KR100353386B1 - 질화알루미늄 소결체 및 그 제조방법 - Google Patents
질화알루미늄 소결체 및 그 제조방법 Download PDFInfo
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- KR100353386B1 KR100353386B1 KR1020020018180A KR20020018180A KR100353386B1 KR 100353386 B1 KR100353386 B1 KR 100353386B1 KR 1020020018180 A KR1020020018180 A KR 1020020018180A KR 20020018180 A KR20020018180 A KR 20020018180A KR 100353386 B1 KR100353386 B1 KR 100353386B1
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- KR
- South Korea
- Prior art keywords
- aluminum nitride
- weight
- sintered body
- carbon
- sintering
- Prior art date
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 title claims abstract description 135
- 238000000034 method Methods 0.000 title claims description 40
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 85
- 238000005245 sintering Methods 0.000 claims abstract description 74
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 73
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 claims abstract description 21
- 239000000843 powder Substances 0.000 claims description 40
- 239000011812 mixed powder Substances 0.000 claims description 18
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 16
- 239000001301 oxygen Substances 0.000 claims description 16
- 229910052760 oxygen Inorganic materials 0.000 claims description 16
- 239000012298 atmosphere Substances 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 8
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 7
- 229930195733 hydrocarbon Natural products 0.000 claims description 6
- 150000002430 hydrocarbons Chemical class 0.000 claims description 6
- 230000001590 oxidative effect Effects 0.000 claims description 5
- 239000004215 Carbon black (E152) Substances 0.000 claims description 4
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 claims description 4
- 229910002091 carbon monoxide Inorganic materials 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 abstract description 30
- 230000035939 shock Effects 0.000 abstract description 8
- 238000010438 heat treatment Methods 0.000 abstract description 7
- 239000000758 substrate Substances 0.000 abstract description 7
- 239000004065 semiconductor Substances 0.000 abstract description 6
- 150000002910 rare earth metals Chemical class 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 239000002245 particle Substances 0.000 description 64
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 17
- 238000001465 metallisation Methods 0.000 description 12
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 11
- 229910052721 tungsten Inorganic materials 0.000 description 11
- 238000007747 plating Methods 0.000 description 9
- 239000010937 tungsten Substances 0.000 description 9
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 8
- 239000007789 gas Substances 0.000 description 8
- -1 yttrium compound Chemical class 0.000 description 8
- 239000006229 carbon black Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 150000001342 alkaline earth metals Chemical class 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 6
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 6
- 230000009467 reduction Effects 0.000 description 6
- 229910018104 Ni-P Inorganic materials 0.000 description 5
- 229910018536 Ni—P Inorganic materials 0.000 description 5
- 239000000292 calcium oxide Substances 0.000 description 5
- 239000007791 liquid phase Substances 0.000 description 5
- 238000009766 low-temperature sintering Methods 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 229910052779 Neodymium Inorganic materials 0.000 description 3
- 235000021355 Stearic acid Nutrition 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 238000005121 nitriding Methods 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 3
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 239000008117 stearic acid Substances 0.000 description 3
- 229910052727 yttrium Inorganic materials 0.000 description 3
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 2
- 229910052691 Erbium Inorganic materials 0.000 description 2
- 229930091371 Fructose Natural products 0.000 description 2
- 239000005715 Fructose Substances 0.000 description 2
- RFSUNEUAIZKAJO-ARQDHWQXSA-N Fructose Chemical compound OC[C@H]1O[C@](O)(CO)[C@@H](O)[C@@H]1O RFSUNEUAIZKAJO-ARQDHWQXSA-N 0.000 description 2
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 229910052772 Samarium Inorganic materials 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229930006000 Sucrose Natural products 0.000 description 2
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910008322 ZrN Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 229910052788 barium Inorganic materials 0.000 description 2
- AYJRCSIUFZENHW-UHFFFAOYSA-L barium carbonate Chemical compound [Ba+2].[O-]C([O-])=O AYJRCSIUFZENHW-UHFFFAOYSA-L 0.000 description 2
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000001273 butane Substances 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 235000013681 dietary sucrose Nutrition 0.000 description 2
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 2
- 239000008103 glucose Substances 0.000 description 2
- 229910052746 lanthanum Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229920002239 polyacrylonitrile Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229910052712 strontium Inorganic materials 0.000 description 2
- 229960004793 sucrose Drugs 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- ZSLUVFAKFWKJRC-IGMARMGPSA-N 232Th Chemical compound [232Th] ZSLUVFAKFWKJRC-IGMARMGPSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910052776 Thorium Inorganic materials 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000011149 active material Substances 0.000 description 1
- 150000001339 alkali metal compounds Chemical class 0.000 description 1
- CAVCGVPGBKGDTG-UHFFFAOYSA-N alumanylidynemethyl(alumanylidynemethylalumanylidenemethylidene)alumane Chemical compound [Al]#C[Al]=C=[Al]C#[Al] CAVCGVPGBKGDTG-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 229940043430 calcium compound Drugs 0.000 description 1
- 150000001674 calcium compounds Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 229960002380 dibutyl phthalate Drugs 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/581—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on aluminium nitride
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Products (AREA)
Abstract
Description
시료 | 탄소분말 첨가량 (중량%) | 1500℃ 탄소량 (중량%) | 소결체 탄소량 (중량%) | 균열발생 | AlN 소결체의 특성 | ||
평균 입경 (㎛) | 상대 밀도 (%) | 열전도율 (W/mK) | |||||
1 | 0.008 | 0.007 | 0.004 | 7/10 | 3.5 | 100 | 100 |
2 | 0.013 | 0.011 | 0.007 | 2/10 | 2.9 | 100 | 150 |
3 | 0.03 | 0.03 | 0.02 | 1/10 | 2.8 | 100 | 160 |
4 | 0.1 | 0.07 | 0.06 | 0/10 | 2.7 | 100 | 160 |
5 | 0.3 | 0.08 | 0.07 | 0/10 | 2.5 | 100 | 165 |
6 | 1.0 | 0.09 | 0.08 | 0/10 | 1.8 | 99 | 170 |
7 | 1.9 | 0.095 | 0.09 | 0/10 | 1.7 | 99 | 170 |
8 | 3.0 | 0.30 | 0.20 | 8/10 | 1.5 | 95 | 160 |
시료 | 박리 강도 (㎏/㎜) |
1 | 1.3 내지 2.0 |
2 | 1.8 내지 2.5 |
3 | 2.0 내지 2.3 |
4 | 2.3 내지 2.6 |
5 | 2.4 내지 2.6 |
6 | 2.5 내지 2.8 |
7 | 2.4 내지 2.6 |
8 | 1.5 내지 1.7 |
시료 | PVB 첨가량 (중량%) | 1500℃ 탄소량 (중량%) | 소결체 탄소량 (중량%) | 균열 발생 | AlN 소결체의 특성 | ||
평균 입경 (㎛) | 상대 밀도 (%) | 열전도율 (W/mK) | |||||
9 | 0.004 | 0.007 | 0.004 | 6/10 | 3.2 | 100 | 90 |
10 | 0.013 | 0.01 | 0.007 | 2/10 | 2.8 | 100 | 140 |
11 | 0.040 | 0.030 | 0.021 | 1/10 | 2.6 | 100 | 150 |
12 | 0.15 | 0.059 | 0.044 | 1/10 | 2.5 | 100 | 152 |
13 | 0.50 | 0.065 | 0.051 | 0/10 | 2.4 | 99 | 158 |
14 | 2.0 | 0.071 | 0.063 | 0/10 | 2.3 | 99 | 162 |
15 | 6.0 | 0.080 | 0.071 | 1/10 | 2.2 | 99 | 164 |
16 | 10.0 | 0.089 | 0.081 | 1/10 | 1.9 | 99 | 166 |
17 | 18.0 | 0.095 | 0.092 | 2/10 | 1.8 | 99 | 170 |
18 | 25.0 | 0.30 | 0.15 | 7/10 | 1.5 | 96 | 150 |
시료 | 소결시의 분위기 (체적%) | 소결체 탄소량 (중량%) | 균열 발생 | AlN 소결체 특성 | ||
평균 입경 (㎛) | 상대 밀도 (%) | 열전도율 (W/mK) | ||||
19 | 질소 (100) | 0.001 | 8/10 | 3.7 | 100 | 85 |
20 | 메탄 (5) + 질소 (95) | 0.003 | 3/10 | 3.3 | 100 | 110 |
21 | 부탄 (15) + 암모니아 (85) | 0.007 | 1/10 | 2.8 | 100 | 120 |
22 | 아세틸렌 (30) + 질소 (70) | 0.01 | 0/10 | 2.5 | 100 | 120 |
23 | 부탄 (50) + 질소 (50) | 0.02 | 0/10 | 2.3 | 100 | 140 |
24 | 아세틸렌 (60) + 질소 (40) | 0.04 | 0/10 | 2.4 | 100 | 130 |
25 | 메탄 (80) + 암모니아 (20) | 0.06 | 0/10 | 1.9 | 100 | 140 |
26 | 부탄 (100) | 0.08 | 0/10 | 1.8 | 100 | 130 |
시료 | AlN 분말의 평균 입경 (㎛) | 1500℃ 탄소량 (중량%) | 소결체 탄소량 (중량%) | 균열 발생 | AlN 소결체의 특성 | ||
평균 입경 (㎛) | 상대 밀도 (%) | 열전도율 (W/mK) | |||||
27 | 0.4 | (성형체에 균열 발생, 소결되지 않음) | |||||
28 | 0.6 | 0.13 | 0.11 | 4/10 | 1.9 | 97 | 140 |
15 | 0.8 | 0.080 | 0.071 | 1/10 | 2.2 | 99 | 164 |
29 | 1.3 | 0.072 | 0.042 | 1/10 | 2.6 | 99 | 160 |
30 | 1.8 | 0.044 | 0.030 | 1/10 | 2.8 | 100 | 152 |
31 | 2.4 | 0.022 | 0.015 | 5/10 | 3.5 | 100 | 130 |
시료 | AlN 분말 산소량 (중량%) | 소결체 탄소량 (중량%) | 균열 발생 | AlN 소결체의 특성 | ||
평균 입경 (㎛) | 상대 밀도 (%) | 열전도율 (W/mK) | ||||
32 | 0.5 | 0.09 | 5/10 | 1.7 | 95 | 110 |
33 | 0.8 | 0.08 | 0/10 | 1.8 | 100 | 133 |
26 | 1.2 | 0.08 | 0/10 | 1.8 | 100 | 130 |
34 | 1.5 | 0.04 | 1/10 | 2.9 | 100 | 122 |
35 | 2.0 | 0.03 | 6/10 | 3.3 | 100 | 120 |
시료 | 소결 온도 (℃) | 1500℃ 탄소량 (중량%) | 소결체 탄소량 (중량%) | 균열 발생 | AlN 소결체의 특성 | ||
평균 입도 (㎛) | 상대 밀도 (%) | 열전도율 (W/mK) | |||||
36 | 1600 | 0.03 | 0.02 | 2/10 | 1.9 | 99 | 120 |
37 | 1650 | 0.03 | 0.02 | 2/10 | 2.3 | 100 | 150 |
3 | 1700 | 0.03 | 0.02 | 1/10 | 2.8 | 100 | 160 |
38 | 1750 | 0.03 | 0.02 | 7/10 | 3.7 | 100 | 180 |
39 | 1800 | 0.03 | 0.02 | 8/10 | 4.0 | 100 | 200 |
시료 | 함유율 | 소결체 탄소량 (중량%) | 균열 발생 | 소결체 특성 | ||||
Y2O3(중량%) | CaO (중량%) | 탄소 분말 (중량%) | 평균 입경 (㎛) | 상대 밀도 (%) | 열전도율 (W/mK) | |||
1 | 0.005 | 1.0 | 0.1 | 0.06 | 9/10 | 1.6 | 85.0 | 80 |
2 | 0.05 | 1.0 | 0.1 | 0.06 | 1/10 | 2.4 | 99.0 | 152 |
3 | 1 | 1.0 | 0.1 | 0.06 | 0/10 | 2.6 | 100.0 | 167 |
4 | 6 | 1.0 | 0.1 | 0.06 | 0/10 | 2.7 | 100.0 | 160 |
5 | 9 | 1.0 | 0.1 | 0.06 | 0/10 | 2.4 | 99.4 | 165 |
6 | 12 | 1.0 | 0.1 | 0.06 | 2/10 | 2.3 | 99.0 | 110 |
7 | 3 | 0.005 | 0.1 | 0.06 | 10/10 | 1.1 | 80.0 | 75 |
8 | 3 | 0.05 | 0.1 | 0.06 | 1/10 | 2.3 | 99.0 | 154 |
10 | 3 | 1.0 | 0.1 | 0.06 | 0/10 | 2.6 | 100.0 | 169 |
11 | 3 | 3.0 | 0.1 | 0.06 | 0/10 | 2.5 | 99.7 | 157 |
12 | 3 | 7.0 | 0.1 | 0.06 | 6/10 | 2.0 | 97.6 | 98 |
Claims (5)
- 산화물로 환산하여 0.01 중량% 이상 5 중량% 이하의 알칼리 토류 금속 원소, 산화물로 환산하여 0.01 중량% 이상 10 중량% 이하의 희토류 원소, 주성분이 질화알루미늄 분말인 나머지 물질을 함유하는 혼합 분말을 준비하는 단계,상기 혼합 분말을 사용하여 성형체를 형성하는 단계, 및일산화탄소 및 탄화수소 중 1종 이상의 함유율이 10 체적% 이상 100 체적% 이하인 비산화성 분위기 하에 상기 성형체를 소결시켜 소결체를 형성하는 단계를 포함하는 질화알루미늄 소결체의 제조 방법.
- 제1항에 있어서, 소결 과정 중 온도 1500 ℃에서 상기 성형체 중의 탄소 함유율이 0.01 중량% 이상 0.1 중량% 이하인 것인 질화알루미늄 소결체의 제조 방법.
- 제1항에 있어서, 소결 온도가 1500 ℃ 이상 1700 ℃ 이하인 것인 질화알루미늄 소결체의 제조 방법.
- 제1항에 있어서, 상기 질화알루미늄 분말의 평균 그레인 크기가 0.5 ㎛ 이상 2.0 ㎛ 이하인 것인 질화알루미늄 소결체의 제조 방법.
- 제1항에 있어서, 상기 질화알루미늄 분말 중의 산소 함유율이 상기 질화알루미늄 분말의 중량에 대하여 0.8 중량% 이상 1.5 중량% 이하인 것인 질화알루미늄 소결체의 제조 방법.
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JP20635398A JP4812144B2 (ja) | 1998-07-22 | 1998-07-22 | 窒化アルミニウム焼結体及びその製造方法 |
JPJP-P-1998-00206353 | 1998-07-22 | ||
KR1019990029427A KR100353387B1 (ko) | 1998-07-22 | 1999-07-21 | 질화알루미늄 소결체 및 그 제조방법 |
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KR20020036986A KR20020036986A (ko) | 2002-05-17 |
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KR1020020018176A KR100353385B1 (ko) | 1998-07-22 | 2002-04-03 | 질화알루미늄 소결체 및 그 제조방법 |
KR1020020018180A KR100353386B1 (ko) | 1998-07-22 | 2002-04-03 | 질화알루미늄 소결체 및 그 제조방법 |
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KR1020020018176A KR100353385B1 (ko) | 1998-07-22 | 2002-04-03 | 질화알루미늄 소결체 및 그 제조방법 |
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US (2) | US6271163B1 (ko) |
EP (1) | EP0974565B1 (ko) |
JP (1) | JP4812144B2 (ko) |
KR (3) | KR100353387B1 (ko) |
CN (2) | CN1305807C (ko) |
CA (1) | CA2277346C (ko) |
DE (1) | DE69921909T2 (ko) |
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WO2021060731A1 (ko) * | 2019-09-25 | 2021-04-01 | 주식회사 케이씨씨 | 질화알루미늄 소결체 및 질화알루미늄 소결체의 제조방법 |
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- 1999-07-21 KR KR1019990029427A patent/KR100353387B1/ko not_active IP Right Cessation
- 1999-07-22 CN CNB991106342A patent/CN1305807C/zh not_active Expired - Lifetime
- 1999-07-22 CN CN2005100727784A patent/CN1689732B/zh not_active Expired - Lifetime
- 1999-07-22 DE DE69921909T patent/DE69921909T2/de not_active Expired - Fee Related
- 1999-07-22 EP EP99305814A patent/EP0974565B1/en not_active Expired - Lifetime
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2001
- 2001-02-13 US US09/783,259 patent/US6428741B2/en not_active Expired - Lifetime
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2002
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2021060731A1 (ko) * | 2019-09-25 | 2021-04-01 | 주식회사 케이씨씨 | 질화알루미늄 소결체 및 질화알루미늄 소결체의 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
KR20000011846A (ko) | 2000-02-25 |
JP4812144B2 (ja) | 2011-11-09 |
EP0974565B1 (en) | 2004-11-17 |
US6271163B1 (en) | 2001-08-07 |
DE69921909D1 (de) | 2004-12-23 |
CA2277346C (en) | 2004-11-23 |
KR20020036985A (ko) | 2002-05-17 |
CN1689732A (zh) | 2005-11-02 |
US6428741B2 (en) | 2002-08-06 |
KR20020036986A (ko) | 2002-05-17 |
CN1689732B (zh) | 2010-06-23 |
KR100353385B1 (ko) | 2002-09-19 |
JP2000044342A (ja) | 2000-02-15 |
DE69921909T2 (de) | 2005-04-21 |
CA2277346A1 (en) | 2000-01-22 |
KR100353387B1 (ko) | 2002-09-18 |
CN1242349A (zh) | 2000-01-26 |
EP0974565A1 (en) | 2000-01-26 |
CN1305807C (zh) | 2007-03-21 |
US20010016551A1 (en) | 2001-08-23 |
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