CN102352194B - 各向异性导电连接用膜以及卷筒体 - Google Patents

各向异性导电连接用膜以及卷筒体 Download PDF

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Publication number
CN102352194B
CN102352194B CN201110208628.7A CN201110208628A CN102352194B CN 102352194 B CN102352194 B CN 102352194B CN 201110208628 A CN201110208628 A CN 201110208628A CN 102352194 B CN102352194 B CN 102352194B
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CN
China
Prior art keywords
film
aforementioned
face
adhesive
adhesive film
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Application number
CN201110208628.7A
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English (en)
Chinese (zh)
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CN102352194A (zh
Inventor
佐藤和也
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Lishennoco Co ltd
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Hitachi Chemical Co Ltd
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Combinations Of Printed Boards (AREA)
CN201110208628.7A 2007-05-23 2008-05-02 各向异性导电连接用膜以及卷筒体 Active CN102352194B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-136982 2007-05-23
JP2007136982A JP5104034B2 (ja) 2007-05-23 2007-05-23 異方導電接続用フィルム及びリール体
CNA2008800048234A CN101606282A (zh) 2007-05-23 2008-05-02 各向异性导电连接用膜以及卷筒体

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNA2008800048234A Division CN101606282A (zh) 2007-05-23 2008-05-02 各向异性导电连接用膜以及卷筒体

Publications (2)

Publication Number Publication Date
CN102352194A CN102352194A (zh) 2012-02-15
CN102352194B true CN102352194B (zh) 2015-11-25

Family

ID=40031700

Family Applications (4)

Application Number Title Priority Date Filing Date
CN201110208628.7A Active CN102352194B (zh) 2007-05-23 2008-05-02 各向异性导电连接用膜以及卷筒体
CN2011102086234A Pending CN102324272A (zh) 2007-05-23 2008-05-02 各向异性导电连接用膜以及卷筒体
CNA2008800048234A Pending CN101606282A (zh) 2007-05-23 2008-05-02 各向异性导电连接用膜以及卷筒体
CN2011102086395A Pending CN102354816A (zh) 2007-05-23 2008-05-02 各向异性导电连接用膜的使用方法

Family Applications After (3)

Application Number Title Priority Date Filing Date
CN2011102086234A Pending CN102324272A (zh) 2007-05-23 2008-05-02 各向异性导电连接用膜以及卷筒体
CNA2008800048234A Pending CN101606282A (zh) 2007-05-23 2008-05-02 各向异性导电连接用膜以及卷筒体
CN2011102086395A Pending CN102354816A (zh) 2007-05-23 2008-05-02 各向异性导电连接用膜的使用方法

Country Status (5)

Country Link
JP (1) JP5104034B2 (ja)
KR (3) KR20110126189A (ja)
CN (4) CN102352194B (ja)
TW (2) TWI456322B (ja)
WO (1) WO2008142985A1 (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010110094A1 (ja) * 2009-03-26 2010-09-30 日立化成工業株式会社 接着材リール
JP5459099B2 (ja) * 2010-06-24 2014-04-02 デクセリアルズ株式会社 半導体装置の製造方法
JP5759168B2 (ja) * 2010-12-24 2015-08-05 デクセリアルズ株式会社 リール体及びリール体の製造方法
JP5737134B2 (ja) * 2011-10-21 2015-06-17 Tdk株式会社 粘着シート、表示器用部品および粘着シート製造方法
US9252390B2 (en) 2012-08-07 2016-02-02 Joled Inc. Production method for joined body, and joined body
JP6170290B2 (ja) * 2012-10-11 2017-07-26 日東電工株式会社 積層体
JP6677966B2 (ja) * 2014-11-17 2020-04-08 日東電工株式会社 セパレータ付き封止用シート、及び、半導体装置の製造方法
JP2016096308A (ja) * 2014-11-17 2016-05-26 日東電工株式会社 半導体装置の製造方法
JP6689135B2 (ja) * 2016-05-20 2020-04-28 デクセリアルズ株式会社 接着テープ構造体
JP6829998B2 (ja) * 2017-01-25 2021-02-17 日東シンコー株式会社 基材付接着シート及び半導体モジュール
JP6641338B2 (ja) * 2017-11-02 2020-02-05 積水化学工業株式会社 積層フィルム及び積層フィルムの製造方法
CN109341909B (zh) * 2018-11-20 2020-11-10 郑州大学 一种多功能柔性应力传感器
KR102103745B1 (ko) * 2020-02-06 2020-05-29 (주)에이치케이 전자파 차폐필름용 이형필름의 부착장치 및 방법

Citations (2)

* Cited by examiner, † Cited by third party
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CN1671609A (zh) * 2002-07-30 2005-09-21 日立化成工业株式会社 粘接材料带及其连接方法、制造方法、压接方法、粘接材料带卷、粘接装置、粘接剂带盒、使用它们的粘接剂的压接方法及各向异性导电材料带
TW200708587A (en) * 2005-08-04 2007-03-01 Hitachi Chemical Co Ltd Anisotropic conductive film and method for producing the same

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JPS4832260U (ja) * 1971-08-17 1973-04-19
JPS4832660U (ja) * 1971-08-23 1973-04-20
JPS4856600U (ja) * 1971-10-29 1973-07-19
JPS55127741U (ja) * 1979-03-01 1980-09-09
JPS61120178U (ja) * 1985-01-17 1986-07-29
JPH0437239U (ja) * 1990-07-20 1992-03-30
JPH0621573U (ja) * 1992-03-13 1994-03-22 昌一 柴田 クリーナー用ロール巻粘着テープ
JP3552274B2 (ja) * 1994-05-20 2004-08-11 ソニーケミカル株式会社 シート状接着材の剥離フィルムの剥離方法及び剥離装置
JPH11100553A (ja) * 1997-09-29 1999-04-13 Toray Ind Inc Ｔａｂ用接着剤付きテープのロールおよびｔａｂ用接着剤付きテープの製造方法
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JP2004211017A (ja) * 2003-01-08 2004-07-29 Hitachi Chem Co Ltd 接着剤テープ、接着剤テープの製造方法及び接着剤テープの圧着方法
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CN1671609A (zh) * 2002-07-30 2005-09-21 日立化成工业株式会社 粘接材料带及其连接方法、制造方法、压接方法、粘接材料带卷、粘接装置、粘接剂带盒、使用它们的粘接剂的压接方法及各向异性导电材料带
TW200708587A (en) * 2005-08-04 2007-03-01 Hitachi Chemical Co Ltd Anisotropic conductive film and method for producing the same

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Also Published As

Publication number Publication date
JP5104034B2 (ja) 2012-12-19
TWI456322B (zh) 2014-10-11
CN102324272A (zh) 2012-01-18
KR101180619B1 (ko) 2012-09-06
KR101183299B1 (ko) 2012-09-14
TW200912491A (en) 2009-03-16
KR20110126188A (ko) 2011-11-22
KR20110126189A (ko) 2011-11-22
JP2008293751A (ja) 2008-12-04
TWI396022B (zh) 2013-05-11
CN102352194A (zh) 2012-02-15
CN102354816A (zh) 2012-02-15
CN101606282A (zh) 2009-12-16
WO2008142985A1 (ja) 2008-11-27
TW201314329A (zh) 2013-04-01
KR20090122923A (ko) 2009-12-01

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Address after: Japan Tokyo Chiyoda Marunouchi yidingmu 9 No. 2

Applicant after: HITACHI CHEMICAL Co.,Ltd.

Address before: Tokyo, Japan

Applicant before: HITACHI CHEMICAL Co.,Ltd.

COR Change of bibliographic data
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Japan Tokyo Chiyoda Marunouchi yidingmu 9 No. 2

Patentee after: Lishennoco Co.,Ltd.

Address before: Japan Tokyo Chiyoda Marunouchi yidingmu 9 No. 2

Patentee before: HITACHI CHEMICAL Co.,Ltd.