TWI221102B - Laser material processing method and processing device - Google Patents

Abstract

The section of a laser beam is shaped by a mask of a through hole, and a laser beam passed through the through-hole is condensed by a lens and irradiates onto the surface of a work so as to form the image of the through hole of the mask on the surface of a work. A laser beam passed through the lens is manipulated so as to move the incident position of a laser beam on the surface of the work, and the through hole is kept imaged on the surface of the work even during laser beam scanning to thereby process the work, whereby it is possible to enable a quality laser processing with a good time efficiency.

Description

1221102 (1) 发明. Description of the invention [Technical field to which the invention belongs] The present invention relates to a laser processing method and a laser processing apparatus for processing a laser beam by irradiating a processing object. [Prior Art] FIG. 9 is a schematic view of a conventional laser processing device capable of forming a groove. For example, a pulsed laser beam with a frequency of 1 kHz is emitted from a laser light source 51. After the laser beam is homogenized by the pulse energy density (flat top) of the beam cross section by the homogenizer 5 2, the cross-sectional shape is shaped into a circle by a mask 5 3 having a circular through hole, for example. Further, it is reflected by the reflecting mirror 54 and passes through the condenser lens 55 to be incident on the substrate 56. The substrate 56 is a substrate in which an ITO film is formed on a glass base material, for example. The laser beam is incident on the I TO film of the substrate 56. The beam spot of the laser beam on the surface of the ITO film is a circle having a diameter of 0.2 mm, for example. The substrate 56 is mounted on the XY stage 57. By using the XY stage 5 7 to move the substrate 5 6 in a two-dimensional plane, the incident position of the pulsed laser beam can be moved within the upper surface of the substrate 56. First, moving the XY stage 57 causes the substrate 56 to be irradiated with a pulsed laser beam at a repetition rate of 50%, and a groove is formed in the ITO film of the substrate 56. Here, the repetition rate is the ratio of the distance traveled in the radius direction of the circle when the pulse laser beam is fired for each circle diameter. Fig. 10A is a schematic plan view of a substrate 56 formed by digging a continuous hole by irradiating a laser beam at a repetition rate of 50% and forming a groove in the ITO film. The thick (2) 1221102 line shows the opening of the groove. Holes that depend on the beam spot shape of the laser beam incident on the I τ〇 film are continuously excavated to form trenches. Therefore, the side edge of the opening along the longer direction of the groove has unevenness caused by the outer peripheral portion of the circular beam spot. In addition, when the frequency of the irradiated laser beam is [kΗ], the processing speed is 100 mrn / s when the beam spot of the laser beam on the ITO film of the substrate 50 is 0.2 mm in diameter. The main reason is that the speed of the XY stage 57 is used to control the speed, so that the uniformity of the processing shape is taken into consideration, and a faster processing speed cannot be adopted. In order to make the side edges of the trench openings formed by the ITO film close to a straight line, a method of increasing the repetition rate is used. For example, moving the X Y stage 5 7 causes a pulsed laser beam to be irradiated at a repetition rate of 90%, and a groove is formed on the I TO film of the substrate 56. Figure] 0B is a schematic plan view of a substrate 56 formed by forming a continuous hole in a pulsed laser beam irradiated with a 90% repetition rate and forming a groove in the ITO film. Similar to FIG. 10A, the openings of the grooves are shown with thick lines. Although the side edge of the opening along the longer direction of the groove is nearly linear. However, since the laser beam is irradiated at a repetition rate of 90%, the processing speed is 1/5 of the repetition rate of 50%, that is, 20 mm / s. That is, although the shape of the opening can be improved, the time efficiency of processing is deteriorated. FIG. 11 is a schematic cross-sectional view of the substrate 56 taken along line PQ of FIG. 10A. A groove is formed on the ITO film formed on the glass base material, and the side surface of the groove is inclined with respect to the surface of the substrate 56. However, it is better for the groove to have a more steep side shape. An object of the present invention is to provide a laser processing method and processing device capable of performing excellent quality processing at a high time efficiency of -6- (3) (3) 1221102. [Summary of the Invention] According to an aspect of the present invention, a laser processing method is provided, which includes: shaping a beam cross section with a mask having a through hole, so that the through hole of the mask is imaged on a surface of a processing object, The process of condensing the laser beam passing through the through hole by the lens and incident on the surface of the processing object, and moving the incident position of the wrong laser beam on the surface of the processing object, At the same time that the laser beam scans, the laser beam scanning also processes the through-holes to form an image on the surface of the object to be processed. Since the through holes of the mask are often imaged on the surface of the processing object, and the laser beam is scanned, good quality processing can be performed with local time efficiency. In addition, it can prevent the reduction of the processing quality caused by the halo caused by the scanning of the laser beam. According to another aspect of the present invention, a laser processing method is provided. The method includes the following steps. The process of the surface of the processing object; and the process of moving the laser beam incident position on the surface of the processing object to process the processing object, also avoiding the laser beam from the lens to the surface of the processing object The laser beam scanning process is performed while the optical path length is changed. Since the length of the optical path from the lens to the surface of the processing object is kept constant and the laser beam is scanned, it is possible to focus on the surface of the processing object often, for example, to perform high-quality lightning with high time efficiency. Shoot plus (4) 1221102 workers.

Moreover, according to another aspect of the present invention, there is provided a laser processing device including a laser light source capable of emitting a laser beam; a holding table for holding an object to be processed; and a laser emitted from the laser light source capable of shaping the laser light source A mask for a through-hole of a beam profile; a condenser for condensing a laser beam that has been shaped by the above-mentioned mask through the mask's through-hole to form an image on the surface of a processing object held by the holding table; A beam scanner that controls the laser beam condensed by the condenser to scan at least one-dimensional direction on the surface of the processing object; and a movement mechanism that accepts external control to cause the mask and the condenser to move; A control device that synchronizes the scanning of the beam scanner and the movement of the mask and the condenser caused by the moving mechanism. When such a laser processing device is used, the mask and the condenser are displaced in synchronization with the beam scanning, so that high-quality laser processing can be performed with high time efficiency.

According to another aspect of the present invention, a laser processing method is provided, including: (e) a process of condensing a laser beam with a lens and incident on a surface of a processing object; and (f) when the processing object is When the laser beam incident position is moved, the lens is moved to suppress the pulse energy density or power density of the laser beam on the surface of the processing object caused by the movement of the incident position, and the laser beam incident position is at The process of moving the surface of the object. Since the lens is moved to uniformize the pulse energy density or power density of the laser beam irradiated on the surface to be processed, it is possible to maintain a predetermined processability in a wide range of the surface to be processed. According to another aspect of the present invention, a laser processing method is provided, which includes: a process of condensing a laser beam with a lens, and projecting the laser beam onto a surface of a processing object; and a position where the laser beam of the processing object is incident The process of 'moving the lens' while moving to suppress the change in the beam spot area on the surface of the processing object caused by the movement of the incident position and move the laser beam incident position within the surface of the processing object.

By moving the lens to uniformize the beam spot area of the laser beam irradiated on the surface to be processed, it is possible to uniformize the pulse energy density or power density on the substrate, while maintaining a wide range of areas to be processed. Workability.

According to another aspect of the present invention, a laser processing device is provided, including: a laser light source capable of emitting a laser beam; and a holding mechanism for holding a processing object; and a laser beam capable of condensing the laser beam emitted by the laser light source. The lens of light; and the direction of the laser beam emitted by the lens can be swung, so that the laser beam is incident on the surface of the processing object held by the holding mechanism, and the incident position of the laser beam is on the processing object Beam scanner that moves inside the surface; and a moving mechanism that receives the external control signal to cause the lens to move; and that the beam scanner can control the above when the incident position of the laser beam is moved on the surface of the processing object The moving mechanism is a control device that moves the position of the lens to suppress the pulse energy density or power density of the laser beam on the surface of the processing object. By moving the lens to uniformize the pulse energy density or power density of the laser beam irradiated on the surface to be processed, it is possible to maintain a predetermined processability in a wide range of the surface to be processed -9- (6) 1221102. According to another aspect of the present invention, there is provided a laser processing including: a laser light source capable of emitting a laser beam; and a holding processing pair holding mechanism; and a lens capable of giving the laser beam emitted by the laser light source described above; and The laser beam emitted from the lens is processed, and the laser beam is incident on the opposite side of the processing held by the holding mechanism, so that the incident position of the laser beam is within the surface of the object to be processed; The control signal promotes the above-mentioned transparent movement mechanism; and when the beam scanner causes the laser beam to move on the surface of the processing object, the movement of the lens position of the above-mentioned movement mechanism can be controlled to suppress the light beam on the surface of the processing object Jog control. By urging the lens to move to uniformize the area of the beam spot of the light irradiated on the surface to be processed, it is possible to uniformize the pulse energy density or degree on the substrate, and maintain the processability in a wide area of the surface to be processed. According to another aspect of the present invention, there is provided a laser processing including: (g) a process of condensing a laser beam with a lens and incident on a surface of an additive; and (h) when the laser light position of the processing object is During the movement, the variable attenuation attenuator is used to adjust the power of the laser beam to adjust the incident position of the laser on the surface of the processing object caused by the movement of the pulse energy density or power density of the laser. Works to be moved within. By using a variable attenuator to uniformly irradiate the surface to be machined, the image of the object is moved to the swinging object surface by condensing the mirror, and the upper area is changed by setting the beam power density. The beam is incident to suppress the incident beam of laser beam into the laser light -10- (7) 1221102 The pulse energy density or power density of the beam, while maintaining a predetermined processability over a wide area of the machined surface.

According to another aspect of the present invention, a laser processing device is provided, comprising: a laser light source capable of emitting a laser beam; and a holding mechanism for holding a processing object; and a laser beam capable of condensing the laser beam emitted by the laser light source A lens of light; and the direction of the laser beam emitted by the lens can be oscillated in a direction that "the laser beam is incident on the surface of the processing object held by the holding mechanism" and the incident position of the laser beam is at the processing object A beam scanner moving inside the surface; and a variable attenuator that receives external control signals and attenuates the power of the laser beam with a variable attenuation rate; and when the variable attenuator causes the laser beam to enter the position A control device that can control the variable attenuator to adjust the power of the laser beam when the surface of the processing object moves, so as to suppress the pulse energy density or power density of the laser beam on the surface of the processing object.

By using a variable attenuator to uniformize the pulse energy density or power density of the laser beam irradiated on the surface to be processed, it is possible to maintain predetermined processability in a wide area of the surface to be processed. According to another aspect of the present invention, a laser processing device is provided. The laser processing device includes: a laser light source capable of emitting a laser beam; and a holding mechanism for holding an object to be processed; and a laser beam capable of converging the laser beam emitted by the laser light source. Or a diffused first lens; and a second lens that allows the laser beam passing through the first lens to enter and condense the incident laser beam; and a second lens that allows the laser beam emitted by the second lens to be focused Sway the direction so that the laser beam is incident on the surface of the object to be held by the holding mechanism, and the laser -11-(8) 1221102 beam is moved into the surface of the object and the beam is received. An external control signal causes the first lens to move; and when the beam scanner causes the laser beam to move into the target surface, the moving mechanism can be controlled to move the position of the upper lens to suppress the processing object. Control device for changing the laser beam volume density or power density on the surface of an object; and the number of apertures of the second lens for the laser beam that shoots two lenses is set to The second lens through said second lens of the laser beam diameter and NA2 is, NA1 / NA2 is 2 or more. By moving the first lens, the energy density or power density of the laser light irradiated on the surface to be processed is uniformized, and a predetermined processability can be maintained in the surface to be processed. In addition, by shortening the first penetration distance, it is possible to increase the speed and accuracy of graphic processing. According to another aspect of the present invention, there is provided a laser plus: a laser light source capable of emitting a laser beam; and a holding and holding mechanism; and a laser beam through hole having the laser beam emitted by the laser light source, and receiving external control The signal can change the beam profile shaper that passes through the beam in one direction; the lens that condenses the laser beam emitted by the beam profile shaper; the direction of the laser beam emitted by the lens is swayed to make the laser When the beam that is incident on the surface of the processing object held by the holding mechanism and whose incident position is moved within the surface of the processing object is scanned, the beam scanner may cause the incident position of the laser beam to move on the processing surface. The beam profiler that controls the beam profiler is provided by the beam scanner; the mobile machine is set on a mobile working device for processing a wide range of scopes of pulses that can enter the first NA, pulses of several beams, The laser beam of the penetrating hole of the object will make the above beam into the laser beam device; and the beam profile of the object will be adjusted -12- 1221102 〇) The shaper controls the shape change of the beam spot on the surface of the object to be processed. C As the shape of the beam spot is suppressed when the processed position is moved, a wide range of areas to be processed can be maintained.

C. According to another aspect of the present invention, a laser processing device includes: a laser light source capable of emitting a laser beam; and a holding mechanism for holding a processing object; and a lens capable of providing the laser beam emitted by the laser light source; With the direction of the laser beam emitted by the lens, the laser beam can be incident on the surface of the processing object held by the holding mechanism, and the incident position of the laser beam can be shifted within the surface of the object to be scanned. And a device having a through-hole arranged in the light path midway through the laser beam emitted from the above-mentioned beam scan and exiting the laser beam to the object to be processed Proximity of __ Beam Scanner @ 0 that uses the direction of the swingable laser beam to achieve high-speed high-speed machining by laser processing of proximity masks. According to another aspect of the present invention, there is provided a laser processing square stomach: a process for adjusting a diffusion angle of a laser beam emitted by a laser light source ¥ G is disposed on a surface of a processing object at a distance of only 2 tt from the surface And sway the laser beam G which is adjusted to have the predetermined diffusion angle, and irradiate the laser beam with a through f 妾 shield, so that the laser beam passing through the through hole is incident on the The processing equipment shall be set on a working basis, and the condensing object of the object shall be moved by a tracing device, and the mask shall be measured in degrees, and the object of the distance into the hole shall be -13- (10) 1221102. The process of transferring the shape of the through-hole to the surface of the processing object; and the accuracy of transferring the at least one of the predetermined diffusion angle and the predetermined distance to the surface of the processing object according to the shape of the through-hole, and laser A process of setting a diffusion angle of a light beam and a relationship obtained in advance regarding a distance between the proximity mask and the surface of the object to be processed.

By using a beam scanner that can swing the laser beam in its direction, laser processing using a proximity mask can be performed, and high-precision processing can be performed at high speed. In addition, based on the previously determined non-satisfactory relationship between the transfer accuracy and the divergence angle of the laser beam and the close gap, the close gap and spread angle can be easily selected when processing with the desired transfer accuracy.

According to another aspect of the present invention, a laser processing device is provided, comprising: a laser light source capable of emitting a continuous wave laser beam; and a holding mechanism for holding an object to be processed; and a laser emitted by being injected into the above-mentioned laser light source Beams 'and according to the opportunity signal provided by the outside, the incoming laser beams can be switched to an optical system that is emitted or not emitted in a certain direction; and with a rectangular through hole', the optical system is emitted from the above-mentioned optical system in a certain direction The laser beam is incident on the through hole to shape the mask of the laser beam profile; and the laser beam emitted from the mask is condensed so that the rectangular through hole of the mask is held and processed by the holding mechanism. A lens for imaging the surface of the object; and a moving mechanism for moving the above-mentioned holding mechanism in accordance with a control signal given from outside to move the position of the laser beam emitted by the lens into the object to be processed within the surface of the object ; In accordance with the control signal given from outside, the above-mentioned mask is rotated to be parallel to the optical axis of the laser beam passing through the through hole of the mask. A mask rotation mechanism around the axis; and controlling the above-mentioned optical-14- (11) 1221102 system to cause the above-mentioned optical system to shoot the laser beam in a certain direction at a predetermined timing, and to control the above-mentioned moving mechanism to cause the above-mentioned moving mechanism to The incident position of the laser beam on the object to be processed is moved in the first direction, and the mask rotation mechanism is controlled to cause the mask rotation mechanism to move the incident position of the laser beam on the surface of the object to be processed by the moving mechanism. Before the first direction, the control device rotates the mask so that a certain side of the image of the rectangular through hole on the surface of the object to be processed is parallel to the first direction.

On the surface of the processing object, a continuous wave laser beam can be irradiated to form a linear pattern (line). At the same time, a pulse laser beam can be cut out from the continuous wave laser beam and irradiated, thereby easily forming a point-like discrete pattern. (point). And by urging the laser beam irradiation position on the surface of the processing object to move in parallel along one side of the rectangular beam spot of the laser beam, the shape of the line and the point can be formed into a rectangle.

According to another aspect of the present invention, a laser processing method is provided, including: (i) a continuous wave laser beam emitted from a laser light source is injected into the laser beam, and the incident laser beam can be switched to be emitted from a certain direction; Or the project of an optical system that is not allowed to emit; and (j) shaping the laser beam emitted from the optical system in a certain direction into a mask with a rectangular through-hole, and shaping it with a lens to condense the above The process of forming the image of the through hole on the surface of the processing object; and (k) the process of moving the image of the through hole on the surface of the processing object in a direction parallel to one side of the image; and to form the surface of the processing object For point-like discrete patterns, that is, in the above-mentioned process (i), laser beams are intermittently emitted from the ± ® optical system in a certain direction, and when a linear pattern is to be formed on the surface of the processing object, the above-mentioned process ( i), from above -15- (12) 1221102, the optical system continuously emits laser beams in a certain direction. On the surface of the processing object, a continuous wave laser beam can be irradiated to form a linear pattern (line). At the same time, a pulse laser beam can be cut out from the continuous wave laser beam and irradiated, thereby easily forming a point-like discrete pattern. (Point) i and by causing the laser beam irradiation position to move parallel to one side of the rectangular beam spot of the laser beam on the surface of the processing object, the shape of the line and the point can be formed into a rectangle. \

According to another aspect of the present invention, a laser processing device is provided, comprising: a holding mechanism capable of holding a processing object; and a first laser light source capable of emitting a pulsed laser beam; and a first laser source capable of emitting a continuous wave laser beam. Two laser light sources; and the pulsed laser beam emitted by the first laser light source and the continuous wave laser beam emitted by the second laser light source, the continuous laser light beam includes a pulse laser beam inside the beam point An optical system for irradiating the surface of a processing object held by the holding mechanism with a light beam spot; and a moving mechanism for moving the beam spots of a pulse laser beam and a continuous wave laser beam on the surface of the processing object held by the holding mechanism . For a certain area to be processed on the surface of the object to be processed, the continuous wave beam is pre-heated first, and then the pulse laser beam is processed. The order is: ’The surface layer of the processed area can be easily and selectively processed. According to another aspect of the present invention, a laser processing method is provided, including: (η) a project of emitting a pulsed laser beam from a first laser light source and a continuous wave laser beam from a second laser light source; and ( 〇) Adding the -16- (13) 1221102 work point to the surface of the base layer and the surface of the base layer on the surface of the base layer, which are formed on the surface of the base layer and have a surface layer formed of a material that is less susceptible to laser processing than the base layer material. After the continuous wave emitted from the second laser light source is irradiated and preheated, a pulsed laser beam emitted from the first laser is irradiated to the processed point, and the surface processing of the object is performed. For a certain processing area on the surface of the processing object, the continuous-wave laser beam is pre-heated, and then the pulse laser is irradiated. Therefore, it is possible to easily and selectively process the processed field. [Embodiment] Fig. 1 is a schematic view of a laser processing apparatus capable of performing a first embodiment of the present invention. Self-laser light source 1. For example, a laser oscillator with a wavelength conversion unit, with a pulse energy lmj / pulse and a pulse width of three times higher harmonics of Nd: YAG laser (wavelength 3 5 5 nm: beam is adjusted Adjustable attenuator for pulse energy 2. Expander 3 with expandable diameter and outgoing in parallel light, incident on conical optical cone optical system 4 contains a pair of cone (shaped) lenses 4a. 4b a, 4 b are, for example, of the same type and are arranged to face each other. The laser beam is superimposed on the vertical vertex with the center of the beam profile, and enters the conical lens 4 a and the mirror 4 b from the axis of the upright cone. The cone The optical system 4 converts the profile of the incident laser light into a weak intensity at the center of the beam profile, which will be described in detail at the periphery. In addition, the conical optical system 4 can also replace the cone lens 4b on the laser exit side, and A convex lens is used. The laser beam is irradiated into the cavity before the light beam is added to the surface. The method of Nd: Y AG 5 0 ns radiation>. Laser beam large beam straight system 4. Composition. A conical part on the bottom surface of each other Beam transmitted from cone The laser beam emitted from the cone optical system 4 passes through the mask 5 having, for example, a rectangular through hole, and the rectangular through hole of the mask 5 can be imaged on the substrate 1 The objective lens 6 on 2. The cover 5 and the objective lens 6 can be moved in a direction parallel to the laser beam traveling direction by the voice coil mechanism 9 'and 10 (also can be replaced with a driving mechanism such as a piezoelectric drive). The movements caused by the voice coil mechanisms 9 and 10 are performed by the signals sent by the controller 11 and the substrate 12 is placed on the holding table 8. The laser beam focused by the objective lens 6 is incident. In the electromagnetic scanner 7. The electromagnetic scanner 7 is composed of an X-direction scanner 7a and a Y-direction scanner 7b, and can scan a laser beam in a two-dimensional direction at high speed. The X-direction scanners 7a and Y directions The scanner 7b includes a swingable mirror. When the X and Y directions orthogonal to each other are defined on the substrate 12 held by the holding table 8, the scanner 7a for the X direction and the scanner for the Y direction are defined. 7b causes the laser beam to be scanned, so that the incident point of the laser beam collected by the objective lens 6 is at The plates 12 and 2 respectively move in the X direction and the Y direction. The electromagnetic scanner 7 can be combined with the X direction scanner 7 a and the Y direction scanner 7 b to scan the laser beam in a two-dimensional direction. The substrate 12 is, for example, a substrate formed with an I TO film on a glass base material, and a laser beam is incident on the ITO film of the substrate 12 with a processing energy of about 1 J / cm2. Figure 2 is a mask 5, an objective lens 6, The electromagnetic scanner 7 scans the laser beam light path on the substrate 12 and shows a schematic view. When the laser beam is incident on the incident position M on the substrate 12, M is a through hole with a mask 5 imaged. In addition, the length of the light path 2C from the mask 5 to the objective lens 6 -18- (15) (15) 1221102 is set to a, the length of the light path from the objective lens 6 to the incident position on the substrate 12 is set to b, and the objective lens When the focal length of 6 is set to f, if the through holes of the mask are to be imaged on the substrate 12, the relational expression (l / a) + (l / b) = l / f ·· (1) is not allowed. Due to the operation of the electromagnetic scanner 7, the incident position of the laser beam becomes N from the incident position M on the substrate 12. Therefore, the angle of incidence for the injection position M and the angle of incidence for the injection position N are different from each other. If the mask 5 and the objective lens 6 are fixed as they are, the length of the light path from the objective lens 6 to the injection position M and the objective lens 6 The lengths of the light paths to the incident position N are different from each other (the difference is set to Δb), so that the through holes of the mask 5 are not imaged on N. In the laser processing apparatus shown in FIG. 1, the controller 11 is synchronized with the operation of the electromagnetic scanner 7, and sends signals for causing the mask 5 and the objective lens 6 to move to the voice coil mechanism 9 · 10, respectively. This signal keeps, for example, the light path length a from the mask 5 to the objective lens 6 and the light path length b from the objective lens 6 to the incident position on the substrate 12 to be constant, and causes the mask 5 and the objective lens 6 to move. signal. The voice coil mechanism 9, 10 receives signals from the controller 11 to move the mask 5 and the objective lens 6 in directions parallel to the laser beam traveling direction, respectively. As shown in FIG. 2, when the incident position changes from M to N, the distance that the mask 5 and the objective lens 6 are moved by the voice coil mechanisms 9 and 10 is Δb. The mask 5 and the objective lens 6 are only displaced by the same distance Δb in the same direction. Thereby, the through-hole of the mask 5 can be imaged at the injection position N while satisfying the above formula (1). -19- (16) (16) 1221102 Therefore, not only the two positions of the incident positions M and N ', as long as the laser beam is scanned, for example, the light path length a from the mask 5 to the objective lens 6 and the objective lens 6 are often The light path length b to the incident position on the substrate 12 is kept constant, so that the through holes of the mask 5 can always be imaged on the surface of the substrate 12. The mask 5 and the objective lens 6 are scanned synchronously with the laser beam caused by the electric scanner 7, and the optical path length a and the optical path length b are always kept constant and moved. At this time, the imaging magnification (reduction rate) of the through holes of the mask 5 is always constant. For example, the focal length f of the objective lens 6 is 8 3 3 mm 'to keep the light path length a of the mask 5 to the objective lens 6 at a predetermined value of 5000 mm, and the optical path of the objective lens 6 to the incident position on the substrate 12 When the length b is maintained at a predetermined value of 1000 mm, the imaging magnification (reduction rate) of the through hole of the mask 5 is ½. FIG. 3A is a schematic plan view of a substrate 12 that can be irradiated with a shooting pulse laser beam on a rectangular through-hole of the imaging mask 5 on the surface to form a hole at the imaging position. A rectangular beam spot with imaged through holes is formed on the substrate 12, and holes are cut in the ITO film at the positions. FIG. 3B is the substrate 1 in which the rectangular through-hole of the mask 5 is imaged at a predetermined imaging magnification while the incident position of the beam is moved 'by irradiating a four-shot pulse laser beam to form a groove at the irradiation position 2 floor plan. Due to the electromagnetic scanner 7, the pulsed laser beam is scanned along the long side of the beam spot imaged into a rectangular shape. In addition, the beam is irradiated at a repetition rate of 50%, so that the holes opened by each firing are continued to form grooves. By forming a rectangular beam spot of a predetermined size, the laser beam can be scanned in a direction parallel to a pair of parallel sides (long sides in FIG. 3B). -20- 1 (17) 1221102 can form a beam of a predetermined width. Trench. As in this embodiment, when using a pulsed laser beam, even if one of the pair of parallel side edges (long side in FIG. 3B) of the beam spot overlaps a part of the pair of parallel side edges of the beam point of the previous shot, The beam is scanned i. Since the opening side edge of the groove is formed as a straight portion of a rectangular beam spot, it has a straight line without unevenness. From the viewpoint of ease of control, etc., The beam spot is preferably formed such that a pair of parallel side edges of the beam spot are parallel to the X direction or the Y direction.

The through hole 'of the mask 5 to be imaged on the substrate 12 may not be rectangular. By forming the beam spot into a shape having a pair of parallel sides, and scanning the laser beam in a direction parallel to the pair of parallel sides, a groove having a predetermined width without unevenness on the side edge of the opening can be processed.

FIG. 4A is an example of a through hole of the mask 5. The through hole of the mask 5 is formed in a shape having a pair of parallel sides. The other pair of side edges connecting the pair of side edges to each other are bent inward. When a mask having such a through hole is used and the laser beam profile is shaped, a beam spot having a pair of parallel side shapes can be formed on the substrate 2. Fig. 4B is a schematic view of a hole burred in the base plate 12 when the through hole shown in Fig. 4A is imaged on the base plate 12. By continuously forming a hole having the same shape as the hole in a direction parallel to a pair of parallel sides, a groove having a predetermined width without unevenness on the U-side edge can be processed. In addition, since the cumulative energy density of the laser beam incident near the side edge of the trench is greater than the cumulative energy density of the laser beam entering the center of the trench, the side of the trench can be made closer to vertical. In addition, when laser processing is required to extend a groove extending in a single direction as shown in FIG. 3B, a one-dimensional electromagnetic scanner or a polygonal scanner with a shaking mirror can also be used. At this time, it is sufficient to make the scanning direction of the scanner coincide with the direction of a pair of parallel sides of the beam spot. 5A to 5C, the conical optical system 4 will be described. As described above, the 'cone optical system 4 can change the beam profile of the incident laser beam to be weaker at the center of the beam cross section and stronger at the periphery.

FIG. 5A is a schematic diagram showing the energy density of each pulse of the pulse laser beam profile emitted by the laser light source 1. FIG. Generally, the pulsed laser beam has a higher pulse energy density in the center of the profile, and a lower pulse energy density toward the periphery. The conical optical system 4 uses two conical lenses 4 a and 4 b to invert the central portion and the peripheral portion of the incident laser beam and emits it. Therefore, the beam profile of the laser beam emitted from the conical optical system 4 has a distribution that is weaker at the center of the beam profile and stronger at the periphery.

FIG. 5B is a schematic diagram showing the energy density of each pulse of the pulse laser beam profile emitted from the conical optical system 4 and shaped by the mask 5. The beam has a pulse energy density distribution that is weaker at the center and stronger at the periphery. Fig. 5C is a schematic sectional view of the substrate 12a cut along the line C5-C5 in Fig. 3B. The laser beam having the beam profile shown in FIG. 5B is focused by the objective lens 6 and incident on the substrate 12, and the ITO film on the substrate] 2 can make the inclination angle of the side surface close to 90 °. Therefore, the groove shown in FIG. 3B is a groove in which the opening side edge is formed in a straight line with a steep side wall. In addition, in synchronism with the operation of the electromagnetic scanner 7, the pulse energy of the pulsed laser beam can be adjusted to perform more excellent processing. Incident -22- (19) 1221102 When the incident angle of the laser beam on the substrate 12 becomes larger, the spot area of the incident beam becomes larger. Therefore, when the pulse energy of the laser beam scanned by the electromagnetic scanner 7 is fixed to a predetermined value, as the incident angle becomes larger, the pulse energy density of the laser beam incident at the position becomes smaller, and the processability changes. . Therefore, in order to maintain the predetermined processability, it is necessary to keep the pulse energy density of the laser beam entering the position constant.

The adjustable attenuator 2 is synchronized with the operation of the electromagnetic scanner 7, and can change the pulse energy of the laser beam emitted by the laser light source 1. According to the synchronization signal sent by the controller 11, when the laser beam is incident on the substrate at a large incidence angle, the attenuation rate is increased and the beam pulse energy emitted by the adjustable attenuator 2 is increased. Furthermore, the pulse energy density of the laser beam incident position can be kept constant during the beam scanning.

In addition, although it does not remain constant, if the incident angle of the laser beam to the substrate 2 is changed, the attenuation rate of the pulse energy caused by the adjustable attenuator 2 can be changed to make the pulse energy density at the incident position. Less variation 'and improve processing quality. In addition, when the laser beam is incident on the substrate 12 for scanning, the operation of the electromagnetic scanner 7 may be synchronized, and the imaging magnification (reduction rate) of the through hole of the mask 5 may be changed, and the laser beam may be incident on the position. The pulse energy density is kept constant. Can satisfy the following two formulas, Δ 2 = f 2 χΔι / (b— f— Δ]) / (b— f) · · · (2) [(a + Z \ 2) / (b — Δ]) ] 2 Two (a / b) 2 / cos6 ... (3) -23- (20) 1221102 Corresponds to the incident angle of the laser beam to the substrate 12 (9 (the angle formed by the substrate 1 and the incident light) ) Set Δ 1 and A 2 to move the mask 5 and the objective lens 6 corresponding to the shot, so that the optical path from the mask 5 to the objective lens 6 is maintained at a + Δ 2. The length of the incident position on the objective lens 6 to the substrate 12 is maintained at b-△ I. Here, a and b are respectively 0 is the length of the light path from the mask 5 to the objective lens 6, and the length of the light path from the objective lens 6 to the incidence position of the substrate 1. Also, f is the focal length of the objective lens 6. The above formulas (2) and (3) are not strictly met. When the incident angle is changed, the laser processing quality can be improved by changing the magnification to reduce the beam spot area. When it becomes larger, the imaging magnification (reduction rate) Fig. 6 is a schematic view of a laser processing apparatus related to the first embodiment of the optical path adjusting mechanism 20 having the incident light path length b of the variable objective lens 6 to the substrate 12. From Fig. 1 The laser plus shown removes the voice coil mechanisms 9 and 10, and the plus The configuration of the light path adjustment mechanism 20 is the same as that of the laser processing apparatus shown in FIG. 1. In the laser processing apparatus, the light path length a of the mask 5 to the objective lens 6 is a. The light path adjustment mechanism 20 can, for example, Synchronized with the electromagnetic scanning | action, during the scanning of the laser beam, the optical path length b of the objective lens 6 to the substrate 1 2 entry position is always kept constant. This allows the through-holes to always be at a predetermined imaging magnification (reduction rate) On the substrate 1 2, the groove shown in FIG. 3B is added. FIG. 7 is a schematic view of the light path adjusting mechanism 20. The light path structure 20 is composed of, for example, two reflection mirrors 2a to 2d. The four mirrors respectively cause the direction of the incident laser beam to change, such as 90 2 normal angle of incidence β diameter length of the light path 0 to 2 times, although the deformation device of the imaging angle of incidence. Other 6 Shown is a reflection of the imaging adjustment machine on the shooting mask 5 above the certain device 7. and ^ -j ct -24- (21) 1221102

The laser beam is emitted by the optical path adjustment mechanism 20 in a direction parallel to the direction in which the incident laser beam enters. The two mirrors 2 1 a and 2 1 b form a moving portion 22. The moving part 22 moves in the direction of the arrow in the figure. The optical path length b from the objective lens 6 to the incident position on the substrate 12 can be adjusted by displacing the moving portion 2 2. When the incident angle of the laser beam to the substrate 12 becomes larger, the moving part 22 moves upward in FIG. 7. By shortening the optical path length of the laser beam in the optical path adjustment mechanism 20, the optical path can be changed. The length b is kept constant. The movement of the moving part 22 can be performed by a signal from the controller 11. The controller 11 also keeps the optical path length b of the objective lens 6 shown in FIG. 6 to the incident position on the substrate 12 constant by promoting the movement of the electromagnetic scanner 7 and the movement of the moving section 22.

In the laser processing apparatus shown in FIG. 6, although the light path adjustment mechanism 20 is added to adjust the light path length b, the light path length a can also be inserted between the mask 5 and the objective lens 6. By using two light path adjustment mechanisms 20, the light path length a and the light path length b can also be adjusted to satisfy the relational expression (1) in the scanning of the laser beam. In addition, as long as the light path length a or the light path length b is adjusted, only one of the mask 5 and the objective lens 6 may be moved. For example, the objective lens 6 may be fixed and only the mask 5 may be moved to satisfy the relational expression (1). For the object to be processed, although it is considered to form a substrate of ITO film on a glass base material, a substrate of polyimide film formed on a silicon substrate may be used to process the polyimide film portion. These can be used as solar cell substrates or liquid crystal substrates. It is also possible to process a touch panel in which a 1 T 0 film is formed on a polyimide film, or process a semiconductor film. It is also possible to process film-shaped objects -25- (22) (22) 1221102. FIG. 8A is a schematic view of a conveying mechanism 31 1 for conveying the film 30. The film 30 is transferred by the transfer mechanism 31. The vacuum chuck 3 2 fixes a predetermined processing position on the film 30 that is being transferred to delineate the processed surface °, and the laser beam scanned by the electromagnetic scanner 7 is injected into the vacuum chuck 3 2 for fixing. The film 30 is processed on a predetermined processing position. When the processing at the predetermined processing position is completed, the conveying mechanism 31 removes the film 30 and fixes another processing position with the vacuum chuck 32 to perform processing. Conventionally, the film 30 fixed by the vacuum chuck 32 is moved in the XY direction stage, and processed by irradiating a beam using a fixed optical system. In this embodiment, since the beam is scanned by the electromagnetic scanner 7, and the beam is irradiated to the processing position for processing, the processing speed can be increased. FIG. 8B is a schematic view of a carrying mechanism 31 with a rotary encoder 33. The rotary encoder 3 3 can detect the speed of the film 30 carried by the carrying mechanism 31. The test result is sent to the controller 11 and the controller 11 determines the transport amount of the film 30 from the transport speed. The controller 11 sends control signals to the electromagnetic scanner 7 from the transport speed of the film 30 and the data of the predetermined processing position defined on the film 30. The electromagnetic scanner 7 receives the control signal to scan the laser beam, and irradiates the beam to a predetermined processing position on the film 30 for processing. Since the XY-direction stage is not required, processing can be performed with the film 30 being transported, so that the processing speed can be increased. By using a laser processing device that removes the conical optical system 4, the mask 5, and the voice coil mechanism 9 from the laser processing device shown in FIG. 1, it is also possible to perform focus addition -26-(23) (23) 1221102. The laser beam is focused by the objective lens 6 and imaged on the substrate 12. When the electromagnetic scanner 7 is activated, the laser beam scans the substrate 12 and the incident position of the beam on the substrate 12 changes, the objective lens 6 moves in a direction parallel to the direction of the beam passing through the objective lens 6, The voice coil mechanism 10 is caused to keep the optical path length b of the laser beam from the objective lens 6 to the substrate 12 constant. And by this movement, the laser beam is often imaged on the substrate 12. Thus, good quality processing can be achieved. Although a pulse laser beam is used in this embodiment, a continuous wave laser beam may be used in accordance with the processing. In addition, although a laser light source uses a Nd: YAG laser oscillator including a wavelength conversion unit and emits three times higher harmonics of Nd: YAG lasers, the fundamental wave of a solid laser can also be used ~ five times higher Subharmonic. In addition, C02 lasers can also be used. Although the electromagnetic scanner is used as the high-speed scanning optical system in this embodiment, a high-speed scanning optical system using a polygon mirror may be used. Since the processing object is not moved by the X Y direction platform to change the incident position of the laser beam, the high-speed scanning optical system is used to scan the laser beam to change the incident position of the laser beam, so the processing speed can be increased. In the above focus processing method, the laser beam is often imaged on the substrate surface. Next, the positional relationship between the focus of the laser beam and the substrate surface is adjusted in accordance with the incident position of the substrate surface of the laser beam, and a good quality processing method is explained. The laser processing apparatus of the second embodiment shown in FIG. 1A is obtained by removing the conical optical system 4, the mask 5, and the voice coil mechanism 9 from the laser processing apparatus shown in FIG. 1, and removing the adjustable attenuator 2 An aperture 5 a with a circular through-hole to adjust the beam diameter is arranged between the expander 3 and the objective lens 6 -27- (24) (24) 1221102. It is not necessary to image the through-holes with a diameter of 5 a on the surface of the substrate 12. By using the voice coil mechanism 10 to move the objective lens 6 in parallel along the direction of the laser beam passing through the objective lens 6, the focal point of the laser beam is close to or away from the surface of the substrate 12, and the surface of the substrate is adjusted to be irradiated. Pulse energy density of a laser beam. Because of the control signal sent by the controller 11, the electromagnetic scanner 7 makes the laser beam swing in the desired direction at the desired timing. By using the control signal sent from the controller 11, the voice coil mechanism 10 is synchronized with the electromagnetic scanner 7, and the laser beam can be irradiated to the substrate 12 with the desired pulse energy density corresponding to the incident position of the laser beam. An example of a laser processing method using the laser processing apparatus of Fig. 12A will be described with reference to Fig. 13. On the upper side of FIG. 13, the light path of the laser beam on the substrate 12 scanned through the objective lens 6 and the electromagnetic scanner 7 is shown briefly. The laser beam L 1 b is incident at an incident position M1 perpendicular to the substrate surface. The laser beams Lla, Llc are incident at the incident positions Ν 1 a, Ν 1 c at an incident angle α 1, respectively. The injection position M 1 is located at the midpoint of the line with the injection positions N 1 a and N 1 c as the two ends. The lower side of FIG. 13 shows the surface of the substrate viewed downward from the electromagnetic scanner 7 side. The beam points 91a591b and 91c are the beam points on the surface of the substrate (ie, the incident positions Nla, Ml, Nlc) of the laser beams Lla, Llb. Llc, respectively. Make the laser beam progress from the light path of the laser beam L 1 a to the light path of the laser beam L 1 c, and irradiate the pulsed laser beam -28- (25) 1221102 repeatedly, as shown in FIG. 10A and FIG. As shown in FIG. 10B, the holes are continuously formed on the surface of the substrate, and the starting point of the objective lens 6 which is firstly irradiated to form the groove 1 0 1 is set to the position of the laser beam N 1 a. In addition, the size of the beam spot is minimized. The position of the mirror 6 when the end point of the groove 101 is irradiated is set to enable the laser beam L. Since the objective lens 6 reaches the injection position Nla, Nlc can consider that the position of the objective lens 6 is in the groove processing. Since the incident points of the laser beams Lla and Lie are 9 1 a and 9 1 c, they have the same area. The following first describes what happens when the objective lens 6 is fixed to the scan to form a groove. Fixing the objective lens 6 to image the laser beam (or the laser beam L 1 c is at the entrance position: electromagnetic scanner 7) The imaginary plane of the laser in the swinging direction is set to the focusing surface 8 1 a. The focusing surface 8 1 is the focal position of the beam LI b. The groove laser beam at the incident positions N 1 a and N 1 c is in focus. The longer the distance from the focal point to the focal point on the way, the larger the diameter of the incident position. The distance between the incident position and the focal point is the largest beam Lib. The groove formed by each irradiated laser position is 〇1. When the light beam L 1 a is shot, the point at which L 1 a is imaged at the incident position is called the focal laser beam L 1 c of the laser beam, and the light path length of the object 1 c at the incident position N 1 c is slightly shorter. At the same time, it is the same at the end and at the same time. With the same angle, the laser beam can be considered as the beam position as it is. C Lla is depicted by the focus trajectory of the beam when it is at the incident position (Nla N 1 c imaging). The point R on a indicates the injection position on the laser groove 101, and it enters the substrate. Since the incident position, the diameter of the beam is straighter than that of the focused beam, and the pulse energy density of the laser beam shining at the center of the trench is -29- (26) 1221102. Generally, the center of the beam profile is higher than the vicinity of the periphery. As the beam diameter becomes larger, the energy density of the individual pulses in the beam profile Π decreases. Therefore, although the beam diameter becomes larger, the area where the pulse energy density above the threshold of the substrate can be processed is limited to the vicinity of the center of the beam profile.

Trench 1 〇1 Near the entrance position N 1 a · N 1 c of the sacrificial part is irradiated with a local pulse energy density. Although the beam diameter is small, the pulse energy density is still near the periphery of the beam profile. The light beam is emitted, and a groove having a relatively wide width is formed. In addition, near the incident position M 1 at the center of the beam profile, the laser beam irradiated with a low pulse energy density has a large beam diameter, but the pulse energy density is only in a narrow area of the center of the beam profile. A narrower trench is formed. In this way, the groove width varies depending on the position.

The distance from the incident position M1 of the laser beam Lib to the point R on the light-condensing surface 81a is such that the incident angle α 1 becomes larger and longer. Therefore, the larger the incidence angle α 1 is, the larger the difference between the diameter of the laser beam irradiated at the injection positions N 1 a, N 1 c and the diameter of the laser beam irradiated at the injection position M 1 is. That is, the width difference between the groove end and the center becomes more significant. The incident angle α 1 is the incident angle of the laser beam that forms the end of the trench, and it becomes large when, for example, a long trench is formed on a large substrate. Next, a method of forming a groove by moving the position of the objective lens 6 to adjust the focal position while performing laser beam scanning will be described. By adjusting the focal position of the laser beam, the beam diameter of the laser beam irradiated on the substrate is adjusted to adjust the pulse energy density on the substrate surface. -30- (27) (27) 1221102 Let us consider where the focus alignment of the laser beam L 1 b incident on the incident position M 1 is more appropriate. Setting the focal point closer to the incident position M1 than the point R on the light-condensing surface 8 1 a can reduce the beam diameter and increase the pulse energy density of the incident position M 1 to correct it. However, the closer the focus is to the injection position M 1, the pulse energy density of the injection position M 1 becomes higher than the pulse energy density of the injection position Nla.Nlc. And because the laser beam Lib is incident on the substrate surface vertically, the beam spot imaged at the incident position M 1 is circular. In addition, since the laser beams L 1 a and L 1 c are incident on the substrate surface obliquely at an incidence angle α 1, the beam points 91a and 91c have widened elliptical shapes. That is, the pulse energy density of the beam point 9 1 b when the laser beam Lib is imaged at the incident position M 1 is higher than the pulse energy density of the beam points 91 a, 91c. Thus, the laser beam L 1 b is focused at a position slightly deeper than the incident position M 1 (farther from the incident position M 1 toward the inside of the substrate), so that the area of the beam spot 91 b is equal to the beam at the incident position Nla Area of points 91a, 91c. In this way, processing can be performed by irradiating the laser with the same pulse energy density as the injection positions N 1 a or N 1 c and M 1. At other incident positions on the grooves 101, the area of the beam spot can also be maintained to be a certain pulse energy density for processing. The focus track when the groove 101 is scanned without changing the beam spot area is the light-condensing surface 81b. And the focal position of the laser beam Lib is the point Q on the light-condensing surface 8 1 b. The following describes how to adjust the position of the objective lens 6 when the focal point is moved along the light-condensing surface 8 1 b. First, the objective lens 6 is set to a position where the laser beam l 1 a -31-(28) 1221102 can be imaged at the incident position N 1 a when the laser beam is irradiated. This position is called the reference position

When the laser beam is scanned from the incident position N 1 a to M 1, the objective lens 6 is gradually moved from the reference position to the laser light source, so that the focal point is closer to the light collecting surface 81 b than the light collecting surface 81 a of the substrate surface. By moving, the area of the beam spot becomes larger, and the reduction of the pulse energy density can be suppressed. The moving distance of the objective lens 6 from the reference position is to set the laser beam Lla incident on the incident position Nla to zero, and as the laser increases toward the incident position M1, it is incident on the incident The laser beam L 1 b at the position M 1 is set to the maximum. Then, when the laser beam is scanned from the incident position M 1 to the incident position N 1 c, the objective lens 6 may be brought close to the reference position slowly. The distance between the objective lens 6 and the reference position decreases as the laser beam approaches the incident position N 1 c, and the laser beam L 1 c incident on the incident position N 1 c is set to zero.

If so, by scanning the laser by adjusting the position of the objective lens 6 while moving the focal point of the laser beam entering each of the incident positions along the light-condensing surface 8 1 b, the wide width can be suppressed to form a groove 1 as the space changes. 〇1. The method of moving the groove 101 is summarized. If the pulse energy density of the substrate surface is continuously reduced without moving the position of the objective lens 6, moving the objective lens 6 causes the focus of the laser beam to approach the incident position to suppress the decrease in the pulse energy density. If the pulse energy density of the substrate surface increases without continuing to scan the position of the objective lens 6, on the contrary, moving the objective lens 6 causes the focal position of the laser beam to move away from the incident position to suppress the increase in pulse energy density. Taking an example of processing, although the method of focusing at the injection positions at both ends of the groove to explain the focus -32- (29) (29) I22tt02 on the surface of the substrate, it is also possible to focus at another injection position. As long as the beam spot of each incident position is kept at a certain area, the pulse energy density can be processed neatly, so the predetermined processability can be maintained for any incident position. In addition, it is not necessary to keep the pulse energy density of the irradiated laser beam constant at each incident position, and only when the incident position changes, the pulse energy density variation of the incident position is suppressed, and the processing can be performed well. Although groove processing (cutting processing) is described as an example, it is also possible to perform digging and the like. Although it is explained that the electromagnetic scanner is scanned in a one-dimensional direction, it is scanned in a two-dimensional direction to complete the processing of the substrate. The processing using a pulsed laser beam can be used as an example. Continuous waves are fine. When processing with a continuous wave laser beam, it is necessary to suppress the power density of the machined surface from varying with each incident position. The pulse energy density of the laser beam irradiated on the substrate can be adjusted by using an adjustable attenuator instead of the moving objective lens 6. The laser processing apparatus according to a modified example of the second embodiment shown in FIG. 12B is the one in which an adjustable attenuator 2 is added to the laser processing apparatus shown in FIG. 12A. The adjustable attenuator 2 is based on the control signal sent by the controller 11 and synchronized with the operation of the electromagnetic scanner 7 to attenuate the power of the pulsed laser beam radiated on the substrate 12 at the desired attenuation rate. An example of a laser processing method using an adjustable attenuator will be described with reference to FIGS. FIG. 14 is a schematic view showing the optical path of the laser beam on the scanning substrate 12 through the objective lens 6 and the electromagnetic scanner 7 in the laser processing apparatus shown in FIG. 12B. -33- (30) (30) 1221102 The laser beam L2b enters the incident position M2 perpendicular to the substrate surface. The laser beams L2a and L2c are incident at the incident positions N2a J2c at an incident angle α2, respectively. The injection position M2 is located at the midpoint of the line with the injection positions N2a. N2c as both ends. The objective lens 6 is fixed to a position where the laser beam L2b can be imaged at the incident position M2. An imaginary plane drawn by the focal point of the laser beam in the swinging direction by the electromagnetic scanner 7 is set as a light collecting surface 82. As described with reference to Fig. 13, the laser beam is moved in the direction from the laser beam L2a to the laser beam L2c, and the pulse laser beam is repeatedly irradiated to form a groove on the substrate surface. As the incident position of the laser beam is further away from the incident position M2, the distance at which the laser beam is imaged and then incident on the substrate becomes longer. Since the laser beam passing through the focus becomes a scattered beam, the longer the distance from the focus to the incident position, the larger the beam spot on the substrate surface becomes. Further, as the incident position is further away from the incident position M 2, the incident angle of the laser beam to the substrate becomes larger. Although it is irradiated with a laser beam having the same beam diameter, as the incident angle becomes larger, the beam spot on the substrate surface becomes larger. As described with reference to FIG. 13 ', the pulse energy density in a larger beam spot decreases the entire beam profile, and the threshold above the threshold for processing a substrate is limited to the vicinity of the center of the beam profile. Therefore, the width of the groove formed by irradiation with a large beam spot is narrow. When a groove is formed by irradiating the laser with a certain pulse energy at any injection position, the groove is formed with a relatively wide width near the center of the groove 'and the groove end is formed with a relatively narrow width. -34- (31) (31) 1221102 Therefore, the pulse energy density on the surface of the substrate is made constant at any position, and the power is adjusted by the adjustable attenuator 2 corresponding to the injection position. The power attenuation amount is set to a minimum when machining the end of the groove, and becomes larger toward the center of the groove, and is set to a maximum when the incident position M2 of the center of the groove is irradiated. In this way, it is possible to prevent the width from varying depending on the space and form a trench. In addition, in order to make the pulse energy density of the laser beam irradiated on the substrate uniform, the focus position can be moved by the voice coil mechanism 10 moving the objective lens 6 and attenuated by the adjustable attenuator 2 use. The laser beam may be a continuous wave. When processing with a continuous wave laser beam, the power density of the machined surface can be suppressed from varying with each incident position, and the power of the continuous wave laser beam can be adjusted with an adjustable attenuator. On the other hand, processing of a glass base material having an ITO film formed on its surface, for example, tends to increase the size of the substrate. As the substrate becomes larger and the area to be processed becomes larger, that is, when the processing is performed by moving the objective lens 6 at a position corresponding to the laser beam incident position as described with reference to FIG. 13, the amount of movement of the objective lens 6 may increase. However, from the viewpoint of the ease of self-control, it is better to make the amount of movement of the objective lens 6 smaller. Next, a laser processing apparatus of a third embodiment which suppresses the movement of the objective lens 6 to a short distance and can increase the moving distance of the focal position of the laser beam will be described with reference to Fig. 15A. In the laser processing apparatus shown in FIG. 15A, a secondary condenser 71 is added between the objective lens 6 and the electromagnetic scanner 7 of the laser processing apparatus shown in FIG. 12A. In the description of FIG. 15A, the objective lens 6 is referred to as a primary condenser lens 6. -35- (32) (32) 1221102 The laser beam emitted from the aperture 5 a is incident on the primary condenser 6. The primary condenser 6 condenses the laser beam on the imaginary primary condenser surface 8 3. The laser beam passing through the primary condenser surface 83 is changed into a scattered beam and incident on the secondary condenser 71. The laser beam converged by the secondary condenser 71 is impinged on the substrate 12 by the electromagnetic scanner 7 in a swinging direction. Next, the amount of movement of the primary condenser 6 will be described. When the primary condenser 6 is brought close to the secondary condenser 71, the focal position of the laser beam converged by the secondary condenser 71 is moved in the direction of the laser beam. Set the moving distance of the primary condenser surface 8 3 to d 1 and the moving distance of the focal point of the laser beam to d 2. In addition, the number of apertures (holes) in the secondary condenser 7 for the laser beam incident on the secondary condenser 71 is set to N A 2. When the magnification P is defined as P = NA1 / NA2, d 2 = d 1 χ p 2 can be established. It can be seen from the above that increasing the magnification p means shortening the moving distance d 1 of the light-condensing surface 8 3 once, and also increasing the moving distance d 2 of the focal point. For example, when the magnification P is 2, if the primary condenser surface 83 is close to the secondary condenser lens 7 at 2 mm], the focus of the laser beam can be moved 8 mmc in the direction of the laser beam. The movement is performed by moving the primary condenser 6 in the direction of the optical axis. When the laser beam incident on the primary condenser 6 is a parallel beam, the moving distance of the primary condenser 6 and the primary condenser surface 83 are equal. If the moving distance of the primary condenser 6 is less than 2mm -36- (33) (33) 1221102, a direct-acting mechanism using a piezoelectric driving mechanism can be used. By replacing the voice coil mechanism 10 with a direct-acting mechanism using a piezoelectric driving mechanism, the condenser lens 6 can be moved at a high speed and high accuracy. One example of the configuration of the secondary condenser 71 is shown in FIG. 16. The secondary condenser 71 is composed of a plurality of lenses. The object point So and the image point Si are in a conjugate relationship. This object point S 0 corresponds to the position of the beam spot on the primary light-condensing surface 83 shown in Fig. 15A. The imaging optical system is assumed to be an infinity conjugate optical system. The secondary condenser 7 1 is divided into a front lens group 7 1 a and a rear lens group 7 1 b. The beam emitted from the object point S 0 is formed into a parallel beam by the front lens group 7 1 a. The rear lens group 7 1 b images the parallel beam at the image point S i. The secondary condenser 71 may not be physically divided, but it is assumed that the secondary condenser 71 can be divided. It is assumed that the focal distance before the front lens group 7 1 a is Ff and the focal distance after the rear lens group 7 1 b is Fr. At this time, the magnification p defined by the above formula can be expressed by p 2 Fr / Ff. Fig. 5A shows the laser processing apparatus shown in Fig. 5A. Although the primary condenser lens 6 is constituted by a convex lens', as shown in Fig. 15B, it may be constituted by a concave mirror 6a. At this time, the primary light-condensing surface 83 becomes a ghost image and appears closer to the laser light source side than the concave mirror 6a. If it is' increasing the magnification P, the moving distance of the primary condenser 6 can be kept short, and the focal position of the laser beam irradiated on the substrate can be greatly changed. If you want to play a promising effect, set the magnification p to 2 or more. -37- (34) (34) 1221102 It is more appropriate to set it to 4 or more. However, the beam points 9 1 a · 9 1 c shown in FIG. 13 are elliptical because they are beam points of a laser beam incident on the substrate obliquely. In addition, the beam spot 9 1 b is a beam spot that is a laser beam that is perpendicularly incident on the substrate and is circular. In this way, the incident angle varies with the incident position of the laser beam, so the beam spot shape on the substrate will be different. The processed hole openings are oval if the beam spot is oval, or circular if they are circular. However, there are cases where it is desired to form the hole openings in the same shape (for example, circular) regardless of the position. Next, referring to Fig. 17, the laser processing apparatus according to the fourth embodiment, in which the beam spot shape can be corrected corresponding to the incident position, will be described. The laser processing device shown in FIG. 17 is an addition to the laser processing device shown in FIG. 12 in addition to an aperture tilting mechanism 60 a capable of rotating the aperture 5 a around an axis perpendicular to the optical axis of the laser beam, and the aperture 5 a Aperture rotation mechanism 6 a rotating around an axis parallel to the optical axis of the laser beam. Also, the 'aperture rotation mechanism 6 1 a is the same mechanism as the mask rotation mechanism for rotating the mask provided by the laser processing apparatus described later with reference to FIG. 22A', and can rotate the aperture 5 a to the optical axis of the laser beam. Around the parallel axis. The aperture tilting mechanism 60a and the aperture rotating mechanism 6 1 a synchronize with the movement of the electromagnetic scanner 7 according to the control signals sent by the controller 1 1, respectively, while changing the aperture 5 a and the axis perpendicular to the optical axis of the laser beam. Inclination angle 'and the rotation angle around the axis parallel to the optical axis of the laser beam. Η Compare the cross-sectional shape of the beam on the substrate surface when the laser beam is incident obliquely on the surface of the substrate and the cross-sectional shape of the beam perpendicular to the optical axis. The beam cross-sectional shape on the substrate surface -38- (35) 1221102 is a shape in which the beam cross-sectional shape perpendicular to the optical axis is stretched along the substrate surface and in the direction of the line of intersection with the incident surface. For example, when a laser beam with a circular cross section is incident obliquely on the substrate surface, the beam cross section of the substrate surface is a long 憜 circle t 沿 along the direction of the intersection of the substrate surface and the incident surface. The larger the beam profile of the substrate surface becomes, the longer the shape is along the cross line direction.

Therefore, the cross-section perpendicular to the optical axis is shaped into an elliptical laser beam with an appropriate long-axis to short-axis ratio, and the long-axis direction of the ellipse is perpendicularly incident to the incident surface and incident on the substrate surface obliquely. Can make the beam spot on the surface of the substrate ¥ round. FIG. 18A is a schematic view showing the aperture 5a rotated by the aperture tilting mechanism 60a around an axis perpendicular to the optical axis of the laser beam, and viewed from the rotation axis direction of the aperture tilting mechanism 60a. The laser beam incident from the left side of the figure b is emitted from the right side of the figure after the aperture 5 a is shaped.

As shown in Fig. 18B, the circular through hole with the aperture 5a rotated by the aperture tilting mechanism 60a looks like a circle when viewed along the line of sight of the optical axis of the laser beam. That is, the laser beam profile has been shaped into an oval shape. In addition, if the diameter of a circular through-hole with a diameter of 5 a is different from the diameter of the extended surface, if the optical axis of the laser beam is orthogonal, the laser beam profile is shaped into a circle jf;. The aperture 5 a is gradually inclined, and as the angle formed by the rotation central axis of the circular through hole and the optical axis of the laser beam becomes larger, the short axis of the beam profile after shaping becomes shorter. If so, the aperture tilt mechanism 60a can change the aspect ratio of the beam profile after shaping. As shown in FIG. 8C, the aperture rotation mechanism 6 1 a is used to rotate the aperture 5 a -39- (36) (36) 1221102 around an axis parallel to the optical axis of the laser beam. The cross-sectional shape of the laser beam with the smallest beam spot (called the focal point of the laser beam) is elliptical. The major axis direction of the beam cross section of the focal point is the minor axis direction of the beam cross section corresponding to the position of the through hole with the aperture 5 a. Therefore, the aperture axis rotation mechanism 6 1 a is used to rotate the aperture 5 a so that the long axis direction of the beam profile at the position of the through hole coincides with the cross-line direction. In this way, the shape of the beam spot on the substrate can be kept circular regardless of any position. Although it is not necessary to explain the concentrating process of imaging a through hole with an aperture of 5 a on the surface of the substrate, only the through hole is performed. When the image is processed by the mask projection method on the substrate surface, the beam spot shape on the substrate can also be corrected. In the mask projection method, the long-axis direction of the image of the through-hole formed on the surface of the substrate, that is, the long-axis direction of the beam cross section corresponding to the position of the through-hole of the mask. The beam axis is tilted around the vertical axis but the same. However, when the mask is rotated around the parallel axis of the laser beam optical axis, the elliptical minor axis direction of the beam cross section when exiting the through-hole is aligned with the direction of the intersection of the incident surface and the substrate surface and rotated. Although the case where the through-hole shape is circular will be described, the beam spot shape of a laser beam shaped by a through-hole of another shape can also be corrected. Next, referring to Fig. 19, a laser processing apparatus according to a fifth embodiment of a laser processing method using a proximity mask will be described. The laser processing apparatus shown in FIG. 19 is a method in which a proximity mask 63 is added to the laser processing apparatus shown in FIG. 12. The proximity mask 63 is held by the proximity mask holding mechanism 64, and is disposed directly above the substrate 12 in parallel with the surface of the substrate 12. Proximity mask -40- (37) (37) 1221102 6 3 A Shan hole having the same shape as the shape to be processed on the substrate surface is formed. The distance (proximity gap) d g between the proximity mask 63 and the surface of the substrate 12 is adjusted by the proximity mask holding mechanism 64. The expander 3 is a film of the beam diameter of the laser beam emitted from the laser light source 1, and emits a laser beam of parallel light. The laser beam emitted by the dilator 3 has a spread angle / 3. When the beam diameter of the laser beam is expanded by, for example, 0 times with the expander 3, the diffusion angle / 3 is reduced to 10 times. The spreader 3 can adjust the diffusion angle of the laser beam. The electromagnetic scanner 7 scans the proximity mask 63 at the same time, and irradiates the beam with V Vli. The laser beam is incident on the dipping plate 12 through the through hole of the close-up mask 63, and the substrate 12 is processed. The portion other than the through hole does not pass the lightning beam, and the substrate 12 is not processed. If so, the shape of the through-holes of the proximity mask 63 can be transferred and processed on the surface of the substrate. At this time, although the incident position of the laser beam changes, it is also possible to suppress the variation of the pulse energy density on the surface of the substrate, and move the position of the objective lens 6 corresponding to the incident position of the laser beam on the substrate to move the laser. In addition, the laser radon source 1 may be a person that emits a continuous wave laser beam. In this case, it is necessary to suppress variations in power density on the surface of the substrate. In addition, in order to perform high-precision processing, it is necessary to accurately transfer the shape of the through-holes in the proximity mask 63 to the substrate. The accuracy of the transfer depends on the diffusion angle of the laser beam irradiated on the proximity gap d g and the proximity mask 63. The spread angle of the laser beam irradiated on the close mask can be assumed to be the same as the spread angle of the laser beam when passing through the expander / 3. In Fig. 20, a close mask with a T-shaped through-hole is shown, showing the simulation results of how the half-degree of transfer -41-(38) 1221102 depends on the close gap and the diffusion angle of the laser beam. The T-shaped through-hole images 9 7 are also displayed in an array when the proximity gap and the diffusion angle of the laser beam are variously changed. In each drawing, the more the laser beam is arranged on the right side, the smaller the diffusion angle of the laser beam, and the lower it is, the closer the gap is.

The clearer the edges like 9 7 the better the transfer accuracy. As can be seen from the figure, the larger the contact gap is, the larger the proximity gap is, the worse the transfer accuracy is. In the same proximity gap, the larger the 'diffusion angle, the worse the transfer accuracy. The smaller the proximity gap and the divergence angle, the better the transfer accuracy. Fig. 21 shows the relationship between the proximity gap and the diffusion angle of the laser beam when the transfer accuracy is to be ensured. To ensure the accuracy of a certain transfer, if the proximity gap is large, it is necessary to set the diffusion angle to be small.

For various transfer accuracy, if the relationship between the proximity gap and the diffusion angle of the laser beam as shown in Figure 21 is obtained in advance, the proximity gap can be easily selected when processing is performed with the desired transfer accuracy With diffusion angle. The laser processing method using the proximity mask has the advantage of setting the proximity gap and the diffusion angle to be relatively small 'for processing with high transfer accuracy. In addition, by arranging the through hole of the close mask directly above the processing position of the substrate for processing, high positioning accuracy can be obtained. Except for the location to be processed, the surface of the substrate is covered with a close mask, so there is an advantage that the scattered objects generated by the substrate being cut during processing are not easily attached to the surface of the substrate. In the process of irradiating a substrate with a laser beam passing through a through hole of a close mask, the laser beam is moved to the substrate's incident position. -42- (39) (39) 1221102 by an electromagnetic scanner It is possible to speed up the processing of the laser beam by swaying the direction of the laser beam, compared to when moving the stage in the XY direction of the loading substrate to move the incident position. Next, a laser processing apparatus having a laser source that can oscillate a continuous wave laser beam will be described with reference to Fig. 22A. As the laser light source capable of vibrating a continuous wave laser beam, for example, a semiconductor laser capable of oscillating a continuous wave laser beam can be used. The laser beam lbo emitted from the laser light source 1 is incident on the spectroscopic optical system 65. The spectroscopic optical system 65 divides the laser beam 1 b 0 into a laser beam 1 b 1 along a certain optical axis at a certain time, and allocates it as a laser beam lb 2 along the other optical axis in other time zones. The spectroscopic optical system 65 is composed of a half-wavelength plate 6 5 a, a photovoltaic element 6 5 b showing a Pockel effect, and a polarizing plate 6 5 c. The half-wavelength plate 6 5 a sets the laser light beam [b0] emitted by the laser light source [b0] as a linearly polarized light that becomes a P wave for the polarizing plate 65c. This P wave is incident on the photovoltaic element 65b. The photoelectric element 65b rotates the polarization axis of the laser beam according to the opportunity signal sig sent by the controller 11. When the photovoltaic element 6 5 b is in a state where no voltage is applied, the incident P wave is emitted as it is. When the photovoltaic element 65b is under a voltage application state, the photovoltaic element 65b rotates the polarization plane of the P wave by 90 degrees. Thereby, the laser beam emitted from the photoelectric element 6 5 b becomes an S-wave to the polarizing plate 6 5 c. The polarizing plate 6 5 c transmits the P wave as it is, and reflects the S wave. The laser beam 1 b 1 of the S wave reflected on the polarizing plate 6 5 c is incident on a beam damper 66 which becomes the end of the laser beam lbl. The laser beam I b2 of the P wave -43- (40) (40) 1221102 transmitted through the polarizing plate 65c enters the expander 3. The beam diameter is enlarged by the expander 3, and a laser beam 1 b2 formed as parallel light is incident on a mask 5 having a rectangular through-hole. Here, a description will be given by taking a mask projection method as an example. That is, the through holes of the mask 5 are imaged on the surface of the substrate 12 and processed. The mask rotation mechanism 61 is used to cause the mask 5 to rotate around an axis parallel to the optical axis of the laser beam. The mask rotation mechanism 61 includes, for example, a goniometer, and rotates the mask at a desired timing according to a control signal sent from the controller 11. The mask rotation mechanism 61 will be described in detail later. The voice coil mechanism 9 moves the position of the mask 5 in parallel along the direction of the laser beam. The laser beam 1 b2 emitted from the mask 5 is focused by the objective lens 6. The voice coil mechanism 10 moves the position of the mask 5 in parallel in the direction of the laser beam. The laser beam emitted from the objective lens 6 passes through the electromagnetic scanner 7 and is incident on the surface of the substrate 12. The substrate 12 of the object to be processed will be described with reference to FIGS. 2 and 2B. A transfer layer is present on the surface of the base layer 1 1 0] 1 1. The transfer layer 1 1 I has a property of being adhered to the surface of the base layer 1 10 by being heated. For example, a part 1 1 1 a of the transfer layer 1 Π is bonded to the base layer 1 1 0 by irradiating a laser. When the unheated portion 1 1 1 b in the transfer layer 1 Π is removed, only the heated portion Π 1 a remains on the surface of the base layer 1 10. This is similar to the case where the heated portion of the ink ribbon is transferred to the paper during thermal transfer printing. Returning to FIG. 22A, the explanation is continued. The XY-direction stage 8a is used as a holding table for the base -44- (41) (41) 1221102 plate 12. The X Y direction stage 8 a can move the substrate 12 in a two-dimensional plane parallel to the surface of the substrate 12. And by the controller] 1 controls the XY direction stage 8 a, the substrate 12 can be moved to the desired position at the desired timing c. The laser processing method example described here is the scanner in the X direction of the electromagnetic scanner 7 The 7 a and Y direction scanners 7 b are fixed at positions where the laser beam emitted from the electromagnetic scanner 7 can be incident on the substrate 12 vertically. By moving the substrate 12 in the X Y direction platform 8a, the laser beam can be moved to the incident position of the substrate 12. Using the voice coil mechanism 9, 10, the light path length of the mask 5 to the objective lens 6 and the light path length of the laser beam incident position of the objective lens 6 to the substrate 12 can be set to; the through hole of the mask 5 can be set The image is formed on the surface of the substrate 12 at the desired imaging magnification. A control method of the spectroscopic optical system will be described with reference to FIGS. Fig. 23 is an example of an opportunity signal s i g and a laser beam 1 b 0, 1 b 1, 1 b 2. The laser beam lbO starts to be emitted at time t 0. From time t 0 to time t], the self-controller does not send the opportunity signal 5 i g. During this period, the photovoltaic element is not applied with a voltage, and a laser beam is often emitted by the spectroscopic optical system] b 2. The laser beam 1 b] is not emitted. The laser beam lb2 here is a continuous wave. From time t 1 to time t 2, the timing signal s i g sent by the controller periodically and synchronously is applied to the photoelectric element of the spectroscopic optical system. While the opportunity signal sig is being sent out, the photovoltaic element system is in a voltage-applied state 'and the laser beam I b 0 is allocated as the laser beam 1 b. In addition, during the period when the -45- (42) (42) 1221102 opportunity signal sig was not sent, the photovoltaic element was in a state where no voltage was applied, 'laser beam] b 0 was assigned as laser beam 1 b 2. Therefore, the laser beam lb2 from time t 1 to time t 2 becomes the laser beam c that periodically oscillates and stops repeatedly. The intermittently emitted laser beam 1 b2 can adjust the pulse width w 1 by adjusting the signal sig. And the period w2 is set to an arbitrary length. For example, if the pulse width wl is set to 1 0 // s to number 10 " s, and the period w2 is set to number 1 0 0 // s 〇 If yes, continuous emission can be obtained when the spectroscopic optical system is not input with the opportunity signal. The laser beam 1 b 2 of the laser beam 1 is intermittently obtained when the spectroscopic optical system is intermittently input with an opportunity signal. In addition, since the laser beam 1 b2 emitted continuously can be irradiated to the substrate continuously, it is suitable for, for example, a process for forming a line (a process in which a linear transfer layer remains on the base layer). In addition, the intermittently emitted laser beam] b 2 can be irradiated to the substrate intermittently, and is suitable for, for example, processing for forming dots (processing for leaving a dot-like transfer layer on a base layer). A method of wire processing will be described with reference to FIG. 24A. For the base plate 12, laser irradiation was started to start processing. At the start of processing, first, a rectangular beam spot 93 is used to illuminate the area on the full width of the line 103. Then, while continuously irradiating the laser, the beam spot is moved to the other end of the line 103 and the χγ-direction platform is moved in one direction. The moving direction of the platform in the χγ direction is parallel to one side of the rectangular beam spot 93. The direction of movement of the beam spot on the substrate is indicated by arrows. When the beam spot reaches the other end of the line 103, the irradiation of the substrate is stopped -46- (43) 1221102 Laser and the processing is ended. In this way, by irradiating and heating a linear area on the substrate surface, a linear residual transfer layer line 103 can be formed on the surface of the base layer. The formed shape of the line 103 is a rectangle whose longer edge is parallel to one side of the beam spot 93 and whose axial edge is parallel to an edge orthogonal to an edge of the beam spot 93. The width of the line 103 is equal to the length of a side orthogonal to an edge of the light spot 93. A method of point processing will be described with reference to FIG. 24B. When the point is added, the substrate 12 is irradiated with the laser beam intermittently, and X γ is moved in one direction toward the platform. The moving direction of the XY direction platform is one side (referred to as side p) of the parallel rectangular beam spot 94a. First, at the beginning of the first pulse of irradiating laser, a rectangular light beam 9 4 a irradiates the area on the full width of the point 1 0 4 a -end. Since the X Y is moving toward the platform, the light spot moves on the substrate until the laser pulse of the first pulse ends. Here, the movement of the beam spot is shown by arrows. In this way, the spot-shaped area of the substrate surface is irradiated with the laser to form a spot 104a on the surface of the base layer in the form of a dot-shaped residual transfer layer. In the same way, the points 104b, 104c, 104d, and 104e are formed by irradiating the laser with the second, third, fourth, and fifth pulses. In addition, when the second, third, fourth, and pulse irradiations are started, the beam spots 9 4 b, 9 4 c, 9 4 d, and 9 4 e irradiate the substrate surface area, respectively, and the substrate surface is irradiated with the beam spot 9 4 a. The areas in which the platform moves in the XY direction are parallel to each other. The points are arranged on a line parallel to the moving direction of the platform in the XY direction. The edge of Lei Zhiyu's side beam is divided into five points at the point of the beam. -47- (44) (44) 1221102 The shape of each point is a side parallel to the side p of the beam point 94a, and S and the beam point. A rectangular shape in which the sides p of 94a are orthogonal to each other (referred to as side q) and the sides are parallel. The length of the side of each point that is orthogonal to the moving direction of the platform in the XY direction is equal to the length of the side q. For example, when the length of the side q is 20 m, it is 2 0 " mc The length of the parallel sides depends on the length of the side P of the beam spot, the moving speed of the platform in the XY direction, and the pulse irradiation time (pulse width). For example, suppose that the length of the edge ρ of the beam spot is 1 2 # m, the moving speed of the platform in the X Υ direction is 800 mm / s, and the pulse width is 10 # s. As the pulse width is 10 s, the distance of the platform movement in the χγ direction (that is, the substrate movement distance) is 8 vm, so that the side length of a point parallel to the platform movement direction in the XY direction is the side of the beam spot, and the length is I2 // m plus 20 ji m with a travel distance of 8 // m. The distance d between adjacent points is a distance consistent with the movement during one cycle of the pulse. For example, when the period of the pulse is 3 7 5 # s and the moving speed of the platform in the X and Y directions is 800 mm / s, the pitch d is 300 " m. To sum up, set the beam spot size to the side ρ length 1 2 # m, the side ρ length 2 0 " m, oscillate the laser beam with a pulse width 1 〇 # s, a period 3 7 5 # s, and make the XY direction When the platform moves at 800mm / s, it can form a point with an angle of 20 / m at a distance of 300 // m. In addition, there are cases where a plurality of lines in different directions of the tool are added to the substrate. However, if the direction of the beam spot on the substrate is fixed as -48- (45) 1221102 to form lines with different directions, problems such as dependence on the line direction occur. An example of such a situation will be described with reference to FIGS. The method illustrated in FIG. 24A is used to form a line 109 & ^ followed by the direction of the beam spot to be formed with a line different from the line 109a. At the beginning of the irradiation laser, irradiate the beam spot 9 9 on the line and move the platform in the XY direction to the longer direction of the line 1 09b to the other end of the line 1 0 9 b to form a line 9b As shown in the figure, although the width of line 1 0 9 a is equal to the length of the beam spot 9 9, the width of line 1 09 b may not be the same as the length of the long side. The end of line 1 0 9 b cannot be formed to be longer than the line. The direction is shown by the mask rotation mechanism 61 shown in FIG. 2A, and this type of mask can be avoided. 25 is a schematic view of the mask 5 mechanism 6 1 with a rectangular through hole 62. The two opposite sides of the rectangular through hole 62 are perpendicular to the optical axis of the laser beam. Mask rotation mechanism The intersection of the rectangular diagonals of the through hole 62 is used as the center, which urges: around an axis parallel to the optical axis of the laser beam. Corresponding to the rotation of the mask 5, the image of the through hole 62 is rotated in the plane. In addition, any direction within the rectangular image of the through hole on the substrate can be made parallel. As described next, the mechanism 61 rotates the mask 5 before changing the direction of the laser beam incident position on the substrate in order to change the direction of the processed line and the like. Referring to FIG. 26, to explain the change of the line width using the mask rotation mechanism. First, by referring to the 'not changing the line of light sentence 1 0 9 b 1 0 9 b-end. At the same time, make the lengths of the sides of the light equal. Again, orthogonal. If: Question. The rotation of the mask is extended by the angle line 6 1 through the lotus cover 5 to rotate the E substrate 1 2 and the surface of the substrate, which can be changed by the mask rotation line processing method -49- (46) 1221102. The line 10a is formed by the method described with reference to Fig. 24A. And the length of the long side of the beam spot 93a is equal to the width of the line 103a, and the direction of the short side of the light 93a is parallel to the longer method of the line 103a. At the beginning of processing the line 1 0 3 b having a direction different from the line 1 0 3 a, the mask is rotated by the mask rotating mechanism so that the short side of the beam spot 93b is parallel to the longer direction of 103b. And the substrate is moved by the XY direction platform, so that the point irradiation line 103b is on the full width of the end. Beginning of the laser beam irradiation 'is explained as shown in Fig. 2 4A. • The X-path' moves the platform in the X and Y direction along the longer direction of the line 10 3 b 'and forms the line 103 b. The width of the line 1 0 3 b is equal to the length of the beam spot 9 3 b. In addition, the side in the width direction of the line 103b is orthogonal to the longer side. In this way, a plurality of lines each having a different direction can be formed to have the same width. In order to form a plurality of points having different directions without changing the large shape, a mask rotation mechanism may be used. Although it is explained here that the spectroscopic optical system is controlled by the periodic opportunity signal to exemplify the pulse of the laser beam ', the opportunity signal is also non-periodic. For example, when you want to form a majority of points at unequal intervals, you can use aperiodic opportunity signals. Moreover, the pulse width of the laser beam may not be fixed. The size and the like of the formation points may be appropriately set. By changing the shape or size of the beam spot on the substrate, the line or dot size can be adjusted. The shape of the beam spot can be changed by changing the mask. Moreover, by changing the imaging magnification (reduction rate), the hypothetical beam spot 刖 can also be changed, and the line beam is also small and systematic at the same time in the long side. The width or large size of the beam should be -50- ( 47) (47) 1221102 Although the above description is made by taking the processing of a linear or dot-shaped transfer layer remaining on the substrate surface as an example, it is also possible to dig a linear or dot-shaped process by irradiating a laser on the surface of the substrate. The shape of the through hole of the mask is not limited to a rectangle, and the shape of the point or line to be formed may be appropriately selected. Although the above description is an example of moving the laser beam incident position on the substrate by the XY direction stage, the incident position can also be moved by the electromagnetic scanner to swing the laser beam forward direction. Next, a seventh embodiment of a laser processing apparatus having two laser light sources, one of which emits a pulsed laser beam and the other laser source which emits a continuous wave laser beam, will be described with reference to FIG. 27A. The laser light source 1 a is, for example, an Nd: YAG laser oscillator including a wavelength conversion unit, and can emit a fourth harmonic (wavelength 266 nm) of the Nd: YAG laser. The pulse width is, for example, 10 ns. Pulses emitted by the laser light source 1 a The laser beam is incident on the half-wavelength plate 69 a and is formed as linearly polarized light having a P wave to the polarizing plate 67. The laser light source 1 b is, for example, a semiconductor laser oscillator, and can emit a continuous wave laser beam with a wavelength of 808 nm. The continuous wave laser beam emitted from the laser light source lb is incident on the half-wavelength plate 69b, and is formed as linearly polarized light having an S wave to the polarizing plate 67. The pulsed laser beam emitted from the half-wavelength plate 69a is expanded by expanding the beam diameter into parallel light 3a and a mask 5 having, for example, a rectangular through-hole, and is incident at an incidence angle of 45 ° On the surface of the polarizer 6 7. The continuous-wave laser beam emitted from the half-wavelength plate 69b is reflected by a folding mirror 6 8 by expanding a beam diameter -51-(48) (48) 1221102 to expand the expander 3 b set as parallel light. And with an injection angle of 4 5. It is incident on the back of the polarizing plate 67. The polarizing plate 67 passes the pulsed laser beam of the P wave, and reflects the continuous wave of the S-wave laser beam. By using the polarizing plate 6 7, the pulsed laser beam emitted from the laser light source 1 a and the continuous wave laser beam emitted from the laser light source 1 b can be overlapped on the same optical axis. The pulsed laser beam passing through the polarizing plate 67 and the continuous wave laser beam reflected by the polarizing plate 67 are focused on the objective lens 6 and incident on the substrate 12 through the electromagnetic scanner 7. · The X Y direction stage 8 a used by the holding table of the substrate 12 can move the substrate 12 in a two-dimensional plane parallel to the surface of the substrate 12. The controller 11 controls the electromagnetic scanner 7 so that the substrate 1 2 can be moved to a desired position at a desired timing. The laser processing method described here is an example in which the X-direction scanner 7a and the Y-direction scanner 7b of the electromagnetic scanner 7 are fixed to the laser beam emitted from the electromagnetic scanner 7. position. By moving the substrate 12 with the XY-direction stage 8a, the laser beam incident position of the substrate 12 can be moved. The voice coil mechanisms 9, 10 respectively move the positions of the mask 5 and the objective lens 6 in parallel along the traveling direction of the pulsed laser beam emitted by the laser light source 1a. The image of the through hole of the mask 5 is formed on the surface of the substrate 12 by adjusting the positions of the mask 5 and the objective lens 6 at the desired imaging magnification (reduction rate). The substrate 12 to be processed will be described with reference to FIG. 27B. A surface layer 121 is formed on the surface of the base layer 120. The base layer 120 is, for example, a color filter of a liquid crystal display device (52) (49) (49) 1221102 display device, which is a resin layer having a thickness of 1 #m and formed of a polyimide resin or an acrylic resin. The surface layer 1 21 is, for example, an ITO film having a thickness of 0.5 ". When only the surface layer 1 2 1 is removed by irradiating a laser, the base layer 1 2 0 is easier to process than the surface layer 1 2 1, so that only the surface layer 1 2 1 is processed. More difficult. For example, when a laser is irradiated to the substrate, the surface layer 1 2 1 is not directly processed, and the base layer 1 2 0 is explosively scattered due to the thermal influence transmitted by the base layer 120. The surface layer 1 2 1 is scraped off. The inventor found that by preheating the substrate and then taking care of the laser, it is easier to process only the surface layer 121. Therefore, the laser processing apparatus shown in FIG. The continuous wave laser beam emitted from the laser light source 1 b preheats the substrate, and then uses the pulsed laser beam emitted from the laser light source 1 a to process the holes and the like. Next, referring to FIGS. 2 8 A to 2 8 C, the use is explained. An example of a method in which a continuous wave laser beam preheats a processed point on a substrate and then irradiates a pulsed laser beam to form a cavity. As shown in Figure 2 8A, the continuous wave laser beam (with a circular beam spot) 9 5) The surface of the irradiated substrate 12 is delineated with processing points 1 0 5 a, 1 0 5 b, 1 0 5 c. The beam spot 95 is located on a straight line connecting the processed points 1 0 5 a to 1 0 5 c. And the X γ direction platform 8 a is moved in parallel with the straight line , The processed point 1 〇5 a ~ 1 0 5 c can be moved to the beam point 95. As shown in FIG. 28B, when the processed point 105a reaches the edge of the beam point 95, the continuous wave laser beam is irradiated and processed. Point 1 〇5 a begins to supply preheating -53- (50) (50) I2m〇2 As shown in Figure 2 8 C, the processed point] 0 5 a reaches the center of beam point 9 5 when it reaches the center of beam point 9 5 A shot pulse laser is irradiated. The beam spot of the pulse laser is displayed as beam spot 9 6. The processed point 1 0 5 a is preheated between the end edge of the beam spot 9 5 and the center. By borrowing The pulsed laser is irradiated on the pre-heated processing point 105a, which can suppress the processing of the base layer and form holes in the surface layer of the substrate. Moving the substrate 12 2 'same as the processing point 105a' also Holes are formed at the processed points 1 0 5 b and 1 0 5 c. The irradiation conditions of the continuous wave laser beam used for preheating is to set the beam spot to a circle with a diameter of 20 mm, for example. The shape sets the power density on the substrate surface to 0.1 W / cm2. The irradiation conditions of the pulsed laser beam used for processing are, for example, setting the beam spot to a square with a diameter of 2 0 // m, and the pulse energy density on the substrate surface. It is set to 〇 · 〖～ 0.4 J / cm2. In addition, the preheating time of the processed point is slightly equal to the time required for the processed point to move the long point of the continuous beam laser beam's beam radius. When the beam spot radius is set to 10 mm and the movement speed of the XY direction stage is set to 800 mm / s, it is about 0.13 seconds. By irradiating a pulsed laser to the center of the beam spot of the continuous wave laser beam ', although the movement direction of the XY direction stage is variously changed, it can be easily processed with a neat warm-up time. The heat imparted to the substrate surface by the continuous wave laser is transmitted to the substrate, so that even if the preheating is too much, the substrate is also processed. Therefore, the supply of preheating needs to keep the temperature of the base layer below the temperature that prevents the base layer from being processed. For example, it is necessary to keep the temperature of the base layer below the melting point of the raw materials of the base layer. -54- (51) (51) 1221102 The ITO film is transparent to visible light, but its absorption coefficient is not zero for near-infrared rays with a wavelength of 8 0 8 m, for example. Therefore, this wavelength of light can be used for the preheating of the I TO film. If light with a wavelength greater than the absorption coefficient of the ITO film (for example, a wavelength near 1 064 nm) is used, the efficiency of preheating can be expected to increase. Although the above description illustrates an example in which a pulsed laser beam and a continuous wave laser beam are superimposed on the same optical axis to irradiate the substrate, the two laser beams may not be on the same optical axis. Prompt the beam point of the continuous wave laser beam to contain the beam point of the pulsed laser beam, and irradiate the two laser beams to the substrate, that is, the processed point can reach the pulsed laser beam after reaching the edge of the beam point of the continuous wave laser beam. Preheating is provided to the processed point between the beam spot positions of the beam. However, in order to provide preheating, it is necessary to pass the processed point through the inside of the beam spot of the continuous wave laser beam, and then reach the irradiation position of the pulse laser beam. Therefore, it is necessary to avoid that the irradiation position of the pulsed laser beam is consistent with the position of the processed point when the processed point is in contact with the outer periphery of the beam point of the continuous wave laser beam. Although the above example describes the formation of the cavity, it is continuously formed. Most holes can be grooved. Although the above describes the example where the laser beam incident position on the substrate is moved by the XY direction stage, the incident position can also be moved by the electromagnetic scanner to swing the laser beam in the direction. Although the present invention has been described along the embodiments, it is not limited to these. For example, 'can make various changes, improvements, combinations, etc., of course, it is obvious to those in the industry. (52) (52) 1221102 [Brief Description of the Drawings] The figure is a schematic view of a laser processing device that can implement the laser processing method of the first embodiment of the present invention. FIG. 2 is a schematic view showing a laser beam light path of a laser processing apparatus capable of implementing the laser processing method according to the first embodiment of the present invention. 3A and 3B are schematic plan views of a substrate processed by laser beam irradiation. FIG. 4A is an illustration of an example of a through hole of a mask, and FIG. 4B is a schematic view of a hole cut out by the substrate when the through hole shown in FIG. Fig. 5 A is a schematic diagram showing the energy density of each pulse of the pulse laser beam profile emitted by the laser light source, and Fig. 5 B is each pulse of the pulse laser beam profile of the pulse energy density profile transformed by the conical optical system. A schematic diagram of the energy density is shown. FIG. 5C is a schematic sectional view of a hole processed by a pulsed laser beam having a pulse energy density distribution shown in FIG. 5B. Fig. 6 is a schematic view of a laser processing apparatus capable of implementing a laser processing method according to a modification of the first embodiment. FIG. 7 is a schematic display diagram of a light path adjustment mechanism. 8A and 8B are schematic diagrams showing a transport mechanism. FIG. 9 is a schematic view of a conventional laser cutting device. 10A and 10B are schematic plan views of a substrate processed by a conventional laser cutting device. Figure 11 is a schematic cross-sectional view of a substrate processed by a conventional laser cutting device -56- (53) 1221102 Figure 1 2A is a schematic view of a laser processing device capable of implementing the laser processing method of the second embodiment FIG. 1B is a schematic view of a laser processing apparatus capable of implementing a laser processing method according to a modification of the second embodiment. Fig. 13 is a schematic view showing a laser beam light path of a laser processing apparatus capable of performing a laser processing method according to a second embodiment of the present invention. Fig. 14 is a schematic view showing a laser beam light path of a laser processing apparatus capable of implementing a laser processing method according to a modification of the second embodiment.

FIG. 15A is a schematic view of a laser processing apparatus capable of implementing the laser processing method of the third embodiment, and FIG. 15B is a schematic view of another configuration example of a primary condenser. FIG. 16 is a schematic view showing a configuration example of a secondary condenser lens. Fig. 17 is a schematic view of a laser processing apparatus capable of implementing the laser processing method of the fourth embodiment.

Figure 18 A is a schematic view of the aperture rotated by the aperture tilt mechanism, viewed from the rotation axis direction of the aperture tilt mechanism, and Figure 18 B is the aperture rotated by the aperture tilt mechanism, and the optical axis of the laser beam Figure 1C is a schematic view of the aperture rotated by the aperture tilt mechanism and the aperture rotation mechanism, as viewed from the optical axis direction of the laser beam. Fig. 19 is a schematic view of a laser processing apparatus capable of implementing the laser processing method of the fifth embodiment. Fig. 20 is a plan view of a substrate with a projected through-hole image of a simulation result of transfer accuracy using a laser processing method of a proximity mask. Fig. 21 is a schematic diagram showing the relationship between the laser beam diffusion angle and the close gap when processing is performed with a certain transfer accuracy. -57 · (54) (54) 1221102 FIG. 22A is a schematic view of a laser processing apparatus capable of performing the laser processing method of the sixth embodiment, and FIG. 22B is a schematic cross-sectional view of a substrate. FIG. 23 is an example of timing signals and laser beam timing diagrams for laser processing using the laser processing method of the sixth embodiment ,:

24A is a schematic plan view of a substrate on which lines are formed. A schematic plan view of the substrate on which the dots are formed. J Figure 25 is a schematic view of a mask rotation mechanism holding a mask. Fig. 26 is a schematic plan view of a substrate using a mask rotation mechanism to form a line. Fig. 27A is a schematic view of a laser processing apparatus capable of implementing the laser processing method of the seventh embodiment, and Fig. 2B is a schematic cross-sectional view of a substrate. Fig. 2 A, Fig. 2 B and Fig. 2 C are plan views of the substrate for explaining the positional relationship between the processed point and the beam spot. Fig. 29 is a schematic plan view of a substrate without using a mask rotation mechanism to form a line. Main component comparison table 1, 1 a, 1 b: Laser light source 2: Adjustable attenuator 3, 3 a: Dilator 4: Conical optical system 4a, 4b: Conical lens 5: Mask 5 a: Aperture (55) 1221102 6: Objective lens 7 · Electromagnetic scanner 7a: X-direction scanner 7b: Y-direction scanner 8: Holding stage

8a: XY-direction stage 9, 1 0: Voice coil mechanism 1 1: Controller 1 2: Substrate 2 0: Optical path adjustment mechanism 21 & 21 € 1: Mirror 2 2: Moving section 30: Film 3 1: Transport Mechanism 3 2: Vacuum chuck

3 3: Rotary encoder

Lla, Lib, Lie: laser beam

Nla, Ml, Nlc: shot position α 1: shot angle S 〇: object point S i: image point

Sig: Opportunity signal lbO ~ lb2: Laser beam 60a: Aperture tilt mechanism -59- (56) (56) 1221102 6 1 a: Aperture rotation mechanism 6 2 a: Through hole 63: Proximity mask 64: Proximity mask holding Mechanism 6 5: Spectroscopic optical system 6 5 a, 6 9 a, 6 9 b: Half-wavelength plate 6 5 b: Electro-optical element 6 5 c, 6 7: Polarizing plate 66: Beam buffer 6 8: Folding mirror 7 1 : Secondary condenser 7 1 a: Front lens group 7 1 b: Rear lens group 81a, 81b · Condensing surface 8 3:-Secondary condensing surface 91a to 91c, 93, 94a to 94e, 95, 96, 99 : Beam point 1 〇1: Grooves 103, 103a, 103b, 109a, 109b: Lines 1 0 4a to 1 0 4e: Points 105a to 105c: Processed points 110, 120: Base layer 1 1 1: Transfer Layer 1 2 1: Surface layer 5 1: Laser light source-60- (57) (57) 1221102 52: Uniformizer 53: Mask 5 4: Mirror 5 5: Condenser 5 6: Substrate 57: XY-direction stage

Claims (1)

(1) 1221102 Scope of application and patent application1. A laser processing method has: (a) shaping a beam profile with a mask having a through hole, so that the through hole is imaged on the surface of the object to be processed, and a lens The laser beam passing through the laser beam is condensed and incident on the surface of the object to be processed; and (b) the position of the laser beam is moved over the object to be scanned, so that the laser beam passing through the lens is scanned At the same time, during the beam scanning, the above-mentioned through-hole is also a process for forming the processing object on the surface of the processing object. 2 · According to the laser processing method described in item 1 of the scope of the patent application, the above-mentioned process (a) refers to a state in which the light path between the mask and the lens and the light path from the lens to the surface of the processing object are longer than a certain state. To cause the laser beam to scan. 3 · As described in the laser processing party described in item 1 of the patent application, the above-mentioned project (b) contains a method for causing the lens to be displaced in a direction parallel to the direction through which the laser beam passes, and promoting The laser beam passing through the mask is parallel and displaced in the direction of the project. 4. The laser processing method described in item 1 of the scope of the patent application ± '± MX X (a) means that the laser beam passing through the through hole is on the surface of the object to be processed, so that the surface of the object to be processed is spotted It has the shape of ~ pairs of parallel sides, the above-mentioned process (b) is to add $ _P @ i: the pair of parallel sides are moved in a direction parallel to the through hole of the mask to add a laser image on the engineering surface, The method of maintaining the path length, the direction of the lens, and the direction of the above-mentioned light beam, and let the -62- (2) 1221102 laser beam scan. 5. As described in item 1 of the scope of patent application In the laser processing method, the intensity distribution of the laser beam incident on the surface of the object to be processed on the surface of the object is a distribution having a large intensity at the central portion of the intensity at the periphery of the beam spot. 6. In the laser processing method described in item 1 of the scope of the patent application, the laser beam incident on the surface of the object to be processed is a pulsed beam, and the above-mentioned process (b) contains information on the object to be processed. When the incident angle becomes larger, the pulse energy of the laser beam can be changed to change the pulse energy. 7. According to the laser processing method described in item 1 of the scope of the patent application, the above-mentioned process (b) will scan the laser beam on the surface of the processing object and change the incident angle on the surface of the processing object. The cover and the lens are displaced to promote a smaller variation in the area of the beam spot of the light beam emitted from the surface of the processing object. 8 · A laser processing method, comprising: (c) projecting the laser beam collected by the lens onto the processing surface; and (d) moving the laser beam incident position to the processing object The process of processing the object on the object is to prevent the laser beam from changing the length of the optical path from the lens of the laser beam to the surface of the object to perform the laser beam scanning. 9. According to the laser processing method described in item 8 of the scope of the patent application, the above-mentioned project (d) contains the laser beam to prevent the laser beam from passing through the above. In the processing ratio, the ground on the surface of the lightning strike and the light emitted from the above The surface of the surface of a lightning object has a mirror to -63- (3) (3) 1221102 The length of the light path on the surface of the object to be processed changes, which causes the lens to change along the direction of the laser beam passing through the lens. Bit of engineering. 10. The laser processing method according to item 8 in the scope of the patent application, wherein the laser beam incident on the lens is a collimated beam, and the length of the light path from the lens to the surface of the processing object is The focal length is the same as the above lens. Π. A laser processing device, comprising: a laser light source capable of emitting a laser beam; and a holding table for holding an object to be processed; and a penetrating laser beam having a cross section? A mask; a condenser lens for condensing the laser beam that has been shaped by the mask through the through hole of the mask to form an image on the surface of the processing object held by the holding table; and receiving external control to cause the condenser lens to focus A beam scanner that scans at least one-dimensional direction of the laser beam on the surface of the object to be processed; and a movement mechanism that receives external control to cause the mask and the condenser to move; and the beam scanner that facilitates the movement of the mask and the condenser A control device for synchronously performing the scanning of the mask and the movement of the mask and the condenser caused by the moving mechanism. 12. The laser processing device described in item 11 of the scope of the patent application, wherein 'the moving mechanism is to keep the length of the light path between the mask and the condenser to a certain length while avoiding the laser scanned by the beam scanner. -64-(4) 1221102 The above-mentioned light beam promotes the above-mentioned condensing direction and the upward direction. 13. As claimed, the above-mentioned shifting beam is for the upper cover on the surface of the object and the above-mentioned light condensing. 14. As claimed, the energy-adjustable adjustable processing object adjustable attenuator is described above. 15. As claimed, the more described The peripheral part of the pulsed laser light is as large as 16. If it is claimed, the above cover is 17. As described above, the light path length changing mirror on the surface of the projected object condensed by the condensing lens to the processing surface is moved to the light passing through the condensing lens. When the mask of the laser beam moves through the laser beam passing through the mask, the laser processing mechanism described in item 11 of the patent scope is to cause the In addition, the variation of the image area of the through hole becomes smaller, and the moving mechanism of the moving mirror. The laser processing described in item 11 of the patent scope can adjust the laser beam attenuator emitted by the above laser light source, that is, when the laser beam enters the surface of the angle with a large amount, the attenuation rate of the pulse energy is patented. In the laser processing described in the item 11 of the range, when the above laser light source emits a pulsed laser beam, the pulse energy density of the beam profile of the beam is set to a medium pulse energy density conversion device. The through-holes of the laser processing cover described in item 11 of the patent range have a pair of parallel sides. The laser-processed beam scanners described in item 16 of the patent range include the above-mentioned holding tables and are mutually positive. When the X and Y directions intersect, the light laser beam is surfaced on the above-mentioned object to be processed, and the above-mentioned shielding device of the laser object is pulsed into a smaller device, and the upper center can be Bibi device, Volt. Device, work object can make up Ji along X -65- (5) (5) 1221102 χ-direction scanner and γ-direction scanner scanning in the γ direction, and the condenser promotes a pair of parallel sides of the through-hole image on the surface of the object to be processed and X Directions are imaged in parallel. 18 — A laser processing method comprising: (e) a process of condensing a laser beam with a lens and incident on the surface of a processing object; and (f) when the laser beam of the processing object is radiated When the incident position is moved, the lens is moved to suppress the pulse energy density or power density of the laser beam on the surface of the processing object caused by the movement of the incident position, and at the same time, the laser beam is incident on the processing object. Works that move within the surface. 19. The laser processing method described in item 18 of the scope of the patent application, wherein in the above-mentioned process (f), if the pulse energy density or power density of the laser beam on the surface of the object to be suppressed is increased, it moves The lens promotes the focal position of the laser beam away from the incident position. When the pulse energy density or power density of the laser beam on the surface of the object to be suppressed is reduced, the lens is moved to promote the focal position of the laser beam close to the incident position . 2 0. A laser processing method, which includes: a process of condensing a laser beam with a lens and incident on a surface of a processing object; and when the laser beam incident position of the processing object moves, causing The movement of the lens to suppress the change of the beam spot area on the surface of the processing object caused by the movement of the incident position, and to move the laser beam incident position within the surface of the processing object while moving the laser beam into the position • 66-(6) 1221102 . 2 1 · A laser processing device, comprising: a laser light source capable of emitting a laser beam; a holding mechanism for holding an object to be processed; and a lens capable of condensing the laser beam emitted by the laser light source; versus The direction of the laser beam emitted by the lens can be swung, so that the laser beam is incident on the surface of the processing object held by the holding mechanism, and the incident position of the laser beam is moved within the surface of the processing object. Beam scanner; and a movement mechanism that receives external control signals to cause the lens to move; and When the beam scanner causes the incident position of the laser beam to move on the surface of the processing object, the moving mechanism may be controlled to move the lens position to suppress the pulse energy density or power of the laser beam on the surface of the processing object. Control device for density change. 22. The laser processing device according to item 21 of the scope of the patent application, wherein the control device controls the moving mechanism to move the pulse energy density or power density of the laser beam on the surface of the processing object when the pulse energy density or power density is increased. The lens promotes the focus position of the laser beam away from the entrance position, and when the pulse energy density or power density of the laser beam on the surface of the processing object is suppressed from decreasing, the moving mechanism is controlled to move the lens to promote the focus of the laser beam The position is close to the injection position. 23. —A laser processing device having: -67- (7) (7) 1221102 a laser light source capable of emitting a laser beam; and a holding mechanism for holding a processing object; and a laser light source capable of emitting the above-mentioned laser light source A lens for condensing the laser beam; and oscillating the direction of the laser beam emitted by the lens, 'make the laser beam incident on the surface of the processing object held by the holding mechanism', so that the laser beam is incident A beam scanner whose position is moved within the surface of the processing object; and a movement mechanism that receives the external control signal to cause the lens to move: and when the beam scanner causes the laser beam to be incident on the surface of the processing object A control device that can control the moving mechanism to move the lens position during movement so as to suppress variation in the area of the beam spot on the surface of the processing object. 2 4 — A laser processing method, comprising: (g) a process of condensing a laser beam with a lens and projecting it onto the surface of the processing object; and (h) when the laser beam of the processing object is radiated When the entry position is moved,% the power of the laser beam is adjusted with a variable attenuator to suppress the change in the pulse energy density or power density of the laser beam on the surface of the processing object caused by the entry position shift_ The process of moving the laser beam incident position within the surface of the object to be processed. 25. —A laser processing device comprising: a laser light source capable of emitting a laser beam; and -68- (8) (8) 1221102 a holding mechanism for holding a processing object; and a laser light source capable of emitting the above-mentioned laser light source A lens for condensing the laser beam; and oscillating the direction of the laser beam emitted by the lens, 'make the laser beam incident on the surface of the processing object held by the holding mechanism', so that the laser beam is incident A beam scanner whose position is moved within the surface of the object to be processed; and a variable attenuator that attenuates the power of the laser beam at a variable attenuation rate by receiving an external control signal; and when the variable attenuator promotes the laser A control device that can control the variable attenuator to adjust the power of the laser beam when the incident position of the beam moves on the surface of the processing object, so as to suppress the pulse energy density or power density of the laser beam on the surface of the processing object. 2 6. A laser processing device comprising: a laser light source capable of emitting a laser beam; and a holding mechanism for holding an object to be processed; and a first stage capable of converging or diffusing the laser beam emitted by the laser light source A lens; and a second lens that allows the laser beam passing through the first lens to be used to converge the incident laser beam; and a swinging direction of the laser beam emitted by the second lens, A beam scanner that makes a laser beam incident on the surface of a processing object held by the holding mechanism and moves the incident position of the laser beam within the surface of the processing object; and Γ f, -69- (9) (9) 1221102 A movement mechanism that causes the first lens to move when receiving an external control signal; and when the beam scanner causes the incident position of the laser beam to move on the surface of the processing object, the movement mechanism can be controlled to act A control device for moving the position of the first lens to suppress a change in pulse energy density or power density of a laser beam on a surface of a processing object; and The second lens of the laser beam diameter is set to the number Zhi NA1, the second for the number of lenses through which the laser beam of the second lens aperture NA2 is in Zhi, NA1 / NA2 is 2 or more. 2 7 · A laser processing device comprising: a laser light source capable of emitting a laser beam; and a holding mechanism for holding an object to be processed; and a through hole 5 through which the laser beam emitted by the laser light source is incident; A beam profiler that can change the length of one direction of the laser beam through the through hole by receiving an external control signal; and a lens that condenses the laser beam emitted by the beam profiler; The direction of the laser beam emitted by the lens is oscillated, so that the laser beam is incident on the surface of the processing object held by the holding mechanism, and the beam scanning that moves the incident position of the laser beam within the surface of the processing object And when the above-mentioned beam scanner causes the incident position of the laser beam to move on the surface of the processing object, the beam profile shaper can be controlled by the beam-70- (10) (10) 1221102 profile shaping A control device that suppresses variations in the shape of a beam spot on the surface of a processing object. 28. The laser processing device described in item 27 of the scope of the patent application, wherein the beam profiler is configured to cause the through hole to be perpendicular to the laser beam when the shaped laser beam profile is long in one direction. The face in the direction of travel is tilted. 29. The laser processing device according to item 28 in the scope of the patent application, wherein the beam profile shaper is capable of rotating the through hole around an axis parallel to the laser beam traveling direction. 3 0 · —A laser processing device comprising: a laser light source capable of emitting a laser beam; and a holding mechanism for holding a processing object; and a lens capable of condensing the laser beam emitted by the laser light source; And can make the direction of the laser beam emitted by the lens swing, so that the laser beam is incident on the surface of the processing object held by the holding mechanism, and the incident position of the laser beam is moved within the surface of the processing object. A beam scanner; and a through-hole, which is arranged in the light path until the laser beam emitted from the above-mentioned beam scanner enters the object to be processed, so that the laser beam passing through the through-hole is incident on the processing The close mask of the object. 31. The laser processing device described in item 30 of the scope of patent application, which further includes: a movement mechanism that accepts an external control signal to cause the lens to move -71-(11) 1221102 When the beam scanner causes the incident position of the laser beam to move on the surface of the processing object, the moving mechanism may be controlled to move the lens position to suppress the pulse energy density or power of the laser beam on the surface of the processing object. Control device for density change. 3 2 · —A laser processing method with: The process of adjusting the diffusion angle of the laser beam emitted by the laser light source; parallel to the surface of the object to be processed is located at a predetermined distance from the surface, and will be adjusted to the laser beam having the predetermined diffusion angle While swinging in the direction, the laser beam is irradiated to a close-up mask having a through hole, so that the laser beam passing through the through hole is incident on the surface of the object to be processed, and the shape of the through hole is transferred to the Engineering of the surface of the object to be processed; and At least one of the predetermined diffusion angle and the predetermined distance is transferred to the surface of the processing object according to the shape of the through-hole, the diffusion angle of the laser beam, and the proximity mask and the processing object. A process in which the relationship between surfaces is determined in advance. 3 3. A laser processing device having: a laser light source capable of emitting a continuous wave laser beam; and a holding mechanism for holding an object to be processed; and a laser beam emitted by the laser light source injected above, and based on The externally provided opportunity signal can switch the incident laser beam into a state where the first direction is emitted and a state where the first direction is not emitted; and an optical system with a rectangular through-hole, A laser beam emitted in one direction of -72- (12) 1221102 is incident on the through hole 'shaping the mask of the laser beam profile; and condensing the laser beam emitted by the aforementioned mask' causes the aforementioned mask to A lens through which a rectangular through-hole forms an image on the surface of the processing object held by the holding mechanism; and moving the holding mechanism according to a control signal provided from the outside, so that the laser beam emitted by the lens is incident on the position of the processing object A moving mechanism that moves within the surface of a processing object; and According to a control signal given from the outside, the above-mentioned mask is rotated around a mask rotation mechanism which is parallel to the axis of the laser beam optical axis passing through the through hole of the mask; and Sending the opportunity signal to the optical system to control the moving mechanism, to cause the moving mechanism to move the incident position of the laser beam to the processing object in the second direction, and to control the mask rotation mechanism, Move the laser beam incident position on the surface of the processing object in front of the second direction, and make the mask rotation mechanism make one side of the image of the rectangular through hole on the surface of the processing object parallel to the second direction. Control device. 3 4 ··· A laser processing method, comprising: (i) a state in which a continuous wave laser beam emitted from a laser light source is injected into a state where the incident laser beam can be switched to be emitted from a first direction, and Engineering of an optical system in a state where emission is not allowed from the first direction; and (j) the laser beam emitted from the optical system in the first direction is incident on a mask with a rectangular through-hole to be shaped, and is condensed by a lens Light, and -73- (13) 1221102 the process of imaging the through-hole image on the surface of the processing object; and (k) making the image of the through-hole on the surface of the processing object along a parallel side of the image Moving process; and when it is desired to form a dot-like discrete pattern on the surface of the processing object, that is, in the above process (i), the laser beam is intermittently emitted from the optical system in the first direction. When a linear pattern is formed on the surface, that is, in the process (i), a laser beam is continuously emitted from the optical system in the first direction. 35. The laser processing method described in item 34 of the scope of patent application, wherein after the above-mentioned process (k), it further comprises: (l) promoting the image of the through-hole to rotate on the surface of the object to be processed, The process of rotating the mask around an axis parallel to the direction in which the laser beam travels; and (m) the image of the through hole to be rotated on the surface of the object in the process (i), parallel and rotated The process of moving the image of the through hole on one side. 36. —A laser processing device having: a holding mechanism capable of holding a processing object; a first laser light source capable of emitting a pulsed laser beam; and a second laser light source capable of emitting a continuous wave laser beam ; And the pulsed laser beam emitted from the first laser light source and the continuous wave laser beam emitted from the second laser light source are provided with the beam point of the pulsed laser beam inside the beam point of the continuous wave laser beam Optical system that irradiates the surface of the object to be held by the above-mentioned holding mechanism S4S -74- (14) 1221102; and the beam points that promote the pulse laser beam and continuous wave laser beam on the surface of the object to be held by the holding mechanism Moving mobile mechanism. 37. The laser processing device according to item 36 in the scope of the patent application, wherein the optical system is a pulsed laser beam emitted by the first laser light source or a continuous wave laser beam emitted by the second laser light source At least one of the optical axes is changed so that the pulsed laser beam and the continuous wave laser beam are caused to proceed along the same optical axis, and the laser beam is irradiated onto the surface of the object held by the holding mechanism. 38. —A laser processing method comprising: (η) a project of emitting a pulsed laser beam from a first laser light source and a continuous wave laser beam from a second laser light source; and (〇) The processing point is defined on the surface of the base layer and on the surface of the base layer, the surface of the object to be processed having a surface layer formed of a material that is harder to irradiate laser processing than the base layer material, and the second laser is irradiated from the second laser After the continuous wave laser beam emitted from the light source is preheated, the processed laser beam is irradiated with the pulsed laser beam emitted from the first laser light source to form holes in the surface layer of the processing object. 39. The laser processing method described in item 38 of the scope of patent application, wherein in the above process (0), the continuous wave laser beam emitted by the second laser light source is provided with the substrate to the object to be processed The layer temperature stays preheated below the melting point of the base layer. 40. The laser processing method described in item 38 of the scope of the patent application, wherein in the above-mentioned process (0), the beam point of the continuous wave laser beam is -75. (15) 1221102 includes pulse processing. The target pulse laser light passes the continuous wave laser position ° 41. As in the above, the point of the upper wave laser beam is located at the beam point of the circular laser beam, and the surface of a certain object to be processed is covered by the continuous wave laser beam. The beam spot irradiation position is moved so that the inside of the beam spot of one of the added beams reaches the inside of the laser processing project (0) described in item 40 of the pulse laser application patent range, which is the processing object described above. The beam spot on the surface is set to be circular and the center of the pulsed laser beam shape. Point on the outside to the working point through the beam method, the continuous beam -76-