KR100266526B1 - 금형 크리닝 장치 및 방법 - Google Patents

금형 크리닝 장치 및 방법 Download PDF

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Publication number
KR100266526B1
KR100266526B1 KR1019970024781A KR19970024781A KR100266526B1 KR 100266526 B1 KR100266526 B1 KR 100266526B1 KR 1019970024781 A KR1019970024781 A KR 1019970024781A KR 19970024781 A KR19970024781 A KR 19970024781A KR 100266526 B1 KR100266526 B1 KR 100266526B1
Authority
KR
South Korea
Prior art keywords
mold
resin molded
cleaning
molded body
conveying means
Prior art date
Application number
KR1019970024781A
Other languages
English (en)
Korean (ko)
Other versions
KR980005917A (ko
Inventor
미쯔히로 야나이
유끼노리 혼도
Original Assignee
가네꼬 히사시
닛본 덴기 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가네꼬 히사시, 닛본 덴기 가부시끼가이샤 filed Critical 가네꼬 히사시
Publication of KR980005917A publication Critical patent/KR980005917A/ko
Application granted granted Critical
Publication of KR100266526B1 publication Critical patent/KR100266526B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0003—Discharging moulded articles from the mould
    • B29C37/0007—Discharging moulded articles from the mould using means operable from outside the mould for moving between mould parts, e.g. robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
KR1019970024781A 1996-06-14 1997-06-14 금형 크리닝 장치 및 방법 KR100266526B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP96-153613 1996-06-14
JP8153613A JP2904124B2 (ja) 1996-06-14 1996-06-14 金型クリーニング装置及び金型クリーニング方法

Publications (2)

Publication Number Publication Date
KR980005917A KR980005917A (ko) 1998-03-30
KR100266526B1 true KR100266526B1 (ko) 2000-09-15

Family

ID=15566322

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970024781A KR100266526B1 (ko) 1996-06-14 1997-06-14 금형 크리닝 장치 및 방법

Country Status (3)

Country Link
JP (1) JP2904124B2 (ja)
KR (1) KR100266526B1 (ja)
NL (1) NL1006326C2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100764803B1 (ko) 2006-10-12 2007-10-08 세크론 주식회사 반도체소자용 금형 세정장치
KR100945895B1 (ko) 2008-05-21 2010-03-05 주식회사 피에스엠 반도체 몰딩 장비의 인라인 금형 세정장치 및 방법
KR101854007B1 (ko) * 2014-09-11 2018-05-03 세메스 주식회사 반도체 소자 몰딩 장치

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109940845A (zh) * 2017-12-21 2019-06-28 重庆科美模具有限公司 注塑模具保护装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61148016A (ja) * 1984-12-24 1986-07-05 Hitachi Ltd モールド装置
DE3515255A1 (de) * 1985-04-27 1986-10-30 Hartmann, Josef, 7987 Weingarten Vorrichtung zum entnehmen und weiterleiten eines spritzgussteiles bei einer spritzgiessmaschine
JPH084097B2 (ja) * 1986-09-03 1996-01-17 日本電気株式会社 半導体樹脂封止装置
DE3837257A1 (de) * 1988-11-03 1990-05-10 Krupp Gmbh Vorrichtung zum reinigen eines formwerkzeugs von kunststoffverarbeitungsmaschinen
US5297897A (en) * 1989-11-24 1994-03-29 Asm Fico Tooling B.V. Single-strip molding apparatus
JP3502106B2 (ja) * 1991-01-14 2004-03-02 松下電器産業株式会社 モールドプレス装置
JPH0919950A (ja) * 1995-07-06 1997-01-21 Mitsubishi Materials Corp 射出成形装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100764803B1 (ko) 2006-10-12 2007-10-08 세크론 주식회사 반도체소자용 금형 세정장치
KR100945895B1 (ko) 2008-05-21 2010-03-05 주식회사 피에스엠 반도체 몰딩 장비의 인라인 금형 세정장치 및 방법
KR101854007B1 (ko) * 2014-09-11 2018-05-03 세메스 주식회사 반도체 소자 몰딩 장치

Also Published As

Publication number Publication date
KR980005917A (ko) 1998-03-30
NL1006326C2 (nl) 1998-05-18
NL1006326A1 (nl) 1997-12-17
JP2904124B2 (ja) 1999-06-14
JPH10631A (ja) 1998-01-06

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