ATE419661T1 - Anisotrop-leitender film , herstellungs- und gebrauchsverfahren - Google Patents

Anisotrop-leitender film , herstellungs- und gebrauchsverfahren

Info

Publication number
ATE419661T1
ATE419661T1 AT04021330T AT04021330T ATE419661T1 AT E419661 T1 ATE419661 T1 AT E419661T1 AT 04021330 T AT04021330 T AT 04021330T AT 04021330 T AT04021330 T AT 04021330T AT E419661 T1 ATE419661 T1 AT E419661T1
Authority
AT
Austria
Prior art keywords
conductive paths
film
film substrate
plural
production
Prior art date
Application number
AT04021330T
Other languages
English (en)
Inventor
Asai Fumiteru
Noro Masato
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003317453A external-priority patent/JP2005085634A/ja
Priority claimed from JP2003326810A external-priority patent/JP4256237B2/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of ATE419661T1 publication Critical patent/ATE419661T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • G—PHYSICS
    • G01—MEASURING; TESTING
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    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
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    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
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    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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    • H01L2224/81101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector the bump connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a bump connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
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    • H01L2224/838—Bonding techniques
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    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Electric Cables (AREA)
AT04021330T 2003-09-09 2004-09-08 Anisotrop-leitender film , herstellungs- und gebrauchsverfahren ATE419661T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003317453A JP2005085634A (ja) 2003-09-09 2003-09-09 異方導電性フィルムおよびその製造方法
JP2003326810A JP4256237B2 (ja) 2003-09-18 2003-09-18 電子部品検査用の異方導電性フィルムおよびそれを用いた電子部品の検査方法

Publications (1)

Publication Number Publication Date
ATE419661T1 true ATE419661T1 (de) 2009-01-15

Family

ID=34138016

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04021330T ATE419661T1 (de) 2003-09-09 2004-09-08 Anisotrop-leitender film , herstellungs- und gebrauchsverfahren

Country Status (7)

Country Link
US (1) US7156669B2 (de)
EP (1) EP1515399B1 (de)
KR (1) KR20050026683A (de)
AT (1) ATE419661T1 (de)
DE (1) DE602004018720D1 (de)
SG (1) SG110194A1 (de)
TW (1) TW200515644A (de)

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JP5145110B2 (ja) 2007-12-10 2013-02-13 富士フイルム株式会社 異方導電性接合パッケージの製造方法
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SG110194A1 (en) 2005-04-28
TW200515644A (en) 2005-05-01
US7156669B2 (en) 2007-01-02
KR20050026683A (ko) 2005-03-15
EP1515399A2 (de) 2005-03-16
EP1515399B1 (de) 2008-12-31
EP1515399A3 (de) 2006-08-02
US20050077542A1 (en) 2005-04-14

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