KR100407746B1 - 반도체장치 - Google Patents

반도체장치 Download PDF

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Publication number
KR100407746B1
KR100407746B1 KR10-2000-0026631A KR20000026631A KR100407746B1 KR 100407746 B1 KR100407746 B1 KR 100407746B1 KR 20000026631 A KR20000026631 A KR 20000026631A KR 100407746 B1 KR100407746 B1 KR 100407746B1
Authority
KR
South Korea
Prior art keywords
semiconductor device
heat spreader
heat
semiconductor chip
adhesive tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-2000-0026631A
Other languages
English (en)
Korean (ko)
Other versions
KR20010014930A (ko
Inventor
마쓰시마히로노리
Original Assignee
미쓰비시덴키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰비시덴키 가부시키가이샤 filed Critical 미쓰비시덴키 가부시키가이샤
Publication of KR20010014930A publication Critical patent/KR20010014930A/ko
Application granted granted Critical
Publication of KR100407746B1 publication Critical patent/KR100407746B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H10W70/60—
    • H10W76/153—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H10W72/877—
    • H10W74/15—
    • H10W90/724—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR10-2000-0026631A 1999-06-08 2000-05-18 반도체장치 Expired - Fee Related KR100407746B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11-161657 1999-06-08
JP11161657A JP2000349178A (ja) 1999-06-08 1999-06-08 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
KR20010014930A KR20010014930A (ko) 2001-02-26
KR100407746B1 true KR100407746B1 (ko) 2003-12-01

Family

ID=15739361

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2000-0026631A Expired - Fee Related KR100407746B1 (ko) 1999-06-08 2000-05-18 반도체장치

Country Status (4)

Country Link
US (1) US6232652B1 (enExample)
JP (1) JP2000349178A (enExample)
KR (1) KR100407746B1 (enExample)
TW (1) TW479332B (enExample)

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* Cited by examiner, † Cited by third party
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JP3180794B2 (ja) * 1999-02-19 2001-06-25 日本電気株式会社 半導体装置及びその製造方法
US6407334B1 (en) * 2000-11-30 2002-06-18 International Business Machines Corporation I/C chip assembly
US7242088B2 (en) * 2000-12-29 2007-07-10 Intel Corporation IC package pressure release apparatus and method
US20030125077A1 (en) * 2002-01-03 2003-07-03 Hsi-Che Lee Multimedia watch
TW471143B (en) * 2001-01-04 2002-01-01 Wen-Wen Chiou Integrated circuit chip package
TW476147B (en) * 2001-02-13 2002-02-11 Siliconware Precision Industries Co Ltd BGA semiconductor packaging with through ventilator heat dissipation structure
KR100447226B1 (ko) * 2001-10-24 2004-09-04 앰코 테크놀로지 코리아 주식회사 칩 삽입형 반도체 패키지
US6841413B2 (en) * 2002-01-07 2005-01-11 Intel Corporation Thinned die integrated circuit package
US20050136640A1 (en) * 2002-01-07 2005-06-23 Chuan Hu Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same
US6703704B1 (en) * 2002-09-25 2004-03-09 International Business Machines Corporation Stress reducing stiffener ring
US6773964B2 (en) 2002-09-30 2004-08-10 Koninklijke Philips Electronics N.V. Integrated circuit package including sealed gaps and prevention of vapor induced failures and method of manufacturing the same
KR20040060123A (ko) * 2002-12-30 2004-07-06 동부전자 주식회사 반도체 소자 패키징 방법
JP4154391B2 (ja) 2003-01-30 2008-09-24 富士通株式会社 半導体装置
US6835960B2 (en) * 2003-03-03 2004-12-28 Opto Tech Corporation Light emitting diode package structure
WO2004086498A1 (ja) * 2003-03-26 2004-10-07 Fujitsu Limited 半導体装置
DE10345377B4 (de) * 2003-09-30 2009-07-30 Qimonda Ag Halbleitermodul und Verfahren zur Herstellung eines Halbleitermoduls
US7098529B1 (en) * 2004-01-07 2006-08-29 Credence Systems Corporation System and method for packaging a semiconductor device
TWI249232B (en) * 2004-10-20 2006-02-11 Siliconware Precision Industries Co Ltd Heat dissipating package structure and method for fabricating the same
TWI246759B (en) * 2004-11-16 2006-01-01 Siliconware Precision Industries Co Ltd Heat dissipating package structure and fabrication method thereof
US8115301B2 (en) * 2006-11-17 2012-02-14 Stats Chippac, Inc. Methods for manufacturing thermally enhanced flip-chip ball grid arrays
TWI342603B (en) * 2006-11-22 2011-05-21 Advanced Semiconductor Eng Package assembly whose spacer has through hole
US7607355B2 (en) * 2007-02-16 2009-10-27 Yamaha Corporation Semiconductor device
JP5126219B2 (ja) * 2007-03-27 2013-01-23 富士通株式会社 半導体部品および半導体部品の製造方法
CN101925997A (zh) * 2008-02-01 2010-12-22 松下电器产业株式会社 驱动模块构造
US8258013B1 (en) * 2010-02-12 2012-09-04 Xilinx, Inc. Integrated circuit assembly having vented heat-spreader
US8659169B2 (en) * 2010-09-27 2014-02-25 Xilinx, Inc. Corner structure for IC die
EP2461275A1 (en) * 2010-12-02 2012-06-06 Gemalto SA Security Document and method of manufacturing security document
US20120188721A1 (en) * 2011-01-21 2012-07-26 Nxp B.V. Non-metal stiffener ring for fcbga
WO2012165647A1 (en) * 2011-06-01 2012-12-06 Canon Kabushiki Kaisha Semiconductor device
US8836110B2 (en) * 2012-08-31 2014-09-16 Freescale Semiconductor, Inc. Heat spreader for use within a packaged semiconductor device
JP6036083B2 (ja) * 2012-09-21 2016-11-30 株式会社ソシオネクスト 半導体装置及びその製造方法並びに電子装置及びその製造方法
US10062634B2 (en) * 2016-12-21 2018-08-28 Micron Technology, Inc. Semiconductor die assembly having heat spreader that extends through underlying interposer and related technology
US11201095B1 (en) 2019-08-23 2021-12-14 Xilinx, Inc. Chip package having a cover with window
WO2023042854A1 (ja) * 2021-09-17 2023-03-23 三菱電機株式会社 複合プリント配線板および複合プリント配線板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH027453A (ja) * 1988-06-27 1990-01-11 Fuji Photo Film Co Ltd ガラスキャップ法
JPH02125640A (ja) * 1988-11-05 1990-05-14 Mitsubishi Electric Corp 中空パッケージ
KR19990037337A (ko) * 1997-10-24 1999-05-25 가네꼬 히사시 반도체 장치

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JPS6384051A (ja) 1986-09-26 1988-04-14 Matsushita Electronics Corp 半導体装置の製造方法
JPH02222564A (ja) * 1989-02-23 1990-09-05 Toto Ltd チップキャリヤ
JPH0582696A (ja) * 1991-09-19 1993-04-02 Mitsubishi Electric Corp 半導体装置のリードフレーム
US5414293A (en) * 1992-10-14 1995-05-09 International Business Machines Corporation Encapsulated light emitting diodes
JP2693694B2 (ja) 1992-11-10 1997-12-24 日本碍子株式会社 半導体素子収納用パッケージのキャップ封止方法
JPH06169026A (ja) 1992-11-30 1994-06-14 Hitachi Ltd 半導体集積回路装置
US5420752A (en) * 1993-08-18 1995-05-30 Lsi Logic Corporation GPT system for encapsulating an integrated circuit package
US5652463A (en) * 1995-05-26 1997-07-29 Hestia Technologies, Inc. Transfer modlded electronic package having a passage means
JP2842355B2 (ja) * 1996-02-01 1999-01-06 日本電気株式会社 パッケージ
US5909057A (en) * 1997-09-23 1999-06-01 Lsi Logic Corporation Integrated heat spreader/stiffener with apertures for semiconductor package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH027453A (ja) * 1988-06-27 1990-01-11 Fuji Photo Film Co Ltd ガラスキャップ法
JPH02125640A (ja) * 1988-11-05 1990-05-14 Mitsubishi Electric Corp 中空パッケージ
KR19990037337A (ko) * 1997-10-24 1999-05-25 가네꼬 히사시 반도체 장치

Also Published As

Publication number Publication date
US6232652B1 (en) 2001-05-15
JP2000349178A (ja) 2000-12-15
KR20010014930A (ko) 2001-02-26
TW479332B (en) 2002-03-11

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