JP5104034B2 - 異方導電接続用フィルム及びリール体 - Google Patents
異方導電接続用フィルム及びリール体 Download PDFInfo
- Publication number
- JP5104034B2 JP5104034B2 JP2007136982A JP2007136982A JP5104034B2 JP 5104034 B2 JP5104034 B2 JP 5104034B2 JP 2007136982 A JP2007136982 A JP 2007136982A JP 2007136982 A JP2007136982 A JP 2007136982A JP 5104034 B2 JP5104034 B2 JP 5104034B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- adhesive
- anisotropic conductive
- conductive connection
- adhesive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002313 adhesive film Substances 0.000 claims description 129
- 230000001681 protective effect Effects 0.000 description 102
- 239000000853 adhesive Substances 0.000 description 20
- 230000001070 adhesive effect Effects 0.000 description 20
- 239000010410 layer Substances 0.000 description 16
- 239000000203 mixture Substances 0.000 description 16
- 239000002245 particle Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- 238000005452 bending Methods 0.000 description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 description 7
- 239000005020 polyethylene terephthalate Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000011282 treatment Methods 0.000 description 7
- 229920000180 alkyd Polymers 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000010030 laminating Methods 0.000 description 6
- -1 polyethylene terephthalate Polymers 0.000 description 6
- 229920002799 BoPET Polymers 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000005026 oriented polypropylene Substances 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 229920000877 Melamine resin Polymers 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
- Combinations Of Printed Boards (AREA)
Description
Claims (6)
- 第1のフィルムと、接着フィルムと、第2のフィルムと、がこの順に積層された積層体を備える帯状の異方導電接続用フィルムであって、
前記接着フィルムが、前記第2のフィルムの長手方向の端面と前記接着フィルムの主面との交差部を面内に有しかつ前記接着フィルムの前記主面と直交する基準面よりも張り出しており、
前記第2のフィルムの前記端面及び前記接着フィルムの端面の間の距離が、1〜100mmである、異方導電接続用フィルム。 - 第1のフィルムと、接着フィルムと、第2のフィルムと、がこの順に積層された積層体を備える帯状の異方導電接続用フィルムであって、
前記接着フィルムが、前記第2のフィルムの長手方向の端面と前記接着フィルムの主面との交差部Xを面内に有しかつ前記接着フィルムの前記主面と直交する基準面よりも張り出しており、
前記第1のフィルムが、前記接着フィルムの長手方向の端面と前記第1のフィルムの主面との交差部Yを面内に有しかつ前記第1のフィルムの前記主面と直交する基準面よりも張り出しており、
前記交差部Xと前記交差部Yとの間の距離D1が1〜100mmである、異方導電接続用フィルム。 - 前記異方導電接続用フィルムの幅が0.5〜10mmである、請求項1又は2に記載の異方導電接続用フィルム。
- 前記第1のフィルム及び前記接着フィルム間の剥離強度と、前記第2のフィルム及び前記接着フィルム間の剥離強度との差が、0.001〜10N/mである、請求項1〜3のいずれか一項に記載の異方導電接続用フィルム。
- 前記第2のフィルムの前記端面を指示するための指示手段を更に備える、請求項1〜4のいずれか一項に記載の異方導電接続用フィルム。
- 巻芯と、その巻芯に巻回した請求項1〜5のいずれか一項に記載の異方導電接続用フィルムと、を備えるリール体。
Priority Applications (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007136982A JP5104034B2 (ja) | 2007-05-23 | 2007-05-23 | 異方導電接続用フィルム及びリール体 |
KR1020117025915A KR20110126189A (ko) | 2007-05-23 | 2008-05-02 | 이방 도전 접속용 필름의 사용 방법 |
CNA2008800048234A CN101606282A (zh) | 2007-05-23 | 2008-05-02 | 各向异性导电连接用膜以及卷筒体 |
CN2011102086395A CN102354816A (zh) | 2007-05-23 | 2008-05-02 | 各向异性导电连接用膜的使用方法 |
CN2011102086234A CN102324272A (zh) | 2007-05-23 | 2008-05-02 | 各向异性导电连接用膜以及卷筒体 |
CN201110208628.7A CN102352194B (zh) | 2007-05-23 | 2008-05-02 | 各向异性导电连接用膜以及卷筒体 |
KR1020117025913A KR101180619B1 (ko) | 2007-05-23 | 2008-05-02 | 이방 도전 접속용 필름 및 릴체 |
PCT/JP2008/058430 WO2008142985A1 (ja) | 2007-05-23 | 2008-05-02 | 異方導電接続用フィルム及びリール体 |
KR1020097016729A KR101183299B1 (ko) | 2007-05-23 | 2008-05-02 | 이방 도전 접속용 필름 및 릴체 |
TW097118385A TWI396022B (zh) | 2007-05-23 | 2008-05-19 | Anisotropic conductive film and reel |
TW101145098A TWI456322B (zh) | 2007-05-23 | 2008-05-19 | 異方性導電連接用薄膜及捲軸體 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007136982A JP5104034B2 (ja) | 2007-05-23 | 2007-05-23 | 異方導電接続用フィルム及びリール体 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011243925A Division JP2012077305A (ja) | 2011-11-07 | 2011-11-07 | 異方導電接続用フィルム及びリール体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008293751A JP2008293751A (ja) | 2008-12-04 |
JP5104034B2 true JP5104034B2 (ja) | 2012-12-19 |
Family
ID=40031700
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007136982A Active JP5104034B2 (ja) | 2007-05-23 | 2007-05-23 | 異方導電接続用フィルム及びリール体 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5104034B2 (ja) |
KR (3) | KR101180619B1 (ja) |
CN (4) | CN102352194B (ja) |
TW (2) | TWI396022B (ja) |
WO (1) | WO2008142985A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101183382B1 (ko) * | 2009-03-26 | 2012-09-14 | 히다치 가세고교 가부시끼가이샤 | 접착재 릴 |
JP5459099B2 (ja) * | 2010-06-24 | 2014-04-02 | デクセリアルズ株式会社 | 半導体装置の製造方法 |
JP5759168B2 (ja) * | 2010-12-24 | 2015-08-05 | デクセリアルズ株式会社 | リール体及びリール体の製造方法 |
JP5737134B2 (ja) * | 2011-10-21 | 2015-06-17 | Tdk株式会社 | 粘着シート、表示器用部品および粘着シート製造方法 |
US9252390B2 (en) | 2012-08-07 | 2016-02-02 | Joled Inc. | Production method for joined body, and joined body |
JP6170290B2 (ja) * | 2012-10-11 | 2017-07-26 | 日東電工株式会社 | 積層体 |
JP2016096308A (ja) * | 2014-11-17 | 2016-05-26 | 日東電工株式会社 | 半導体装置の製造方法 |
JP6677966B2 (ja) * | 2014-11-17 | 2020-04-08 | 日東電工株式会社 | セパレータ付き封止用シート、及び、半導体装置の製造方法 |
JP6689135B2 (ja) * | 2016-05-20 | 2020-04-28 | デクセリアルズ株式会社 | 接着テープ構造体 |
JP6829998B2 (ja) * | 2017-01-25 | 2021-02-17 | 日東シンコー株式会社 | 基材付接着シート及び半導体モジュール |
JP6641338B2 (ja) * | 2017-11-02 | 2020-02-05 | 積水化学工業株式会社 | 積層フィルム及び積層フィルムの製造方法 |
CN109341909B (zh) * | 2018-11-20 | 2020-11-10 | 郑州大学 | 一种多功能柔性应力传感器 |
KR102103745B1 (ko) * | 2020-02-06 | 2020-05-29 | (주)에이치케이 | 전자파 차폐필름용 이형필름의 부착장치 및 방법 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4832260U (ja) * | 1971-08-17 | 1973-04-19 | ||
JPS4832660U (ja) * | 1971-08-23 | 1973-04-20 | ||
JPS4856600U (ja) * | 1971-10-29 | 1973-07-19 | ||
JPS55127741U (ja) * | 1979-03-01 | 1980-09-09 | ||
JPS61120178U (ja) * | 1985-01-17 | 1986-07-29 | ||
JPH0437239U (ja) * | 1990-07-20 | 1992-03-30 | ||
JPH0621573U (ja) * | 1992-03-13 | 1994-03-22 | 昌一 柴田 | クリーナー用ロール巻粘着テープ |
JP3552274B2 (ja) * | 1994-05-20 | 2004-08-11 | ソニーケミカル株式会社 | シート状接着材の剥離フィルムの剥離方法及び剥離装置 |
JPH11100553A (ja) * | 1997-09-29 | 1999-04-13 | Toray Ind Inc | Tab用接着剤付きテープのロールおよびtab用接着剤付きテープの製造方法 |
JP2003276090A (ja) * | 2002-03-25 | 2003-09-30 | Sony Chem Corp | フィルム状接着剤の貼付装置 |
CN100548840C (zh) * | 2002-07-30 | 2009-10-14 | 日立化成工业株式会社 | 粘接材料带连接体及粘接材料带的连接方法 |
JP2004211017A (ja) * | 2003-01-08 | 2004-07-29 | Hitachi Chem Co Ltd | 接着剤テープ、接着剤テープの製造方法及び接着剤テープの圧着方法 |
JP3921452B2 (ja) * | 2003-03-04 | 2007-05-30 | ソニーケミカル&インフォメーションデバイス株式会社 | 異方導電性フィルムの積層テープ製造方法 |
DE602004018720D1 (de) * | 2003-09-09 | 2009-02-12 | Nitto Denko Corp | Anisotrop-leitender Film , Herstellungs- und Gebrauchsverfahren |
KR101335794B1 (ko) * | 2005-01-12 | 2013-12-02 | 이데미쓰 고산 가부시키가이샤 | TFT 기판 및 그의 제조 방법, 및 Al배선을 구비한투명 도전막 적층 기판 및 그의 제조 방법, 및 Al배선을구비한 투명 도전막 적층 회로 기판 및 그의 제조 방법, 및산화물 투명 도전막 재료 |
JP2006278837A (ja) * | 2005-03-30 | 2006-10-12 | Mitsui Mining & Smelting Co Ltd | フレキシブルプリント配線板の製造方法及びフレキシブルプリント配線板 |
KR101025369B1 (ko) * | 2005-08-04 | 2011-03-28 | 히다치 가세고교 가부시끼가이샤 | 이방도전필름 및 그 제조방법 |
KR100683307B1 (ko) * | 2006-01-16 | 2007-02-15 | 엘에스전선 주식회사 | 두께 편차를 갖는 이방성 도전 필름 |
-
2007
- 2007-05-23 JP JP2007136982A patent/JP5104034B2/ja active Active
-
2008
- 2008-05-02 CN CN201110208628.7A patent/CN102352194B/zh active Active
- 2008-05-02 KR KR1020117025913A patent/KR101180619B1/ko active IP Right Grant
- 2008-05-02 WO PCT/JP2008/058430 patent/WO2008142985A1/ja active Application Filing
- 2008-05-02 CN CNA2008800048234A patent/CN101606282A/zh active Pending
- 2008-05-02 CN CN2011102086395A patent/CN102354816A/zh active Pending
- 2008-05-02 CN CN2011102086234A patent/CN102324272A/zh active Pending
- 2008-05-02 KR KR1020117025915A patent/KR20110126189A/ko not_active Application Discontinuation
- 2008-05-02 KR KR1020097016729A patent/KR101183299B1/ko active IP Right Grant
- 2008-05-19 TW TW097118385A patent/TWI396022B/zh active
- 2008-05-19 TW TW101145098A patent/TWI456322B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR20090122923A (ko) | 2009-12-01 |
TW200912491A (en) | 2009-03-16 |
CN102354816A (zh) | 2012-02-15 |
TWI456322B (zh) | 2014-10-11 |
JP2008293751A (ja) | 2008-12-04 |
KR101180619B1 (ko) | 2012-09-06 |
KR20110126188A (ko) | 2011-11-22 |
CN102352194B (zh) | 2015-11-25 |
TWI396022B (zh) | 2013-05-11 |
TW201314329A (zh) | 2013-04-01 |
CN101606282A (zh) | 2009-12-16 |
CN102324272A (zh) | 2012-01-18 |
WO2008142985A1 (ja) | 2008-11-27 |
KR20110126189A (ko) | 2011-11-22 |
KR101183299B1 (ko) | 2012-09-14 |
CN102352194A (zh) | 2012-02-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5104034B2 (ja) | 異方導電接続用フィルム及びリール体 | |
JP4596086B2 (ja) | 接着材リール | |
US20100018755A1 (en) | Anisotropic conductive tape and method of manufacturing it, connected structure and method of connecting circuit member by use of the tape | |
WO2010110094A1 (ja) | 接着材リール | |
JP2020198422A (ja) | 接続構造体の製造方法、及び接続構造体、並びにフィルム構造体、及びフィルム構造体の製造方法 | |
JP2012077305A (ja) | 異方導電接続用フィルム及びリール体 | |
JP2010147442A (ja) | フレキシブルプリント配線板、フレキシブルプリント配線板の製造方法、及びフレキシブルプリント回路板 | |
CN112738974A (zh) | 电池保护板及其制作方法、移动终端 | |
JP3489442B2 (ja) | Icカードの製造方法 | |
JP2008303067A (ja) | 接着材リール及びこれを用いた回路接続体の製造方法 | |
JP2009111326A (ja) | 回路部材の実装方法 | |
JP4916057B2 (ja) | Fpc用保護フィルム、fpc用保護フィルム付樹脂導体箔積層体およびそれを用いたフレキシブルプリント配線基板の製造方法 | |
JP2011077125A (ja) | 配線板、配線板の製造方法、配線板の接続構造及び配線板の接続方法 | |
JP4198245B2 (ja) | 電子回路用基板、電子回路およびその製造方法 | |
JP4945829B2 (ja) | フレキシブルプリント配線板およびその製造方法 | |
JP2010186807A (ja) | フレキシブルプリント配線板および離型シート体 | |
TW201311084A (zh) | 具有斷差結構的電路板的製作方法 | |
WO2020184267A1 (ja) | 接続構造体の製造方法、及び接続構造体、並びにフィルム構造体、及びフィルム構造体の製造方法 | |
JP5942507B2 (ja) | 電子部品の製造方法 | |
JP5177497B2 (ja) | フレキシブルプリント配線板およびその製造方法 | |
JP2023151680A (ja) | 個片加工接着フィルム、接続構造体の製造方法、及び接続構造体 | |
JP2011077126A (ja) | 配線板、配線板の製造方法、配線板の接続構造及び配線板の接続方法 | |
JPWO2021182158A5 (ja) | ||
JP2005019816A (ja) | 配線基板及びその製造方法、半導体装置並びに電子機器 | |
JP2020017605A (ja) | 導電接続材及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20091118 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110906 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111107 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120403 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120426 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120904 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120917 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 5104034 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20151012 Year of fee payment: 3 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20151012 Year of fee payment: 3 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |