CN102324272A - Film and reel for anisotropic electroconductive connection - Google Patents
Film and reel for anisotropic electroconductive connection Download PDFInfo
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- CN102324272A CN102324272A CN2011102086234A CN201110208623A CN102324272A CN 102324272 A CN102324272 A CN 102324272A CN 2011102086234 A CN2011102086234 A CN 2011102086234A CN 201110208623 A CN201110208623 A CN 201110208623A CN 102324272 A CN102324272 A CN 102324272A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention refers to a film and reel for anisotropic electroconductive connection. This invention provides a strip-shaped film (10) for anisotropic electroconductive connection, comprising a laminate (15) comprising a first film (11), an adhesive film (12), and a second film (13) stacked in that order. In this strip-shaped film (10), the adhesive film (12) has in its plane a cross part X between an end face (13a) in the longitudinal direction of the second film (13) and a main plane (12b) of the adhesive film (12) and is projected from a reference plane (16) perpendicular to the main plane (12b) of the adhesive film (12). According to the film for anisotropic electroconductive connection, in the films holding the adhesive film therebetween, only one of the films can be selectively separated and removed with satisfactory reliability.
Description
The application is original application, the applying date to be on May 2nd, 2008, and application number is 200880004823.4, and denomination of invention is divided an application for the one Chinese patent application of " anisotropic conductive connects with film and spool body ".
Technical field
The present invention relates to anisotropic conductive connects with film and spool body.
Background technology
All the time; As to relatively to circuit substrate or electronic unit heat, pressurize; And optionally make the connection material that is electrically connected between electrode or the terminal of compression aspect; Use circuit connection materials such as anisotropic conductive film (below, be called ACF) or the bonding film of insulating properties (below, be called NCF).For ACF; Connecting printed circuit substrate, LCD with substrates such as glass substrate, flexible printing substrates, or when semiconductor element such as IC, LSI or packaging body etc., be configured in relative to electrode between; And, optionally carry out between connection electrode or the terminal through heating and pressurizing.That is to say, ACF and NCF shown have simultaneously relatively to electrode or the conductivity between the terminal, and the anisotropic conductive of adjacent electrode or the insulating properties between the terminal connects.Therefore, these bonding films have electrical connection and the function of this two aspect of mechanical connection (bonding) between circuit substrate or electronic unit.
Representational ACF and NCF preferably use bonding agent compositions such as epoxy resin bonding agent or acrylic acid series bonding agent.For example, ACF is dispersed in the electroconductive particle that is cooperated as required in the above-mentioned bonding agent composition and forms.These bonding films carry out commercialization with the belt-like form that is layered on the supporting films such as PET (PETG) film.In addition, for the surface of protecting these bonding films makes its not dust in the ingress of air etc., the further situation (for example, referring to patent documentation 1) of stacked guard film is arranged also on the interarea of bonding film and supporting film opposition side.
Among Fig. 4, the anisotropic conductive that the three-decker of above-mentioned range upon range of supporting film, bonding film and diaphragm is shown is connected the example in the past with film.Fig. 4 representes that anisotropic conductive connected the end with the film length direction in the past.Anisotropic conductive connects with film 40, has the structure that bonding films 42 such as having stacked gradually supporting film 41, ACF and diaphragm 43 form.In the past anisotropic conductive connects with film 40, can pass through with above-mentioned each film 41,42 and 43 range upon range of after, obtain with respect to stacked direction perpendicular cuts to specific length.Therefore, this anisotropic conductive connects end face 4a and the stack direction quadrature with film 40 length directions, and each film 41,42 and 43 end face are evened up mutually.
Use the anisotropic conductive of this three-decker to connect connection, usually, carry out as follows with the circuit substrate of film 40 or the electrode in the electronic unit etc.At first, diaphragm 43 is connected to peel off with film 40 from anisotropic conductive remove.Then, the interarea that makes the bonding film 42 that exposes and circuit substrate etc. contacts by the sticky object surface and interim the pressure glued.Then, peel off and remove supporting film 41.Then, another interarea that makes the bonding film 42 that exposes contact by the sticky object surface with other, and pressurization heating on one side (the formal pressure glued) on its stacked direction on one side, accomplishes the connection of electrode that this circuit substrate etc. had etc. thus.Peeling off of diaphragm 43 removed, and for example, can carry out through waiting between bonding film 42 and diaphragm 43, to peel off with finger.
Patent documentation 1: TOHKEMY 2004-211017 communique
Summary of the invention
Yet in recent years, along with the miniaturization of various e-machines, circuit substrate that is had in this e-machine or electronic unit are also in miniaturization step by step.Therefore, require bonding films such as ACF in its filmization, make further that film is wide to narrow down.
Yet anisotropic conductive in the past shown in Figure 4 connects with film 40, and along with its filmization and film width narrow, selective detachment is removed diaphragm 43 and become difficult gradually.That is to say that because this anisotropic conductive connects with film 40, its end face 4a is above-mentioned form, therefore, when making that thickness attenuation or film are wide to narrow down, use finger to wait only between diaphragm 43 and bonding film 42, to peel off to become difficult.
In addition, it is also conceivable that adhesive tape joining on the interarea that diaphragm 43 and supporting film 41 expose, and pull each other, peel off the method for removing diaphragm 43 thus.When this method of use was peeled off, the peel strength between supporting film 41 and the bonding film 42 should be than high certain degree of the peel strength between diaphragm 43 and the bonding film 42.Yet this peel strength also exists with ... the constituent material of bonding film 42, and this constituent material determines according to the purposes of bonding film 42.Therefore, also have the situation of above-mentioned peel strength required in the time of can't obtaining removing diaphragm 43 through the method selective detachment that uses splicing tape.
Therefore; The present invention In view of the foregoing carries out; And purpose is to provide a kind of anisotropic conductive to connect and use film, and it can fully guarantee optionally only to peel off one that removes in the film of clamping bonding film, and provides and have the spool body of this anisotropic conductive connection with film.
To achieve these goals; The present invention provides a kind of anisotropic conductive to connect and uses film; It is to have the zonal anisotropy who stacks gradually the duplexer that the 1st film, bonding film and the 2nd film form to conduct electricity to be connected and use film; Wherein, bonding film protrudes in datum level, said datum level for the cross section of the interarea of end face and the bonding film of the length direction that in face, has the 2nd film and with the datum level of the interarea quadrature of bonding film.
Anisotropic conductive in the past connects under the situation with film 40, does not contact with supporting film 41 with bonding film 42, and only pinches diaphragm 43, comes down to impossible.Therefore, to remove the diaphragm 43 that this anisotropic conductive connects with film 40 be very difficult to selective detachment.
On the other hand, anisotropic conductive of the present invention connects uses film, because its bonding film is more outstanding than said reference face, therefore can use finger, does not pinch the 2nd film ground and at least only pinches bonding film.Then, if the bonding film that will pinch and according to circumstances except bonding film, also have the 1st film is bent to the 1st film side of stacked direction,, and cause the 2nd film and bonding film on the direction that pulls mutually, to apply power then because the elasticity of flexure function of the 2nd film.Thus, the 2nd film is peeled off from the end face side of its length direction.Then, pinch the released part of the 2nd film again, perhaps, hold the splicing tape that sticks on the 2nd film and the 1st film, on the direction that is separated from each other, pull bonding film and the 2nd film, then can fully guarantee optionally only to peel off to remove the 2nd film.
Using film when anisotropic conductive of the present invention connects, further have when being used to indicate the indicating member of the 2nd film end face, is preferred.Thus, use the film miniaturization even anisotropic conductive connects, therefore the end face of Visual Confirmation the 2nd film at an easy rate, can not contact with the 2nd film, and only pinch bonding film etc. more easily yet.The result can more guarantee and peel off easily and remove the 2nd film.
In addition, the present invention provides a kind of spool body, and it has the volume core, is connected and uses film with above-mentioned anisotropic conductive on being wound on this volume core.The anisotropic conductive of from this spool body, pulling out connects uses film, owing to have above-mentioned formation, therefore can fully guarantee optionally only to peel off and remove the 2nd film.
According to the present invention, can provide a kind of anisotropic conductive to connect and use film, it can fully guarantee optionally only to peel off one that removes in the film of clamping bonding film.
Description of drawings
[Fig. 1] is that the anisotropic conductive of expression the present invention the 1st execution mode connects the schematic section with a film part.
[Fig. 2] is that the anisotropic conductive of expression the present invention the 2nd execution mode connects the schematic section with a film part.
[Fig. 3] is that the anisotropic conductive of expression the present invention the 3rd execution mode connects the schematic section with a film part.
[Fig. 4] representes that anisotropic conductive connected the schematic section with a film part in the past.
Symbol description
10,20,30 ... Anisotropic conductive connects uses film, 11,21,31 ... Supporting film, 12,22,32 ... Bonding film, 13,23,33 ... Diaphragm, 15,25,35 ... Duplexer, 18 ... Indicating member.
Embodiment
Below, as required,, preferred implementation of the present invention is elaborated with reference to accompanying drawing.In addition, in the accompanying drawing, identical element gives identical symbol, and omits the explanation of repetition.And, wait the position relation up and down, do not have to specify, based on position shown in the drawings relation.In addition, the dimension scale of accompanying drawing is not limited to illustrated ratio.
Fig. 1 is that the zonal anisotropy that schematically illustrates preferred the 1st execution mode of the present invention is conducted electricity and connected the sectional view with film length direction end.The anisotropic conductive of this execution mode connects with film 10, has the supporting film 11 that stacks gradually as the 1st film, bonding film 12, as the duplexer that forms 15 of the diaphragm 13 of the 2nd film.In addition, this anisotropic conductive connects with film 10, on the interarea of diaphragm 13 and bonding film 12 opposition sides, has the indicating member 18 of the end face 13a that is used to indicate diaphragm 13.
The width that anisotropic conductive connects with film 10 is preferably 0.3～320mm, and 0.5～10mm more preferably.Thus, according to the present invention, can more effectively play and optionally only to peel off the advantageous effects of removing diaphragm.
In the 1st execution mode, supporting film 11, bonding film 12 and diaphragm 13 are parallel to the face of the stacked direction S of duplexer 15 at end face 11a, 12a and the 13a of length direction L.In these end faces, the end face 11a of supporting film 11 and the end face 12a of bonding film 12 even up mutually.In addition, supporting film 11 and bonding film 12 protrude in the end face 13a of diaphragm 13, and consequently, the part of the interarea 12b of bonding film 12 is exposed.
The end face 13a of diaphragm 13 and the datum level 16 among the present invention are evened up, said datum level 16, promptly in face, have diaphragm end face 13a and bonding film 12 interarea 12b cross section X and with the face of the interarea 12b quadrature of bonding film 12.In other words, bonding film 12 protrudes in datum level 16.
The anisotropic conductive of this execution mode connects with film 10, because bonding film 12 protrudes in datum level 16, therefore can use finger to wait and not pinch diaphragm 13, and optionally only pinch supporting film 11 and bonding film 12.Then, if these films 11 and 12 that will pinch are bent to supporting film 11 sides of the stacked direction S of duplexer 15,, and cause film 11 on the direction of mutual pulling, to apply power with diaphragm 13 with 12 then because the elasticity of flexure effect of diaphragm 13.Thus, diaphragm 13 is peeled off from end face 13a side.Then, the stripping portion that pinches diaphragm 13 is again graded, and on direction disconnected from each other stretched film 11 and 12 and diaphragm 13, then can fully guarantee optionally only to peel off to remove diaphragm 13.
The interarea 12b of bonding film 12 preferably exposes the degree that optionally pinches bonding film 12 and supporting film 11 to the enough fingers of ability.Specifically, preferably expose to the distance B between the end face 12a of the end face 13a of diaphragm 13 and bonding film 12 be 1～100mm, 5～80mm more preferably, and further be preferably 10～50mm.If this distance B is less than 1mm, the then selective supporting film 11 that pinches becomes difficult tendency with bonding film 12.On the other hand, if distance B surpasses 100mm, remove easy degree though then can change peeling off of diaphragm 13 hardly, the exposed portions serve that has bonding film 12 surfaces that will protect becomes many, and the loss of bonding film 12 becomes big tendency.
Supporting film 11 can be an individual layer, also can be range upon range of structure more than 2 layers.Supporting film 11 preferably has more than one the film that is selected from PETG (PET) film, orientation polypropylene (OPP) film, polyethylene (PE) film and polyimide film.Wherein, consider, be preferably PET film and/or OPP film from the viewpoint that can improve thermal endurance and reduce cost, and PET film more preferably.
In addition, supporting film 11 can use demoulding inorganic agent that the interarea that is provided with bonding film 12 1 sides is handled as required, also can implement roughened to this interarea.As demoulding inorganic agent, for example, can enumerate organosilicon, silicone alkyd, alkyd amino, alkyl alkyd and melamine.In addition, supporting film 11 also can use its interareas of coating such as polymer.These processing can be used a kind separately, also can be with combining more than 2 kinds.
Bonding film 12 can be through supporting coating adhesive composition and dry obtaining on the base material.This bonding film 12 also can be through being formed on the supporting film 11 at coating adhesive composition on the interarea of supporting film 11 and drying.Perhaps, bonding film 12 can also obtain film through coating adhesive composition and drying on the support base material different with supporting film 11, peels off this film from this support base material again, is laminated to then on the interarea of supporting film 11 and is formed on the supporting film 11.
As the adhesive composite of bonding film 12 raw materials, be preferably and carry out the material that anisotropic conductive connects.Therefore, this adhesive composite can contain thermoplastic resin, free-radical polymerised compound and radical polymerization initiator.Perhaps, this adhesive composite can also contain thermoplastic resin, thermosetting resin and potentiality curing agent.Contained each composition in the above-mentioned adhesive composite is so long as contained material gets final product in the so-called in the past anisotropic conductive bonding agent.
Above-mentioned adhesive composite, can contain with in the past anisotropic conductive bonding agent in the contained identical electroconductive particle of electroconductive particle, can not contain yet.By the formed bonding film 12 of the adhesive composite that contains electroconductive particle, through electroconductive particle optionally connect relatively to electrode and/or terminal between, and will contain the substrate of these electrodes and/or terminal simultaneously or install bonding.By the formed bonding film 12 of the adhesive composite that does not contain electroconductive particle, through make relatively to electrode and/or terminal directly contact, will contain the substrate of these electrodes and/or terminal or install bondingly, optionally connect these electrodes and/or terminal thus.
Further, this adhesive composite, except above-mentioned each the composition, can also contain in the past contained composition in the anisotropic conductive bonding agent.
When bonding film 12 had had the structure more than 2 layers range upon range of, each layer can be identical composition each other, also can be different compositions.That is to say, as the composition of the adhesive composite of each layer raw material, can be identical each other, also can be different, and can have the layer that contains electroconductive particle and this two kinds of layers of layer that do not contain electroconductive particle.For example, when bonding film 12 had had 2 layers structure range upon range of, the layer of supporting film 11 1 sides can be the layer that does not contain electroconductive particle, diaphragm 13 1 sides layer can be the layer that contains electroconductive particle.
As the method that diaphragm 13 is configured on the bonding film 12, can enumerate the further method of stacked guard film 13 on bonding film 12 surfaces such as laminating machine of using.Perhaps, can also make as stated in formed bonding film on the supporting film 11 and the same manner forms on diaphragm 13 the mutual subtend of bonding film and carry out pressing and obtain.
As making supporting film 11 and bonding film 12 protrude in the method for datum level 16, can be set forth in the duplexer of supported film 11, bonding film 12 and diaphragm 13 after, the method for the end of tripping protection film 13 only optionally.Perhaps, can be set forth in the duplexer that forms supporting film 11 and bonding film 12 after, the mode configuration protection film 13 by the part of the interarea 12b of bonding film 12 is exposed in advance carries out range upon range of method again.
In addition, the difference of the peel strength between peel strength between supporting film 11 and the bonding film 12 and diaphragm 13 and the bonding film 12 is preferably 0.001～10N/m.Anisotropic conductive connects with film 10, removes diaphragm 13 in order optionally to peel off, and the peel strength between preferred supporting film 11 and the bonding film 12 is stronger than the peel strength between diaphragm 13 and the bonding film.On the other hand, consider at circuit substrate etc. and peel off behind the bonding film 12 of pressing on by sticky object when removing supporting film 11, preferably stronger than the peel strength between supporting film 11 and the bonding film 12 by the peel strength between sticky object and the bonding film 12.When these situation are taken all factors into consideration, preferably be in the peel strength difference in the above-mentioned number range.
In in the past anisotropic conductive connects with film, when the difference of peel strength is in this number range, has and be difficult to optionally only peel off the tendency of removing diaphragm.Yet,,, also can fully guarantee optionally only to peel off to remove diaphragm 13 even this anisotropic conductive connects with film 10 according to the present invention.
In addition, the peel strength among the present invention uses rheometer to measure.
The difference of above-mentioned peel strength can be adjusted peel strength and/or the peel strength between diaphragm 13 and the bonding film 12 between supporting film 11 and the bonding film 12 through the mode of being described below, and drop in the above-mentioned number range.Specifically; In order to improve peel strength; As long as reduce content as the resin (thermoplastic resin) in the adhesive composite of bonding film 12 raw materials; Perhaps reduce the glass transformation temperature (Tg) of this resin, perhaps improve the content of free-radical polymerised compound or thermosetting resin, perhaps roughened is carried out on the surface of supporting film 11 and diaphragm 13 and get final product.Perhaps, in order to improve peel strength, when bonding film 12 contained the solids of electroconductive particle or insulating properties, the content that reduces these particles got final product.Perhaps, in order to reduce peel strength, use demoulding inorganic agent that supporting film 11 or diaphragm 13 are carried out surface treatment, or the thickness that reduces these films get final product.
The thickness of supporting film 11, bonding film 12 and diaphragm 13 is adjusted according to its purposes etc. and to be got final product, and not special restriction.But as stated, preferably with the thickness of supporting film 11 and diaphragm 13, the percentage elongation difference that is adjusted to per unit width diminishes, and suitable difference with peel strength is adjusted to and falls in the above-mentioned number range.
Indicating member 18 is used to indicate the end face 13a of diaphragm 13., be difficult to when being transparent or semitransparent at diaphragm 13 especially through its end face of Visual Confirmation 13a.Therefore, if can confirm the position of end face 13a, then can more easily carry out peeling off of diaphragm 13 and remove processing through indicating member 18.This indicating member 18 can be confirmed to get final product through visual, for example is the strip-shaped members of black, and preferred so that the axle mode parallel with the end face 13a of diaphragm 13 of its length direction is arranged on shown position with it.
The anisotropic conductive of this execution mode connects with film 10, is wound on core (not shown) and goes up the formation spool body.Constitute spool body thus, improved anisotropic conductive and connected operability with film 10.
Fig. 2 is that the zonal anisotropy that schematically illustrates preferred the 2nd execution mode of the present invention is conducted electricity and connected the sectional view with film length direction end.The anisotropic conductive of this execution mode connects with film 20, has to stack gradually the duplexer 25 that supporting film 21, bonding film 22 and diaphragm 23 form.
In the 2nd execution mode, end face 21a, 22a and the 23a of the length direction L of supporting film 21, bonding film 22 and diaphragm 23, for the parallel face of duplexer 25 stacked direction S.Supporting film 11 protrudes in the end face 22a of bonding film 22, and bonding film 22 protrudes in the end face 23a of diaphragm 23.Therefore, the part of the interarea 22b of the interarea 21b of supporting film 21 and bonding film 22 is exposed.
The end face 23a and the datum level of the present invention 26 of diaphragm 23 are evened up, said datum level 26 promptly, in face, have diaphragm 23 end face 23a and bonding film 22 interarea 22b cross section X and with the face of the interarea 22a quadrature of bonding film 22.In other words, bonding film 22 protrudes in datum level 26.
In addition, the end face 22a and the datum level 27 of bonding film 22 are evened up, said datum level 27 promptly, in face, have bonding film 22 end face 22a and supporting film 21 interarea 21b cross section Y and with the face of the interarea 21a quadrature of supporting film 21.In other words, supporting film 21 protrudes in datum level 27.
The anisotropic conductive of this execution mode connects with film 20, protrudes in datum level 26 through its bonding film 22, can use finger to wait and not pinch diaphragm 23, and optionally only pinch supporting film 21 and bonding film 22.Then, if these films 21 and 22 that will pinch are bent to supporting film 21 sides of duplexer 25 stacked direction S,, and cause film 21 on the direction of mutual pulling, to apply power with diaphragm 23 with 22 then because the elasticity of flexure effect of diaphragm 23.Thus, diaphragm 23 is peeled off from end face 23a side.Then, the stripping portion that pinches diaphragm 23 is again graded, and film 21 and 22 and diaphragm 23 direction disconnected from each other on pull, then can fully guarantee optionally only to peel off and remove diaphragm 23.
In addition, the anisotropic conductive of this execution mode connects with film 20, because its supporting film 21 protrudes in datum level 27, therefore can use finger to wait and not pinch diaphragm 23 and bonding film 22, and optionally only pinch supporting film 21.Then, if the supporting film that pinches 21 is bent to supporting film 21 sides of duplexer 25 stacked direction S,, and cause film 21 on the direction of mutual pulling, to apply power with diaphragm 23 with 22 then because the elasticity of flexure function of diaphragm 23.Thus, diaphragm 23 is peeled off from end face 23a side.Then, the stripping portion that pinches diaphragm 23 is again graded, and film 21 and 22 and diaphragm 23 direction disconnected from each other on pull, then can fully guarantee optionally only to peel off and remove diaphragm 23.The peel strength between supporting film 21 and bonding film 22 particularly, during greater than the peel strength between diaphragm 23 and the bonding film 22, this is peeled off to remove and can more guarantee to carry out.
The interarea 21b of supporting film 21 and the interarea 22b of bonding film 22 preferably expose to the degree that can enough fingers etc. optionally pinches supporting film 21 and bonding film 22.Specifically, preferably expose to the distance B 1 between the end face 21a of the end face 22a of bonding film 22 and supporting film 21 be 1～100mm, 5～80mm more preferably, and further be preferably 10～50mm.In addition, preferably expose to the distance B 2 between the end face 22a of the end face 23a of diaphragm 23 and bonding film 22 be 10～200mm, and 50～150mm more preferably.
Identical for this execution mode place in addition with the 1st execution mode.
Fig. 3 is that the zonal anisotropy that schematically illustrates preferred the 3rd execution mode of the present invention is conducted electricity and connected the sectional view with the length direction end of film.The anisotropic conductive of this execution mode connects with film 30, has to stack gradually the duplexer 35 that supporting film 31, bonding film 32 and diaphragm 33 form.
In the 3rd execution mode, end face 31a, 32a and the 33a of the length direction L of supporting film 31, bonding film 32 and diaphragm 33 are the inclined plane with respect to the stacked direction S of duplexer 35.This is formed slopely: supporting film 31 protrudes in the end face 32a of bonding film 32, and bonding film 32 protrudes in the end face 33a of diaphragm 33.
The end face 33a and the datum level 36 of diaphragm 33 are evened up, said datum level 36 promptly, in face, have diaphragm 33 end face 33a and bonding film 32 interarea 32b cross section X and with the face of the interarea 32b quadrature of bonding film 32.In other words, bonding film 32 protrudes in datum level 36.
The end face 32a and the datum level 37 of bonding film 32 are evened up, said datum level 37 promptly, in face, have bonding film 32 end face 33a and supporting film 31 interarea 31b cross section Y and with the face of the interarea 31b quadrature of supporting film 31.In other words, supporting film 31 protrudes in datum level 37.
The anisotropic conductive of this execution mode connects with film 30, because its bonding film 32 protrudes in datum level 36, therefore, can use to point to wait not pinch diaphragm 33 and optionally only pinch supporting film 31 and bonding film 32.Then, if these films 31 and 32 that will pinch are bent to supporting film 31 sides at the stacked direction S of duplexer 35,, and cause film 31 on the direction of mutual pulling, to apply power with diaphragm 33 with 32 then because the elasticity of flexure function of diaphragm 33.Thus, diaphragm 33 is peeled off from end face 33a side.Then, the stripping portion that pinches diaphragm 33 is again graded, and film 31 and 32 and diaphragm 33 direction disconnected from each other on pull, then can fully guarantee optionally only to peel off and remove diaphragm 33.
In addition, the anisotropic conductive of this execution mode connects with film 30, because its supporting film 31 protrudes in datum level 37, therefore can use finger to wait and not pinch diaphragm 33 and bonding film 32, and optionally only pinch supporting film 31.Then, if with the supporting film that pinches 31,35 stacked direction S are bent to supporting film 31 sides at duplexer, then because the elasticity of flexure function of diaphragm 33, and cause film 31 on the direction of mutual pulling, to apply power with diaphragm 33 with 32.Thus, diaphragm 33 is peeled off from end face 33a side.Then, the stripping portion that pinches diaphragm 33 is again graded, and film 31 and 32 and diaphragm 33 direction disconnected from each other on pull, then can fully guarantee optionally only to peel off and remove diaphragm 33.The peel strength between supporting film 31 and bonding film 32 particularly, during greater than the peel strength between diaphragm 33 and the bonding film 32, this is peeled off to remove and can more guarantee to carry out.
The inclination of above-mentioned end face is preferably exposed to the degree that can enough fingers etc. optionally pinches supporting film 31 and bonding film 32.Specifically; The cross section X of the end face 33a of preferred angled to diaphragm 33 and the interarea 32b of bonding film 32; And the distance B between the cross section Y of the end face 32a of bonding film 32 and the interarea 31b of supporting film 31 1 is 1～100mm, 5～80mm more preferably, and further be preferably 10～50mm.In addition, preferred angled is to the cross section Y of the interarea 31b of the end face 32a of bonding film 32 and supporting film 31, and the distance B between the end portion Z of the end face 31a of supporting film 31 2 is 1～200mm, and 5～150mm more preferably.
Identical for this execution mode place in addition with the 1st execution mode.
More than, be illustrated for preferred implementation of the present invention, but the present invention is not limited to above-mentioned execution mode.The present invention can carry out various changes in the scope that does not break away from its inventive point.
For example, in the of the present invention the 2nd and the 3rd execution mode, can be the same with the 1st execution mode, on diaphragm and interarea bonding film side opposition side, have indicating member.In addition, in the 3rd execution mode, the lower end (X) for the end face 33a that indicates diaphragm 33 also can have indicating member on end face 33a.In addition, indicating member also can be directly to use oiliness China ink etc. to be drawn in the situation on the diaphragm.
In addition, also can with diaphragm partly or entirely carry out the painted indicating member that replaces, thereby can pass through its end face of Visual Confirmation.Perhaps, when diaphragm is the PETG film, if on this diaphragm the state of irradiation ultraviolet radiation, then can pass through its end face of Visual Confirmation.
Claims (3)
1. an anisotropic conductive connects and uses film, and it is to have the zonal anisotropy who stacks gradually the duplexer that the 1st film, bonding film and the 2nd film form to conduct electricity to be connected and use film,
Wherein, aforementioned bonding film protrudes in datum level, said datum level for the cross section of the interarea of end face and the aforementioned bonding film of the length direction that in face, has aforementioned the 2nd film and with the datum level of the aforementioned interarea quadrature of aforementioned bonding film,
A part of exposing the interarea of aforementioned bonding film.
2. anisotropic conductive as claimed in claim 1 connects uses film, and it further has the indicating member of the aforementioned end face that is used to indicate aforementioned the 2nd film.
3. spool body, it has the volume core and is connected with anisotropic conductive according to claim 1 or claim 2 on being wound on this volume core and uses film.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-136982 | 2007-05-23 | ||
| JP2007136982A JP5104034B2 (en) | 2007-05-23 | 2007-05-23 | Anisotropic conductive connection film and reel body |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008800048234A Division CN101606282A (en) | 2007-05-23 | 2008-05-02 | Anisotropic conductive connects with film and spool body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102324272A true CN102324272A (en) | 2012-01-18 |
Family
ID=40031700
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008800048234A Pending CN101606282A (en) | 2007-05-23 | 2008-05-02 | Anisotropic conductive connects with film and spool body |
| CN201110208628.7A Active CN102352194B (en) | 2007-05-23 | 2008-05-02 | Film for anisotropic electroconductive connection and spool body |
| CN2011102086395A Pending CN102354816A (en) | 2007-05-23 | 2008-05-02 | Method for using film for anisotropic electroconductive connection |
| CN2011102086234A Pending CN102324272A (en) | 2007-05-23 | 2008-05-02 | Film and reel for anisotropic electroconductive connection |
Family Applications Before (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008800048234A Pending CN101606282A (en) | 2007-05-23 | 2008-05-02 | Anisotropic conductive connects with film and spool body |
| CN201110208628.7A Active CN102352194B (en) | 2007-05-23 | 2008-05-02 | Film for anisotropic electroconductive connection and spool body |
| CN2011102086395A Pending CN102354816A (en) | 2007-05-23 | 2008-05-02 | Method for using film for anisotropic electroconductive connection |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5104034B2 (en) |
| KR (3) | KR101183299B1 (en) |
| CN (4) | CN101606282A (en) |
| TW (2) | TWI396022B (en) |
| WO (1) | WO2008142985A1 (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120015126A1 (en) * | 2009-03-26 | 2012-01-19 | Hitachi Chemical Company, Ltd. | Adhesive material reel |
| JP5459099B2 (en) * | 2010-06-24 | 2014-04-02 | デクセリアルズ株式会社 | Manufacturing method of semiconductor device |
| JP5759168B2 (en) * | 2010-12-24 | 2015-08-05 | デクセリアルズ株式会社 | Reel body and method for manufacturing reel body |
| JP5737134B2 (en) * | 2011-10-21 | 2015-06-17 | Tdk株式会社 | Adhesive sheet, display part and adhesive sheet manufacturing method |
| US9252390B2 (en) | 2012-08-07 | 2016-02-02 | Joled Inc. | Production method for joined body, and joined body |
| JP6170290B2 (en) * | 2012-10-11 | 2017-07-26 | 日東電工株式会社 | Laminate |
| JP2016096308A (en) * | 2014-11-17 | 2016-05-26 | 日東電工株式会社 | Semiconductor device manufacturing method |
| JP6677966B2 (en) * | 2014-11-17 | 2020-04-08 | 日東電工株式会社 | Sealing sheet with separator and method of manufacturing semiconductor device |
| JP6689135B2 (en) * | 2016-05-20 | 2020-04-28 | デクセリアルズ株式会社 | Adhesive tape structure |
| JP6829998B2 (en) * | 2017-01-25 | 2021-02-17 | 日東シンコー株式会社 | Adhesive sheet with base material and semiconductor module |
| JP6641338B2 (en) * | 2017-11-02 | 2020-02-05 | 積水化学工業株式会社 | Laminated film and method for producing laminated film |
| CN109341909B (en) * | 2018-11-20 | 2020-11-10 | 郑州大学 | Multifunctional flexible stress sensor |
| KR102103745B1 (en) * | 2020-02-06 | 2020-05-29 | (주)에이치케이 | Apparatus for attaching release film for EMI shielding film and thereof method |
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- 2008-05-02 KR KR1020097016729A patent/KR101183299B1/en active IP Right Grant
- 2008-05-02 WO PCT/JP2008/058430 patent/WO2008142985A1/en active Application Filing
- 2008-05-02 CN CN201110208628.7A patent/CN102352194B/en active Active
- 2008-05-02 KR KR1020117025915A patent/KR20110126189A/en not_active Application Discontinuation
- 2008-05-02 KR KR1020117025913A patent/KR101180619B1/en active IP Right Grant
- 2008-05-02 CN CN2011102086395A patent/CN102354816A/en active Pending
- 2008-05-02 CN CN2011102086234A patent/CN102324272A/en active Pending
- 2008-05-19 TW TW097118385A patent/TWI396022B/en active
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20110126189A (en) | 2011-11-22 |
| CN102352194A (en) | 2012-02-15 |
| CN102352194B (en) | 2015-11-25 |
| KR20110126188A (en) | 2011-11-22 |
| JP5104034B2 (en) | 2012-12-19 |
| TW200912491A (en) | 2009-03-16 |
| TW201314329A (en) | 2013-04-01 |
| TWI456322B (en) | 2014-10-11 |
| KR101180619B1 (en) | 2012-09-06 |
| JP2008293751A (en) | 2008-12-04 |
| KR20090122923A (en) | 2009-12-01 |
| CN102354816A (en) | 2012-02-15 |
| CN101606282A (en) | 2009-12-16 |
| KR101183299B1 (en) | 2012-09-14 |
| TWI396022B (en) | 2013-05-11 |
| WO2008142985A1 (en) | 2008-11-27 |
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Application publication date: 20120118 |