KR100659478B1 - 레이저 가공방법 및 가공장치 - Google Patents

레이저 가공방법 및 가공장치 Download PDF

Info

Publication number
KR100659478B1
KR100659478B1 KR1020057003237A KR20057003237A KR100659478B1 KR 100659478 B1 KR100659478 B1 KR 100659478B1 KR 1020057003237 A KR1020057003237 A KR 1020057003237A KR 20057003237 A KR20057003237 A KR 20057003237A KR 100659478 B1 KR100659478 B1 KR 100659478B1
Authority
KR
South Korea
Prior art keywords
laser beam
lens
laser
workpiece
incident
Prior art date
Application number
KR1020057003237A
Other languages
English (en)
Korean (ko)
Other versions
KR20050059103A (ko
Inventor
시로 하마다
지로 야마모토
도모유키 야마구치
Original Assignee
스미도모쥬기가이고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미도모쥬기가이고교 가부시키가이샤 filed Critical 스미도모쥬기가이고교 가부시키가이샤
Publication of KR20050059103A publication Critical patent/KR20050059103A/ko
Application granted granted Critical
Publication of KR100659478B1 publication Critical patent/KR100659478B1/ko

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • B23K26/364Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • B23K26/389Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
KR1020057003237A 2002-08-30 2003-08-29 레이저 가공방법 및 가공장치 KR100659478B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2002-00254015 2002-08-30
JP2002254015 2002-08-30

Publications (2)

Publication Number Publication Date
KR20050059103A KR20050059103A (ko) 2005-06-17
KR100659478B1 true KR100659478B1 (ko) 2006-12-20

Family

ID=31972820

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057003237A KR100659478B1 (ko) 2002-08-30 2003-08-29 레이저 가공방법 및 가공장치

Country Status (5)

Country Link
JP (2) JPWO2004020140A1 (zh)
KR (1) KR100659478B1 (zh)
CN (6) CN101041206A (zh)
TW (1) TWI221102B (zh)
WO (1) WO2004020140A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100817824B1 (ko) * 2007-05-28 2008-03-31 주식회사 이오테크닉스 광위치결정유닛의 제어방법

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10344526A1 (de) * 2003-09-24 2005-04-28 Kuka Schweissanlagen Gmbh Verfahren zum Laserstrahlschweißen von Bauteilen
US7820941B2 (en) * 2004-07-30 2010-10-26 Corning Incorporated Process and apparatus for scoring a brittle material
CN101434010B (zh) * 2004-08-06 2011-04-13 浜松光子学株式会社 激光加工方法及半导体装置
KR100700654B1 (ko) 2005-02-22 2007-03-27 삼성에스디아이 주식회사 레이저 조사 장치 및 레이저 열 전사법
KR100723935B1 (ko) * 2005-10-18 2007-05-31 주식회사 한광옵토 레이저 패턴 가공 장치
ITBO20060586A1 (it) * 2006-08-03 2006-11-02 El En Spa Dispositivo per il taglio laser di un nastro continuo.
JP4884897B2 (ja) * 2006-09-15 2012-02-29 株式会社キーエンス レーザ加工装置、その制御方法及びその制御プログラム
JP5268749B2 (ja) * 2009-04-01 2013-08-21 株式会社日立ハイテクノロジーズ 基板状態検査方法及びレーザ加工装置並びにソーラパネル製造方法
AR076936A1 (es) 2009-06-02 2011-07-20 Vitae Pharmaceuticals Inc Inhibidores de carbamato y urea de la 11 beta hidroxiesteroide deshidrogenasa 1
JP5383365B2 (ja) * 2009-07-27 2014-01-08 株式会社日立ハイテクノロジーズ レーザ加工方法及びレーザ加工装置並びにソーラパネル製造方法
JP5580826B2 (ja) 2009-08-11 2014-08-27 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
CN101881889B (zh) * 2010-06-13 2012-05-23 深圳市大族激光科技股份有限公司 一种光学整形系统
KR100998484B1 (ko) * 2010-07-07 2010-12-06 레이져라이팅(주) 레이저 빔의 광경로 거리가 일정한 도광판 레이저 가공장치
KR101973660B1 (ko) * 2010-10-22 2019-04-30 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 빔 디더링 및 스카이빙을 위한 레이저 처리 시스템 및 방법
TWI400137B (zh) * 2010-12-17 2013-07-01 Ind Tech Res Inst 移除玻璃板材邊緣缺陷之裝置及其方法
CN102248289A (zh) * 2011-01-13 2011-11-23 苏州德龙激光有限公司 晶硅太阳能电池的激光划线绝缘设备
US20120322235A1 (en) * 2011-06-15 2012-12-20 Wei-Sheng Lei Wafer dicing using hybrid galvanic laser scribing process with plasma etch
JP5920662B2 (ja) * 2012-06-05 2016-05-18 三菱マテリアル株式会社 レーザ加工装置およびレーザ加工方法
JP5920661B2 (ja) * 2012-06-05 2016-05-18 三菱マテリアル株式会社 レーザ加工装置およびレーザ加工方法
JP6021493B2 (ja) * 2012-07-30 2016-11-09 株式会社アマダミヤチ レーザ加工システム及びレーザ加工方法
US9067278B2 (en) * 2013-03-29 2015-06-30 Photon Automation, Inc. Pulse spread laser
DE102013217783A1 (de) * 2013-09-05 2015-03-05 Sauer Gmbh Lasertec Verfahren zur Bearbeitung eines Werkstücks mittels eines Laserstrahls, Laserwerkzeug, Lasermaschine, Maschinensteuerung
GB2519088B (en) * 2013-10-08 2015-09-16 M Solv Ltd Laser scanning system for laser release
TWI576186B (zh) * 2014-08-20 2017-04-01 Lever focusing module for laser processing
FR3025936B1 (fr) * 2014-09-11 2016-12-02 Saint Gobain Procede de recuit par lampes flash
KR102291486B1 (ko) * 2014-10-27 2021-08-20 삼성디스플레이 주식회사 증착용 마스크 제조 방법
JP6633297B2 (ja) * 2015-05-29 2020-01-22 パナソニック デバイスSunx株式会社 レーザ加工装置、及び、レーザ加工装置の集光角設定方法
GB2541412B (en) 2015-08-18 2018-08-01 M Solv Ltd Method and Apparatus for Forming a Conductive Track
KR102483322B1 (ko) * 2015-09-30 2022-12-30 삼성디스플레이 주식회사 편광 모듈 및 이를 포함하는 레이저 조사 장치
JP6204964B2 (ja) * 2015-12-08 2017-09-27 株式会社アマダホールディングス レーザ加工機
JP6150313B1 (ja) * 2016-02-15 2017-06-21 三菱重工業株式会社 レーザ加工機
JP6753347B2 (ja) * 2016-03-31 2020-09-09 Agc株式会社 ガラス基板の製造方法、ガラス基板に孔を形成する方法、およびガラス基板に孔を形成する装置
JP6642702B2 (ja) * 2016-04-18 2020-02-12 株式会社島津製作所 質量分析装置
CN105834597B (zh) * 2016-06-12 2018-05-18 西安石油大学 一种导光板加工机构
US10066986B2 (en) * 2016-08-31 2018-09-04 GM Global Technology Operations LLC Light emitting sensor having a plurality of secondary lenses of a moveable control structure for controlling the passage of light between a plurality of light emitters and a primary lens
TWI651136B (zh) * 2017-06-14 2019-02-21 財團法人工業技術研究院 雷射清潔裝置及方法
DE102018125436A1 (de) * 2018-10-15 2020-04-16 Ewag Ag Verfahren zur materialabtragenden Laserbearbeitung eines Werkstücks
JP2020104167A (ja) * 2018-12-28 2020-07-09 三星ダイヤモンド工業株式会社 レーザー加工装置およびビームローテータユニット
JP6808114B1 (ja) * 2020-03-10 2021-01-06 三菱電機株式会社 波長変換レーザ装置および波長変換レーザ加工機
JP7348109B2 (ja) * 2020-03-11 2023-09-20 住友重機械工業株式会社 レーザ加工装置の制御装置、レーザ加工装置、及びレーザ加工方法
WO2023234004A1 (ja) * 2022-06-02 2023-12-07 株式会社島津製作所 レーザ光照射装置及びレーザ加工装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3029104A1 (de) * 1980-07-31 1982-02-18 Siemens AG, 1000 Berlin und 8000 München Verfahren und vorrichtung zur fokuskorrektur bei bearbeitungslasern
JPH04167993A (ja) * 1990-10-29 1992-06-16 Mitsubishi Electric Corp 光加工装置
JP3258751B2 (ja) * 1992-04-15 2002-02-18 日東電工株式会社 レーザー加工装置
JP3473268B2 (ja) * 1996-04-24 2003-12-02 三菱電機株式会社 レーザ加工装置
JPH10286683A (ja) * 1997-04-16 1998-10-27 Sharp Corp エキシマレーザ加工装置ならびに加工方法
JP3175006B2 (ja) * 1997-05-28 2001-06-11 住友重機械工業株式会社 レーザ加工装置及び加工方法
US6177648B1 (en) * 1999-03-30 2001-01-23 Laser Machining, Inc. Steered laser beam system with laser power control
JP2001345536A (ja) * 2000-06-02 2001-12-14 Matsushita Electric Works Ltd 回路基板の製造方法
WO2002031869A2 (en) * 2000-10-10 2002-04-18 The Trustees Of Columbia University In The City Of New York Method and apparatus for processing thin metal layers
JP2002120080A (ja) * 2000-10-18 2002-04-23 Hitachi Via Mechanics Ltd レーザ加工装置
AUPR245601A0 (en) * 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd An apparatus (WSM09)
JP3859978B2 (ja) * 2001-02-28 2006-12-20 ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク 基板上の半導体材料膜に横方向に延在する結晶領域を形成する装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100817824B1 (ko) * 2007-05-28 2008-03-31 주식회사 이오테크닉스 광위치결정유닛의 제어방법

Also Published As

Publication number Publication date
CN101041209A (zh) 2007-09-26
CN100391679C (zh) 2008-06-04
WO2004020140A1 (ja) 2004-03-11
CN101041207A (zh) 2007-09-26
CN101041206A (zh) 2007-09-26
CN101041205B (zh) 2011-11-30
CN101041208A (zh) 2007-09-26
CN1678426A (zh) 2005-10-05
JPWO2004020140A1 (ja) 2005-12-15
CN101041205A (zh) 2007-09-26
JP2008229724A (ja) 2008-10-02
TWI221102B (en) 2004-09-21
KR20050059103A (ko) 2005-06-17
CN100553854C (zh) 2009-10-28
TW200408486A (en) 2004-06-01
JP4721293B2 (ja) 2011-07-13

Similar Documents

Publication Publication Date Title
KR100659478B1 (ko) 레이저 가공방법 및 가공장치
US7402772B2 (en) Laser processing method and processing device
JP6353683B2 (ja) レーザ加工装置及びレーザ加工方法
JP5670647B2 (ja) 加工対象物切断方法
KR100500343B1 (ko) 레이저 가공 장치
JP4752488B2 (ja) レーザ内部スクライブ方法
WO2011016296A1 (ja) レーザ加工方法
JP2011110567A (ja) レーザ加工方法
US20090016400A1 (en) Multi-beam laser apparatus
JP5536319B2 (ja) レーザスクライブ方法および装置
JP6715632B2 (ja) レーザ加工方法及びレーザ加工装置
KR20150126603A (ko) 테이퍼 제어를 위한 빔 각도 및 작업물 이동의 공조
KR101026356B1 (ko) 레이저 스캐닝 장치
JP5153205B2 (ja) レーザマーキング装置
JPH11170072A (ja) レーザー加工方法及び装置、並びに非導電性透明基板の回路形成方法及び装置
KR20040017248A (ko) 취성재료기판의 스크라이브 장치
JP2000263261A (ja) レーザ加工装置及びその装置を用いてレーザ加工する方法
JP3194248B2 (ja) レーザドリル装置及びレーザ穴あけ加工方法
TW202135965A (zh) 雷射加工裝置和雷射加工工件的方法
CN111065759B (zh) 激光装置和对薄膜进行加工的方法
JP2006049635A (ja) レーザ照射方法及びレーザ照射装置並びにレーザアニール方法
KR100664573B1 (ko) 레이저 가공 장치 및 방법
JP6757509B2 (ja) 光加工方法
JP3818580B2 (ja) レーザ加工方法
JP3524855B2 (ja) レーザ照射装置及びレーザ加工方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20121121

Year of fee payment: 7

FPAY Annual fee payment

Payment date: 20131118

Year of fee payment: 8

FPAY Annual fee payment

Payment date: 20141120

Year of fee payment: 9

FPAY Annual fee payment

Payment date: 20151118

Year of fee payment: 10

LAPS Lapse due to unpaid annual fee