KR100260478B1 - 이방성 전기 전도성 접착 필름 및 이를 사용하는 결합 구조물 - Google Patents

이방성 전기 전도성 접착 필름 및 이를 사용하는 결합 구조물 Download PDF

Info

Publication number
KR100260478B1
KR100260478B1 KR1019930003608A KR930003608A KR100260478B1 KR 100260478 B1 KR100260478 B1 KR 100260478B1 KR 1019930003608 A KR1019930003608 A KR 1019930003608A KR 930003608 A KR930003608 A KR 930003608A KR 100260478 B1 KR100260478 B1 KR 100260478B1
Authority
KR
South Korea
Prior art keywords
electrically conductive
conductive adhesive
adhesive film
anisotropic electrically
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019930003608A
Other languages
English (en)
Korean (ko)
Other versions
KR930019791A (ko
Inventor
가즈미 히가시
아마네 모치즈키
마사코 마에다
Original Assignee
야마모토 히데키
닛토덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4090044A external-priority patent/JPH05258789A/ja
Priority claimed from JP4090045A external-priority patent/JPH05258790A/ja
Application filed by 야마모토 히데키, 닛토덴코 가부시키가이샤 filed Critical 야마모토 히데키
Publication of KR930019791A publication Critical patent/KR930019791A/ko
Application granted granted Critical
Publication of KR100260478B1 publication Critical patent/KR100260478B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
KR1019930003608A 1992-03-13 1993-03-11 이방성 전기 전도성 접착 필름 및 이를 사용하는 결합 구조물 Expired - Fee Related KR100260478B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP4090044A JPH05258789A (ja) 1992-03-13 1992-03-13 異方導電性接着フィルムおよびこれを用いた接続構造
JP4090045A JPH05258790A (ja) 1992-03-13 1992-03-13 異方導電性接着フィルムおよびこれを用いた接続構造
JP92-090044 1992-03-13
JP92-090045 1992-03-13

Publications (2)

Publication Number Publication Date
KR930019791A KR930019791A (ko) 1993-10-18
KR100260478B1 true KR100260478B1 (ko) 2000-07-01

Family

ID=26431560

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930003608A Expired - Fee Related KR100260478B1 (ko) 1992-03-13 1993-03-11 이방성 전기 전도성 접착 필름 및 이를 사용하는 결합 구조물

Country Status (4)

Country Link
US (1) US5438223A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0560072A3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR100260478B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TW274620B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5814180A (en) * 1993-11-03 1998-09-29 W. L. Gore & Associates, Inc. Low temperature method for mounting electrical components
DE69411940T2 (de) * 1993-11-03 1998-11-26 W.L. Gore & Associates, Inc., Newark, Del. Elektrisch leitfähige klebstoffe
CA2158941A1 (en) * 1994-01-27 1995-08-03 Ciaran Bernard Mcardle Compositions and methods for providing anisotropic conductive pathways and bonds between two sets of conductors
US5497938A (en) * 1994-09-01 1996-03-12 Intel Corporation Tape with solder forms and methods for transferring solder to chip assemblies
FR2726397B1 (fr) * 1994-10-28 1996-11-22 Commissariat Energie Atomique Film conducteur anisotrope pour la microconnectique
US5698496A (en) * 1995-02-10 1997-12-16 Lucent Technologies Inc. Method for making an anisotropically conductive composite medium
US5661901A (en) 1995-07-10 1997-09-02 Micron Technology, Inc. Method for mounting and electrically interconnecting semiconductor dice
US5851644A (en) * 1995-08-01 1998-12-22 Loctite (Ireland) Limited Films and coatings having anisotropic conductive pathways therein
US5673846A (en) * 1995-08-24 1997-10-07 International Business Machines Corporation Solder anchor decal and method
US5661042A (en) * 1995-08-28 1997-08-26 Motorola, Inc. Process for electrically connecting electrical devices using a conductive anisotropic material
GB2310315A (en) * 1996-02-15 1997-08-20 Motorola Gmbh Semiconductor die mounting arrangement
US5789271A (en) * 1996-03-18 1998-08-04 Micron Technology, Inc. Method for fabricating microbump interconnect for bare semiconductor dice
US5726075A (en) * 1996-03-29 1998-03-10 Micron Technology, Inc. Method for fabricating microbump interconnect for bare semiconductor dice
US5741430A (en) * 1996-04-25 1998-04-21 Lucent Technologies Inc. Conductive adhesive bonding means
US5761053A (en) * 1996-05-08 1998-06-02 W. L. Gore & Associates, Inc. Faraday cage
US5808360A (en) * 1996-05-15 1998-09-15 Micron Technology, Inc. Microbump interconnect for bore semiconductor dice
US5789278A (en) * 1996-07-30 1998-08-04 Micron Technology, Inc. Method for fabricating chip modules
US6977025B2 (en) * 1996-08-01 2005-12-20 Loctite (R&D) Limited Method of forming a monolayer of particles having at least two different sizes, and products formed thereby
ATE309556T1 (de) 1996-08-01 2005-11-15 Loctite Ireland Ltd Verfahren zur erzeugung einer monoschicht von teilchen und damit hergestellte produkte
US5916641A (en) * 1996-08-01 1999-06-29 Loctite (Ireland) Limited Method of forming a monolayer of particles
US6402876B1 (en) 1997-08-01 2002-06-11 Loctite (R&D) Ireland Method of forming a monolayer of particles, and products formed thereby
US6230963B1 (en) 1997-01-28 2001-05-15 Eric L. Hertz Method and apparatus using colored foils for placing conductive preforms
US6202918B1 (en) 1997-01-28 2001-03-20 Eric Hertz Method and apparatus for placing conductive preforms
US6427903B1 (en) 1997-02-06 2002-08-06 Speedline Technologies, Inc. Solder ball placement apparatus
US6641030B1 (en) 1997-02-06 2003-11-04 Speedline Technologies, Inc. Method and apparatus for placing solder balls on a substrate
US6056190A (en) * 1997-02-06 2000-05-02 Speedline Technologies, Inc. Solder ball placement apparatus
US5973389A (en) * 1997-04-22 1999-10-26 International Business Machines Corporation Semiconductor chip carrier assembly
WO1998057226A2 (en) 1997-06-12 1998-12-17 Zetfolie B.V. Substrate having a unidirectional conductivity perpendicular to its surface, devices comprising such a substrate and methods for manufacturing such a substrate
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
JPH11168263A (ja) * 1997-09-30 1999-06-22 Canon Inc 光デバイス装置及びその製造方法
US6156484A (en) * 1997-11-07 2000-12-05 International Business Machines Corporation Gray scale etching for thin flexible interposer
US6260264B1 (en) * 1997-12-08 2001-07-17 3M Innovative Properties Company Methods for making z-axis electrical connections
TW359884B (en) * 1998-01-07 1999-06-01 Nanya Technology Co Ltd Multi-level interconnects with I-plug and production process therefor
US6370019B1 (en) * 1998-02-17 2002-04-09 Sarnoff Corporation Sealing of large area display structures
US6897855B1 (en) 1998-02-17 2005-05-24 Sarnoff Corporation Tiled electronic display structure
US6476783B2 (en) * 1998-02-17 2002-11-05 Sarnoff Corporation Contrast enhancement for an electronic display device by using a black matrix and lens array on outer surface of display
US6084296A (en) * 1998-07-09 2000-07-04 Satcon Technology Corporation Low cost high power hermetic package with electrical feed-through bushings
KR100298829B1 (ko) * 1999-07-21 2001-11-01 윤종용 칩 사이즈 패키지의 솔더 접합 구조 및 방법
US6365977B1 (en) 1999-08-31 2002-04-02 International Business Machines Corporation Insulating interposer between two electronic components and process thereof
US6287894B1 (en) 1999-10-04 2001-09-11 Andersen Laboratories, Inc. Acoustic device packaged at wafer level
WO2001051580A1 (fr) * 2000-01-13 2001-07-19 Nitto Denko Corporation Feuille adhesive poreuse, plaquette a semi-conducteurs munie de la feuille adhesive poreuse, et procede de fabrication associe
JP2001217279A (ja) * 2000-02-01 2001-08-10 Mitsubishi Electric Corp 高密度実装装置
AU2001242205A1 (en) * 2000-03-31 2001-10-15 Dyconex Patente Ag Element and method for connecting constituents of an electronic assembly
JP2001351345A (ja) * 2000-06-12 2001-12-21 Alps Electric Co Ltd 磁気ヘッド装置および前記磁気ヘッド装置を搭載した磁気記録及び／または再生装置
JP4030285B2 (ja) * 2001-10-10 2008-01-09 株式会社トクヤマ 基板及びその製造方法
DE10392199T5 (de) * 2002-01-18 2005-01-05 Avery Dennison Corp., Pasadena Folie mit Mikroarchitektur
US7514045B2 (en) * 2002-01-18 2009-04-07 Avery Dennison Corporation Covered microchamber structures
US20030155656A1 (en) * 2002-01-18 2003-08-21 Chiu Cindy Chia-Wen Anisotropically conductive film
JP2004031555A (ja) * 2002-06-25 2004-01-29 Nec Corp 回路基板装置および基板間の接続方法
ATE419661T1 (de) * 2003-09-09 2009-01-15 Nitto Denko Corp Anisotrop-leitender film , herstellungs- und gebrauchsverfahren
WO2005048407A1 (ja) * 2003-11-17 2005-05-26 Jsr Corporation 異方導電性シートおよびその製造方法並びにその応用製品
JP2006278014A (ja) 2005-03-28 2006-10-12 Three M Innovative Properties Co 異方導電性構造体
US8802214B2 (en) * 2005-06-13 2014-08-12 Trillion Science, Inc. Non-random array anisotropic conductive film (ACF) and manufacturing processes
US20060280912A1 (en) * 2005-06-13 2006-12-14 Rong-Chang Liang Non-random array anisotropic conductive film (ACF) and manufacturing processes
US20070170599A1 (en) * 2006-01-24 2007-07-26 Masazumi Amagai Flip-attached and underfilled stacked semiconductor devices
US7923488B2 (en) * 2006-10-16 2011-04-12 Trillion Science, Inc. Epoxy compositions
JP2008117945A (ja) 2006-11-06 2008-05-22 Nitto Denko Corp ウォータージェットレーザダイシング用粘着シート
US20100186997A1 (en) * 2009-01-29 2010-07-29 Samtec Inc. Crimped solder on a flexible circuit board
US8507804B2 (en) * 2010-02-22 2013-08-13 Tyco Electronics Corporation Electrical connector with solder columns
US8138020B2 (en) * 2010-03-25 2012-03-20 International Business Machines Corporation Wafer level integrated interconnect decal and manufacturing method thereof
JP5410387B2 (ja) 2010-08-31 2014-02-05 デクセリアルズ株式会社 導電性粒子及びその製造方法、並びに異方性導電フィルム、接合体、及び接続方法
KR101310256B1 (ko) 2011-06-28 2013-09-23 삼성전기주식회사 인쇄회로기판의 무전해 표면처리 도금층 및 이의 제조방법
US9475963B2 (en) 2011-09-15 2016-10-25 Trillion Science, Inc. Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes
US9102851B2 (en) 2011-09-15 2015-08-11 Trillion Science, Inc. Microcavity carrier belt and method of manufacture
US9365749B2 (en) 2013-05-31 2016-06-14 Sunray Scientific, Llc Anisotropic conductive adhesive with reduced migration
US9777197B2 (en) 2013-10-23 2017-10-03 Sunray Scientific, Llc UV-curable anisotropic conductive adhesive
JP6513281B2 (ja) * 2016-02-29 2019-05-15 富士フイルム株式会社 異方導電性接合部材、半導体デバイス、半導体パッケージおよび半導体デバイスの製造方法
US10038264B2 (en) 2016-11-14 2018-07-31 Microsoft Technology Licensing, Llc Universal coupling for electrically connecting a flexible printed circuit to another flexible printed circuit in multiple different orientations
CN211909269U (zh) * 2017-11-16 2020-11-10 株式会社村田制作所 树脂多层基板、电子部件及其安装构造
CN213522492U (zh) * 2017-11-16 2021-06-22 株式会社村田制作所 树脂多层基板、电子部件及其安装构造
KR102650926B1 (ko) * 2017-11-17 2024-03-27 인스티튜시오 카탈라나 드 르세르카 아이 에스투디스 아반카츠 직접 그래핀 전사 및 그래핀 기반 디바이스
JP7370926B2 (ja) * 2020-04-24 2023-10-30 新光電気工業株式会社 端子構造、配線基板及び端子構造の製造方法
WO2021241654A1 (ja) * 2020-05-29 2021-12-02 三井化学株式会社 異方導電性シート、異方導電性シートの製造方法、電気検査装置および電気検査方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5463200A (en) * 1977-10-31 1979-05-21 Shin Etsu Chem Co Ltd Acryloyloxy group-containing organopolysiloxane and its preparation
US4323914A (en) * 1979-02-01 1982-04-06 International Business Machines Corporation Heat transfer structure for integrated circuit package
JPS55161306A (en) * 1979-06-05 1980-12-15 Asahi Chemical Ind Partly plated porous sheet
CA1284523C (en) * 1985-08-05 1991-05-28 Leo G. Svendsen Uniaxially electrically conductive articles with porous insulating substrate
AU588925B2 (en) * 1985-11-06 1989-09-28 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
JPS6340218A (ja) * 1986-08-05 1988-02-20 住友スリ−エム株式会社 異方導電膜とその製造方法
JPS6394504A (ja) * 1986-10-08 1988-04-25 セイコーエプソン株式会社 異方性導電膜
KR910006949B1 (ko) * 1987-09-24 1991-09-14 가부시키가이샤 도시바 범프 및 그 형성방법
US5014111A (en) * 1987-12-08 1991-05-07 Matsushita Electric Industrial Co., Ltd. Electrical contact bump and a package provided with the same
JP2840098B2 (ja) * 1988-02-05 1998-12-24 レイケム・リミテッド ポリマーのレーザー加工
EP0344702B1 (en) * 1988-05-30 1996-03-13 Canon Kabushiki Kaisha Electric circuit apparatus
JP3022565B2 (ja) * 1988-09-13 2000-03-21 株式会社日立製作所 半導体装置
JP2984064B2 (ja) * 1989-12-19 1999-11-29 日東電工株式会社 異方導電フィルムの製造方法
KR910013440A (ko) * 1989-12-19 1991-08-08 가마이 고로 이방성 도전막 및 그 제조공정
US5071359A (en) * 1990-04-27 1991-12-10 Rogers Corporation Array connector
US5086558A (en) * 1990-09-13 1992-02-11 International Business Machines Corporation Direct attachment of semiconductor chips to a substrate with a substrate with a thermoplastic interposer
US5232702A (en) * 1991-07-22 1993-08-03 Dow Corning Corporation Silicone pressure sensitive adhesive compositons for transdermal drug delivery devices and related medical devices

Also Published As

Publication number Publication date
EP0560072A3 (en) 1993-10-06
EP0560072A2 (en) 1993-09-15
US5438223A (en) 1995-08-01
TW274620B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1996-04-21
KR930019791A (ko) 1993-10-18

Similar Documents

Publication Publication Date Title
KR100260478B1 (ko) 이방성 전기 전도성 접착 필름 및 이를 사용하는 결합 구조물
US5600103A (en) Circuit devices and fabrication method of the same
US6297553B1 (en) Semiconductor device and process for producing the same
KR100466680B1 (ko) 덴드라이트 상호접속을 이용하여 박판에 대한 박막의 부착
CN100539055C (zh) 线路板以及半导体器件
CN1842254B (zh) 双面布线印制电路板及其制造方法
US20070169960A1 (en) Multilayer stacked wiring board
KR20000053243A (ko) 프린트배선판 및 그 제조방법
JP2000514955A (ja) Ｚ軸相互接続方法および回路
US8541687B2 (en) Coreless layer buildup structure
JP3352705B2 (ja) 異方導電性接着フィルムを用いた実装構造
US7520053B2 (en) Method for manufacturing a bump-attached wiring circuit board
KR20130063984A (ko) 배선기판 및 그 제조방법
JPH03178152A (ja) モールドｉｃおよびその製造方法
US9351408B2 (en) Coreless layer buildup structure with LGA and joining layer
US8536459B2 (en) Coreless layer buildup structure with LGA
JPH05258790A (ja) 異方導電性接着フィルムおよびこれを用いた接続構造
JPH0410696A (ja) 多層配線基板の製造方法
JP2984064B2 (ja) 異方導電フィルムの製造方法
JP3455602B2 (ja) 半導体素子実装基板の製造方法
JPH05258789A (ja) 異方導電性接着フィルムおよびこれを用いた接続構造
JPH05343822A (ja) 両面回路基板およびその製造方法
JP2002158446A (ja) フレキシブル基板素片、及び、多層フレキシブル配線板
JPH10107178A (ja) 電子回路基板の構造とその製造方法
JP2918994B2 (ja) 回路基板及び多層回路基板の製造方法

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20030408

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20030408

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000