TWI456322B - 異方性導電連接用薄膜及捲軸體 - Google Patents

異方性導電連接用薄膜及捲軸體 Download PDF

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Publication number
TWI456322B
TWI456322B TW101145098A TW101145098A TWI456322B TW I456322 B TWI456322 B TW I456322B TW 101145098 A TW101145098 A TW 101145098A TW 101145098 A TW101145098 A TW 101145098A TW I456322 B TWI456322 B TW I456322B
Authority
TW
Taiwan
Prior art keywords
film
conductive connection
anisotropic conductive
connection according
adhesive
Prior art date
Application number
TW101145098A
Other languages
English (en)
Chinese (zh)
Other versions
TW201314329A (zh
Inventor
Kazuya Sato
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW201314329A publication Critical patent/TW201314329A/zh
Application granted granted Critical
Publication of TWI456322B publication Critical patent/TWI456322B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Combinations Of Printed Boards (AREA)
TW101145098A 2007-05-23 2008-05-19 異方性導電連接用薄膜及捲軸體 TWI456322B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007136982A JP5104034B2 (ja) 2007-05-23 2007-05-23 異方導電接続用フィルム及びリール体

Publications (2)

Publication Number Publication Date
TW201314329A TW201314329A (zh) 2013-04-01
TWI456322B true TWI456322B (zh) 2014-10-11

Family

ID=40031700

Family Applications (2)

Application Number Title Priority Date Filing Date
TW097118385A TWI396022B (zh) 2007-05-23 2008-05-19 Anisotropic conductive film and reel
TW101145098A TWI456322B (zh) 2007-05-23 2008-05-19 異方性導電連接用薄膜及捲軸體

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW097118385A TWI396022B (zh) 2007-05-23 2008-05-19 Anisotropic conductive film and reel

Country Status (5)

Country Link
JP (1) JP5104034B2 (ja)
KR (3) KR101183299B1 (ja)
CN (4) CN101606282A (ja)
TW (2) TWI396022B (ja)
WO (1) WO2008142985A1 (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120015126A1 (en) * 2009-03-26 2012-01-19 Hitachi Chemical Company, Ltd. Adhesive material reel
JP5459099B2 (ja) * 2010-06-24 2014-04-02 デクセリアルズ株式会社 半導体装置の製造方法
JP5759168B2 (ja) * 2010-12-24 2015-08-05 デクセリアルズ株式会社 リール体及びリール体の製造方法
JP5737134B2 (ja) * 2011-10-21 2015-06-17 Tdk株式会社 粘着シート、表示器用部品および粘着シート製造方法
US9252390B2 (en) 2012-08-07 2016-02-02 Joled Inc. Production method for joined body, and joined body
JP6170290B2 (ja) * 2012-10-11 2017-07-26 日東電工株式会社 積層体
JP6677966B2 (ja) * 2014-11-17 2020-04-08 日東電工株式会社 セパレータ付き封止用シート、及び、半導体装置の製造方法
JP2016096308A (ja) * 2014-11-17 2016-05-26 日東電工株式会社 半導体装置の製造方法
JP6689135B2 (ja) * 2016-05-20 2020-04-28 デクセリアルズ株式会社 接着テープ構造体
JP6829998B2 (ja) * 2017-01-25 2021-02-17 日東シンコー株式会社 基材付接着シート及び半導体モジュール
JP6641338B2 (ja) * 2017-11-02 2020-02-05 積水化学工業株式会社 積層フィルム及び積層フィルムの製造方法
CN109341909B (zh) * 2018-11-20 2020-11-10 郑州大学 一种多功能柔性应力传感器
KR102103745B1 (ko) * 2020-02-06 2020-05-29 (주)에이치케이 전자파 차폐필름용 이형필름의 부착장치 및 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07315682A (ja) * 1994-05-20 1995-12-05 Sony Chem Corp シート状接着材の剥離フィルムの剥離方法及び剥離装置
JPH11100553A (ja) * 1997-09-29 1999-04-13 Toray Ind Inc Ｔａｂ用接着剤付きテープのロールおよびｔａｂ用接着剤付きテープの製造方法
JP2004211017A (ja) * 2003-01-08 2004-07-29 Hitachi Chem Co Ltd 接着剤テープ、接着剤テープの製造方法及び接着剤テープの圧着方法
TW200629567A (en) * 2005-01-12 2006-08-16 Idemitsu Kosan Co Thin film transistor substrate and its production method, transparent conductive film laminated substrate with Al wiring and its production method and oxide transparent conductive film material
TW200642020A (en) * 2005-03-30 2006-12-01 Mitsui Mining & Smelting Co Method for producing flexible printed wiring board, and flexible printed wiring board

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4832260U (ja) * 1971-08-17 1973-04-19
JPS4832660U (ja) * 1971-08-23 1973-04-20
JPS4856600U (ja) * 1971-10-29 1973-07-19
JPS55127741U (ja) * 1979-03-01 1980-09-09
JPS61120178U (ja) * 1985-01-17 1986-07-29
JPH0437239U (ja) * 1990-07-20 1992-03-30
JPH0621573U (ja) * 1992-03-13 1994-03-22 昌一 柴田 クリーナー用ロール巻粘着テープ
JP2003276090A (ja) * 2002-03-25 2003-09-30 Sony Chem Corp フィルム状接着剤の貼付装置
CN100548840C (zh) * 2002-07-30 2009-10-14 日立化成工业株式会社 粘接材料带连接体及粘接材料带的连接方法
JP3921452B2 (ja) * 2003-03-04 2007-05-30 ソニーケミカル＆インフォメーションデバイス株式会社 異方導電性フィルムの積層テープ製造方法
EP1515399B1 (en) * 2003-09-09 2008-12-31 Nitto Denko Corporation Anisotropic conductive film, production method thereof and method of use thereof
KR101025369B1 (ko) * 2005-08-04 2011-03-28 히다치 가세고교 가부시끼가이샤 이방도전필름 및 그 제조방법
KR100683307B1 (ko) * 2006-01-16 2007-02-15 엘에스전선 주식회사 두께 편차를 갖는 이방성 도전 필름

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07315682A (ja) * 1994-05-20 1995-12-05 Sony Chem Corp シート状接着材の剥離フィルムの剥離方法及び剥離装置
JPH11100553A (ja) * 1997-09-29 1999-04-13 Toray Ind Inc Ｔａｂ用接着剤付きテープのロールおよびｔａｂ用接着剤付きテープの製造方法
JP2004211017A (ja) * 2003-01-08 2004-07-29 Hitachi Chem Co Ltd 接着剤テープ、接着剤テープの製造方法及び接着剤テープの圧着方法
TW200629567A (en) * 2005-01-12 2006-08-16 Idemitsu Kosan Co Thin film transistor substrate and its production method, transparent conductive film laminated substrate with Al wiring and its production method and oxide transparent conductive film material
TW200642020A (en) * 2005-03-30 2006-12-01 Mitsui Mining & Smelting Co Method for producing flexible printed wiring board, and flexible printed wiring board

Also Published As

Publication number Publication date
KR101183299B1 (ko) 2012-09-14
JP2008293751A (ja) 2008-12-04
TWI396022B (zh) 2013-05-11
KR20090122923A (ko) 2009-12-01
TW201314329A (zh) 2013-04-01
CN102352194A (zh) 2012-02-15
KR20110126189A (ko) 2011-11-22
KR101180619B1 (ko) 2012-09-06
CN102324272A (zh) 2012-01-18
KR20110126188A (ko) 2011-11-22
CN102354816A (zh) 2012-02-15
JP5104034B2 (ja) 2012-12-19
CN101606282A (zh) 2009-12-16
CN102352194B (zh) 2015-11-25
TW200912491A (en) 2009-03-16
WO2008142985A1 (ja) 2008-11-27

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