TWI313047B - - Google Patents

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Publication number
TWI313047B
TWI313047B TW092101441A TW92101441A TWI313047B TW I313047 B TWI313047 B TW I313047B TW 092101441 A TW092101441 A TW 092101441A TW 92101441 A TW92101441 A TW 92101441A TW I313047 B TWI313047 B TW I313047B
Authority
TW
Taiwan
Prior art keywords
wafer
substrate
sealant
forming
bearing surface
Prior art date
Application number
TW092101441A
Other languages
English (en)
Chinese (zh)
Other versions
TW200414460A (en
Inventor
Chang Kenny
Original Assignee
Via Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Via Tech Inc filed Critical Via Tech Inc
Priority to TW092101441A priority Critical patent/TW200414460A/zh
Publication of TW200414460A publication Critical patent/TW200414460A/zh
Application granted granted Critical
Publication of TWI313047B publication Critical patent/TWI313047B/zh

Links

Classifications

    • H10W74/00—
    • H10W74/15—
    • H10W90/734—

Landscapes

  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW092101441A 2003-01-23 2003-01-23 Method for fabricating a chip package TW200414460A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW092101441A TW200414460A (en) 2003-01-23 2003-01-23 Method for fabricating a chip package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092101441A TW200414460A (en) 2003-01-23 2003-01-23 Method for fabricating a chip package

Publications (2)

Publication Number Publication Date
TW200414460A TW200414460A (en) 2004-08-01
TWI313047B true TWI313047B (enExample) 2009-08-01

Family

ID=45072705

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092101441A TW200414460A (en) 2003-01-23 2003-01-23 Method for fabricating a chip package

Country Status (1)

Country Link
TW (1) TW200414460A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8390119B2 (en) 2010-08-06 2013-03-05 Mediatek Inc. Flip chip package utilizing trace bump trace interconnection

Also Published As

Publication number Publication date
TW200414460A (en) 2004-08-01

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Legal Events

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MK4A Expiration of patent term of an invention patent