NL1006326C2 - Inrichting en werkwijze voor het reinigen van een gietvorm. - Google Patents

Inrichting en werkwijze voor het reinigen van een gietvorm. Download PDF

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Publication number
NL1006326C2
NL1006326C2 NL1006326A NL1006326A NL1006326C2 NL 1006326 C2 NL1006326 C2 NL 1006326C2 NL 1006326 A NL1006326 A NL 1006326A NL 1006326 A NL1006326 A NL 1006326A NL 1006326 C2 NL1006326 C2 NL 1006326C2
Authority
NL
Netherlands
Prior art keywords
mold
cleaning
cleaning member
transport
transport member
Prior art date
Application number
NL1006326A
Other languages
English (en)
Dutch (nl)
Other versions
NL1006326A1 (nl
Inventor
Yanai Mitsuhiro
Hondo Yukinori
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Publication of NL1006326A1 publication Critical patent/NL1006326A1/xx
Application granted granted Critical
Publication of NL1006326C2 publication Critical patent/NL1006326C2/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0003—Discharging moulded articles from the mould
    • B29C37/0007—Discharging moulded articles from the mould using means operable from outside the mould for moving between mould parts, e.g. robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
NL1006326A 1996-06-14 1997-06-16 Inrichting en werkwijze voor het reinigen van een gietvorm. NL1006326C2 (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP15361396 1996-06-14
JP8153613A JP2904124B2 (ja) 1996-06-14 1996-06-14 金型クリーニング装置及び金型クリーニング方法

Publications (2)

Publication Number Publication Date
NL1006326A1 NL1006326A1 (nl) 1997-12-17
NL1006326C2 true NL1006326C2 (nl) 1998-05-18

Family

ID=15566322

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1006326A NL1006326C2 (nl) 1996-06-14 1997-06-16 Inrichting en werkwijze voor het reinigen van een gietvorm.

Country Status (3)

Country Link
JP (1) JP2904124B2 (ja)
KR (1) KR100266526B1 (ja)
NL (1) NL1006326C2 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100764803B1 (ko) 2006-10-12 2007-10-08 세크론 주식회사 반도체소자용 금형 세정장치
KR100945895B1 (ko) 2008-05-21 2010-03-05 주식회사 피에스엠 반도체 몰딩 장비의 인라인 금형 세정장치 및 방법
KR101854007B1 (ko) * 2014-09-11 2018-05-03 세메스 주식회사 반도체 소자 몰딩 장치
CN109940845A (zh) * 2017-12-21 2019-06-28 重庆科美模具有限公司 注塑模具保护装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61148016A (ja) * 1984-12-24 1986-07-05 Hitachi Ltd モールド装置
DE3515255A1 (de) * 1985-04-27 1986-10-30 Hartmann, Josef, 7987 Weingarten Vorrichtung zum entnehmen und weiterleiten eines spritzgussteiles bei einer spritzgiessmaschine
JPS6362331A (ja) * 1986-09-03 1988-03-18 Nec Corp 半導体樹脂封止装置
EP0366986A2 (de) * 1988-11-03 1990-05-09 Umformtechnik ERFURT GmbH Vorrichtung zum Reinigen eines Formwerkzeugs von Kunststoffverarbeitungsmaschinen
JPH04241912A (ja) * 1991-01-14 1992-08-28 Matsushita Electric Ind Co Ltd モールドプレス装置
US5297897A (en) * 1989-11-24 1994-03-29 Asm Fico Tooling B.V. Single-strip molding apparatus
JPH0919950A (ja) * 1995-07-06 1997-01-21 Mitsubishi Materials Corp 射出成形装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61148016A (ja) * 1984-12-24 1986-07-05 Hitachi Ltd モールド装置
DE3515255A1 (de) * 1985-04-27 1986-10-30 Hartmann, Josef, 7987 Weingarten Vorrichtung zum entnehmen und weiterleiten eines spritzgussteiles bei einer spritzgiessmaschine
JPS6362331A (ja) * 1986-09-03 1988-03-18 Nec Corp 半導体樹脂封止装置
EP0366986A2 (de) * 1988-11-03 1990-05-09 Umformtechnik ERFURT GmbH Vorrichtung zum Reinigen eines Formwerkzeugs von Kunststoffverarbeitungsmaschinen
US5297897A (en) * 1989-11-24 1994-03-29 Asm Fico Tooling B.V. Single-strip molding apparatus
JPH04241912A (ja) * 1991-01-14 1992-08-28 Matsushita Electric Ind Co Ltd モールドプレス装置
JPH0919950A (ja) * 1995-07-06 1997-01-21 Mitsubishi Materials Corp 射出成形装置

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 010, no. 349 (M - 538) 26 November 1986 (1986-11-26) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 012 (M - 1351) 11 January 1993 (1993-01-11) *
PATENT ABSTRACTS OF JAPAN vol. 097, no. 005 30 May 1997 (1997-05-30) *
PATENT ABSTRACTS OF JAPAN vol. 12, no. 285 (E - 642) 4 August 1988 (1988-08-04) *

Also Published As

Publication number Publication date
KR980005917A (ko) 1998-03-30
NL1006326A1 (nl) 1997-12-17
JPH10631A (ja) 1998-01-06
KR100266526B1 (ko) 2000-09-15
JP2904124B2 (ja) 1999-06-14

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Legal Events

Date Code Title Description
AD1A A request for search or an international type search has been filed
PD2B A search report has been drawn up
SD Assignments of patents

Owner name: SUMITOMO HEAVY INDUSTRIES, LTD.

Effective date: 20080422

VD1 Lapsed due to non-payment of the annual fee

Effective date: 20100101