KR100690227B1 - 포지티브형 감광성 수지 조성물 - Google Patents
포지티브형 감광성 수지 조성물 Download PDFInfo
- Publication number
- KR100690227B1 KR100690227B1 KR1020007008523A KR20007008523A KR100690227B1 KR 100690227 B1 KR100690227 B1 KR 100690227B1 KR 1020007008523 A KR1020007008523 A KR 1020007008523A KR 20007008523 A KR20007008523 A KR 20007008523A KR 100690227 B1 KR100690227 B1 KR 100690227B1
- Authority
- KR
- South Korea
- Prior art keywords
- novolak resin
- low molecular
- molecular weight
- resin composition
- alkali
- Prior art date
Links
- BMCUJWGUNKCREZ-UHFFFAOYSA-N Cc(cc(C(c(cc1C)cc(C)c1O)c(cccc1)c1O)cc1C)c1O Chemical compound Cc(cc(C(c(cc1C)cc(C)c1O)c(cccc1)c1O)cc1C)c1O BMCUJWGUNKCREZ-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
- G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
- G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
Abstract
Description
(2) 해상도
감광성 노볼락 수지 | 저분자 페놀 화합물 | 감도 (mJ/㎠) | 해상도 (㎛) | 패턴 형상 | 스컴 | 마이크로그루빙 | |||
종류 | 첨가량 | 종류 | 첨가량 | ||||||
실시예 1 | C | 90 | D-1 | 10 | 620 | 0.55 | ○ | ○ | ○ |
실시예 2 | C | 90 | D-2 | 10 | 585 | 0.55 | ○ | ○ | ○ |
비교예1 | C | 100 | - | - | 920 | 0.80 | × | × | × |
비교예2 | E | 100 | - | - | 730 | 0.60 | ○ | × | × |
비교예3 | E | 90 | D-1 | 10 | 530 | 0.70 | △ | × | × |
Claims (4)
- 분별처리에 의해 이량체, 삼량체 및 사량체를 포함하는 저분자량 성분이 제거된 알칼리 가용성 노볼락 수지와 o-나프토퀴논디아지드 화합물과의 반응 생성물을 포함하는 감광성 노볼락 수지(i) 및 화학식 I의 페놀성 하이드록실 그룹을 갖는 저분자 화합물(ii)을 함유하는 포지티브형 감광성 수지 조성물로서, 상기 분별처리에서 상당량의 이량체, 삼량체 및 사량체가 침전에 의해 제거되고, 상기 알칼리 가용성 노볼락 수지의 2.38중량%의 수산화테트라메틸암모늄 수용액에 대한 용해속도가 10 내지 180Å/sec임을 특징으로 하는, 포지티브형 감광성 수지 조성물.화학식 I위의 화학식 I에서,R1, R2, R3, R4, R5, R6 및 R7은 각각 독립적으로 H, C1 내지 C4의 알킬 그룹, C1 내지 C4의 알콕시 그룹, 사이클로헥실 그룹 또는 화학식 의 그룹이고,R8은 H, C1 내지 C4의 알킬 그룹, C1 내지 C4의 알콕시 그룹 또는 사이클로헥실 그룹이며,m 및 n은 각각 0, 1 또는 2이고,a, b, c, d, e, f, g 및 h는 a+b≤5, c+d≤5, e+f≤5, g+h≤5를 만족시키는 0 또는 1 내지 5의 정수이며,i는 0, 1 또는 2이다.
- 삭제
- 제1항에 있어서, 분별처리에 의해 이량체, 삼량체 및 사량체를 포함하는 저분자량 성분이 제거된 알칼리 가용성 노볼락 수지가 폴리스티렌 환산 중량 평균 분자량이 3,000 내지 15,000이고, 감광성 노볼락 수지가, 알칼리 가용성 노볼락 수지의 하이드록실 그룹의 수소원자에 대한 o-나프토퀴논디아지드 화합물의 반응 치환율이 3 내지 25mol%임을 특징으로 하는, 포지티브형 감광성 수지 조성물.
- 제1항에 있어서, 화학식 I의 페놀성 하이드록실 그룹을 갖는 저분자 화합물이, 분별처리에 의해 이량체, 삼량체 및 사량체를 포함하는 저분자량 성분이 제거된 알칼리 가용성 노볼락 수지 1O0중량부에 대하여, 0.5 내지 20중량부 함유되어 있는 포지티브형 감광성 수지 조성물.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP35158198 | 1998-12-10 | ||
JP98-351581 | 1998-12-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010040651A KR20010040651A (ko) | 2001-05-15 |
KR100690227B1 true KR100690227B1 (ko) | 2007-03-20 |
Family
ID=18418248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020007008523A KR100690227B1 (ko) | 1998-12-10 | 1999-12-01 | 포지티브형 감광성 수지 조성물 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6475693B1 (ko) |
EP (1) | EP1055969A4 (ko) |
KR (1) | KR100690227B1 (ko) |
CN (1) | CN1306337C (ko) |
TW (1) | TWI224714B (ko) |
WO (1) | WO2000034829A1 (ko) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7192681B2 (en) * | 2001-07-05 | 2007-03-20 | Fuji Photo Film Co., Ltd. | Positive photosensitive composition |
JP2003195495A (ja) * | 2001-12-26 | 2003-07-09 | Tokyo Ohka Kogyo Co Ltd | ポジ型ホトレジスト組成物 |
KR100783603B1 (ko) * | 2002-01-05 | 2007-12-07 | 삼성전자주식회사 | 포토레지스트 조성물 및 이를 사용한 패턴의 형성방법 |
JP3894477B2 (ja) * | 2002-02-27 | 2007-03-22 | Azエレクトロニックマテリアルズ株式会社 | 感光性樹脂組成物 |
US6790582B1 (en) * | 2003-04-01 | 2004-09-14 | Clariant Finance Bvi Limited | Photoresist compositions |
US6905809B2 (en) * | 2003-04-01 | 2005-06-14 | Clariant Finance (Bvi) Limited | Photoresist compositions |
JP4112416B2 (ja) * | 2003-04-04 | 2008-07-02 | 東京応化工業株式会社 | 吐出ノズル式塗布法用ポジ型ホトレジスト組成物及びレジストパターンの形成方法 |
JP2004347682A (ja) * | 2003-05-20 | 2004-12-09 | Tokyo Ohka Kogyo Co Ltd | システムlcd製造用ポジ型ホトレジスト組成物及びレジストパターン形成方法 |
KR100676737B1 (ko) * | 2003-06-30 | 2007-02-01 | 가부시키가이샤 씽크. 라보라토리 | 포지티브형 감광성 조성물 |
US20050033811A1 (en) | 2003-08-07 | 2005-02-10 | International Business Machines Corporation | Collaborative email |
JP3977307B2 (ja) * | 2003-09-18 | 2007-09-19 | 東京応化工業株式会社 | ポジ型フォトレジスト組成物及びレジストパターン形成方法 |
JP4152852B2 (ja) * | 2003-09-30 | 2008-09-17 | 東京応化工業株式会社 | 吐出ノズル式塗布法用ポジ型ホトレジスト組成物及びレジストパターンの形成方法 |
JP4440600B2 (ja) * | 2003-10-31 | 2010-03-24 | Azエレクトロニックマテリアルズ株式会社 | 厚膜および超厚膜対応化学増幅型感光性樹脂組成物 |
US8353896B2 (en) | 2004-04-19 | 2013-01-15 | The Invention Science Fund I, Llc | Controllable release nasal system |
DE602004015513D1 (de) * | 2004-05-27 | 2008-09-11 | Think Labs Kk | Positive lichtempfindliche zusammensetzung |
JP2006154477A (ja) * | 2004-11-30 | 2006-06-15 | Think Laboratory Co Ltd | ポジ型感光性組成物 |
WO2008016270A1 (en) * | 2006-08-04 | 2008-02-07 | Dongwoo Fine-Chem. Co., Ltd. | Photoresist composition and patterning method thereof |
US7747903B2 (en) * | 2007-07-09 | 2010-06-29 | Micron Technology, Inc. | Error correction for memory |
KR101432503B1 (ko) | 2008-02-26 | 2014-08-22 | 삼성디스플레이 주식회사 | 포토레지스트 조성물 및 이를 이용한 어레이 기판의 제조방법 |
KR20120107653A (ko) | 2011-03-22 | 2012-10-04 | 삼성디스플레이 주식회사 | 감광성 수지 조성물 및 이를 이용한 패턴의 형성 방법 |
US10723684B2 (en) * | 2014-05-27 | 2020-07-28 | University Of Delaware | Bisphenol alternative derived from renewable substituted phenolics and their industrial application |
JP6621233B2 (ja) * | 2014-07-25 | 2019-12-18 | 東京応化工業株式会社 | 有機el表示素子における絶縁膜形成用の感光性樹脂組成物 |
TWI678596B (zh) * | 2018-09-13 | 2019-12-01 | 新應材股份有限公司 | 正型光阻組成物及圖案化聚醯亞胺層之形成方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10153857A (ja) * | 1996-11-22 | 1998-06-09 | Nippon Zeon Co Ltd | ポジ型フォトレジスト組成物 |
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US3666473A (en) | 1970-10-06 | 1972-05-30 | Ibm | Positive photoresists for projection exposure |
JPS5280022A (en) | 1975-12-26 | 1977-07-05 | Fuji Photo Film Co Ltd | Light solubilizable composition |
DE2847878A1 (de) | 1978-11-04 | 1980-05-22 | Hoechst Ag | Lichtempfindliches gemisch |
JPS61205933A (ja) | 1985-03-08 | 1986-09-12 | Konishiroku Photo Ind Co Ltd | 感光性平版印刷版 |
JPS62160444A (ja) * | 1986-01-09 | 1987-07-16 | Mitsubishi Petrochem Co Ltd | ポジ型レジスト樹脂 |
JP2590342B2 (ja) | 1986-11-08 | 1997-03-12 | 住友化学工業株式会社 | ポジ型フォトレジスト用ノボラック樹脂及びそれを含有するポジ型フォトレジスト組成物 |
JP3258384B2 (ja) * | 1992-08-14 | 2002-02-18 | ジェイエスアール株式会社 | ポジ型感放射線性樹脂組成物 |
JP3010963B2 (ja) * | 1993-02-17 | 2000-02-21 | 信越化学工業株式会社 | レジスト組成物 |
JP3278306B2 (ja) * | 1994-10-31 | 2002-04-30 | 富士写真フイルム株式会社 | ポジ型フォトレジスト組成物 |
JP3796555B2 (ja) * | 1995-08-01 | 2006-07-12 | 信越化学工業株式会社 | 化学増幅ポジ型レジスト材料 |
JP3297984B2 (ja) * | 1996-08-27 | 2002-07-02 | 信越化学工業株式会社 | ポジ型レジスト組成物 |
JP3287234B2 (ja) * | 1996-09-19 | 2002-06-04 | 信越化学工業株式会社 | リフトオフ法用ポジ型レジスト組成物及びパターン形成方法 |
JP4068253B2 (ja) * | 1999-01-27 | 2008-03-26 | Azエレクトロニックマテリアルズ株式会社 | ポジ型感光性樹脂組成物 |
-
1999
- 1999-12-01 KR KR1020007008523A patent/KR100690227B1/ko active IP Right Grant
- 1999-12-01 CN CNB998027987A patent/CN1306337C/zh not_active Expired - Lifetime
- 1999-12-01 US US09/622,179 patent/US6475693B1/en not_active Expired - Lifetime
- 1999-12-01 EP EP99957401A patent/EP1055969A4/en not_active Withdrawn
- 1999-12-01 WO PCT/JP1999/006729 patent/WO2000034829A1/ja not_active Application Discontinuation
- 1999-12-06 TW TW088121308A patent/TWI224714B/zh not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10153857A (ja) * | 1996-11-22 | 1998-06-09 | Nippon Zeon Co Ltd | ポジ型フォトレジスト組成物 |
Also Published As
Publication number | Publication date |
---|---|
CN1290357A (zh) | 2001-04-04 |
EP1055969A4 (en) | 2002-01-16 |
TWI224714B (en) | 2004-12-01 |
US6475693B1 (en) | 2002-11-05 |
WO2000034829A1 (fr) | 2000-06-15 |
KR20010040651A (ko) | 2001-05-15 |
EP1055969A1 (en) | 2000-11-29 |
CN1306337C (zh) | 2007-03-21 |
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