TWI456322B - Thin film and reel body for anisotropic conductive connection - Google Patents
Thin film and reel body for anisotropic conductive connection Download PDFInfo
- Publication number
- TWI456322B TWI456322B TW101145098A TW101145098A TWI456322B TW I456322 B TWI456322 B TW I456322B TW 101145098 A TW101145098 A TW 101145098A TW 101145098 A TW101145098 A TW 101145098A TW I456322 B TWI456322 B TW I456322B
- Authority
- TW
- Taiwan
- Prior art keywords
- film
- conductive connection
- anisotropic conductive
- connection according
- adhesive
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
- Combinations Of Printed Boards (AREA)
Claims (23)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007136982A JP5104034B2 (en) | 2007-05-23 | 2007-05-23 | Anisotropic conductive connection film and reel body |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201314329A TW201314329A (en) | 2013-04-01 |
TWI456322B true TWI456322B (en) | 2014-10-11 |
Family
ID=40031700
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101145098A TWI456322B (en) | 2007-05-23 | 2008-05-19 | Thin film and reel body for anisotropic conductive connection |
TW097118385A TWI396022B (en) | 2007-05-23 | 2008-05-19 | Anisotropic conductive film and reel |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097118385A TWI396022B (en) | 2007-05-23 | 2008-05-19 | Anisotropic conductive film and reel |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5104034B2 (en) |
KR (3) | KR20110126189A (en) |
CN (4) | CN102324272A (en) |
TW (2) | TWI456322B (en) |
WO (1) | WO2008142985A1 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4596089B2 (en) * | 2009-03-26 | 2010-12-08 | 日立化成工業株式会社 | Adhesive reel |
JP5459099B2 (en) * | 2010-06-24 | 2014-04-02 | デクセリアルズ株式会社 | Manufacturing method of semiconductor device |
JP5759168B2 (en) * | 2010-12-24 | 2015-08-05 | デクセリアルズ株式会社 | Reel body and method for manufacturing reel body |
JP5737134B2 (en) * | 2011-10-21 | 2015-06-17 | Tdk株式会社 | Adhesive sheet, display part and adhesive sheet manufacturing method |
WO2014024478A1 (en) * | 2012-08-07 | 2014-02-13 | パナソニック株式会社 | Production method for joined body, and joined body |
JP6170290B2 (en) * | 2012-10-11 | 2017-07-26 | 日東電工株式会社 | Laminate |
JP2016096308A (en) * | 2014-11-17 | 2016-05-26 | 日東電工株式会社 | Semiconductor device manufacturing method |
JP6677966B2 (en) * | 2014-11-17 | 2020-04-08 | 日東電工株式会社 | Sealing sheet with separator and method of manufacturing semiconductor device |
JP6689135B2 (en) * | 2016-05-20 | 2020-04-28 | デクセリアルズ株式会社 | Adhesive tape structure |
JP6829998B2 (en) * | 2017-01-25 | 2021-02-17 | 日東シンコー株式会社 | Adhesive sheet with base material and semiconductor module |
JP6641338B2 (en) * | 2017-11-02 | 2020-02-05 | 積水化学工業株式会社 | Laminated film and method for producing laminated film |
CN109341909B (en) * | 2018-11-20 | 2020-11-10 | 郑州大学 | Multifunctional flexible stress sensor |
KR102103745B1 (en) * | 2020-02-06 | 2020-05-29 | (주)에이치케이 | Apparatus for attaching release film for EMI shielding film and thereof method |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07315682A (en) * | 1994-05-20 | 1995-12-05 | Sony Chem Corp | Method and apparatus for stripping stripping film of sheet-like adhesive |
JPH11100553A (en) * | 1997-09-29 | 1999-04-13 | Toray Ind Inc | Roll of tape with adhesive for tab and preparation method thereof |
JP2004211017A (en) * | 2003-01-08 | 2004-07-29 | Hitachi Chem Co Ltd | Adhesive tape, method of producing the same and compression adhesion method for the same |
TW200629567A (en) * | 2005-01-12 | 2006-08-16 | Idemitsu Kosan Co | Thin film transistor substrate and its production method, transparent conductive film laminated substrate with Al wiring and its production method and oxide transparent conductive film material |
TW200642020A (en) * | 2005-03-30 | 2006-12-01 | Mitsui Mining & Smelting Co | Method for producing flexible printed wiring board, and flexible printed wiring board |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4832260U (en) * | 1971-08-17 | 1973-04-19 | ||
JPS4832660U (en) * | 1971-08-23 | 1973-04-20 | ||
JPS4856600U (en) * | 1971-10-29 | 1973-07-19 | ||
JPS55127741U (en) * | 1979-03-01 | 1980-09-09 | ||
JPS61120178U (en) * | 1985-01-17 | 1986-07-29 | ||
JPH0437239U (en) * | 1990-07-20 | 1992-03-30 | ||
JPH0621573U (en) * | 1992-03-13 | 1994-03-22 | 昌一 柴田 | Roll roll adhesive tape for cleaner |
JP2003276090A (en) * | 2002-03-25 | 2003-09-30 | Sony Chem Corp | Apparatus for application of film-like adhesive |
CN100548840C (en) * | 2002-07-30 | 2009-10-14 | 日立化成工业株式会社 | The method of attachment of adhesive material tape connector and adhesive material tape |
JP3921452B2 (en) * | 2003-03-04 | 2007-05-30 | ソニーケミカル&インフォメーションデバイス株式会社 | Method for producing laminated tape of anisotropic conductive film |
ATE419661T1 (en) * | 2003-09-09 | 2009-01-15 | Nitto Denko Corp | ANISOTROPIC CONDUCTING FILM, PROCESS OF PRODUCTION AND USE |
KR101025369B1 (en) * | 2005-08-04 | 2011-03-28 | 히다치 가세고교 가부시끼가이샤 | Anisotropic conductive film and method for producing same |
KR100683307B1 (en) * | 2006-01-16 | 2007-02-15 | 엘에스전선 주식회사 | Anisotropic conductive film that has differential thickness |
-
2007
- 2007-05-23 JP JP2007136982A patent/JP5104034B2/en active Active
-
2008
- 2008-05-02 KR KR1020117025915A patent/KR20110126189A/en not_active Application Discontinuation
- 2008-05-02 KR KR1020117025913A patent/KR101180619B1/en active IP Right Grant
- 2008-05-02 KR KR1020097016729A patent/KR101183299B1/en active IP Right Grant
- 2008-05-02 WO PCT/JP2008/058430 patent/WO2008142985A1/en active Application Filing
- 2008-05-02 CN CN2011102086234A patent/CN102324272A/en active Pending
- 2008-05-02 CN CN201110208628.7A patent/CN102352194B/en active Active
- 2008-05-02 CN CN2011102086395A patent/CN102354816A/en active Pending
- 2008-05-02 CN CNA2008800048234A patent/CN101606282A/en active Pending
- 2008-05-19 TW TW101145098A patent/TWI456322B/en active
- 2008-05-19 TW TW097118385A patent/TWI396022B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07315682A (en) * | 1994-05-20 | 1995-12-05 | Sony Chem Corp | Method and apparatus for stripping stripping film of sheet-like adhesive |
JPH11100553A (en) * | 1997-09-29 | 1999-04-13 | Toray Ind Inc | Roll of tape with adhesive for tab and preparation method thereof |
JP2004211017A (en) * | 2003-01-08 | 2004-07-29 | Hitachi Chem Co Ltd | Adhesive tape, method of producing the same and compression adhesion method for the same |
TW200629567A (en) * | 2005-01-12 | 2006-08-16 | Idemitsu Kosan Co | Thin film transistor substrate and its production method, transparent conductive film laminated substrate with Al wiring and its production method and oxide transparent conductive film material |
TW200642020A (en) * | 2005-03-30 | 2006-12-01 | Mitsui Mining & Smelting Co | Method for producing flexible printed wiring board, and flexible printed wiring board |
Also Published As
Publication number | Publication date |
---|---|
KR101183299B1 (en) | 2012-09-14 |
WO2008142985A1 (en) | 2008-11-27 |
CN102352194A (en) | 2012-02-15 |
KR20110126189A (en) | 2011-11-22 |
TW200912491A (en) | 2009-03-16 |
CN102354816A (en) | 2012-02-15 |
KR101180619B1 (en) | 2012-09-06 |
CN102324272A (en) | 2012-01-18 |
TW201314329A (en) | 2013-04-01 |
KR20110126188A (en) | 2011-11-22 |
JP2008293751A (en) | 2008-12-04 |
JP5104034B2 (en) | 2012-12-19 |
TWI396022B (en) | 2013-05-11 |
CN102352194B (en) | 2015-11-25 |
KR20090122923A (en) | 2009-12-01 |
CN101606282A (en) | 2009-12-16 |
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