WO2013110373A3 - Method for producing matt copper deposits - Google Patents

Method for producing matt copper deposits Download PDF

Info

Publication number
WO2013110373A3
WO2013110373A3 PCT/EP2012/073688 EP2012073688W WO2013110373A3 WO 2013110373 A3 WO2013110373 A3 WO 2013110373A3 EP 2012073688 W EP2012073688 W EP 2012073688W WO 2013110373 A3 WO2013110373 A3 WO 2013110373A3
Authority
WO
WIPO (PCT)
Prior art keywords
copper
water soluble
copper layer
sulfonic acid
sulfur
Prior art date
Application number
PCT/EP2012/073688
Other languages
French (fr)
Other versions
WO2013110373A2 (en
Inventor
Stefan Kretschmer
Philip Hartmann
Bernd Roelfs
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Priority to CA2862141A priority Critical patent/CA2862141C/en
Priority to KR1020147022888A priority patent/KR101979975B1/en
Priority to US14/374,000 priority patent/US20150014177A1/en
Priority to BR112014018114-4A priority patent/BR112014018114B1/en
Priority to JP2014553641A priority patent/JP6086930B2/en
Priority to CN201280068192.9A priority patent/CN104080955B/en
Publication of WO2013110373A2 publication Critical patent/WO2013110373A2/en
Publication of WO2013110373A3 publication Critical patent/WO2013110373A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The present invention relates to a method for deposition of a matt copper coating wherein a first copper layer is deposited from an aqueous copper electrolyte which does not contain an organic compound comprising divalent sulfur. A second copper layer is then deposited onto the first copper layer from an aqueous copper electrolyte comprising a first and a second water soluble sulfurcontaining additive wherein the first water soluble sulfur-containing compound is an alkyl sulfonic acid derivative and the second water soluble sulfur-containing additive is an aromatic sulfonic acid derivative. The method provides copper layers with a homogeneous and adjustable matt appearance for decorative applications.
PCT/EP2012/073688 2012-01-25 2012-11-27 Method for producing matt copper deposits WO2013110373A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CA2862141A CA2862141C (en) 2012-01-25 2012-11-27 Method for producing matt copper deposits
KR1020147022888A KR101979975B1 (en) 2012-01-25 2012-11-27 Method for producing matt copper deposits
US14/374,000 US20150014177A1 (en) 2012-01-25 2012-11-27 Method for producing matt copper deposits
BR112014018114-4A BR112014018114B1 (en) 2012-01-25 2012-11-27 METHOD FOR THE PRODUCTION OF MATERIAL COPPER TANKS
JP2014553641A JP6086930B2 (en) 2012-01-25 2012-11-27 Method for manufacturing matte copper plating
CN201280068192.9A CN104080955B (en) 2012-01-25 2012-11-27 Manufacture the method for matt copper deposition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP12152390.6A EP2620529B1 (en) 2012-01-25 2012-01-25 Method for producing matt copper deposits
EP12152390.6 2012-01-25

Publications (2)

Publication Number Publication Date
WO2013110373A2 WO2013110373A2 (en) 2013-08-01
WO2013110373A3 true WO2013110373A3 (en) 2014-04-24

Family

ID=47226182

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/073688 WO2013110373A2 (en) 2012-01-25 2012-11-27 Method for producing matt copper deposits

Country Status (11)

Country Link
US (1) US20150014177A1 (en)
EP (1) EP2620529B1 (en)
JP (1) JP6086930B2 (en)
KR (1) KR101979975B1 (en)
CN (1) CN104080955B (en)
BR (1) BR112014018114B1 (en)
CA (1) CA2862141C (en)
ES (1) ES2478267T3 (en)
PL (1) PL2620529T3 (en)
TW (1) TWI526582B (en)
WO (1) WO2013110373A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210094558A (en) 2018-11-07 2021-07-29 코벤트야 인크. Satin Copper Bath and Satin Copper Layer Deposition Method
US11384446B2 (en) * 2020-08-28 2022-07-12 Macdermid Enthone Inc. Compositions and methods for the electrodeposition of nanotwinned copper
US20240318342A1 (en) * 2021-08-05 2024-09-26 Macdermid Enthone Inc. Compositions and methods for the eletrodeposition of nanotwinned copper

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08134689A (en) * 1994-11-04 1996-05-28 Kanehiro Metaraijingu:Kk Dull plating method and dull plating method corresponding to meter
US20040020783A1 (en) * 2000-10-19 2004-02-05 Gonzalo Urrutia Desmaison Copper bath and methods of depositing a matt copper coating
US20040154926A1 (en) * 2002-12-24 2004-08-12 Zhi-Wen Sun Multiple chemistry electrochemical plating method
US20050045485A1 (en) * 2003-09-03 2005-03-03 Taiwan Semiconductor Manufacturing Co. Ltd. Method to improve copper electrochemical deposition

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ZA739310B (en) * 1972-12-14 1974-11-27 M & T Chemicals Inc Electrode position of copper
US4009087A (en) * 1974-11-21 1977-02-22 M&T Chemicals Inc. Electrodeposition of copper
US3945894A (en) 1975-04-11 1976-03-23 Oxy Metal Industries Corporation Bath composition and method of electrodepositing utilizing the same
JPH04139787A (en) * 1990-09-28 1992-05-13 Fujitsu Ltd Electroplating method of printed wiring board
DE4324995C2 (en) * 1993-07-26 1995-12-21 Demetron Gmbh Cyanide-alkaline baths for the galvanic deposition of copper-tin alloy coatings
DE19540011C2 (en) * 1995-10-27 1998-09-10 Lpw Chemie Gmbh Process for the galvanic deposition of glare-free nickel or nickel alloy deposits
DE19653681C2 (en) * 1996-12-13 2000-04-06 Atotech Deutschland Gmbh Process for the electrolytic deposition of copper layers with a uniform layer thickness and good optical and metal-physical properties and application of the process
US6649038B2 (en) * 2000-10-13 2003-11-18 Shipley Company, L.L.C. Electroplating method
US6679983B2 (en) * 2000-10-13 2004-01-20 Shipley Company, L.L.C. Method of electrodepositing copper
DE10354760A1 (en) * 2003-11-21 2005-06-23 Enthone Inc., West Haven Process for depositing nickel and chromium (VI) free metallic matte layers
ES2615337T3 (en) * 2008-07-08 2017-06-06 Enthone, Inc. Electrolyte and method to deposit a matt metallic layer
DE102008033174B3 (en) * 2008-07-15 2009-09-17 Enthone Inc., West Haven Cyanide-free electrolyte composition for the electrodeposition of a copper layer and method for the deposition of a copper-containing layer
JP5823665B2 (en) * 2009-02-20 2015-11-25 株式会社大和化成研究所 Plating bath and plating method using the same
KR101141923B1 (en) * 2009-12-28 2012-05-07 한밭대학교 산학협력단 Method for fabricating metal layer using by double electroplating and metal layer fabricated by the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08134689A (en) * 1994-11-04 1996-05-28 Kanehiro Metaraijingu:Kk Dull plating method and dull plating method corresponding to meter
US20040020783A1 (en) * 2000-10-19 2004-02-05 Gonzalo Urrutia Desmaison Copper bath and methods of depositing a matt copper coating
US20040154926A1 (en) * 2002-12-24 2004-08-12 Zhi-Wen Sun Multiple chemistry electrochemical plating method
US20050045485A1 (en) * 2003-09-03 2005-03-03 Taiwan Semiconductor Manufacturing Co. Ltd. Method to improve copper electrochemical deposition

Also Published As

Publication number Publication date
TWI526582B (en) 2016-03-21
US20150014177A1 (en) 2015-01-15
CA2862141C (en) 2020-03-10
KR20140119123A (en) 2014-10-08
WO2013110373A2 (en) 2013-08-01
BR112014018114A2 (en) 2017-06-20
ES2478267T3 (en) 2014-07-21
TW201333274A (en) 2013-08-16
CN104080955A (en) 2014-10-01
KR101979975B1 (en) 2019-09-03
JP6086930B2 (en) 2017-03-01
BR112014018114A8 (en) 2017-07-11
EP2620529B1 (en) 2014-04-30
EP2620529A1 (en) 2013-07-31
CN104080955B (en) 2016-03-23
PL2620529T3 (en) 2014-09-30
CA2862141A1 (en) 2013-08-01
BR112014018114B1 (en) 2020-09-01
JP2015510038A (en) 2015-04-02

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