단면의 표면 조도가 0.2 내지 20㎛ 인 범프가 형성된 범프가 부착된 배선회로 기판의 제조방법에 있어서,(a) 상기 배선회로의 두께와 상기 배선회로에 형성할 상기 범프의 높이를 합산한 두께를 가지며 표면 조도가 0.2 내지 20㎛ 인 금속박의 범프 형성면에 보호필름을 적층하고, 상기 금속박의 배선회로 형성면에 배선회로 형성용 에칭마스크를 형성하는 공정,(b) 상기 배선회로 형성용 에칭마스크측으로부터 상기 금속박을 하프 에칭하여 소정 두께의 배선회로를 형성하는 공정,(c) 상기 배선회로 형성용 에칭마스크를 제거한 후에 상기 배선회로에 커버코트층을 형성하는 공정,(d) 상기 금속박의 상기 범프 형성면에 형성된 상기 보호필름을 제거한 후에 상기 범프 형성면에 범프 형성용 에칭마스크를 형성하는 공정,(e) 상기 범프 형성용 에칭마스크측으로부터 상기 금속박을 하프 에칭하여 소정 높이의 범프를 형성하는 공정,(f) 상기 범프 형성용 에칭마스크를 제거한 후에 상기 범프를 메우도록 폴리이미드 전구체층을 형성하는 공정 및,(g) 상기 폴리이미드 전구체층을 에칭하고 이미드화시켜 소정 두께의 절연층 을 형성하는 공정을 포함하여 이루어진 것을 특징으로 하는 범프가 부착된 배선회로 기판의 제조방법.
- 제 5 항에 있어서,상기 공정 (f) 에서 상기 범프 형성용 에칭마스크를 제거한 후에, 상기 금속박과 다른 금속으로 이루어진 금속박막층을 형성하고, 그 금속박막층 상에 상기 범프를 메우도록 폴리이미드 전구체층을 형성하는 것을 특징으로 하는 범프가 부착된 배선회로 기판의 제조방법.
- 제 6 항에 있어서,상기 금속박막층이 상기 금속박보다 상기 폴리이미드 전구체층에 대하여 높은 접착력을 갖는 것을 특징으로 하는 범프가 부착된 배선회로 기판의 제조방법.
- 배선회로 상에 선단면의 표면 조도가 0.2 내지 20㎛ 인 범프가 형성된 범프가 부착된 배선회로 기판의 제조방법에 있어서,(aa) 상기 배선회로의 두께와 상기 배선회로에 형성할 상기 범프의 높이를 합산한 두께를 가지며 표면 조도가 0.2 내지 20㎛ 인 금속박의 배선회로 형성면에 보호필름을 적층하고, 상기 금속박의 범프 형성면에 범프 형성용 에칭마스크를 형성하는 공정,(bb) 상기 범프 형성용 에칭마스크측으로부터 상기 금속박을 하프 에칭하여 소정 높이의 범프를 형성하는 공정,(cc) 상기 범프 형성용 에칭마스크를 제거한 후에 상기 범프를 메우도록 폴리이미드 전구체층을 형성하는 공정,(dd) 상기 폴리이미드 전구체층을 에칭하고 이미드화시켜 소정 두께의 절연층을 형성하는 공정,(ee) 상기 금속박의 상기 배선회로 형성면에 형성된 상기 보호필름을 제거한 후에 상기 배선회로 형성면에 배선회로 형성용 에칭마스크를 형성하는 공정,(ff) 상기 배선회로 형성용 에칭마스크측으로부터 상기 금속박을 하프 에칭하여 소정 두께의 배선회로를 형성하는 공정 및,(gg) 상기 배선회로 형성용 에칭마스크를 제거한 후에 상기 배선회로에 커버코트층을 형성하는 공정을 포함하여 이루어진 것을 특징으로 하는 범프가 부착된 배선회로 기판의 제조방법.
- 제 8 항에 있어서,상기 공정 (cc) 에서 상기 범프 형성용 에칭마스크를 제거한 후에 상기 금속박과 다른 금속으로 이루어진 금속박막층을 형성하고, 이 금속박막층 상에 상기 범프를 메우도록 폴리이미드 전구체층을 형성하는 것을 특징으로 하는 범프가 부착된 배선회로 기판의 제조방법.
- 제 9 항에 있어서,상기 금속박막층은 상기 금속박보다 상기 폴리이미드 전구체층에 대하여 높은 접착력을 갖는 것을 특징으로 하는 범프가 부착된 배선회로 기판의 제조방법.
- 삭제
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JPJP-P-2000-00303745 | 2000-10-03 | ||
JP2000303745A JP2002111185A (ja) | 2000-10-03 | 2000-10-03 | バンプ付き配線回路基板及びその製造方法 |
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KR20020026849A KR20020026849A (ko) | 2002-04-12 |
KR100794544B1 true KR100794544B1 (ko) | 2008-01-17 |
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KR1020010060759A KR100794544B1 (ko) | 2000-10-03 | 2001-09-28 | 범프가 부착된 배선회로 기판 및 그 제조방법 |
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US (2) | US6800816B2 (ko) |
JP (1) | JP2002111185A (ko) |
KR (1) | KR100794544B1 (ko) |
CN (1) | CN1346147A (ko) |
TW (1) | TW497188B (ko) |
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JP3593935B2 (ja) * | 1999-11-10 | 2004-11-24 | ソニーケミカル株式会社 | バンプ付き配線回路基板の製造方法及びバンプ形成方法 |
US7006883B2 (en) * | 2001-10-10 | 2006-02-28 | Semiconductor Energy Laboratory Co., Ltd. | Production system for composite product and production method for manufacturing of same |
WO2003085728A1 (en) * | 2002-04-11 | 2003-10-16 | Koninklijke Philips Electronics N.V. | Carrier, method of manufacturing a carrier and an electronic device |
CN101621015B (zh) * | 2008-07-04 | 2011-03-23 | 南茂科技股份有限公司 | 平坦化金属凸块表面的方法 |
JP5147779B2 (ja) * | 2009-04-16 | 2013-02-20 | 新光電気工業株式会社 | 配線基板の製造方法及び半導体パッケージの製造方法 |
JP6996976B2 (ja) * | 2014-12-16 | 2022-01-17 | アンフェノール コーポレイション | プリント回路基板のための高速インターコネクト |
CN109661112B (zh) * | 2017-10-12 | 2020-08-04 | 伟裕(厦门)电子有限公司 | 一种单层铜多种厚度结构的镂空柔性线路板及其制作方法 |
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- 2001-09-28 KR KR1020010060759A patent/KR100794544B1/ko active IP Right Grant
- 2001-10-03 CN CN01137241A patent/CN1346147A/zh active Pending
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Also Published As
Publication number | Publication date |
---|---|
US6800816B2 (en) | 2004-10-05 |
CN1346147A (zh) | 2002-04-24 |
TW497188B (en) | 2002-08-01 |
US7076868B2 (en) | 2006-07-18 |
JP2002111185A (ja) | 2002-04-12 |
US20020038721A1 (en) | 2002-04-04 |
US20040188139A1 (en) | 2004-09-30 |
KR20020026849A (ko) | 2002-04-12 |
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