PL2620529T3 - Sposób wytwarzania matowych warstw miedzianych - Google Patents

Sposób wytwarzania matowych warstw miedzianych

Info

Publication number
PL2620529T3
PL2620529T3 PL12152390T PL12152390T PL2620529T3 PL 2620529 T3 PL2620529 T3 PL 2620529T3 PL 12152390 T PL12152390 T PL 12152390T PL 12152390 T PL12152390 T PL 12152390T PL 2620529 T3 PL2620529 T3 PL 2620529T3
Authority
PL
Poland
Prior art keywords
copper deposits
matt copper
producing matt
producing
deposits
Prior art date
Application number
PL12152390T
Other languages
English (en)
Inventor
Stefan Kretschmer
Philip Hartmann
Bernd Roelfs
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of PL2620529T3 publication Critical patent/PL2620529T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
PL12152390T 2012-01-25 2012-01-25 Sposób wytwarzania matowych warstw miedzianych PL2620529T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP12152390.6A EP2620529B1 (en) 2012-01-25 2012-01-25 Method for producing matt copper deposits

Publications (1)

Publication Number Publication Date
PL2620529T3 true PL2620529T3 (pl) 2014-09-30

Family

ID=47226182

Family Applications (1)

Application Number Title Priority Date Filing Date
PL12152390T PL2620529T3 (pl) 2012-01-25 2012-01-25 Sposób wytwarzania matowych warstw miedzianych

Country Status (11)

Country Link
US (1) US20150014177A1 (pl)
EP (1) EP2620529B1 (pl)
JP (1) JP6086930B2 (pl)
KR (1) KR101979975B1 (pl)
CN (1) CN104080955B (pl)
BR (1) BR112014018114B1 (pl)
CA (1) CA2862141C (pl)
ES (1) ES2478267T3 (pl)
PL (1) PL2620529T3 (pl)
TW (1) TWI526582B (pl)
WO (1) WO2013110373A2 (pl)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3877571A4 (en) 2018-11-07 2022-08-17 Coventya Inc. SATIN COPPER BATH AND PROCESS FOR DEPOSITIONING A SATIN COPPER LAYER
US11384446B2 (en) 2020-08-28 2022-07-12 Macdermid Enthone Inc. Compositions and methods for the electrodeposition of nanotwinned copper
CN117795135A (zh) * 2021-08-05 2024-03-29 麦克德米德乐思公司 用于电沉积纳米孪晶铜的组合物和方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ZA739310B (en) * 1972-12-14 1974-11-27 M & T Chemicals Inc Electrode position of copper
US4009087A (en) * 1974-11-21 1977-02-22 M&T Chemicals Inc. Electrodeposition of copper
US3945894A (en) 1975-04-11 1976-03-23 Oxy Metal Industries Corporation Bath composition and method of electrodepositing utilizing the same
JPH04139787A (ja) * 1990-09-28 1992-05-13 Fujitsu Ltd プリント配線板の電解メッキ方法
DE4324995C2 (de) * 1993-07-26 1995-12-21 Demetron Gmbh Cyanidisch-alkalische Bäder zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen
JP2915305B2 (ja) * 1994-11-04 1999-07-05 有限会社カネヒロ・メタライジング つや消しメッキ方法および検針器対応つや消しメッキ方法
DE19540011C2 (de) * 1995-10-27 1998-09-10 Lpw Chemie Gmbh Verfahren zur galvanischen Abscheidung von blendfreien Nickel- oder Nickellegierungsniederschlägen
DE19653681C2 (de) * 1996-12-13 2000-04-06 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupferschichten mit gleichmäßiger Schichtdicke und guten optischen und metallphysikalischen Eigenschaften und Anwendung des Verfahrens
US6649038B2 (en) * 2000-10-13 2003-11-18 Shipley Company, L.L.C. Electroplating method
US6679983B2 (en) * 2000-10-13 2004-01-20 Shipley Company, L.L.C. Method of electrodepositing copper
CN1314839C (zh) * 2000-10-19 2007-05-09 埃托特克德国有限公司 沉积无光泽铜镀层的铜浴及方法
US20040154926A1 (en) * 2002-12-24 2004-08-12 Zhi-Wen Sun Multiple chemistry electrochemical plating method
US20050045485A1 (en) * 2003-09-03 2005-03-03 Taiwan Semiconductor Manufacturing Co. Ltd. Method to improve copper electrochemical deposition
DE10354760A1 (de) * 2003-11-21 2005-06-23 Enthone Inc., West Haven Verfahren zur Abscheidung von Nickel und Chrom(VI)freien metallischen Mattschichten
EP2143828B1 (en) * 2008-07-08 2016-12-28 Enthone, Inc. Electrolyte and method for the deposition of a matt metal layer
DE102008033174B3 (de) * 2008-07-15 2009-09-17 Enthone Inc., West Haven Cyanidfreie Elektrolytzusammensetzung zur galvanischen Abscheidung einer Kupferschicht und Verfahren zur Abscheidung einer kupferhaltigen Schicht
JP5823665B2 (ja) * 2009-02-20 2015-11-25 株式会社大和化成研究所 めっき浴及びそれを用いためっき方法
KR101141923B1 (ko) * 2009-12-28 2012-05-07 한밭대학교 산학협력단 이중 전기도금법을 이용한 전기도금법 및 이로부터 형성되는 금속 박막

Also Published As

Publication number Publication date
EP2620529B1 (en) 2014-04-30
KR20140119123A (ko) 2014-10-08
CN104080955B (zh) 2016-03-23
TW201333274A (zh) 2013-08-16
CA2862141A1 (en) 2013-08-01
JP6086930B2 (ja) 2017-03-01
TWI526582B (zh) 2016-03-21
WO2013110373A2 (en) 2013-08-01
BR112014018114A8 (pt) 2017-07-11
BR112014018114B1 (pt) 2020-09-01
WO2013110373A3 (en) 2014-04-24
JP2015510038A (ja) 2015-04-02
KR101979975B1 (ko) 2019-09-03
US20150014177A1 (en) 2015-01-15
ES2478267T3 (es) 2014-07-21
CN104080955A (zh) 2014-10-01
CA2862141C (en) 2020-03-10
BR112014018114A2 (pl) 2017-06-20
EP2620529A1 (en) 2013-07-31

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