TW479332B - Semiconductor device and manufacturing method thereof - Google Patents

Semiconductor device and manufacturing method thereof Download PDF

Info

Publication number
TW479332B
TW479332B TW089109818A TW89109818A TW479332B TW 479332 B TW479332 B TW 479332B TW 089109818 A TW089109818 A TW 089109818A TW 89109818 A TW89109818 A TW 89109818A TW 479332 B TW479332 B TW 479332B
Authority
TW
Taiwan
Prior art keywords
plate
heat
ring
semiconductor
semiconductor device
Prior art date
Application number
TW089109818A
Other languages
English (en)
Chinese (zh)
Inventor
Hironori Matsushima
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of TW479332B publication Critical patent/TW479332B/zh

Links

Classifications

    • H10W70/60—
    • H10W76/153—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H10W72/877—
    • H10W74/15—
    • H10W90/724—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW089109818A 1999-06-08 2000-05-22 Semiconductor device and manufacturing method thereof TW479332B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11161657A JP2000349178A (ja) 1999-06-08 1999-06-08 半導体装置及びその製造方法

Publications (1)

Publication Number Publication Date
TW479332B true TW479332B (en) 2002-03-11

Family

ID=15739361

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089109818A TW479332B (en) 1999-06-08 2000-05-22 Semiconductor device and manufacturing method thereof

Country Status (4)

Country Link
US (1) US6232652B1 (enExample)
JP (1) JP2000349178A (enExample)
KR (1) KR100407746B1 (enExample)
TW (1) TW479332B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI463578B (zh) * 2010-09-27 2014-12-01 吉林克斯公司 用於積體電路晶粒的角結構

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3180794B2 (ja) * 1999-02-19 2001-06-25 日本電気株式会社 半導体装置及びその製造方法
US6407334B1 (en) * 2000-11-30 2002-06-18 International Business Machines Corporation I/C chip assembly
US7242088B2 (en) * 2000-12-29 2007-07-10 Intel Corporation IC package pressure release apparatus and method
US20030125077A1 (en) * 2002-01-03 2003-07-03 Hsi-Che Lee Multimedia watch
TW471143B (en) * 2001-01-04 2002-01-01 Wen-Wen Chiou Integrated circuit chip package
TW476147B (en) * 2001-02-13 2002-02-11 Siliconware Precision Industries Co Ltd BGA semiconductor packaging with through ventilator heat dissipation structure
KR100447226B1 (ko) * 2001-10-24 2004-09-04 앰코 테크놀로지 코리아 주식회사 칩 삽입형 반도체 패키지
US6841413B2 (en) * 2002-01-07 2005-01-11 Intel Corporation Thinned die integrated circuit package
US20050136640A1 (en) * 2002-01-07 2005-06-23 Chuan Hu Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same
US6703704B1 (en) * 2002-09-25 2004-03-09 International Business Machines Corporation Stress reducing stiffener ring
US6773964B2 (en) 2002-09-30 2004-08-10 Koninklijke Philips Electronics N.V. Integrated circuit package including sealed gaps and prevention of vapor induced failures and method of manufacturing the same
KR20040060123A (ko) * 2002-12-30 2004-07-06 동부전자 주식회사 반도체 소자 패키징 방법
JP4154391B2 (ja) 2003-01-30 2008-09-24 富士通株式会社 半導体装置
US6835960B2 (en) * 2003-03-03 2004-12-28 Opto Tech Corporation Light emitting diode package structure
WO2004086498A1 (ja) * 2003-03-26 2004-10-07 Fujitsu Limited 半導体装置
DE10345377B4 (de) * 2003-09-30 2009-07-30 Qimonda Ag Halbleitermodul und Verfahren zur Herstellung eines Halbleitermoduls
US7098529B1 (en) * 2004-01-07 2006-08-29 Credence Systems Corporation System and method for packaging a semiconductor device
TWI249232B (en) * 2004-10-20 2006-02-11 Siliconware Precision Industries Co Ltd Heat dissipating package structure and method for fabricating the same
TWI246759B (en) * 2004-11-16 2006-01-01 Siliconware Precision Industries Co Ltd Heat dissipating package structure and fabrication method thereof
US8115301B2 (en) * 2006-11-17 2012-02-14 Stats Chippac, Inc. Methods for manufacturing thermally enhanced flip-chip ball grid arrays
TWI342603B (en) * 2006-11-22 2011-05-21 Advanced Semiconductor Eng Package assembly whose spacer has through hole
US7607355B2 (en) * 2007-02-16 2009-10-27 Yamaha Corporation Semiconductor device
JP5126219B2 (ja) * 2007-03-27 2013-01-23 富士通株式会社 半導体部品および半導体部品の製造方法
CN101925997A (zh) * 2008-02-01 2010-12-22 松下电器产业株式会社 驱动模块构造
US8258013B1 (en) * 2010-02-12 2012-09-04 Xilinx, Inc. Integrated circuit assembly having vented heat-spreader
EP2461275A1 (en) * 2010-12-02 2012-06-06 Gemalto SA Security Document and method of manufacturing security document
US20120188721A1 (en) * 2011-01-21 2012-07-26 Nxp B.V. Non-metal stiffener ring for fcbga
WO2012165647A1 (en) * 2011-06-01 2012-12-06 Canon Kabushiki Kaisha Semiconductor device
US8836110B2 (en) * 2012-08-31 2014-09-16 Freescale Semiconductor, Inc. Heat spreader for use within a packaged semiconductor device
JP6036083B2 (ja) * 2012-09-21 2016-11-30 株式会社ソシオネクスト 半導体装置及びその製造方法並びに電子装置及びその製造方法
US10062634B2 (en) * 2016-12-21 2018-08-28 Micron Technology, Inc. Semiconductor die assembly having heat spreader that extends through underlying interposer and related technology
US11201095B1 (en) 2019-08-23 2021-12-14 Xilinx, Inc. Chip package having a cover with window
WO2023042854A1 (ja) * 2021-09-17 2023-03-23 三菱電機株式会社 複合プリント配線板および複合プリント配線板の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6384051A (ja) 1986-09-26 1988-04-14 Matsushita Electronics Corp 半導体装置の製造方法
JPH027453A (ja) * 1988-06-27 1990-01-11 Fuji Photo Film Co Ltd ガラスキャップ法
JPH02125640A (ja) * 1988-11-05 1990-05-14 Mitsubishi Electric Corp 中空パッケージ
JPH02222564A (ja) * 1989-02-23 1990-09-05 Toto Ltd チップキャリヤ
JPH0582696A (ja) * 1991-09-19 1993-04-02 Mitsubishi Electric Corp 半導体装置のリードフレーム
US5414293A (en) * 1992-10-14 1995-05-09 International Business Machines Corporation Encapsulated light emitting diodes
JP2693694B2 (ja) 1992-11-10 1997-12-24 日本碍子株式会社 半導体素子収納用パッケージのキャップ封止方法
JPH06169026A (ja) 1992-11-30 1994-06-14 Hitachi Ltd 半導体集積回路装置
US5420752A (en) * 1993-08-18 1995-05-30 Lsi Logic Corporation GPT system for encapsulating an integrated circuit package
US5652463A (en) * 1995-05-26 1997-07-29 Hestia Technologies, Inc. Transfer modlded electronic package having a passage means
JP2842355B2 (ja) * 1996-02-01 1999-01-06 日本電気株式会社 パッケージ
US5909057A (en) * 1997-09-23 1999-06-01 Lsi Logic Corporation Integrated heat spreader/stiffener with apertures for semiconductor package
JP2991172B2 (ja) * 1997-10-24 1999-12-20 日本電気株式会社 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI463578B (zh) * 2010-09-27 2014-12-01 吉林克斯公司 用於積體電路晶粒的角結構

Also Published As

Publication number Publication date
US6232652B1 (en) 2001-05-15
JP2000349178A (ja) 2000-12-15
KR20010014930A (ko) 2001-02-26
KR100407746B1 (ko) 2003-12-01

Similar Documents

Publication Publication Date Title
TW479332B (en) Semiconductor device and manufacturing method thereof
CN114695275B (zh) 薄膜倒装封装
CN102347294B (zh) 半导体装置
TW201411788A (zh) 集成電路封裝件及其裝配方法
TW200849515A (en) Heat dissipation type package structure and fabrication method thereof
TW200832654A (en) Semiconductor package for electromagnetic shielding
JP2000349178A5 (enExample)
US7025848B2 (en) Heat sink for chip package and bonding method thereof
CN113097162A (zh) 散热片、芯片及电路板
TWI601218B (zh) 具有高溫塗層之晶片封裝構造之製造方法
US6339875B1 (en) Method for removing heat from an integrated circuit
TWI312567B (en) Chip package structure
TWI721898B (zh) 半導體封裝結構
JP2009302556A (ja) 半導体装置
TW567563B (en) Semiconductor package and manufacturing method thereof
CN118263207B (zh) 倒装芯片球栅阵列的散热器结构及其制作方法
US7235889B2 (en) Integrated heatspreader for use in wire bonded ball grid array semiconductor packages
JPH06252299A (ja) 半導体装置及びこの半導体装置を実装した基板
TWI250597B (en) Method for manufacturing multi-chip package having encapsulated bond-wires between stack chips
KR20010009153A (ko) 박형 시스템 대응 고방열 히트스프레다 부착 패키지구조 및 그의 제조 방법
CN112242360A (zh) fcBGA封装结构及其制备方法
JP3648896B2 (ja) 半導体装置
CN110734706A (zh) 散热膜及其制作方法、电子设备
TW530399B (en) Method using releasing film for heating and curing IC substrate and the leaving-mold film structure
JP2004296565A (ja) 半導体素子収納用パッケージの製造方法

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees