KR100635429B1 - 무기 재료를 사용한 중합체-기재 고체 장치의 캡슐화 - Google Patents

무기 재료를 사용한 중합체-기재 고체 장치의 캡슐화 Download PDF

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Publication number
KR100635429B1
KR100635429B1 KR1020017001442A KR20017001442A KR100635429B1 KR 100635429 B1 KR100635429 B1 KR 100635429B1 KR 1020017001442 A KR1020017001442 A KR 1020017001442A KR 20017001442 A KR20017001442 A KR 20017001442A KR 100635429 B1 KR100635429 B1 KR 100635429B1
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South Korea
Prior art keywords
polymer
layer
delete delete
light emitting
protective
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KR1020017001442A
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English (en)
Korean (ko)
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KR20010072212A (ko
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부 닐슨
필립 베일리
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듀폰 디스플레이즈, 인크.
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020017001442A 1998-08-03 1999-08-03 무기 재료를 사용한 중합체-기재 고체 장치의 캡슐화 KR100635429B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US9515598P 1998-08-03 1998-08-03
US60/095,155 1998-08-03

Publications (2)

Publication Number Publication Date
KR20010072212A KR20010072212A (ko) 2001-07-31
KR100635429B1 true KR100635429B1 (ko) 2006-10-18

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KR1020017001442A KR100635429B1 (ko) 1998-08-03 1999-08-03 무기 재료를 사용한 중합체-기재 고체 장치의 캡슐화

Country Status (9)

Country Link
US (3) US6635989B1 (ja)
EP (1) EP1121838A4 (ja)
JP (2) JP2002522884A (ja)
KR (1) KR100635429B1 (ja)
CN (1) CN1287636C (ja)
AU (1) AU5334999A (ja)
CA (1) CA2337085A1 (ja)
HK (1) HK1040035A1 (ja)
WO (1) WO2000008899A1 (ja)

Families Citing this family (85)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2353506A1 (en) 1998-11-02 2000-05-11 3M Innovative Properties Company Transparent conductive oxides for plastic flat panel displays
MXPA01010917A (es) * 1999-04-28 2002-07-30 Du Pont Dispositivo electronico organico flexible con resistencia mejorada a la degradacion por oxigeno y humedad.
US20100330748A1 (en) 1999-10-25 2010-12-30 Xi Chu Method of encapsulating an environmentally sensitive device
US6866901B2 (en) 1999-10-25 2005-03-15 Vitex Systems, Inc. Method for edge sealing barrier films
US8957584B2 (en) 1999-10-29 2015-02-17 Semiconductor Energy Laboratory Co., Ltd. Self light-emitting device
CN1227751C (zh) * 2000-02-17 2005-11-16 Lg电子株式会社 有机电致发光显示板及其封装方法
JP4618918B2 (ja) * 2000-03-27 2011-01-26 株式会社半導体エネルギー研究所 自発光装置の作製方法
US20010052752A1 (en) * 2000-04-25 2001-12-20 Ghosh Amalkumar P. Thin film encapsulation of organic light emitting diode devices
DE10044841B4 (de) 2000-09-11 2006-11-30 Osram Opto Semiconductors Gmbh Plasmaverkapselung für elektronische und mikroelektronische Bauelemente wie OLEDs sowie Verfahren zu dessen Herstellung
US6537688B2 (en) * 2000-12-01 2003-03-25 Universal Display Corporation Adhesive sealed organic optoelectronic structures
JP2002252082A (ja) * 2000-12-21 2002-09-06 Sony Corp 表示装置及び表示装置の製造方法
US7495390B2 (en) * 2000-12-23 2009-02-24 Lg Display Co., Ltd. Electro-luminescence device with improved thermal conductivity
WO2002071506A1 (en) * 2001-02-15 2002-09-12 Emagin Corporation Thin film encapsulation of organic light emitting diode devices
US7211950B2 (en) * 2001-05-29 2007-05-01 Choong Hoon Yi Organic electro luminescent display and manufacturing method thereof
US7005799B2 (en) * 2001-07-30 2006-02-28 Intel Corporation Sealing organic light emitting device displays
US6590157B2 (en) * 2001-09-21 2003-07-08 Eastman Kodak Company Sealing structure for highly moisture-sensitive electronic device element and method for fabrication
JP2003133070A (ja) * 2001-10-30 2003-05-09 Seiko Epson Corp 積層膜の製造方法、電気光学装置、電気光学装置の製造方法、有機エレクトロルミネッセンス装置の製造方法、及び電子機器
JP4019690B2 (ja) * 2001-11-02 2007-12-12 セイコーエプソン株式会社 電気光学装置及びその製造方法並びに電子機器
KR20040066898A (ko) 2001-12-13 2004-07-27 코닌클리케 필립스 일렉트로닉스 엔.브이. 디스플레이 디바이스용 밀봉 구조
KR100819864B1 (ko) * 2001-12-28 2008-04-07 엘지.필립스 엘시디 주식회사 유기전기발광소자
JP4207441B2 (ja) * 2002-03-18 2009-01-14 セイコーエプソン株式会社 有機ｅｌ素子の製造方法
US8900366B2 (en) 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8808457B2 (en) 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
TW548859B (en) * 2002-06-03 2003-08-21 Ritdisplay Corp Organic light-emitting display
JP4240276B2 (ja) 2002-07-05 2009-03-18 株式会社半導体エネルギー研究所 発光装置
KR100858803B1 (ko) * 2002-08-23 2008-09-17 삼성에스디아이 주식회사 유기전계발광 표시장치
CN100352078C (zh) * 2002-09-20 2007-11-28 友达光电股份有限公司 有机电致发光显示元件的封装结构及其封装方法
JP4032909B2 (ja) * 2002-10-01 2008-01-16 ソニー株式会社 有機発光表示装置の製造方法
JP2004281256A (ja) * 2003-03-17 2004-10-07 Nippon Sheet Glass Co Ltd 表示パネル
US7648925B2 (en) 2003-04-11 2010-01-19 Vitex Systems, Inc. Multilayer barrier stacks and methods of making multilayer barrier stacks
AU2004229123A1 (en) * 2003-04-16 2004-10-28 Universite Libre De Bruxelles A non-invasive sensor to visually analyze the level of muscle activity
EP1629543B1 (en) 2003-05-16 2013-08-07 E.I. Du Pont De Nemours And Company Barrier films for flexible polymer substrates fabricated by atomic layer deposition
JP2005011794A (ja) * 2003-05-22 2005-01-13 Tohoku Pioneer Corp 有機ｅｌパネル及びその製造方法
EP1658640B1 (en) * 2003-06-16 2014-05-21 Koninklijke Philips N.V. Barrier laminate for an electroluminescent device
DE10328140B4 (de) * 2003-06-20 2006-12-07 Schott Ag Organische lichtemittierende Einrichtung und Verfahren zu deren Herstellung
KR100487566B1 (ko) * 2003-07-23 2005-05-03 삼성전자주식회사 핀 전계 효과 트랜지스터 및 그 형성 방법
US7291967B2 (en) * 2003-08-29 2007-11-06 Semiconductor Energy Laboratory Co., Ltd. Light emitting element including a barrier layer and a manufacturing method thereof
US7902747B2 (en) * 2003-10-21 2011-03-08 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device having a thin insulating film made of nitrogen and silicon and an electrode made of conductive transparent oxide and silicon dioxide
US20050248270A1 (en) * 2004-05-05 2005-11-10 Eastman Kodak Company Encapsulating OLED devices
US7915822B2 (en) * 2004-08-04 2011-03-29 Samsung Electronics Co., Ltd. Display device and method and apparatus for manufacturing the same
JP2006049308A (ja) * 2004-08-04 2006-02-16 Samsung Electronics Co Ltd 表示装置、その製造方法、及びその製造装置
JP4732084B2 (ja) * 2004-09-21 2011-07-27 三星モバイルディスプレイ株式會社 発光素子用の基板、その製造方法、発光素子用の電極、及びこれを備えた発光素子
JP2006222071A (ja) * 2005-01-17 2006-08-24 Seiko Epson Corp 発光装置、発光装置の製造方法、及び電子機器
US7906906B2 (en) * 2005-03-25 2011-03-15 Lg Display Co., Ltd. Light emitting device having spacer for protecting light emission unit from moisture absorbent
JP4539518B2 (ja) * 2005-03-31 2010-09-08 セイコーエプソン株式会社 電気光学装置及び電気光学装置の製造方法
US20060278965A1 (en) * 2005-06-10 2006-12-14 Foust Donald F Hermetically sealed package and methods of making the same
US7722929B2 (en) * 2005-08-18 2010-05-25 Corning Incorporated Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device
US7829147B2 (en) * 2005-08-18 2010-11-09 Corning Incorporated Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device
US20070040501A1 (en) * 2005-08-18 2007-02-22 Aitken Bruce G Method for inhibiting oxygen and moisture degradation of a device and the resulting device
US20080206589A1 (en) * 2007-02-28 2008-08-28 Bruce Gardiner Aitken Low tempertature sintering using Sn2+ containing inorganic materials to hermetically seal a device
US7767498B2 (en) 2005-08-25 2010-08-03 Vitex Systems, Inc. Encapsulated devices and method of making
KR100685845B1 (ko) 2005-10-21 2007-02-22 삼성에스디아이 주식회사 유기전계 발광표시장치 및 그 제조방법
US8044571B2 (en) * 2005-12-14 2011-10-25 General Electric Company Electrode stacks for electroactive devices and methods of fabricating the same
US7999372B2 (en) 2006-01-25 2011-08-16 Samsung Mobile Display Co., Ltd. Organic light emitting display device and method of fabricating the same
JP4886540B2 (ja) * 2006-03-01 2012-02-29 キヤノン株式会社 有機ｅｌ素子パネル
ES2361661T3 (es) 2006-03-26 2011-06-21 Lotus Applied Technology, Llc Dispositivo y procedimiento de deposición de capas atómicas y método de revestimiento de substratos flexibles.
TWI314025B (en) * 2006-04-13 2009-08-21 Au Optronics Corp Method for fabricating active illumination apparatus
US8187679B2 (en) 2006-07-29 2012-05-29 Lotus Applied Technology, Llc Radical-enhanced atomic layer deposition system and method
EP2067191B1 (de) * 2006-09-29 2020-06-17 Osram Oled Gmbh Beleuchtungseinrichtung
EP1916725A1 (en) * 2006-10-27 2008-04-30 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Organic light emitting diode device with multilayer seal
US8115326B2 (en) * 2006-11-30 2012-02-14 Corning Incorporated Flexible substrates having a thin-film barrier
CN101573228B (zh) 2006-12-28 2015-08-05 3M创新有限公司 用于薄膜金属层形成的成核层
CA2698425A1 (en) 2007-09-07 2009-03-12 Avery International Corporation Block out label, label sheet, and related method
JP5555180B2 (ja) * 2008-01-16 2014-07-23 ライツ、 キャメラ、 アクション エルエルシイ 水中使用可能な高照度光源アセンブリー
US8350451B2 (en) 2008-06-05 2013-01-08 3M Innovative Properties Company Ultrathin transparent EMI shielding film comprising a polymer basecoat and crosslinked polymer transparent dielectric layer
US9184410B2 (en) 2008-12-22 2015-11-10 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
US9337446B2 (en) 2008-12-22 2016-05-10 Samsung Display Co., Ltd. Encapsulated RGB OLEDs having enhanced optical output
US7948178B2 (en) * 2009-03-04 2011-05-24 Global Oled Technology Llc Hermetic seal
JP5532887B2 (ja) * 2009-03-16 2014-06-25 コニカミノルタ株式会社 有機エレクトロニクスパネル
EP2438629A4 (en) 2009-06-01 2015-08-19 Sumitomo Chemical Co FORMULATIONS FOR IMPROVED ELECTRODES FOR ELECTRONIC EQUIPMENT
US8637123B2 (en) 2009-12-29 2014-01-28 Lotus Applied Technology, Llc Oxygen radical generation for radical-enhanced thin film deposition
US8590338B2 (en) 2009-12-31 2013-11-26 Samsung Mobile Display Co., Ltd. Evaporator with internal restriction
US11038144B2 (en) 2010-12-16 2021-06-15 Samsung Display Co., Ltd. Organic light-emitting display apparatus
KR101752876B1 (ko) 2010-12-16 2017-07-03 삼성디스플레이 주식회사 유기 발광 표시 장치
JP4976595B1 (ja) * 2011-03-11 2012-07-18 パイオニア株式会社 有機エレクトロルミネッセンスデバイス
TWI501030B (zh) * 2012-06-12 2015-09-21 Cheil Ind Inc 光可固化型組成物、包含該組成物之保護層及包含該組成物之封裝裝置
DE102013110174A1 (de) * 2013-09-16 2015-03-19 Osram Oled Gmbh Elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements
DE102014101518A1 (de) * 2014-02-07 2015-08-13 Osram Oled Gmbh Organisches optoelektronisches Bauelement und Verfahren zum Herstellen eines organischen optoelektronischen Bauelements
JP6336042B2 (ja) * 2014-03-18 2018-06-06 株式会社Ｊｏｌｅｄ 有機ｅｌ素子および有機ｅｌ素子の製造方法
WO2016084256A1 (ja) * 2014-11-28 2016-06-02 パイオニア株式会社 発光装置
FR3061404B1 (fr) * 2016-12-27 2022-09-23 Packaging Sip Procede de fabrication collective de modules electroniques hermetiques
JP2018190608A (ja) * 2017-05-08 2018-11-29 コニカミノルタ株式会社 有機エレクトロルミネッセンス素子
KR101886284B1 (ko) * 2017-06-26 2018-08-08 삼성디스플레이 주식회사 유기 발광 표시 장치
US10756298B2 (en) * 2017-11-03 2020-08-25 OLEDWorks LLC Solder hermetic sealing for OLEDs
CN109585681B (zh) * 2018-12-05 2021-01-22 京东方科技集团股份有限公司 一种显示面板及其封装方法、以及显示装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63105493A (ja) * 1986-10-22 1988-05-10 アルプス電気株式会社 薄膜ｅｌパネル

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4599538A (en) * 1982-09-30 1986-07-08 Gte Prod Corp Electroluminescent display device
JPS6375783A (ja) * 1986-09-19 1988-04-06 双葉電子工業株式会社 電界発光表示パネル
US4839557A (en) * 1987-12-18 1989-06-13 Gte Products Corporation Fill member for electroluminescent panels
US4963788A (en) 1988-07-14 1990-10-16 Planar Systems, Inc. Thin film electroluminescent display with improved contrast
GB8909011D0 (en) 1989-04-20 1989-06-07 Friend Richard H Electroluminescent devices
EP0443861B2 (en) 1990-02-23 2008-05-28 Sumitomo Chemical Company, Limited Organic electroluminescence device
US5059862A (en) 1990-07-26 1991-10-22 Eastman Kodak Company Electroluminescent device with improved cathode
US5047687A (en) 1990-07-26 1991-09-10 Eastman Kodak Company Organic electroluminescent device with stabilized cathode
GB9018698D0 (en) 1990-08-24 1990-10-10 Lynxvale Ltd Semiconductive copolymers for use in electroluminescent devices
US5408109A (en) 1991-02-27 1995-04-18 The Regents Of The University Of California Visible light emitting diodes fabricated from soluble semiconducting polymers
JPH04278983A (ja) * 1991-03-07 1992-10-05 Fuji Electric Co Ltd 表示パネルの封止方法
US5151629A (en) 1991-08-01 1992-09-29 Eastman Kodak Company Blue emitting internal junction organic electroluminescent device (I)
JP2813499B2 (ja) * 1991-09-30 1998-10-22 出光興産株式会社 有機ｅｌ素子
US5652067A (en) * 1992-09-10 1997-07-29 Toppan Printing Co., Ltd. Organic electroluminescent device
JPH07166160A (ja) * 1993-12-16 1995-06-27 Toppan Printing Co Ltd 有機薄膜ｅｌ素子
JPH07169567A (ja) * 1993-12-16 1995-07-04 Idemitsu Kosan Co Ltd 有機ｅｌ素子
US5723873A (en) 1994-03-03 1998-03-03 Yang; Yang Bilayer composite electrodes for diodes
JPH0888089A (ja) * 1994-09-20 1996-04-02 Fuji Electric Co Ltd 薄膜電場発光素子
JP3577117B2 (ja) * 1994-10-07 2004-10-13 Ｔｄｋ株式会社 有機エレクトロルミネセンス素子の製法
US5804917A (en) * 1995-01-31 1998-09-08 Futaba Denshi Kogyo K.K. Organic electroluminescent display device and method for manufacturing same
US5686360A (en) * 1995-11-30 1997-11-11 Motorola Passivation of organic devices
US6195142B1 (en) * 1995-12-28 2001-02-27 Matsushita Electrical Industrial Company, Ltd. Organic electroluminescence element, its manufacturing method, and display device using organic electroluminescence element
JPH10125463A (ja) * 1995-12-28 1998-05-15 Matsushita Electric Ind Co Ltd 有機エレクトロルミネセンス素子、液晶照明装置、表示デバイス装置、および、有機エレクトロルミネセンス素子の製造方法
KR100500078B1 (ko) * 1996-02-26 2005-07-18 이데미쓰 고산 가부시키가이샤 유기 전자 발광 소자 및 그의 제조방법
US5693956A (en) * 1996-07-29 1997-12-02 Motorola Inverted oleds on hard plastic substrate
WO1998010473A1 (en) * 1996-09-04 1998-03-12 Cambridge Display Technology Limited Electrode deposition for organic light-emitting devices
US5952778A (en) * 1997-03-18 1999-09-14 International Business Machines Corporation Encapsulated organic light emitting device
US6452218B1 (en) 1997-06-10 2002-09-17 Uniax Corporation Ultra-thin alkaline earth metals as stable electron-injecting electrodes for polymer light emitting diodes
JPH11242994A (ja) * 1997-12-24 1999-09-07 Toray Ind Inc 発光素子およびその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63105493A (ja) * 1986-10-22 1988-05-10 アルプス電気株式会社 薄膜ｅｌパネル

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Publication number Publication date
CA2337085A1 (en) 2000-02-17
CN1287636C (zh) 2006-11-29
JP2011159630A (ja) 2011-08-18
WO2000008899A1 (en) 2000-02-17
US6635989B1 (en) 2003-10-21
JP2002522884A (ja) 2002-07-23
US20030184222A1 (en) 2003-10-02
EP1121838A4 (en) 2004-10-27
US7088041B2 (en) 2006-08-08
HK1040035A1 (zh) 2002-05-17
EP1121838A1 (en) 2001-08-08
US20040140766A1 (en) 2004-07-22
AU5334999A (en) 2000-02-28
CN1311976A (zh) 2001-09-05
US6873101B2 (en) 2005-03-29
KR20010072212A (ko) 2001-07-31

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