KR100546989B1 - 구리층을 일렉트로리틱 디포지트하는 방법 - Google Patents

구리층을 일렉트로리틱 디포지트하는 방법 Download PDF

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Publication number
KR100546989B1
KR100546989B1 KR1019997004258A KR19997004258A KR100546989B1 KR 100546989 B1 KR100546989 B1 KR 100546989B1 KR 1019997004258 A KR1019997004258 A KR 1019997004258A KR 19997004258 A KR19997004258 A KR 19997004258A KR 100546989 B1 KR100546989 B1 KR 100546989B1
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KR
South Korea
Prior art keywords
bath
copper
deposit
copper layer
iron
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Expired - Lifetime
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KR1019997004258A
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English (en)
Korean (ko)
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KR20000053278A (ko
Inventor
셍게게르트
담스볼프강
Original Assignee
아토테크 도이칠란드 게엠베하
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Publication of KR20000053278A publication Critical patent/KR20000053278A/ko
Application granted granted Critical
Publication of KR100546989B1 publication Critical patent/KR100546989B1/ko
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
KR1019997004258A 1996-12-13 1997-12-04 구리층을 일렉트로리틱 디포지트하는 방법 Expired - Lifetime KR100546989B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19653681A DE19653681C2 (de) 1996-12-13 1996-12-13 Verfahren zur elektrolytischen Abscheidung von Kupferschichten mit gleichmäßiger Schichtdicke und guten optischen und metallphysikalischen Eigenschaften und Anwendung des Verfahrens
DE19653681.2 1996-12-13

Publications (2)

Publication Number Publication Date
KR20000053278A KR20000053278A (ko) 2000-08-25
KR100546989B1 true KR100546989B1 (ko) 2006-01-26

Family

ID=7815786

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019997004258A Expired - Lifetime KR100546989B1 (ko) 1996-12-13 1997-12-04 구리층을 일렉트로리틱 디포지트하는 방법

Country Status (8)

Country Link
US (1) US6129830A (https=)
EP (1) EP0944749B1 (https=)
JP (1) JP4221064B2 (https=)
KR (1) KR100546989B1 (https=)
AT (1) ATE204035T1 (https=)
CA (1) CA2275214C (https=)
DE (2) DE19653681C2 (https=)
WO (1) WO1998026114A1 (https=)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19915146C1 (de) * 1999-01-21 2000-07-06 Atotech Deutschland Gmbh Verfahren zum galvanischen Bilden von Leiterstrukturen aus hochreinem Kupfer bei der Herstellung von integrierten Schaltungen
JP4394234B2 (ja) * 2000-01-20 2010-01-06 日鉱金属株式会社 銅電気めっき液及び銅電気めっき方法
US6503375B1 (en) * 2000-02-11 2003-01-07 Applied Materials, Inc Electroplating apparatus using a perforated phosphorus doped consumable anode
JP2001267726A (ja) * 2000-03-22 2001-09-28 Toyota Autom Loom Works Ltd 配線基板の電解メッキ方法及び配線基板の電解メッキ装置
US6491806B1 (en) * 2000-04-27 2002-12-10 Intel Corporation Electroplating bath composition
US6776893B1 (en) * 2000-11-20 2004-08-17 Enthone Inc. Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
JP4806498B2 (ja) * 2001-08-01 2011-11-02 凸版印刷株式会社 プリント配線基板の製造装置および製造方法
EP1310582A1 (en) * 2001-11-07 2003-05-14 Shipley Company LLC Process for electrolytic copper plating
US8002962B2 (en) 2002-03-05 2011-08-23 Enthone Inc. Copper electrodeposition in microelectronics
US7316772B2 (en) * 2002-03-05 2008-01-08 Enthone Inc. Defect reduction in electrodeposited copper for semiconductor applications
DE10259362A1 (de) * 2002-12-18 2004-07-08 Siemens Ag Verfahren zum Abscheiden einer Legierung auf ein Substrat
KR20040073974A (ko) * 2003-02-14 2004-08-21 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. 전기도금 조성물
EP1598449B1 (en) * 2004-04-26 2010-08-04 Rohm and Haas Electronic Materials, L.L.C. Improved plating method
TWI400365B (zh) 2004-11-12 2013-07-01 安頌股份有限公司 微電子裝置上的銅電沈積
EP1717351A1 (de) * 2005-04-27 2006-11-02 Enthone Inc. Galvanikbad
US20070158199A1 (en) * 2005-12-30 2007-07-12 Haight Scott M Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps
US20070178697A1 (en) * 2006-02-02 2007-08-02 Enthone Inc. Copper electrodeposition in microelectronics
JP5073736B2 (ja) * 2006-03-30 2012-11-14 アトテック・ドイチュラント・ゲーエムベーハー 孔及びキャビティの金属による電解充填法
US7887693B2 (en) * 2007-06-22 2011-02-15 Maria Nikolova Acid copper electroplating bath composition
US7905994B2 (en) 2007-10-03 2011-03-15 Moses Lake Industries, Inc. Substrate holder and electroplating system
JP2009167506A (ja) * 2008-01-21 2009-07-30 Ebara Udylite Kk 酸性電解銅めっき液およびこれを用いる微細配線回路の作製方法
DE102008031003B4 (de) 2008-06-30 2010-04-15 Siemens Aktiengesellschaft Verfahren zum Erzeugen einer CNT enthaltenen Schicht aus einer ionischen Flüssigkeit
US20100206737A1 (en) * 2009-02-17 2010-08-19 Preisser Robert F Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv)
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
EP2392694A1 (en) * 2010-06-02 2011-12-07 ATOTECH Deutschland GmbH Method for etching of copper and copper alloys
EP2518187A1 (en) * 2011-04-26 2012-10-31 Atotech Deutschland GmbH Aqueous acidic bath for electrolytic deposition of copper
PL2620529T3 (pl) * 2012-01-25 2014-09-30 Atotech Deutschland Gmbh Sposób wytwarzania matowych warstw miedzianych
JP6216522B2 (ja) * 2013-03-14 2017-10-18 大日本印刷株式会社 インターポーザー基板の製造方法。
CN109072468B (zh) * 2016-05-19 2020-04-07 德国艾托特克公司 监测增亮剂在酸性铜/铜合金电镀浴中的总量的方法和受控的电镀过程
JP6909582B2 (ja) * 2017-01-18 2021-07-28 株式会社Ｊｃｕ 着色用めっき液および着色方法
KR20210062369A (ko) * 2019-11-21 2021-05-31 에스케이넥실리스 주식회사 찢김 또는 주름 불량을 방지할 수 있는 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법
TW202342827A (zh) * 2022-03-31 2023-11-01 日商奧野製藥工業股份有限公司 Pr脈衝電解用銅鍍敷液、及利用pr脈衝電解法之銅鍍敷方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB662217A (en) * 1948-10-13 1951-12-05 Westinghouse Electric Int Co Improvements in or relating to the electrodeposition of copper
DD215589B5 (de) * 1983-05-11 1994-06-01 Heinz Dr Rer Nat Liebscher Verfahren zur elektrolytischen Metallabscheidung bei erzwungener Konvektion
DD261613A1 (de) * 1987-06-05 1988-11-02 Leipzig Galvanotechnik Verfahren zur elektrolytischen kupferabscheidung aus sauren elektrolyten mit dimensionsstabiler anode
GB8801827D0 (en) * 1988-01-27 1988-02-24 Jct Controls Ltd Improvements in electrochemical processes
CN1045770A (zh) * 1989-03-18 1990-10-03 王英 用膜法蒸馏技术分离浓缩醋酸铵与氢氧化铵的系统
GB8913561D0 (en) * 1989-06-13 1989-08-02 Learonal Uk Plc Method of stabilising an organic additive in an electroplating solution
DE4344387C2 (de) * 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
JP2866300B2 (ja) * 1994-03-07 1999-03-08 生物系特定産業技術研究推進機構 運搬作業車
JPH0967693A (ja) * 1995-08-29 1997-03-11 Nikko Gould Foil Kk 電解銅箔の製造方法

Also Published As

Publication number Publication date
DE19653681C2 (de) 2000-04-06
EP0944749B1 (de) 2001-08-08
JP4221064B2 (ja) 2009-02-12
JP2001505955A (ja) 2001-05-08
DE59704260D1 (de) 2001-09-13
CA2275214C (en) 2007-10-02
WO1998026114A1 (de) 1998-06-18
KR20000053278A (ko) 2000-08-25
ATE204035T1 (de) 2001-08-15
CA2275214A1 (en) 1998-06-18
EP0944749A1 (de) 1999-09-29
DE19653681A1 (de) 1998-06-18
US6129830A (en) 2000-10-10

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