TW201314329A - Film and reel for anisotropic electroconductive connection - Google Patents

Abstract

This invention provides a strip-shaped film (10) for anisotropic electroconductive connection, comprising a laminate (15) comprising a first film (11), an adhesive film (12), and a second film (13) stacked in that order. In this strip-shaped film (10), the adhesive film (12) has in its plane a cross part X between an end face (13a) in the longitudinal direction of the second film (13) and a main plane (12b) of the adhesive film (12) and is projected from a reference plane (16) perpendicular to the main plane (12b) of the adhesive film (12). According to the film for anisotropic electroconductive connection, in the films holding the adhesive film therebetween, only one of the films can be selectively separated and removed with satisfactory reliability.

Description

Thin film and reel body for anisotropic conductive connection

The present invention relates to a film for an anisotropic conductive connection and a reel body.

Conventionally, an anisotropic conductive film is used for a connecting material that electrically and presses a facing circuit board or an electronic component and selectively electrically connects electrodes or terminals in a pressurizing direction. Hereinafter, it is referred to as a circuit connecting material such as ACF) or an insulating adhesive film (hereinafter referred to as NCF). In the case of connecting a printed wiring board, a glass substrate for LCD, a substrate such as a flexible printed circuit board, or a semiconductor element such as an IC or an LSI, or a package, the ACF is disposed between the opposing electrodes, and is heated and added. Pressing, selectively connecting the electrodes or terminals to each other. That is, the ACF and the NCF show an anisotropic conductive connection that takes into consideration the electrical conductivity of the electrodes or the terminals and the insulation between the adjacent electrodes or terminals. In this way, the adhesive films have the functions of both electrical and mechanical connections (and subsequent) between the circuit board and the electronic components.

In the representative ACF and NCF, an adhesive component such as an epoxy resin adhesive or an acrylic adhesive is suitably used. For example, ACF is obtained by dispersing conductive particles which are blended in the above-mentioned adhesive component as needed. These adhesive films are produced by a state in which they are laminated on a support film such as a PET (polyethylene terephthalate) film. In addition, in order to protect the surface of the adhesive film from dust or the like in the external air, there is also a separate lamination on the main surface of the film opposite to the support film. In the case of a protective film (see, for example, Patent Document 1).

Fig. 4 shows a conventional example of a film for anisotropic conductive connection in which a three-layer structure of the above-mentioned support film, adhesive film, and protective film is laminated. Fig. 4 is a view showing an end portion in the longitudinal direction of a conventional film for an anisotropic conductive connection. The film 40 for the anisotropic conductive connection has a structure in which a support film 41, an adhesive film 42 such as ACF, and a protective film 43 are laminated in this order. The conventional anisotropic conductive connecting film 40 is obtained by laminating the above-mentioned respective films 41, 42 and 43 so as to have a predetermined length so as to be perpendicular to the lamination direction. Therefore, the end faces 4a in the longitudinal direction of the anisotropic conductive connecting film 40 are orthogonal to the lamination direction, and the end faces of the respective films 41, 42 and 43 are formed to have a uniform plane.

The connection of the circuit board of the anisotropic conductive connection film 40 or the electrode or the like in the electronic component using the three-layer structure as described above is generally performed in the following manner. First, the protective film 43 is peeled off by the anisotropic conductive connection film 40. Then, one of the main surfaces of the exposed adhesive film 42 is brought into contact with the surface of the substrate to be temporarily pressed, and the like. Thereafter, the support film 41 is peeled off and removed. Then, the other main surface of the exposed adhesive film 42 is brought into contact with the other surface of the object to be pressed, and heated in the lamination direction (main pressure bonding) to provide the circuit board or the like. The connection of the electrodes and the like is completed. The peeling removal of the protective film 43 is performed by peeling between the adhesive film 42 and the protective film 43 using, for example, a finger.

(Patent Document 1) Japanese Patent Laid-Open No. 2004-211017

However, in recent years, with the miniaturization of various electronic devices, circuit boards or electronic components provided in electronic devices have been gradually miniaturized. Therefore, the film of the ACF or the like needs to be thinned more narrowly as it is thinned.

However, as the thin film 40 for the anisotropic conductive connection shown in FIG. 4 is thinned and the film width is narrowed, it is gradually difficult to selectively peel off the protective film 43. In other words, the film 4 for the anisotropic conductive connection is formed as described above, so that when the film thickness is reduced or the film width is narrowed, only the protective film 43 and the film are peeled off by fingers or the like. 42 rooms have become more difficult.

Further, a method has been considered in which the adhesive tape is adhered to the main surface of the protective film 43 and the support film 41, and the protective film 43 is peeled off by stretching the layers. When peeling by this method, it is necessary to make the peeling strength between the support film 41 and the adhesive film 42 higher than the peeling strength between the protective film 43 and the adhesive film 42 to some extent. However, the peel strength of these films also depends on the constituent material of the adhesive film 42, and the constituent materials are determined depending on the use of the film 42. Therefore, there is a case where the above peel strength required for selectively removing the protective film 43 by using the method of using the adhesive tape is not obtained.

Therefore, the present invention has been made in view of the above circumstances, and it is an object of the invention to provide a film for anisotropic conductive connection which can selectively and selectively remove only one of the films of the film which is bonded to the film, and The reel body of the film for the anisotropic conductive connection.

In order to achieve the above object, the present invention provides a film for anisotropic conductive connection, comprising a film for a strip-shaped anisotropic conductive connection in which a first film, a film of a film, and a film of a second film are laminated in this order. The film is characterized in that the film has an intersection between the end surface of the second film in the longitudinal direction and the main surface of the film, and protrudes from a reference surface orthogonal to the main surface of the film.

In the case of the conventional anisotropic conductive connection film 40, it is substantially impossible to grasp only the protective film 43 without touching the adhesive film 42 and the support film 41. Therefore, it is extremely difficult to selectively peel off the protective film 43 of the anisotropic conductive connecting film 40 as described above.

On the other hand, since the film for anisotropic conductive connection of the present invention protrudes more than the above-mentioned reference surface, it is not necessary to grasp the second film by fingers or the like, and at least only the film can be grasped. Then, depending on the film to be picked up and the case, the first film is bent toward the first film side in the lamination direction, and the second film is bonded to the second film by the action of the bending elasticity of the second film. The films are forced in a direction in which they are stretched from each other. Thereby, the second film is peeled off from the end surface side in the longitudinal direction. Thereafter, the peeling portion of the second film is additionally grasped, or the adhesive tape adhered to the second film and the first film is stretched, and the film is stretched in a direction in which the film and the second film are separated from each other. Only the second film was peeled off.

It is preferable that the film for anisotropic conductive connection of the present invention further has an indicating means for indicating the end surface of the second film. Thereby, even if the film for anisotropic conductive connection is miniaturized, the end surface of the second film can be easily visually recognized, so that it is easier to grasp only the adhesive film or the like without touching the second film. As a result, the second film can be peeled off more reliably and easily.

Further, the present invention provides a reel body comprising: a winding core; and the above-described anisotropic conductive connecting film wound around the winding core. Since the film for anisotropic conductive connection pulled out by the reel body has the above-described configuration, it is possible to selectively and selectively remove only the second film.

According to the present invention, there is provided a film for anisotropic conductive connection which can selectively remove only one of the films of the film which is adhered to the film.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same components are denoted by the same reference numerals, and the description thereof will not be repeated. Further, the positional relationship such as up, down, left, right, and the like is based on the positional relationship shown in the drawing unless otherwise specified. Further, the illustrated size ratio is not limited to the illustrated ratio.

Fig. 1 is a view showing a preferred embodiment of the present invention in a mode A cross-sectional view of the end portion in the longitudinal direction of the film for an anisotropic conductive connection. The film 10 for anisotropic conductive connection according to the present embodiment includes a laminate 15 in which a support film 11 as a first film, a film 12, and a protective film 13 as a second film are laminated in this order. Further, the anisotropic conductive connecting film 10 is provided on the main surface of the protective film 13 opposite to the film 12, and includes an indicating means 18 for indicating the end surface 13a of the protective film 13.

The width of the film 10 for anisotropic conductive connection is preferably from 0.3 to 320 mm, more preferably from 0.5 to 10 mm. Thereby, the advantageous effect of selectively stripping and removing the protective film provided by the present invention can be more effectively achieved.

In the first embodiment, the end faces 11a, 12a, and 13a of the support film 11, the adhesive film 12, and the protective film 13 in the longitudinal direction L are formed in a plane parallel to the lamination direction S of the laminate 15. The end faces 11a of the support film 11 and the end faces 12a of the film 12 in the end faces are formed in a plane conforming to each other. Further, the support film 11 and the adhesive film 12 are more protruded than the end surface 13a of the protective film 13, and as a result, a part of the main surface 12b of the film 12 is exposed.

The end surface 13a of the protective film 13 is a plane that coincides with the reference surface 16 in the present invention, that is, the reference surface 16 has an intersection X of the protective film and an intersection X of the main surface 12b of the film 12, and Next, the major faces 12b of the film 12 are orthogonal faces. That is, the film 12 is then more prominent than the reference surface 16.

In the film 10 for anisotropic conductive connection of the present embodiment, since the film 12 is more protruded than the reference surface 16, it is not necessary to grasp with a finger or the like. The protective film 13 can selectively grasp only the support film 11 and the adhesive film 12. Then, the film 11 and 12 are grasped to support the film 11 side bending toward the lamination direction S of the laminate 15, that is, by the bending elasticity of the protective film 13, the films 11 and 12 and the protective film 13 are applied. Apply force in the direction of stretching. Thereby, the protective film 13 is peeled off from the side of the end face 13a. Thereafter, if the peeled portion of the protective film 13 or the like is grasped and stretched in a direction in which the films 11 and 12 and the protective film 13 are separated from each other, it is possible to selectively and selectively remove only the protective film 13 selectively.

Next, the main surface 12b of the film 12 is preferably exposed to such an extent that the film 12 and the support film 11 can be selectively grasped by fingers or the like. Specifically, the distance D between the end surface 13a of the protective film 13 and the end surface 12a of the film 12 is preferably 1 to 100 mm, preferably 5 to 80 mm, and more preferably 10 to 50 mm. When the distance D is less than 1 mm, there is a tendency that it is difficult to selectively grasp the support film 11 and the film 12 . On the other hand, when the distance D exceeds 100 mm, the ease of peeling removal of the protective film 13 hardly changes, but there is a tendency that the exposed portion of the surface of the adhesive film 12 to be protected is increased, and the loss of the film 12 tends to increase.

The support film 11 may be a single layer or a laminate of two or more layers. The support film 11 is preferably one or more selected from the group consisting of a polyethylene terephthalate (PET) film, an oriented polypropylene (OPP) film, a polyethylene (PE) film, and a polyimide film. film. Among these, a PET film and/or an OPP film is preferable, and a PET film is more preferable from the viewpoint of high heat resistance and cost reduction.

Further, the support film 11 may be a main surface on which the side of the film 12 is provided by a release treatment agent as needed, or may be a roughened surface on the main surface thereof. Examples of the release treatment agent include anthrone, silicone alkyd, Amino-alkyd, alkyl alkyd, and melamine. Further, the support film 11 may be one in which a main surface is coated with a polymer or the like. These treatments may be used alone or in combination of two or more.

Next, the film 12 is obtained by applying an adhesive composition on a support substrate and drying it. The adhesive film 12 can also be formed on the support film 11 by applying an adhesive composition on the main surface of the support film 11 and drying it. Alternatively, the film obtained by applying and drying the adhesive composition on the support substrate different from the support film 11 may be laminated on the support film after being peeled off from the support substrate. The surface is formed on the support film 11.

The film 12 may be a single layer or a laminate having two or more layers. At this time, the film 12 is obtained by separately forming a film which is formed as described above by using a film formed as described above as a base layer. Alternatively, the adhesive film formed on the support film 11 as described above and the adhesive film formed on the protective film 13 in the same manner may be pressed against each other.

The adhesive composition which is the raw material of the film 12 is preferably an anisotropic conductive connection. Therefore, the adhesive composition may be a thermoplastic resin, a radically polymerizable compound, and a radical polymerization initiator. Alternatively, the adhesive composition may also contain a thermoplastic resin, heat A curable resin and a latent hardener. Each component contained in the above-mentioned adhesive composition may be contained in a so-called anisotropic conductive adhesive known in the art.

The above-mentioned adhesive composition may or may not contain the same conductive particles as those contained in a conventional anisotropic conductive adhesive. The adhesive film 12 formed of the adhesive composition containing conductive particles selectively connects the electrodes and/or the terminals facing each other via the conductive particles, and then includes a substrate or a device of the members. The adhesive film 12 formed of the adhesive composition containing no conductive particles is in direct contact with the opposing electrodes and/or terminals, and then a substrate or device having the members is provided, thereby selectively connecting the films 12 Between the electrodes and / or terminals.

Further, the adhesive composition may contain components other than the above-described respective components, which may be contained in a conventional anisotropic conductive adhesive.

When the film 12 has a structure in which two or more layers are laminated, the layers may have the same composition or different compositions. That is, the composition of the adhesive composition as a raw material of each layer may be the same or different from each other, and may be provided with both a layer containing conductive particles and a layer not containing conductive particles. For example, when the adhesive film 12 has a structure in which two layers are laminated, the layer on the side of the support film 11 may be a layer containing no conductive particles, and the layer on the side of the protective film 13 may be a layer containing conductive particles.

The protective film 13 may be a single layer or a laminate having two or more layers. In terms of the protective film, it is preferably provided, for example, selected from the group consisting of polyethylene terephthalate (PET) film, oriented polypropylene (OPP) film, polyethylene (PE) film, and polyimide film. More than one type of thin membrane. Among these, from the viewpoint of high flexural elasticity and cost reduction, an OPP or PET film is most suitable, and a PET film is more preferable.

In order to arrange the protective film 13 on the adhesive film 12, a series of methods of laminating the protective film 13 on the surface of the film 12 by a laminator or the like are additionally employed. Alternatively, it may be obtained by pressure-bonding the adhesive film formed on the support film 11 as described above and the adhesive film formed on the protective film 13 in the same direction.

The protective film 13 may be surface-treated with a release agent as needed, or the surface may be roughened. In the case of the release treatment agent, a series of oxime, anthraquinone acid, amino alkyd, alkyl alkyd, melamine and the like are mentioned. Further, the surface of the protective film 13 may also be coated with a polymer or the like. These systems may be used alone or in combination of two or more.

In order to make the support film 11 and the film 12 more prominent than the reference surface 16, the series of selective protective films 13 are selectively selected after obtaining the laminate of the support film 11, the film 12 and the protective film 13. The method of cutting the ends. Alternatively, after the laminate of the support film 11 and the adhesive film 12 is formed, the protective film 13 is placed in such a manner that a part of the main surface 12b of the film 12 is exposed in advance and laminated.

Further, the difference between the peeling strength between the support film 11 and the adhesive film 12 and the peel strength between the protective film 13 and the adhesive film 12 is preferably 0.001 to 10 N/m. The film 10 for anisotropic conductive connection is used to selectively peel off the protective film 13 and to support the ratio between the film 11 and the film 12 It is preferable that the peeling strength between the protective film 13 and the film is stronger. On the other hand, in consideration of peeling off the support film 11 after the adhesive film 12 is pressure-bonded to a substrate such as a circuit board, the peeling strength between the object and the film 12 is higher than that between the support film 11 and the film 12 It is better. If these factors are taken into consideration, the difference in peel strength within the above numerical range is preferred.

In the conventional film for anisotropic conductive connection, when the peel strength difference is within the numerical range, it is difficult to selectively remove only the protective film. However, according to the present invention, in the anisotropic conductive connecting film 10 as described above, it is also possible to selectively and selectively remove only the protective film 13 selectively.

Here, the peel strength in the present invention is measured by a rheometer.

The peel strength difference described above can be adjusted within the above numerical range by adjusting the peel strength between the support film 11 and the adhesive film 12 and/or the peel strength between the protective film 13 and the adhesive film 12 as follows. Specifically, in order to increase the peel strength, the content of the resin (thermoplastic resin) in the adhesive composition as the raw material of the film 12 is reduced, or the glass transition temperature (Tg) of the resin is lowered, or the radical is increased. The content of the polymerizable compound or the thermosetting resin or the surface of the support film 11 and the protective film 13 may be roughened. Alternatively, in order to increase the peel strength, when the film 12 contains conductive particles or insulating solid particles, the content of the film may be reduced. Alternatively, in order to reduce the peel strength, the release film may be used to support the film 11 or The protective film 13 may be subjected to surface treatment or the thickness of the films may be reduced.

The thickness of the support film 11, the adhesive film 12, and the protective film 13 is not particularly limited as long as it is adjusted depending on the use or the like. However, as described above, the thicknesses of the support film 11 and the protective film 13 are preferably adjusted so that the difference in the tensile elongation of the average unit width becomes small, and the peel strength difference is adjusted within the above numerical range. Suitable.

The indicating means 18 is for indicating the end face 13a of the protective film 13. In particular, when the protective film 13 is transparent or translucent, it is difficult to visually confirm the end face 13a thereof. Therefore, if the position of the end surface 13a can be confirmed by the indicating means 18, the peeling removal process of the protective film 13 can be performed more easily. The indicator means 18 may be visually confirmed, for example, a black strip-shaped member, and the longitudinal direction axis is parallel to the end surface 13a of the protective film 13, and it is preferable to provide it in the position shown in the figure.

The anisotropic conductive connecting film 10 of the present embodiment is wound around a winding core (not shown) to form a reel body. By forming the reel body as described above, the handleability of the anisotropic conductive connection film 10 is improved.

Fig. 2 is a cross-sectional view showing the end portion in the longitudinal direction of the film for an anisotropic conductive connection according to a preferred embodiment of the present invention. The anisotropic conductive connection film 20 of the present embodiment includes a laminate 25 in which the support film 21, the adhesive film 22, and the protective film 23 are sequentially laminated.

In the second embodiment, the end faces 21a, 22a, and 23a of the support film 21, the adhesive film 22, and the protective film 23 in the longitudinal direction L are formed in a plane parallel to the lamination direction S of the laminate 25. Support film 11 system ratio Then, the end face 22a of the film 22 is more protruded, and then the film 22 is more protruded than the end face 23a of the protective film 23. As a result, a part of the main surface 21b of the support film 21 and the main surface 22b of the subsequent film 22 are exposed.

The end surface 23a of the protective film 23 is formed to face the reference surface 26 of the present invention, and the reference surface 26, that is, the intersection portion 23a of the protective film 23 and the intersection X of the main surface 22b of the film 22, Further, it faces a plane orthogonal to the main surface 22a of the film 22. That is, the film 22 is then more prominent than the reference surface 26.

Further, the end surface 22a of the film 22 is formed to face the reference surface 27, that is, the reference surface 27, that is, the intersection portion Y of the end surface 22a of the film 22 and the main surface 21b of the support film 21 in the plane, and The main surface 21b of the support film 21 has orthogonal faces. That is, the support film 21 is more prominent than the reference surface 27.

Since the film 22 for the anisotropic conductive connection of the present embodiment protrudes more than the reference surface 26, the protective film 23 can be selectively grasped only by grasping the protective film 23 with a finger or the like, and only the support film 21 and the film 22 can be selectively grasped. . Then, when the film 21 and 22 which are grasped are bent toward the film 21 side in the lamination direction S of the laminate 25, the films 21 and 22 and the protective film are oriented by the bending elasticity of the protective film 23. 23 Apply force in the direction of stretching. Thereby, the protective film 23 is peeled off from the end surface 23a side. Thereafter, if the peeled portion or the like of the protective film 23 is additionally gripped and stretched in a direction in which the films 21 and 22 and the protective film 23 are separated from each other, it is possible to selectively and selectively remove only the protective film 23 by peeling off.

Further, the anisotropic conductive connecting film 20 of the present embodiment is Then, the film 21 protrudes more than the reference surface 27, so that the support film 21 can be selectively grasped only without grasping the protective film 23 and the film 22 with a finger or the like. Then, when the gripping support film 21 is bent toward the film 21 side in the lamination direction S of the laminate 25, the film 21 and 22 and the protective film 23 are pulled toward each other by the bending elasticity of the protective film 23. Apply force in the direction of extension. Thereby, the protective film 23 is peeled off from the end surface 23a side. Thereafter, if the peeled portion or the like of the protective film 23 is additionally gripped and stretched in a direction in which the films 21 and 22 and the protective film 23 are separated from each other, it is possible to selectively and selectively remove only the protective film 23 by peeling off. In particular, when the peeling strength between the support film 21 and the adhesive film 22 is larger than the peel strength between the protective film 23 and the adhesive film 22, the peeling removal can be performed more reliably.

It is preferable that the main surface 21b of the support film 21 and the main surface 22b of the adhesive film 22 are exposed so that the support film 21 and the film 22 can be selectively grasped by a finger or the like. Specifically, the distance D1 between the end surface 22a of the film 22 and the end surface 21a of the support film 21 is preferably 1 to 100 mm, preferably 5 to 80 mm, and more preferably 10 to 50 mm. Further, the distance D2 between the end surface 23a of the protective film 23 and the end surface 22a of the film 22 is preferably 10 to 200 cm, preferably 50 to 150 cm.

The other technical contents of the present embodiment are the same as those of the first embodiment.

Fig. 3 is a cross-sectional view showing the end portion in the longitudinal direction of the film for an anisotropic conductive connection according to a preferred embodiment of the present invention. Real The film 30 for anisotropic conductive connection is provided with a laminate 35 in which the support film 31, the film 32, and the protective film 33 are sequentially laminated.

In the third embodiment, the end faces 31a, 32a, and 33a of the support film 31, the adhesive film 32, and the protective film 33 in the longitudinal direction L are formed to be inclined with respect to the lamination direction S of the laminate 35. This inclination is formed such that the support film 31 protrudes more than the end surface 32a of the film 32, and then the film 32 is protruded more than the end surface 33a of the protective film 33.

The end surface 33a of the protective film 33 is formed to face the reference surface 36 of the present invention, and the reference surface 36 has an intersection X between the end surface 33a of the film 33 and the main surface 32b of the film 32 in the plane. Further, it faces a plane orthogonal to the main surface 32b of the film 32. That is, the film 32 is then more prominent than the reference surface 36.

Then, the end surface 32a of the film 32 is formed to face the reference surface 37, that is, the reference surface 37, that is, the intersection Y of the end surface 33a of the film 32 and the main surface 31b of the support film 31, and the support film. The main faces 31b of 31 are orthogonal faces. That is, the support film 31 is more protruded than the reference surface 37.

In the film for anisotropic conductive connection 30 of the present embodiment, since the adhesive film 32 protrudes more than the reference surface 36, it is possible to selectively grasp only the support film 31 and the adhesive film without grasping the protective film 33 with a finger or the like. 32. Next, when the film 31 and 32 are grasped, the film 31 side is bent toward the lamination direction S of the laminate 35, that is, by the bending elasticity of the protective film 33, toward the films 31 and 32 and the protective film. 33 pull each other Apply force in the direction of extension. Thereby, the protective film 33 is peeled off from the side of the end surface 33a. After that, if the peeled portion of the protective film 33 or the like is grasped and stretched in a direction in which the films 31 and 32 and the protective film 33 are separated from each other, it is possible to selectively and selectively remove only the protective film 33.

Further, in the film for anisotropic conductive connection 30 of the present embodiment, since the support film 31 protrudes more than the reference surface 37, it is possible to selectively grasp only the support film 33 without grasping the protective film 33 and the adhesive film 32 with a finger or the like. Film 31. Then, if the grasped support film 31 is bent toward the film 31 side in the lamination direction S of the laminate 35, that is, by the bending elasticity of the protective film 33, the films 31 and 32 and the protective film 33 are pulled toward each other. Apply force in the direction of extension. Thereby, the protective film 33 is peeled off from the side of the end surface 33a. Thereafter, the peeling portion or the like of the protective film 33 is additionally gripped, and the film 31 and 32 are stretched in a direction in which the protective film 33 is separated from each other, so that only the protective film 33 can be selectively and selectively removed. In particular, when the peeling strength between the support film 31 and the adhesive film 32 is larger than the peel strength between the protective film 33 and the adhesive film 32, the peeling removal can be performed more reliably.

It is preferable that the inclination of the end face is exposed to such an extent that the support film 31 and the film 32 can be selectively grasped by a finger or the like. Specifically, the distance D1 between the end surface 33a of the protective film 33 and the intersection X of the main surface 32b of the film 32, and the intersection D of the end surface 32a of the film 32 and the main surface 31b of the support film 31 is preferably It is preferably 1 to 100 mm, preferably 5 to 80 mm, and preferably 10 to 50 mm. Further, the intersection of the end surface 32a of the film 32 with the main surface 31b of the support film 31 and the lower end portion of the end surface 31a of the support film 31 are provided. The distance D2 between Z is preferably from 1 mm to 200 cm, and is preferably inclined from 5 mm to 150 cm.

The other technical contents of the present embodiment are the same as those of the first embodiment.

The above is a description of the preferred embodiments of the present invention, but the present invention is not limited to the above embodiments. The present invention may be variously modified without departing from the spirit and scope of the invention.

For example, in the second and third embodiments of the present invention, as in the first embodiment, an instruction means may be provided on the main surface on the side opposite to the film side of the protective film. In the third embodiment, in order to indicate the lower end (X) of the end surface 33a of the protective film 33, an indication means may be provided on the end surface 33a. Further, the indicating means can also be directly written on the protective film using an oily ink or the like.

Further, instead of the indicating means, the end surface of the protective film may be visually confirmed by coloring a part or all of the protective film. Alternatively, when the protective film is a polyethylene terephthalate film, the end face can be visually confirmed by irradiating the protective film with ultraviolet rays.

10, 20, 30, 40‧‧‧ anisotropic conductive film

11, 21, 31, 41‧‧‧ Support film

4a, 11a, 12a, 13a, 21a, 22a, 23a, 31a, 32a, 33a‧‧‧ end faces

12, 22, 32, 42‧‧‧ followed by film

12b, 21b, 22b, 32b‧‧‧ main faces

13, 23, 33, 43‧ ‧ protective film

15, 25, 35‧‧ ‧ laminate

16, 26, 27, 36, 37‧‧ ‧ datum

18‧‧‧Instructions

D, D1, D2‧‧‧ distance

X‧‧‧Intersection

Y‧‧‧Intersection

Z‧‧‧Bottom

Fig. 1 is a schematic cross-sectional view showing a part of the film for anisotropic conductive connection according to the first embodiment of the present invention.

Fig. 2 is a schematic cross-sectional view showing a part of the film for anisotropic conductive connection according to the second embodiment of the present invention.

Figure 3 is a diagram showing the anisotropic conductive connection of the third embodiment of the present invention. A schematic sectional view of a portion of the film.

Fig. 4 is a schematic cross-sectional view showing a part of a conventional film for anisotropic conductive connection.

10‧‧‧Amorphous film for conductive connection

11‧‧‧Support film

End faces 11a, 12a, 13a‧‧

12‧‧‧Next film

12b‧‧‧Main face

13‧‧‧Protective film

15‧‧‧Laminated body

16‧‧‧ datum

18‧‧‧Instructions

D‧‧‧Distance

X‧‧‧Intersection

Claims (23)

A film for an anisotropic conductive connection, comprising a film for an anisotropic conductive connection in which a first film, a film of a film, and a film of a second film are laminated in this order, wherein the anisotropy is At least one end portion of the longitudinal direction of the film for electrically conductive connection: the adhesive film protrudes from the reference surface, and the reference surface has an end surface in the longitudinal direction of the second film and a main surface of the adhesive film in the surface The intersection portion is orthogonal to the main surface of the adhesive film, and a part of the main surface of the adhesive film is exposed. The film for an anisotropic conductive connection according to the first aspect of the invention, further comprising an indicating means for indicating the end surface of the second film. The film for an anisotropic conductive connection according to the second aspect of the invention, wherein the indication means is an indication means that can be visually confirmed. The film for anisotropic conductive connection according to the first aspect of the invention, wherein the width of the film for the heteroconductive conductive connection is 0.3 to 320 mm. The film for anisotropic conductive connection according to the first aspect of the invention, wherein the end surface of the first film in the longitudinal direction and the long side of the film are formed on the end portion of the film for anisotropic conductive connection. The end faces of the directions are mutually uniform planes. The film for an anisotropic conductive connection according to the first aspect of the invention, wherein the aforesaid end portion of the anisotropic conductive connecting film is as described above The end surface in the longitudinal direction of the first film, the end surface in the longitudinal direction of the film, and the end surface in the longitudinal direction of the second film are formed to be parallel to the lamination direction of the laminate. The film for an anisotropic conductive connection according to the first aspect of the invention, wherein the end surface of the second film and the reference surface are aligned. The film for anisotropic conductive connection according to claim 1, wherein the first film contains a film selected from the group consisting of polyethylene terephthalate film, alignment polypropylene film, polyethylene film, and polyimide film. One or more types of films in a group. The film for an anisotropic conductive connection according to the first aspect of the invention, wherein the adhesive film is a single layer. The film for an anisotropic conductive connection according to the first aspect of the invention, wherein the adhesive film has a structure in which two or more layers are laminated. The film for an anisotropic conductive connection according to the first aspect of the invention, wherein the adhesive film is formed of an adhesive composition which can be electrically conductively connected. The film for an anisotropic conductive connection according to the eleventh aspect of the invention, wherein the adhesive composition contains a thermoplastic resin, a radical polymerizable compound, and a radical polymerization initiator. The film for an anisotropic conductive connection according to claim 11, wherein the adhesive composition contains a thermoplastic resin, a thermosetting resin, and a latent curing agent. Such as the application of patent scope 11th of the anisotropic conductive connection thin A film in which the above-mentioned adhesive composition contains conductive particles. The film for anisotropic conductive connection according to claim 1, wherein the second film contains a film selected from the group consisting of polyethylene terephthalate film, oriented polypropylene film, polyethylene film, and polyimide film. One or more types of films in a group. The film for anisotropic conductive connection according to the first aspect of the invention, wherein the peel strength between the first film and the adhesive film is stronger than the peel strength between the second film and the adhesive film. The film for anisotropic conductive connection according to the first aspect of the invention, wherein a difference between a peel strength between the first film and the adhesive film and a peel strength between the second film and the adhesive film is 0.001 to 10 N/ m. The film for an anisotropic conductive connection according to any one of the first aspect of the invention, wherein the film of the anisotropic conductive connection is protruded from the second reference surface at the end portion of the film for anisotropic conductive connection. The second reference surface has an intersection between an end surface of the longitudinal direction of the adhesive film and a main surface of the first film in the plane, and is orthogonal to the main surface of the first film. The film for an anisotropic conductive connection according to claim 18, wherein a part of the main surface of the first film is exposed at the end portion of the film for anisotropic conductive connection. The film for anisotropic conductive connection according to claim 18, wherein the end surface of the adhesive film and the second reference surface are aligned. The film for an anisotropic conductive connection according to claim 18, wherein a distance between the end surface of the first film and the end surface of the adhesive film is 10 to 200 cm. The film for anisotropic conductive connection according to claim 18, wherein a distance between the end surface of the first film and the end surface of the adhesive film is 50 to 150 cm. A reel body comprising: a winding core, and a film for an anisotropic conductive connection wound in the winding core according to any one of claims 1 to 22.