TWI456322B - Thin film and reel body for anisotropic conductive connection - Google Patents

Thin film and reel body for anisotropic conductive connection Download PDF

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Publication number
TWI456322B
TWI456322B TW101145098A TW101145098A TWI456322B TW I456322 B TWI456322 B TW I456322B TW 101145098 A TW101145098 A TW 101145098A TW 101145098 A TW101145098 A TW 101145098A TW I456322 B TWI456322 B TW I456322B
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Taiwan
Prior art keywords
film
conductive connection
anisotropic conductive
connection according
adhesive
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TW101145098A
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Chinese (zh)
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TW201314329A (en
Inventor
Kazuya Sato
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Hitachi Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Combinations Of Printed Boards (AREA)

Claims (23)

一種異方性導電連接用薄膜，係具備依序疊層有第1薄膜、接著薄膜及第2薄膜之疊層體的帶狀異方性導電連接用薄膜，其特徵為：在前述異方性導電連接用薄膜之長邊方向的至少一方端部上：前述接著薄膜係從基準面突出，前述基準面係在面內具有前述第2薄膜之長邊方向之端面與前述接著薄膜之主面的交叉部，而且與前述接著薄膜的前述主面呈正交；並且，前述接著薄膜的主面的一部分露出。A film for an anisotropic conductive connection, comprising a film for an anisotropic conductive connection in which a first film, a film of a film, and a film of a second film are laminated in this order, wherein the anisotropy is At least one end portion of the longitudinal direction of the film for electrically conductive connection: the adhesive film protrudes from the reference surface, and the reference surface has an end surface in the longitudinal direction of the second film and a main surface of the adhesive film in the surface The intersection portion is orthogonal to the main surface of the adhesive film, and a part of the main surface of the adhesive film is exposed. 如申請專利範圍第1項之異方性導電連接用薄膜，其中，另外具備用以指示前述第2薄膜之前述端面的指示手段。The film for an anisotropic conductive connection according to the first aspect of the invention, further comprising an indicating means for indicating the end surface of the second film. 如申請專利範圍第2項之異方性導電連接用薄膜，其中，前述指示手段是可用目視來確認的指示手段。The film for an anisotropic conductive connection according to the second aspect of the invention, wherein the indication means is an indication means that can be visually confirmed. 如申請專利範圍第1之異方性導電連接用薄膜，其中，前述異方導電連接用薄膜的寬度是0.3~320mm。The film for anisotropic conductive connection according to the first aspect of the invention, wherein the width of the film for the heteroconductive conductive connection is 0.3 to 320 mm. 如申請專利範圍第1項之異方性導電連接用薄膜，其中，在前述異方性導電連接用薄膜的前述端部上，前述第1薄膜之長邊方向的端面與前述接著薄膜之長邊方向的端面，互相成為一致的平面。The film for anisotropic conductive connection according to the first aspect of the invention, wherein the end surface of the first film in the longitudinal direction and the long side of the film are formed on the end portion of the film for anisotropic conductive connection. The end faces of the directions are mutually uniform planes. 如申請專利範圍第1項之異方性導電連接用薄膜，其中，在前述異方性導電連接用薄膜的前述端部上，前述 第1薄膜之長邊方向的端面、前述接著薄膜之長邊方向的端面、以及前述第2薄膜之長邊方向的端面，係形成為與前述疊層體的疊層方向平行的面。The film for an anisotropic conductive connection according to the first aspect of the invention, wherein the aforesaid end portion of the anisotropic conductive connecting film is as described above The end surface in the longitudinal direction of the first film, the end surface in the longitudinal direction of the film, and the end surface in the longitudinal direction of the second film are formed to be parallel to the lamination direction of the laminate. 如申請專利範圍第1項之異方性導電連接用薄膜，其中，前述第2薄膜的前述端面與前述基準面成為一致的平面。The film for an anisotropic conductive connection according to the first aspect of the invention, wherein the end surface of the second film and the reference surface are aligned. 如申請專利範圍第1項之異方性導電連接用薄膜，其中，前述第1薄膜含有選自由聚對苯二甲酸乙二酯薄膜、配向聚丙烯薄膜、聚乙烯薄膜及聚醯亞胺薄膜所成群組之1種以上的薄膜。The film for anisotropic conductive connection according to claim 1, wherein the first film contains a film selected from the group consisting of polyethylene terephthalate film, alignment polypropylene film, polyethylene film, and polyimide film. One or more types of films in a group. 如申請專利範圍第1項之異方性導電連接用薄膜，其中，前述接著薄膜是單層。The film for an anisotropic conductive connection according to the first aspect of the invention, wherein the adhesive film is a single layer. 如申請專利範圍第1項之異方性導電連接用薄膜，其中，前述接著薄膜具有疊層2層以上之構成。The film for an anisotropic conductive connection according to the first aspect of the invention, wherein the adhesive film has a structure in which two or more layers are laminated. 如申請專利範圍第1項之異方性導電連接用薄膜，其中，前述接著薄膜是由可進行異方導電連接之接著劑組成物所形成。The film for an anisotropic conductive connection according to the first aspect of the invention, wherein the adhesive film is formed of an adhesive composition which can be electrically conductively connected. 如申請專利範圍第11項之異方性導電連接用薄膜，其中，前述接著劑組合物含有熱可塑性樹脂、自由基聚合性化合物及自由基聚合起始劑。The film for an anisotropic conductive connection according to the eleventh aspect of the invention, wherein the adhesive composition contains a thermoplastic resin, a radical polymerizable compound, and a radical polymerization initiator. 如申請專利範圍第11項之異方性導電連接用薄膜，其中，前述接著劑組合物含有熱可塑性樹脂、熱硬化性樹脂及潛在性硬化劑。The film for an anisotropic conductive connection according to claim 11, wherein the adhesive composition contains a thermoplastic resin, a thermosetting resin, and a latent curing agent. 如申請專利範圍第11項之異方性導電連接用薄 膜，其中，前述接著劑組合物含有導電性粒子。Such as the application of patent scope 11th of the anisotropic conductive connection thin A film in which the above-mentioned adhesive composition contains conductive particles. 如申請專利範圍第1項之異方性導電連接用薄膜，其中，前述第2薄膜含有選自由聚對苯二甲酸乙二酯薄膜、配向聚丙烯薄膜、聚乙烯薄膜及聚醯亞胺薄膜所成群組之1種以上的薄膜。The film for anisotropic conductive connection according to claim 1, wherein the second film contains a film selected from the group consisting of polyethylene terephthalate film, oriented polypropylene film, polyethylene film, and polyimide film. One or more types of films in a group. 如申請專利範圍第1項之異方性導電連接用薄膜，其中，前述第1薄膜及前述接著薄膜間之剝離強度比前述第2薄膜及前述接著薄膜間之剝離強度強。The film for anisotropic conductive connection according to the first aspect of the invention, wherein the peel strength between the first film and the adhesive film is stronger than the peel strength between the second film and the adhesive film. 如申請專利範圍第1項之異方性導電連接用薄膜，其中，前述第1薄膜及前述接著薄膜間之剝離強度與前述第2薄膜及前述接著薄膜間之剝離強度的差是0.001~10N/m。The film for anisotropic conductive connection according to the first aspect of the invention, wherein a difference between a peel strength between the first film and the adhesive film and a peel strength between the second film and the adhesive film is 0.001 to 10 N/ m. 如申請專利範圍第1~17項中任一項之異方性導電連接用薄膜，其中，在前述異方性導電連接用薄膜的前述端部上，前述接著薄膜係從第2基準面突出，前述第2基準面係在面內具有前述接著薄膜之長邊方向的端面與前述第1薄膜之主面的交叉部，而且與前述第1薄膜的前述主面呈正交。The film for an anisotropic conductive connection according to any one of the first aspect of the invention, wherein the film of the anisotropic conductive connection is protruded from the second reference surface at the end portion of the film for anisotropic conductive connection. The second reference surface has an intersection between an end surface of the longitudinal direction of the adhesive film and a main surface of the first film in the plane, and is orthogonal to the main surface of the first film. 如申請專利範圍第18項之異方性導電連接用薄膜，其中，在前述異方性導電連接用薄膜的前述端部上，前述第1薄膜的主面的一部分露出。The film for an anisotropic conductive connection according to claim 18, wherein a part of the main surface of the first film is exposed at the end portion of the film for anisotropic conductive connection. 如申請專利範圍第18項之異方性導電連接用薄膜，其中，前述接著薄膜的前述端面與前述第2基準面成為一致的平面。The film for anisotropic conductive connection according to claim 18, wherein the end surface of the adhesive film and the second reference surface are aligned. 如申請專利範圍第18項之異方性導電連接用薄膜，其中，前述第1薄膜的前述端面及前述接著薄膜的前述端面之間的距離是10~200cm。The film for an anisotropic conductive connection according to claim 18, wherein a distance between the end surface of the first film and the end surface of the adhesive film is 10 to 200 cm. 如申請專利範圍第18項之異方性導電連接用薄膜，其中，前述第1薄膜的前述端面及前述接著薄膜的前述端面之間的距離是50~150cm。The film for anisotropic conductive connection according to claim 18, wherein a distance between the end surface of the first film and the end surface of the adhesive film is 50 to 150 cm. 一種捲軸體，其特徵為具備：捲芯、及捲繞在該捲芯之如申請專利範圍第1~22項中任一項之異方性導電連接用薄膜。A reel body comprising: a winding core, and a film for an anisotropic conductive connection wound in the winding core according to any one of claims 1 to 22.
TW101145098A 2007-05-23 2008-05-19 Thin film and reel body for anisotropic conductive connection TWI456322B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007136982A JP5104034B2 (en) 2007-05-23 2007-05-23 Anisotropic conductive connection film and reel body

Publications (2)

Publication Number Publication Date
TW201314329A TW201314329A (en) 2013-04-01
TWI456322B true TWI456322B (en) 2014-10-11

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TW101145098A TWI456322B (en) 2007-05-23 2008-05-19 Thin film and reel body for anisotropic conductive connection
TW097118385A TWI396022B (en) 2007-05-23 2008-05-19 Anisotropic conductive film and reel

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JP (1) JP5104034B2 (en)
KR (3) KR20110126189A (en)
CN (4) CN102324272A (en)
TW (2) TWI456322B (en)
WO (1) WO2008142985A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4596089B2 (en) * 2009-03-26 2010-12-08 日立化成工業株式会社 Adhesive reel
JP5459099B2 (en) * 2010-06-24 2014-04-02 デクセリアルズ株式会社 Manufacturing method of semiconductor device
JP5759168B2 (en) * 2010-12-24 2015-08-05 デクセリアルズ株式会社 Reel body and method for manufacturing reel body
JP5737134B2 (en) * 2011-10-21 2015-06-17 Tdk株式会社 Adhesive sheet, display part and adhesive sheet manufacturing method
WO2014024478A1 (en) * 2012-08-07 2014-02-13 パナソニック株式会社 Production method for joined body, and joined body
JP6170290B2 (en) * 2012-10-11 2017-07-26 日東電工株式会社 Laminate
JP2016096308A (en) * 2014-11-17 2016-05-26 日東電工株式会社 Semiconductor device manufacturing method
JP6677966B2 (en) * 2014-11-17 2020-04-08 日東電工株式会社 Sealing sheet with separator and method of manufacturing semiconductor device
JP6689135B2 (en) * 2016-05-20 2020-04-28 デクセリアルズ株式会社 Adhesive tape structure
JP6829998B2 (en) * 2017-01-25 2021-02-17 日東シンコー株式会社 Adhesive sheet with base material and semiconductor module
JP6641338B2 (en) * 2017-11-02 2020-02-05 積水化学工業株式会社 Laminated film and method for producing laminated film
CN109341909B (en) * 2018-11-20 2020-11-10 郑州大学 Multifunctional flexible stress sensor
KR102103745B1 (en) * 2020-02-06 2020-05-29 (주)에이치케이 Apparatus for attaching release film for EMI shielding film and thereof method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07315682A (en) * 1994-05-20 1995-12-05 Sony Chem Corp Method and apparatus for stripping stripping film of sheet-like adhesive
JPH11100553A (en) * 1997-09-29 1999-04-13 Toray Ind Inc Roll of tape with adhesive for tab and preparation method thereof
JP2004211017A (en) * 2003-01-08 2004-07-29 Hitachi Chem Co Ltd Adhesive tape, method of producing the same and compression adhesion method for the same
TW200629567A (en) * 2005-01-12 2006-08-16 Idemitsu Kosan Co Thin film transistor substrate and its production method, transparent conductive film laminated substrate with Al wiring and its production method and oxide transparent conductive film material
TW200642020A (en) * 2005-03-30 2006-12-01 Mitsui Mining & Smelting Co Method for producing flexible printed wiring board, and flexible printed wiring board

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4832260U (en) * 1971-08-17 1973-04-19
JPS4832660U (en) * 1971-08-23 1973-04-20
JPS4856600U (en) * 1971-10-29 1973-07-19
JPS55127741U (en) * 1979-03-01 1980-09-09
JPS61120178U (en) * 1985-01-17 1986-07-29
JPH0437239U (en) * 1990-07-20 1992-03-30
JPH0621573U (en) * 1992-03-13 1994-03-22 昌一 柴田 Roll roll adhesive tape for cleaner
JP2003276090A (en) * 2002-03-25 2003-09-30 Sony Chem Corp Apparatus for application of film-like adhesive
CN100548840C (en) * 2002-07-30 2009-10-14 日立化成工业株式会社 The method of attachment of adhesive material tape connector and adhesive material tape
JP3921452B2 (en) * 2003-03-04 2007-05-30 ソニーケミカル＆インフォメーションデバイス株式会社 Method for producing laminated tape of anisotropic conductive film
ATE419661T1 (en) * 2003-09-09 2009-01-15 Nitto Denko Corp ANISOTROPIC CONDUCTING FILM, PROCESS OF PRODUCTION AND USE
KR101025369B1 (en) * 2005-08-04 2011-03-28 히다치 가세고교 가부시끼가이샤 Anisotropic conductive film and method for producing same
KR100683307B1 (en) * 2006-01-16 2007-02-15 엘에스전선 주식회사 Anisotropic conductive film that has differential thickness

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07315682A (en) * 1994-05-20 1995-12-05 Sony Chem Corp Method and apparatus for stripping stripping film of sheet-like adhesive
JPH11100553A (en) * 1997-09-29 1999-04-13 Toray Ind Inc Roll of tape with adhesive for tab and preparation method thereof
JP2004211017A (en) * 2003-01-08 2004-07-29 Hitachi Chem Co Ltd Adhesive tape, method of producing the same and compression adhesion method for the same
TW200629567A (en) * 2005-01-12 2006-08-16 Idemitsu Kosan Co Thin film transistor substrate and its production method, transparent conductive film laminated substrate with Al wiring and its production method and oxide transparent conductive film material
TW200642020A (en) * 2005-03-30 2006-12-01 Mitsui Mining & Smelting Co Method for producing flexible printed wiring board, and flexible printed wiring board

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CN102352194A (en) 2012-02-15
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TW200912491A (en) 2009-03-16
CN102354816A (en) 2012-02-15
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CN102324272A (en) 2012-01-18
TW201314329A (en) 2013-04-01
KR20110126188A (en) 2011-11-22
JP2008293751A (en) 2008-12-04
JP5104034B2 (en) 2012-12-19
TWI396022B (en) 2013-05-11
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KR20090122923A (en) 2009-12-01
CN101606282A (en) 2009-12-16

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