JP2000349178A5 - - Google Patents

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Publication number
JP2000349178A5
JP2000349178A5 JP1999161657A JP16165799A JP2000349178A5 JP 2000349178 A5 JP2000349178 A5 JP 2000349178A5 JP 1999161657 A JP1999161657 A JP 1999161657A JP 16165799 A JP16165799 A JP 16165799A JP 2000349178 A5 JP2000349178 A5 JP 2000349178A5
Authority
JP
Japan
Prior art keywords
semiconductor chip
heat spreader
substrate
semiconductor device
ring member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1999161657A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000349178A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP11161657A priority Critical patent/JP2000349178A/ja
Priority claimed from JP11161657A external-priority patent/JP2000349178A/ja
Priority to US09/447,675 priority patent/US6232652B1/en
Priority to KR10-2000-0026631A priority patent/KR100407746B1/ko
Priority to TW089109818A priority patent/TW479332B/zh
Publication of JP2000349178A publication Critical patent/JP2000349178A/ja
Publication of JP2000349178A5 publication Critical patent/JP2000349178A5/ja
Pending legal-status Critical Current

Links

JP11161657A 1999-06-08 1999-06-08 半導体装置及びその製造方法 Pending JP2000349178A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP11161657A JP2000349178A (ja) 1999-06-08 1999-06-08 半導体装置及びその製造方法
US09/447,675 US6232652B1 (en) 1999-06-08 1999-11-23 Semiconductor device having a packaged semiconductor element and permanent vent and manufacturing method thereof
KR10-2000-0026631A KR100407746B1 (ko) 1999-06-08 2000-05-18 반도체장치
TW089109818A TW479332B (en) 1999-06-08 2000-05-22 Semiconductor device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11161657A JP2000349178A (ja) 1999-06-08 1999-06-08 半導体装置及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009199963A Division JP2009302556A (ja) 2009-08-31 2009-08-31 半導体装置

Publications (2)

Publication Number Publication Date
JP2000349178A JP2000349178A (ja) 2000-12-15
JP2000349178A5 true JP2000349178A5 (enExample) 2006-11-30

Family

ID=15739361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11161657A Pending JP2000349178A (ja) 1999-06-08 1999-06-08 半導体装置及びその製造方法

Country Status (4)

Country Link
US (1) US6232652B1 (enExample)
JP (1) JP2000349178A (enExample)
KR (1) KR100407746B1 (enExample)
TW (1) TW479332B (enExample)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3180794B2 (ja) * 1999-02-19 2001-06-25 日本電気株式会社 半導体装置及びその製造方法
US6407334B1 (en) * 2000-11-30 2002-06-18 International Business Machines Corporation I/C chip assembly
US7242088B2 (en) * 2000-12-29 2007-07-10 Intel Corporation IC package pressure release apparatus and method
US20030125077A1 (en) * 2002-01-03 2003-07-03 Hsi-Che Lee Multimedia watch
TW471143B (en) * 2001-01-04 2002-01-01 Wen-Wen Chiou Integrated circuit chip package
TW476147B (en) * 2001-02-13 2002-02-11 Siliconware Precision Industries Co Ltd BGA semiconductor packaging with through ventilator heat dissipation structure
KR100447226B1 (ko) * 2001-10-24 2004-09-04 앰코 테크놀로지 코리아 주식회사 칩 삽입형 반도체 패키지
US6841413B2 (en) * 2002-01-07 2005-01-11 Intel Corporation Thinned die integrated circuit package
US20050136640A1 (en) * 2002-01-07 2005-06-23 Chuan Hu Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same
US6703704B1 (en) * 2002-09-25 2004-03-09 International Business Machines Corporation Stress reducing stiffener ring
US6773964B2 (en) 2002-09-30 2004-08-10 Koninklijke Philips Electronics N.V. Integrated circuit package including sealed gaps and prevention of vapor induced failures and method of manufacturing the same
KR20040060123A (ko) * 2002-12-30 2004-07-06 동부전자 주식회사 반도체 소자 패키징 방법
JP4154391B2 (ja) 2003-01-30 2008-09-24 富士通株式会社 半導体装置
US6835960B2 (en) * 2003-03-03 2004-12-28 Opto Tech Corporation Light emitting diode package structure
WO2004086498A1 (ja) * 2003-03-26 2004-10-07 Fujitsu Limited 半導体装置
DE10345377B4 (de) * 2003-09-30 2009-07-30 Qimonda Ag Halbleitermodul und Verfahren zur Herstellung eines Halbleitermoduls
US7098529B1 (en) * 2004-01-07 2006-08-29 Credence Systems Corporation System and method for packaging a semiconductor device
TWI249232B (en) * 2004-10-20 2006-02-11 Siliconware Precision Industries Co Ltd Heat dissipating package structure and method for fabricating the same
TWI246759B (en) * 2004-11-16 2006-01-01 Siliconware Precision Industries Co Ltd Heat dissipating package structure and fabrication method thereof
US8115301B2 (en) * 2006-11-17 2012-02-14 Stats Chippac, Inc. Methods for manufacturing thermally enhanced flip-chip ball grid arrays
TWI342603B (en) * 2006-11-22 2011-05-21 Advanced Semiconductor Eng Package assembly whose spacer has through hole
US7607355B2 (en) * 2007-02-16 2009-10-27 Yamaha Corporation Semiconductor device
JP5126219B2 (ja) * 2007-03-27 2013-01-23 富士通株式会社 半導体部品および半導体部品の製造方法
CN101925997A (zh) * 2008-02-01 2010-12-22 松下电器产业株式会社 驱动模块构造
US8258013B1 (en) * 2010-02-12 2012-09-04 Xilinx, Inc. Integrated circuit assembly having vented heat-spreader
US8659169B2 (en) * 2010-09-27 2014-02-25 Xilinx, Inc. Corner structure for IC die
EP2461275A1 (en) * 2010-12-02 2012-06-06 Gemalto SA Security Document and method of manufacturing security document
US20120188721A1 (en) * 2011-01-21 2012-07-26 Nxp B.V. Non-metal stiffener ring for fcbga
WO2012165647A1 (en) * 2011-06-01 2012-12-06 Canon Kabushiki Kaisha Semiconductor device
US8836110B2 (en) * 2012-08-31 2014-09-16 Freescale Semiconductor, Inc. Heat spreader for use within a packaged semiconductor device
JP6036083B2 (ja) * 2012-09-21 2016-11-30 株式会社ソシオネクスト 半導体装置及びその製造方法並びに電子装置及びその製造方法
US10062634B2 (en) * 2016-12-21 2018-08-28 Micron Technology, Inc. Semiconductor die assembly having heat spreader that extends through underlying interposer and related technology
US11201095B1 (en) 2019-08-23 2021-12-14 Xilinx, Inc. Chip package having a cover with window
WO2023042854A1 (ja) * 2021-09-17 2023-03-23 三菱電機株式会社 複合プリント配線板および複合プリント配線板の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6384051A (ja) 1986-09-26 1988-04-14 Matsushita Electronics Corp 半導体装置の製造方法
JPH027453A (ja) * 1988-06-27 1990-01-11 Fuji Photo Film Co Ltd ガラスキャップ法
JPH02125640A (ja) * 1988-11-05 1990-05-14 Mitsubishi Electric Corp 中空パッケージ
JPH02222564A (ja) * 1989-02-23 1990-09-05 Toto Ltd チップキャリヤ
JPH0582696A (ja) * 1991-09-19 1993-04-02 Mitsubishi Electric Corp 半導体装置のリードフレーム
US5414293A (en) * 1992-10-14 1995-05-09 International Business Machines Corporation Encapsulated light emitting diodes
JP2693694B2 (ja) 1992-11-10 1997-12-24 日本碍子株式会社 半導体素子収納用パッケージのキャップ封止方法
JPH06169026A (ja) 1992-11-30 1994-06-14 Hitachi Ltd 半導体集積回路装置
US5420752A (en) * 1993-08-18 1995-05-30 Lsi Logic Corporation GPT system for encapsulating an integrated circuit package
US5652463A (en) * 1995-05-26 1997-07-29 Hestia Technologies, Inc. Transfer modlded electronic package having a passage means
JP2842355B2 (ja) * 1996-02-01 1999-01-06 日本電気株式会社 パッケージ
US5909057A (en) * 1997-09-23 1999-06-01 Lsi Logic Corporation Integrated heat spreader/stiffener with apertures for semiconductor package
JP2991172B2 (ja) * 1997-10-24 1999-12-20 日本電気株式会社 半導体装置

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