TW200414460A - Method for fabricating a chip package - Google Patents

Method for fabricating a chip package Download PDF

Info

Publication number
TW200414460A
TW200414460A TW092101441A TW92101441A TW200414460A TW 200414460 A TW200414460 A TW 200414460A TW 092101441 A TW092101441 A TW 092101441A TW 92101441 A TW92101441 A TW 92101441A TW 200414460 A TW200414460 A TW 200414460A
Authority
TW
Taiwan
Prior art keywords
substrate
chip
sealant
wafer
wafers
Prior art date
Application number
TW092101441A
Other languages
English (en)
Chinese (zh)
Other versions
TWI313047B (enExample
Inventor
Kenny Chang
Original Assignee
Via Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Via Tech Inc filed Critical Via Tech Inc
Priority to TW092101441A priority Critical patent/TW200414460A/zh
Publication of TW200414460A publication Critical patent/TW200414460A/zh
Application granted granted Critical
Publication of TWI313047B publication Critical patent/TWI313047B/zh

Links

Classifications

    • H10W74/00—
    • H10W74/15—
    • H10W90/734—

Landscapes

  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW092101441A 2003-01-23 2003-01-23 Method for fabricating a chip package TW200414460A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW092101441A TW200414460A (en) 2003-01-23 2003-01-23 Method for fabricating a chip package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092101441A TW200414460A (en) 2003-01-23 2003-01-23 Method for fabricating a chip package

Publications (2)

Publication Number Publication Date
TW200414460A true TW200414460A (en) 2004-08-01
TWI313047B TWI313047B (enExample) 2009-08-01

Family

ID=45072705

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092101441A TW200414460A (en) 2003-01-23 2003-01-23 Method for fabricating a chip package

Country Status (1)

Country Link
TW (1) TW200414460A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10354970B2 (en) 2010-08-06 2019-07-16 Mediatek Inc. Flip chip package utilizing trace bump trace interconnection

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10354970B2 (en) 2010-08-06 2019-07-16 Mediatek Inc. Flip chip package utilizing trace bump trace interconnection
US10707183B2 (en) 2010-08-06 2020-07-07 Mediatek Inc. Flip chip package utilizing trace bump trace interconnection
US11121108B2 (en) 2010-08-06 2021-09-14 Mediatek Inc. Flip chip package utilizing trace bump trace interconnection

Also Published As

Publication number Publication date
TWI313047B (enExample) 2009-08-01

Similar Documents

Publication Publication Date Title
US8378480B2 (en) Dummy wafers in 3DIC package assemblies
US9064879B2 (en) Packaging methods and structures using a die attach film
CN103915414B (zh) 倒装芯片晶片级封装及其方法
US6900534B2 (en) Direct attach chip scale package
TWI482261B (zh) 三維系統級封裝堆疊式封裝結構
US8217511B2 (en) Redistributed chip packaging with thermal contact to device backside
US7348218B2 (en) Semiconductor packages and methods of manufacturing thereof
US7906857B1 (en) Molded integrated circuit package and method of forming a molded integrated circuit package
US20160284568A1 (en) Encapsulated dies with enhanced thermal performance
US6835592B2 (en) Methods for molding a semiconductor die package with enhanced thermal conductivity
TWI414027B (zh) 晶片尺寸封裝件及其製法
US20250160014A1 (en) Semiconductor package structure and related methods
US20250038042A1 (en) Semiconductor device package and manufacturing method thereof
KR20150055857A (ko) 반도체 패키지 및 그 제조 방법
KR20080015725A (ko) 기계적으로 분리된 리드 부착물을 갖는 플라스틱오버몰딩된 패키지들
TW202412119A (zh) 芯片封裝結構及製備方法
US7776648B2 (en) High thermal performance packaging for circuit dies
CN112117203A (zh) 封装方法及封装结构
CN115312406A (zh) 芯片封装结构及制备方法
CN115116860A (zh) 芯片封装方法及芯片
TW202238859A (zh) 封裝結構及其製造方法
TW567563B (en) Semiconductor package and manufacturing method thereof
TW202306060A (zh) 半導體裝置
TW200522302A (en) Semiconductor package
CN101295655A (zh) 平板/晶圆结构封装设备与其方法

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent