JPH11100553A - Roll of tape with adhesive for tab and preparation method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the flatness and the decrease in yield during the fine- processing process of an adhesive tape for TAB(tape automated bonding) by preventing the adhesive from adhering to an organic insulating tape. SOLUTION: A roll of a tape with an adhesive for TAB is prepared by winding up a tape with an adhesive for TAB, which is prepared by laminating an organic insulating film, an adhesive layer and a protective film, in a roll form having a void ratio of 5% or larger with a spacer disposed in between.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a TAB (tape / tape).
The present invention relates to a tape with an adhesive used for a semiconductor integrated circuit mounting tape (hereinafter, abbreviated as a TAB tape) referred to as an automated bonding method, that is, a roll of a tape with an adhesive for TAB and a method for manufacturing a tape with an adhesive for TAB. Things.

[0002]

2. Description of the Related Art Generally, a tape with an adhesive for TAB is
It has a structure in which an insulating adhesive layer and a protective film are laminated on a flexible organic insulating film such as a polyimide film. TAB adhesive tape is (1) sprocket and device hole perforation, (2)
Removal of protective film, (3) lamination of copper foil,
The TAB tape is processed through processing steps such as (4) heat curing of the adhesive, (5) pattern formation by resist coating, etching and resist removal, and (6) tin or gold plating. A semiconductor package is manufactured by thermocompression bonding the inner lead portion of the TAB tape to the bump of the semiconductor integrated circuit and sealing with a resin. Such a semiconductor package is connected to a circuit board or the like on which other components are mounted via outer leads, and is mounted on an electronic device.

[0003] With the recent reduction in size and weight of electronic devices, the density of semiconductor packages has also been increasing. In the above-mentioned package form, since the TAB tape finally remains inside the package, a high degree of insulation, heat resistance, adhesion to copper foil, dimensional stability, and flatness are required.

[0004] In the process of processing into a TAB tape, if there is contamination on the surface of the tape with the adhesive for TAB, which is a material of the material, the processability such as contamination of the roll and poor etching is caused. For this reason, the TAB adhesive tape is required to have a high degree of cleanliness.

It is known that a 150 μm-thick polyimide film is used as a spacer at the time of winding in order to protect a product of a TAB tape with an adhesive, which is a material of the TAB tape (JP-A-8-335608).

[0006]

However, when a thick spacer is used, there is a problem that the winding diameter of the product is increased and handling becomes difficult, and furthermore, the spacer shrinks due to heat and tightness due to dimensional change during heat treatment is caused. Therefore, there is a problem that the adhesive oozes out and the flatness is reduced.

A tape with an adhesive for TAB is manufactured by the following method. First, an adhesive resin mixed solution is applied to a protective film, dried, a release film is adhered thereto, and slit to a desired width. Next, the release film is peeled off, and the adhesive surface is thermocompression-bonded to a polyimide film that has been slit in advance. Next, this is wound into a roll and subjected to a heat treatment to obtain a product. FIG. 2 is a schematic view of a cross section during winding and heat treatment. In this case, after winding, the protective film 3 and the upper polyimide film 5
Is in direct contact. In addition, the width of the protective film 3 and the width of the adhesive layer 4 are smaller than the width of the polyimide film 5 in order to facilitate the perforation of the sprocket holes during TAB tape processing. Therefore, at the time of heat treatment, the adhesive oozes out from the end of the protective film 3 due to the softening of the adhesive and the tightness of the roll, and further adheres to the polyimide film 5 side. If the adhesive oozes out, the position of the sprocket hole perforated at the time of processing the TAB tape is contaminated, which hinders the operation. When the adhesive adheres to the polyimide film 5 side, the polyimide film 5 can be removed during TAB tape processing.
The adhesive is transferred to the roll that comes into contact with it, causing contamination.
Further, the flatness of the polyimide film 5 is reduced, and TAB
It causes defects such as defective etching during tape processing and pitch deviation during mounting. The present invention prevents high-quality TAB with excellent processability and productivity by preventing contamination and flatness of the organic insulating film surface due to bleeding of the adhesive, etc. in the process of manufacturing a tape with an adhesive for TAB. An object of the present invention is to provide a method for producing a tape with an adhesive and a tape with an adhesive for TAB.

[0008]

SUMMARY OF THE INVENTION It is an object of the present invention to provide an organic insulating film, an adhesive layer and a protective film having a laminated T film.
Void ratio 5 with AB adhesive tape via spacer
% TAB characterized by being rolled up in a roll form
TAB characterized by winding a tape with adhesive for tape and a tape with adhesive for TAB on which an organic insulating film, an adhesive layer and a protective film are laminated with a porosity of 5% or more via a spacer. This is achieved by a method for producing a tape with an adhesive for use.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The adhesive tape for TAB of the present invention is obtained by laminating an organic insulating film, an adhesive layer and a protective film.

As the organic insulating film used in the present invention, a so-called heat-resistant film such as a polyimide film, a polyetherimide film or an aromatic polyamide film, or a composite material such as a flexible epoxy / glass cloth can be used. Among these materials, a polyimide film is preferably used from the viewpoint of heat resistance and insulating properties. The preferred thickness of the insulating film is 1
2.5-250 μm, more preferably 20-133 μm
m.

[0011] The adhesive layer used in the present invention is usually provided in an uncured state, and after lamination, heating, pressing, electric field, magnetic field,
At least one selected from ultraviolet rays, radiation, ultrasonic waves, etc.
There is no particular limitation as long as it can be cured and cross-linked by the application of more than one kind of energy, but a thermosetting adhesive is particularly preferable. The adhesive layer used in the present invention contains a phenol resin, and more preferably contains a polyamide resin or an epoxy resin. Dicarboxylic acid having 36 carbon atoms (so-called dimer acid) is used as the polyamide resin of the adhesive layer.
Those containing are preferred. This is because the use of dimer acid makes it possible to reduce the water absorption and enhance the electrical insulation. As the phenol resin, any known phenol resin such as a novolak phenol resin and a resol phenol resin can be used. The epoxy resin is not particularly limited as long as it has two or more epoxy groups in one molecule. The addition of a curing agent and a curing accelerator for epoxy resin and phenol resin to the adhesive layer of the present invention is not limited at all.

The protective film used in the present invention includes:
A plastic film such as polyester or a film or paper subjected to a release treatment is preferably used. The thickness of the protective film is preferably 20 μm or more, more preferably 25 μm or more, from the viewpoint of heat resistance.

In the present invention, an organic insulating film,
It is important that a tape with an adhesive for TAB on which an adhesive layer and a protective film are laminated is wound into a roll with a porosity of 5% or more via a spacer. That is, for example, when the film is wound into a roll after thermocompression bonding of the organic insulating film and the adhesive layer, the spacer 2 is overlaid on the protective film 3 and both are wound simultaneously. FIG. 1 shows a cross-sectional view when the film is wound. The spacer 2 prevents transfer of the adhesive to the polyimide film 5 due to bleeding of the adhesive.
The spacer has a thickness of 5 to 130 μm, preferably 5 to 130 μm.
５０50 μm, more preferably 8 to 25 μm can be used. If the thickness is larger than 130 μm, handling becomes difficult due to an increase in the product winding diameter. If the thickness is smaller than 5 μm, the “stiffness” of the spacer becomes weak, and it becomes difficult to wind up the spacer.

The temperature of the spacer is 70 to 80.
It is preferable that the heat shrinkage in the treatment at 24 ° C. for 24 hours is 1% or less and the surface is subjected to a release treatment. When a material having a large heat shrinkage is used, the adhesive oozes due to tight winding caused by a dimensional change at the time of heat treatment, causing a decrease in flatness. Here, the heat shrinkage refers to a value measured according to ASTM D1204.

It is necessary that the porosity when the TAB adhesive tape is wound into a roll is 5% or more.
If the porosity is small, the adhesive oozes due to tightness of the windings caused by the dimensional change during the heat treatment, causing a decrease in flatness. Here, the porosity is calculated by the following equation (1).

[0016]

(Equation 1)

As a material of the spacer, a known resin film such as polyimide, polyphenylene sulfide, or polyethylene terephthalate can be used.

TAB with porosity of 5% or more thus obtained
Is a high quality TAB adhesive tape roll with excellent workability and productivity, which prevents contamination and flatness of the organic insulating film surface due to oozing out of the adhesive. is there.

[0019]

EXAMPLES The contents of the present invention will be described in detail below with reference to examples. In addition, the measurement of the porosity in this example was in accordance with the above equation.

Example 1, Comparative Example 1 A 25 μm thick polyethylene terephthalate film (heat shrinkage at 70 ° C. 0.5%) was used as a protective film, and an adhesive comprising a polyamide resin, an epoxy resin and a phenol resin was used. Was applied to a thickness of 12 μm. This is applied to a 75 μm thick polyimide film.
Thermocompression bonding was performed at 30 ° C. and 1.2 kg / cm ² , and a 12 μm-thick polyethylene terephthalate film was inserted as a spacer when wound up into a roll. At the time of winding, the tension was adjusted so that the porosity was 8%. next,
This roll was subjected to a heat treatment at 70 ° C. for 24 hours in an air oven to obtain a tape with an adhesive for TAB. Table 1 shows the inspection results of the polyimide surface of the produced film. No bleeding of the adhesive was observed, and no stain on the polyimide surface was observed, indicating high flatness and workability.

As Comparative Example 1, winding was performed under the same conditions as in Example 1 without inserting a spacer film.
Heat treatment was performed to obtain a tape with an adhesive for TAB. Table 1 shows the inspection results of the polyimide surface of the produced film. A large amount of adhesive that had oozed out was observed on the polyimide surface, resulting in poor flatness and workability.

[0022]

[Table 1]

[0023]

According to the present invention, in the adhesive tape for TAB, adhesion of the adhesive to the organic insulating film can be prevented. As a result, the flatness of the TAB tape can be improved, and the decrease in the yield in the fine processing step can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a state in which a tape with an adhesive for TAB and a spacer are overlapped in an embodiment of the present invention.

FIG. 2 is a schematic view of a process for producing a tape with an adhesive for TAB in a conventional method.

FIG. 3 is a sectional view showing the relationship between a TAB adhesive tape and a spacer.

[Explanation of symbols]

 1. 1. Tape with adhesive for TAB Spacer film 3. Protective film 4. Adhesive layer 5. Polyimide film

Claims (6)

[Claims] 1. An adhesive for TAB, wherein a tape with an adhesive for TAB, on which an organic insulating film, an adhesive layer and a protective film are laminated, is wound into a roll with a porosity of 5% or more via a spacer. Roll of tape with tape. 2. The tape roll with TAB adhesive according to claim 1, wherein the thickness of the spacer is in the range of 5 to 130 μm. 3. The tape roll with TAB adhesive according to claim 1, wherein the material of the spacer has a heat shrinkage of 1% or less at 70 ° C. 4. An adhesive tape for TAB, wherein a tape with an adhesive for TAB on which an organic insulating film, an adhesive layer and a protective film are laminated is wound into a roll with a porosity of 5% or more via a spacer. Tape manufacturing method. 5. The method according to claim 4, wherein the thickness of the spacer is in the range of 5 to 130 μm. 6. The method for producing an adhesive tape for TAB according to claim 4, wherein the material of the spacer has a heat shrinkage at 70 ° C. of 1% or less.