JP2020017605A - Conductive connection material and method for manufacturing the same - Google Patents

Abstract

To provide a conductive connection material which can omit thermal compression bonding in connection of first and second wiring materials, and can appropriately connect the first and second wiring materials, for instance, even when there exists a step between the first and second wiring materials, and a method for manufacturing the conductive connection material.SOLUTION: A conductive connection material 10 that electrically connects first and second wiring materials 1 and 1A includes a base material adhesion layer 11 interposed between the first and second wiring materials 1 and 1A, and a conductive pattern layer 14 which is laminated on the base material adhesion layer 11 and is electrically connected to connection terminals 5 and 5A of the first and second wiring materials 1 and 1A, in which the base material adhesion layer 11 includes a resin film 12 that is interposed between the first and second wiring materials 1 and 1A and is bendable and an adhesive 13 which is laminated on the resin film 12 and can be bonded at a normal temperature, and the conductive pattern layer 14 is transferred and laminated onto the adhesive 13. The first and second wiring materials 1 and 1A are conductively connected with the conductive connection material 10 only by pressurization, which can prevent deformation of the resin film 12.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a conductive connecting material used for connection of a vehicle-mounted device, a home appliance, an air conditioner, a computer device, an information communication device, and the like, and a method of manufacturing the same.

  Conventionally, when the first and second wiring members 1 and 1A are electrically connected to each other, as shown in FIG. 9, a difference that can contribute to miniaturization and thinning while achieving both conductivity and insulation. An isotropic conductive film (ACF) 30 is used (see Patent Documents 1 and 2).

  The first wiring member 1 is made of, for example, a printed circuit board (PCB), a flexible printed wiring board (FCP), or the like, and a wiring pattern 3 is laminated on a base material 7. 6 and the remaining portion of the wiring pattern 3 exposed from the insulating protective layer 6 forms the connection terminal 5 for connection. On the other hand, the second wiring member 1A is made of, for example, a flexible printed wiring board (FCP) or the like, and a wiring pattern 3A is laminated on a flexible insulating film 8, and a part of the wiring pattern 3A is formed of an insulating protective layer. 6A, the remaining portion of the wiring pattern 3A exposed from the insulating protective layer 6A forms a connection terminal 5A for connection and faces the connection terminal 5 of the first wiring member 1 from below.

  The anisotropic conductive film (ACF) 30 includes a resin film which is easily softened by heating, and is formed by applying an adhesive in which a large number of conductive particles are dispersed to the resin film. It is electrically connected to the connection terminals 5.5A of the first and second wiring members 1.1A. The resin film is formed of polyethylene terephthalate resin, polycarbonate resin, acrylic resin, or the like, and is interposed between the connection terminals 5, 5A of the first and second wiring members 1.1A. As the adhesive, an epoxy adhesive having excellent mechanical strength and adhesiveness is used.

  When the first and second wiring members 1.1A are electrically connected using such an anisotropic conductive film 30, the first and second wiring members 1.1A are arranged vertically. When the anisotropic conductive film 30 is positioned and sandwiched between the connection terminals 5 and 5A, and heated and pressed by a heater head and thermocompression-bonded, a large number of conductive particles of the anisotropic conductive film 30 overlap to form a conductive path. Is formed, the first and second wiring members 1.1A can be electrically connected.

JP 2010-244776 A JP 2015225565A

  The conventional anisotropic conductive film 30 is configured as described above, and can be reduced in size and thickness. However, the resin film is a resin film weak to heat, and the adhesive is an epoxy adhesive having a high melting temperature. In this case, a problem arises in that the resin film is deformed and thermocompression bonding becomes difficult. A heater head is used for thermocompression bonding of the anisotropic conductive film 30. If a step is present between the first and second wiring members 1 and 1A (see FIG. 10), a heater head is used. Since the anisotropic conductive film 30 does not sufficiently follow the first and second wiring members 1.1A, there is a problem that the electrical connection between the first and second wiring members 1.1A is hindered. .

  The present invention has been made in view of the above, it is possible to omit the thermocompression bonding of the first and second wiring members, even if there is a step between the first and second wiring members, It is an object of the present invention to provide a conductive connecting material that can appropriately connect the first and second wiring members and a method of manufacturing the conductive connecting material.

In the present invention, in order to solve the above problems, the first, the second wiring member is to electrically connect,
A base material adhesive layer interposed between the first and second wiring members, and a conductive pattern laminated on the base material adhesive layer and electrically connected to the conductive connection portion of the first and second wiring members. Layers and
The base material adhesive layer includes a bendable resin base material interposed between the first and second wiring members, and a normal temperature bondable adhesive laminated on the resin base material. A conductive pattern layer is laminated thereon.

  It should be noted that a protection tape that is attached to an opposing portion that opposes through the gap between the first and second wiring members can be included.

Further, the first wiring member has a base material facing the second wiring member, a wiring pattern laminated on the base material, and an insulating protective layer laminated on the base material and covering a part of the wiring pattern. Containing, the substrate is formed of a thermoplastic resin having a deflection temperature under load of 180 ° C. or less, and the remaining portion of the wiring pattern exposed from the insulating protective layer is formed in the conductive connection portion for the conductive pattern layer,
The second wiring member includes a base material facing the first wiring member, a wiring pattern laminated on the base material, and an insulating protection layer laminated on the base material and covering a part of the wiring pattern. The remaining portion of the wiring pattern exposed from the insulating protective layer can be formed in the conductive connection portion for the conductive pattern layer.

Further, it is preferable that the adhesive of the base material adhesive layer is acrylic.
Further, the adhesive of the base material adhesive layer is preferably laminated on the resin base material with a thickness of 25 μm or more and formed to have a length of 15 mm or more.
The adhesive of the base material adhesive layer is preferably laminated on the resin base material with a thickness of 75 μm or more and formed to have a length of 5 mm or more.
Further, the width of the conductive pattern layer can be changed according to the width of the conductive connection portion of the first and second wiring members.

Further, in order to solve the above problems, the present invention provides a method for producing a conductive connecting material according to any one of claims 1 to 7,
A conductive pattern layer is formed by applying a conductive material on the release-treated surface of the release material and drying and curing the applied material. And separating the release material and transferring the conductive pattern layer from the release material to the adhesive of the base material adhesive layer.

  Here, the first and second wiring members in the claims may be formed two-dimensionally or three-dimensionally, but it is preferable that the first wiring member is formed three-dimensionally and three-dimensionally. The first wiring member can be a part of an electric device, an electronic device, a precision device, or the like, for example, a part of a capacitance sensor, a three-dimensional circuit board, or the like. The second wiring member includes at least parts (for example, terminal parts) such as a printed circuit board and a flexible printed wiring board. The second wiring member may include a terminal layer that covers an end of the wiring pattern, in addition to the base material, the wiring pattern, and the insulating protective layer.

  The base material of the first and second wiring members includes at least a resin sheet or a resin film. The resin substrate of the substrate adhesive layer includes at least a resin sheet or a resin film. The adhesive includes a normal temperature bonding adhesive and a normal temperature bonding adhesive.

  According to the present invention, since the first and second wiring members are electrically connected to each other by the conductive connecting member by applying pressure, it is possible to prevent the resin base material of the base material adhesive layer from being deformed. Further, since heating is not required when the first and second wiring members are connected, the heater head and the like can be omitted.

  According to the present invention, the substrate adhesive layer, the first, the bendable resin base material interposed between the second wiring member, and the room temperature bonding adhesive that is laminated on the resin base material Since the conductive pattern layer is laminated on the adhesive by transfer or the like, there is an effect that the thermocompression bonding can be omitted for connecting the first and second wiring members. Further, even if there is a step or the like between the first and second wiring members, there is an effect that the first and second wiring members can be appropriately connected.

According to the second aspect of the present invention, since the protective tape is attached to the opposing portions of the first and second wiring members, the connection strength and the electrical conductivity of the first and second wiring members are improved and stabilized. Can be.
According to the third aspect of the invention, the three-dimensional formation of the first wiring member can provide at least a sense of quality, a sense of quality, and the like.
According to the fourth aspect of the present invention, since the adhesive is acrylic, excellent flexibility and transferability can be obtained, and the conductive pattern layer can be easily transferred to the adhesive.

According to the fifth aspect of the present invention, since the adhesive is laminated on the resin base material with a thickness of 25 μm or more, and the adhesive is formed to have a length of 15 mm or more, the conductive pattern layer has good electrical conductivity. Can be provided.
According to the invention as set forth in claim 6, the adhesive is laminated on the resin base material to a thickness of 75 μm or more, and the adhesive is formed to a length of 5 mm or more. Can be provided.

  According to the invention as set forth in claim 7, even if the widths of the conductive connecting portions of the first and second wiring members are different, the wiring pattern of the first wiring member, the conductive pattern layer of the conductive connecting material, and the The wiring pattern of the second wiring member can be appropriately connected, and excellent electrical conductivity can be expected.

  According to the eighth aspect of the present invention, since the conductive pattern layer is formed by applying the conductive pattern layer to the release-treated surface of the release material, the conductive pattern layer can be made substantially flush, and a part of the surface of the conductive pattern layer It is possible to prevent the remaining portion and the remaining portion from having irregularities and becoming uneven. In addition, since the conductive pattern layer is transferred to the adhesive of the base material adhesive layer instead of being printed, the adhesive force of the adhesive does not hinder the lamination of the conductive pattern layer, and the adhesive of the base material adhesive layer The conductive pattern layer can be appropriately formed.

It is a sectional side view showing typically the embodiment of the conductive connection material concerning the present invention. 1 is a sectional end view schematically showing an embodiment of a conductive connecting material according to the present invention. FIG. 2 is a perspective explanatory view schematically showing a state before conducting and connecting the first and second wiring members by the conductive connecting material in the embodiment of the conductive connecting material according to the present invention. It is a perspective explanatory view showing typically the state after conducting connection of the 1st and 2nd wiring materials in the embodiment of the conductive connection material concerning the present invention by the conductive connection material. It is explanatory drawing which shows typically embodiment of the manufacturing method of the conductive connection material which concerns on this invention, (a) is a perspective view which shows the state which forms a conductive pattern layer in the release processing surface of a peeling film, (b) The figure is a perspective view showing a state in which the adhesive of the base material adhesive layer is adhered to the release-treated surface of the release film by applying pressure, and a laminate is formed. FIG. FIG. 4D is a perspective view showing a state in which the release film is peeled off, and FIG. 4E is a perspective view showing a manufactured conductive connecting material. It is a sectional side view showing typically a 2nd embodiment of a conductive connection material concerning the present invention. It is a plane explanatory view showing typically a 3rd embodiment of the conductive connecting material concerning the present invention. It is a plane explanatory view showing typically the 1st wiring material in the example of the conductive connecting material concerning the present invention. It is sectional explanatory drawing which shows the connection structure of the 1st, 2nd wiring material and anisotropic conductive film in the prior art. FIG. 4 is an explanatory diagram illustrating a case where a step exists between first and second wiring members.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 to 5, a conductive connecting member 10 according to the present embodiment includes first and second wiring members 1 and 1A. It is a tape-shaped connecting material for electrical connection, and a base material adhesive layer 11 interposed between the first and second wiring members 1 and 1A, and a first, A conductive pattern layer 14 electrically connected to the connection terminals 5.5A of the second wiring member 1.1A, and the conductive pattern layer 14 is transferred to the adhesive 13 of the base material adhesive layer 11 instead of printing. It is formed by lamination.

  As shown in FIGS. 1, 3, and 4, a first wiring member 1 includes a base member 2 which horizontally faces and opposes a second wiring member 1A, and a wiring pattern laminated on the base member 2. 3 and an insulating protective layer 6 laminated on the base material 2 and covering a part of the wiring pattern 3, and are arranged downward. The base material 2 is preferably a thermoplastic resin having a deflection temperature under load of 180 ° C. or less, specifically, a polyethylene terephthalate resin, a polybutylene terephthalate resin, and a polyethylene naphthalate having excellent dimensional stability, insulation, flexibility, and workability. It is three-dimensionally formed by advanced molding using a resin, a polycarbonate resin, a polyoxymethylene resin, a cycloolefin polymer resin, or the like.

  The wiring pattern 3 includes a plurality of wiring lines 4 arranged at predetermined intervals in the width direction of the substrate 2, and each of the wiring lines 4 is formed in an elongated line extending in the longitudinal direction of the substrate 2. The wiring line 4 is formed by printing a conductive material on the base material 2 and drying and curing the conductive material. The conductive material is prepared, for example, by blending an ink such as gold, silver, or copper with a thermosetting resin. Further, the printing method is not particularly limited, but a screen printing method that can be expected to have high accuracy is optimal. Most of the plurality of wiring lines 4 are partially covered with the insulating protective layer 6, and the remaining ends are exposed from the insulating protective layer 6. The ends exposed from the insulating protective layer 6 are electrically conductive patterns. The connection terminals 5 for the layer 14 are formed.

  Although not particularly limited, the insulating protective layer 6 is formed into a flat rectangular shape by, for example, printing an ultraviolet-curable resin on the base material 2 and drying and curing the resin, and covers a part of the plurality of wiring lines 4. To protect from external dust and liquid. The printing method is not particularly limited, but a screen printing method that can be expected to have high accuracy is optimal.

  As shown in FIGS. 1, 3, and 4, the second wiring member 1A is a planar rectangular base member 2A that faces the first wiring member 1 and collides horizontally, and is laminated on the base member 2A. Wiring pattern 3A and an insulating protection layer 6A laminated on the base material 2A and covering a part of the wiring pattern 3A, and are arranged downward. The base material 2A is an insulating film such as a polyethylene terephthalate resin, a polybutylene terephthalate resin, a polyethylene naphthalate resin, a polycarbonate resin, a polyoxymethylene resin, and a cycloolefin polymer resin having excellent dimensional stability, insulation properties, flexibility, and workability. Is raised. Further, when high molding workability is not required for the second wiring member 1A, an insulating film having heat resistance such as a polyimide resin may be used.

  The wiring pattern 3A includes a plurality of wiring lines 4A arranged at predetermined intervals in the width direction of the base material 2A, and each wiring line 4A is formed in an elongated line extending in the longitudinal direction of the base material 2A. The wiring line 4A is formed by printing a conductive material on the base material 2A and drying and curing the conductive material. The conductive material is prepared, for example, by blending an ink such as gold, silver, or copper with a thermosetting resin. The printing method is not limited, but a screen printing method, which can be expected to have high accuracy, is preferable. The plurality of wiring lines 4A are partially covered with the insulating protective layer 6A, and the remaining ends are exposed from the insulating protective layer 6A. The ends exposed from the insulating protective layer 6A are electrically conductive patterns. The connection terminal 5A for the layer 14 is formed.

  The insulating protective layer 6A is not limited, but is formed into a flat rectangular shape by, for example, printing and drying and curing an ultraviolet curable resin on the base material 2A, and covering a part of the plurality of wiring lines 4A. Protect from external dust and liquids. The printing method is not particularly limited, but a screen printing method that can be expected to have high accuracy is preferable.

  As shown in FIGS. 2 to 4, the base adhesive layer 11 of the conductive connecting material 10 has a bendable flat rectangular shape interposed between the connecting terminals 5 and 5A of the first and second wiring members 1 and 1A. It is formed to include a resin film 12 and an adhesive 13 that is laminated on the surface of the resin film 12 and adheres to the first and second wiring members 1.1A. As the resin film 12, a resin insulating film or the like similar to the base materials 2 and 2A of the first and second wiring members 1 and 1A is cut into a tape shape and used. When a high degree of moldability is not required for the conductive connecting material 10, a heat-resistant insulating film such as a polyimide resin is cut into a tape shape and used.

  Among these insulating films, a flexible insulating film made of a polyethylene terephthalate resin, a polycarbonate resin, or a polyetheretherketone resin having excellent dimensional stability, insulation properties and heat resistance is most suitable. Further, the thickness of the resin film 12 is preferably 25 μm or more and 200 μm or less, preferably 50 μm or more and 175 μm or less, more preferably 75 μm or more and 150 μm or less, from the viewpoint of securing flexibility and convenience in handling.

  The adhesive 13 is of a type that can be bonded at room temperature, for example, an acrylic or epoxy type, and is used for the base material 2.2A of the first and second wiring members 1.1A and the insulating protective layer 6.6A. Glued. The adhesive 13 may be an epoxy type or the like, but an acrylic type having excellent flexibility and transferability is optimal. The acrylic adhesive 13 is not particularly limited to a reactive type, a one-part type, a two-part type, etc., as long as the transfer of the conductive pattern layer 14 and the normal temperature bonding are possible.

  The adhesive 13 is laminated on the surface of the resin film 12 in a layer having a thickness of 25 μm or more, preferably 50 μm or more, more preferably 75 μm or more and 100 μm or less from the viewpoint of maintaining the conductivity of the conductive pattern layer 14. The length of the adhesive 13 is set to 5 mm or more, preferably 10 mm or more, more preferably 15 mm or more in order to maintain the conductivity of the conductive pattern layer 14.

  The conductive pattern layer 14 of the conductive connecting material 10 includes a plurality of conductive lines 15 arranged at predetermined intervals in the width direction of the adhesive 13, and each conductive line 15 is formed of a predetermined conductive material in the longitudinal direction of the resin film 12. Both ends of the conductive line 15 are connected to the first and second wiring members 1 and 1A as the connection lines 16 and the connection lines 4 and 4A and the connection terminals 5 and 5A, respectively. Conductively connected. The conductive material is prepared, for example, by blending an ink such as silver with a thermosetting resin. The conductive line 15 is formed to have a thickness of 10 μm or more, preferably 12 μm or more, more preferably 12 μm or more and 20 μm or less in order to achieve both conductivity and flexibility. The width is substantially the same as the width of the 1A wiring lines 4A.

  In the above configuration, when manufacturing the conductive connecting material 10, as shown in FIG. 5, first, a release film 20 is prepared as a release material, and a release process (non-silicone) of the release film 20 is performed. A conductive material is printed on the surface and dried and cured to form the conductive pattern layer 14 (see FIG. 5A). The release film 20 is not particularly limited. For example, a planar rectangular polyethylene terephthalate resin film having a thickness of 100 μm is used. Although the printing method is not limited, a screen printing method, which can be expected to have high accuracy, is desirable.

  When the conductive pattern layer 14 is formed on the release processing surface of the release film 20, the surfaces of the plurality of conductive lines 15 and the connection terminals 16 of the conductive pattern layer 14 can be flush with each other. It is possible to prevent the connection surfaces of 16 from becoming uneven and becoming irregular.

  Next, the adhesive 13 of the base material adhesive layer 11 is temporarily pressurized on the release treatment surface of the release film 20 without heating, and thereafter, is subjected to actual pressure without heating, and is adhered (see FIG. 5B). The adhesive 13 is partially filled between the plurality of conductive lines 15 of the conductive pattern layer 14 to form a laminate. After forming the laminate in this manner, the laminate is cut and adjusted to a predetermined size (see FIG. 5C), and then the release film 20 is peeled (see FIG. 5D). By this peeling, the conductive pattern layer 14 is directly transferred from the release treated surface of the release film 20 to the adhesive 13 of the base adhesive layer 11, and the transfer type conductive connecting material 10 can be manufactured (FIG. 5 (e)). )reference).

  At this time, since the conductive pattern layer 14 is transferred to the adhesive 13 of the base material adhesive layer 11 instead of being printed, the adhesive force of the adhesive 13 does not hinder the lamination of the conductive pattern layer 14. Therefore, the conductive pattern layer 14 can be appropriately laminated on the adhesive 13 of the base material adhesive layer 11.

  Next, when the first and second wiring members 1 and 1A are electrically connected using the conductive connecting member 10, the first and second wiring members 1 and 1A are arranged side by side and butted without gap. The conductive connecting material 10 is set between the first and second wiring members 1.1A, and the conductive pattern layer 14 of the conductive connecting material 10 is formed on the wiring patterns 3.3A of the first and second wiring members 1.1A. After the conductive connecting members 10 are temporarily pressurized, they may be pressurized by actual pressing. Then, the adhesive 13 of the base material adhesive layer 11 is firmly adhered to the first and second wiring members 1.1A, and the conductive pattern layer is connected to the connection terminals 5.5A of the first and second wiring members 1.1A. Since the fourteen conductive lines 15 and the connection terminals 16 are pressed against each other, the first and second wiring members 1.1A can be electrically connected to each other by the conductive connection member 10.

  According to the above, the first and second wiring members 1 and 1A are electrically connected to each other by the transfer-type conductive connecting material 10 only by applying pressure without using heating, so that the resin film 12 is prevented from being deformed. Can be. Further, since the heater head can be omitted when the first and second wiring members 1.1A are electrically connected, a step (see FIG. 10) and an angle between the first and second wiring members 1.1A can be omitted. Is present, the first and second wiring members 1.1A can be appropriately electrically connected. Further, the omission of the heater head does not require any special tool stand even if the crimping portion is three-dimensional. Further, unlike the anisotropic conductive film 30, the entire structure can be bonded, so that a strict alignment work can be omitted, and improvement in workability can be greatly expected.

  Next, FIG. 6 shows a second embodiment of the present invention. In this case, the first and second wiring members 1 and 1A are opposed to each other via a gap, and the first and second wiring members 1 and 1A are opposed to each other. A protective tape 21 opposing the conductive connecting member 10 from above is adhered to an opposing portion opposing the wiring member 1.1A via a gap.

The protective tape 21 is made of, for example, an acrylic adhesive, and is stretched and bonded between the ends of the base materials 2 and 2A of the first and second wiring members 1 and 1A. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.
In this embodiment, the same operation and effect as those in the above embodiment can be expected. Further, since the protective tape 21 is adhered to the opposing portions of the first and second wiring members 1 and 1A, the first and second wiring members are provided. It is clear that the connection strength and the electrical conductivity of the material 1.1A can be improved.

  Next, FIG. 7 shows a third embodiment of the present invention. In this case, the width of the conductive pattern layer 14 is set to the width of the connection terminal 5 of the first and second wiring members 1 and 1A. They are changed accordingly.

  The width of the conductive pattern layer 14, in other words, the width of the conductive line 15 or the connection terminal 16 is substantially the same when the width of the connection terminal 5.5A of the first and second wiring members 1.1A is small. When the width of the connection terminals 5 and 5A of the first and second wiring members 1 and 1A is large, they are formed to be substantially the same width. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.

  In this embodiment, the same operation and effect as those of the above embodiment can be expected, and the width of the conductive pattern layer 14 is adjusted according to the width of the connection terminals 5 and 5A of the first and second wiring members 1.1A. Therefore, even if there is a difference in the width of the connection terminals 5, 5A, the first wiring member 1, the conductive connection member 10, and the second wiring member 1A can be appropriately electrically connected.

  In the above embodiment, the wiring patterns 3.3A of the first and second wiring members 1.1A are a plurality of wiring lines 4.4A, but a combination of the plurality of wiring lines 4.4A and a plurality of lands. It is good. In addition, the second wiring member 1A is formed by the base material 2A, the wiring pattern 3A, and the insulating protection layer 6A, but is not limited thereto. The second wiring material 1A is formed of the base material 2A, the wiring pattern 3A, and the insulating protection layer 6A. Alternatively, a terminal layer that covers one end or the other end of the wiring pattern 3A may be added.

  Further, the insulating protective layers 6 and 6A of the first and second wiring members 1 and 1A may be insulating resin films. Further, although the conductive pattern layer 14 of the conductive connecting material 10 is a plurality of conductive lines 15, a combination of the plurality of conductive lines 15 and a plurality of lands can be used. Further, the conductive line 15 and the connection terminal 16 can be gradually widened or narrowed.

[Example 1]
Hereinafter, examples of the conductive connecting material according to the present invention and a method for manufacturing the conductive connecting material will be described. The first and second wiring members and the conductive connecting member are respectively manufactured, and the first and second wiring members are conductively connected by the conductive connecting member, and the thickness and length of the adhesive in the base material adhesive layer of the conductive connecting member. We examined about.

  First, in order to manufacture the first wiring member and the second wiring member shown in FIG. 8, a wiring pattern was formed by screen-printing a conductive material on the surface of the base material and drying and curing the conductive material. As the substrate, a 100 μm-thick polyethylene terephthalate resin film was used. The conductive material was prepared by blending a silver ink with a thermosetting resin. The wiring pattern was provided with a plurality of wiring lines, formed with a tail width of 15 mm, a width of 0.25 mm per wiring line, a thickness of 12 μm, and a pitch of 1 mm. After the wiring pattern is formed on the base material in this manner, an insulating protection layer is screen-printed on the surface of the base material using a UV-curable resin, and a part of the wiring pattern is covered with the insulating protection layer. Wiring materials were manufactured respectively.

  Next, in order to manufacture a conductive connection material, a release film is prepared as a release material, and a conductive material is screen-printed on the release-treated surface of the release film (non-silicone), which is dried and cured. Then, a conductive pattern layer having a plurality of conductive lines was formed. As the release film, a plane rectangular polyethylene terephthalate resin film having a thickness of 100 μm was used. The conductive material was prepared by blending a silver ink with a thermosetting resin.

Next, the adhesive of the base material adhesive layer was applied to the release-treated surface of the release film by applying a pressure of 60 kg / cm ² without heating to form a laminate. As the resin film of the substrate adhesive layer, a polyethylene terephthalate resin film having a thickness of 100 μm was employed. An acrylic adhesive was used as the adhesive for the base adhesive layer, and the thickness of the acrylic adhesive was adjusted to 25 μm. After the laminate is formed, the laminate is cut and adjusted to a predetermined size, and the release film is peeled to transfer the conductive pattern layer from the release-treated surface of the release film to the adhesive of the base material adhesive layer. A transfer type conductive connecting material was manufactured.

  Next, in order to electrically connect the first and second wiring members using the conductive connecting material, the first and second wiring members are arranged side by side and butted without gap, and between the first and second wiring members. Along with setting the conductive connecting material, the conductive pattern layer of the conductive connecting material is opposed to the connecting terminals of the first and second wiring members, and the conductive connecting material is temporarily pressurized and then fully pressurized and crimped. Then, the second wiring member was electrically connected with the conductive connecting member.

When electrically connecting with the conductive connecting material, the conductive connecting material is temporarily pressurized by cutting at the portion A in FIG. 8 and adjusting the distance between Bs indicated by arrows into three stages of lengths of 5 mm, 10 mm, and 15 mm, and 60 kg / The conductive connection material was connected by the main pressure at a pressure of ² cm ² .

  When the first and second wiring members are electrically connected by the conductive connection material, CY (70 ° C./90% RH × 2 h → movement 1 h → −20 ° C. × 2 h → movement 1 h) →), HH (60 ° C, 95% RH), TS (40 ° C x 30 minutes → move 2 minutes → 85 ° C x 30 minutes → move 2 minutes →), conduct an environmental test for 72 hours, and conduct electricity with conductive connecting material The results were collectively evaluated and examined in Table 1 in a XX system.

[Example 2]
An acrylic adhesive was employed as an adhesive for the base adhesive layer of the conductive connecting material, and the thickness of the acrylic adhesive was changed to 75 μm. The other parts were the same as in Example 1.
When the first and second wiring members are electrically connected by the conductive connection material, CY (70 ° C./90% RH × 2 h → movement 1 h → −20 ° C. × 2 h → movement 1 h) →), HH (60 ° C, 95% RH), TS (40 ° C x 30 minutes → move 2 minutes → 85 ° C x 30 minutes → move 2 minutes →), conduct an environmental test for 72 hours, and conduct electricity with conductive connecting material The results were collectively evaluated and examined in Table 1 in a XX system.

[Evaluation]
As a result of the study, it has been found that when the thickness of the adhesive of the base material adhesive layer of the conductive connection material is 25 μm, if the length is 15 mm or more, complete energization can be secured. It was also confirmed that when the thickness was 75 μm, the current could be maintained if the length was set to 5 mm or more.

  INDUSTRIAL APPLICABILITY The conductive connecting material according to the present invention and the method for manufacturing the same are used in the fields of manufacturing automotive equipment, music players, home appliances, air conditioners, portable equipment, computer equipment, housing equipment, information communication equipment, and the like.

DESCRIPTION OF SYMBOLS 1 1st wiring material 1A 2nd wiring material 2 Base material 2A Base material 3 Wiring pattern 3A Wiring pattern 4 Wiring line 4A Wiring line 5 Connection terminal (conductive connection part)
5A connection terminal (conduction connection part)
6 Insulation protection layer 6A Insulation protection layer 10 Conductive connecting material 11 Base adhesive layer 12 Resin film (resin base)
13 adhesive 14 conductive pattern layer 15 conductive line 16 connection terminal 20 release film (release material)
21 Protective tape

Claims (8)

A conductive connecting material for electrically connecting the first and second wiring members, and a base adhesive layer interposed between the first and second wiring members; 1, a conductive pattern layer electrically connected to the conductive connection portion of the second wiring member,
The base material adhesive layer includes a bendable resin base material interposed between the first and second wiring members, and a normal temperature bondable adhesive laminated on the resin base material. A conductive pattern material, wherein a conductive pattern layer is laminated on the conductive pattern layer.   2. The conductive connecting material according to claim 1, further comprising a protective tape attached to an opposing portion facing the first and second wiring members via a gap between the first and second wiring members. The first wiring member includes a base material facing the second wiring member, a wiring pattern laminated on the base material, and an insulating protective layer laminated on the base material and covering a part of the wiring pattern. The base material is formed of a thermoplastic resin having a deflection temperature under load of 180 ° C. or less, and the remaining portion of the wiring pattern exposed from the insulating protective layer is formed in the conductive connection portion for the conductive pattern layer,
The second wiring member includes a base material facing the first wiring member, a wiring pattern laminated on the base material, and an insulating protection layer laminated on the base material and covering a part of the wiring pattern. 3. The conductive connecting material according to claim 1, wherein a remaining portion of the wiring pattern exposed from the insulating protective layer is formed in a conductive connecting portion for the conductive pattern layer.   The conductive connecting material according to claim 1, 2 or 3, wherein the adhesive of the substrate adhesive layer is an acryl-based adhesive.   The conductive connecting material according to any one of claims 1 to 4, wherein the adhesive of the base material adhesive layer is laminated on the resin base material with a thickness of 25 µm or more and formed to have a length of 15 mm or more.   The conductive connecting material according to any one of claims 1 to 4, wherein the adhesive of the base material adhesive layer is laminated on the resin base material with a thickness of 75 µm or more and formed to a length of 5 mm or more.   7. The conductive connecting material according to claim 1, wherein the width of the conductive pattern layer is changed according to the width of the conductive connecting portion of the first and second wiring members.   A method for producing a conductive connecting material according to any one of claims 1 to 7, wherein a conductive pattern layer is formed by applying and drying and curing a conductive material on a release-treated surface of the release material. The conductive material is characterized in that the adhesive of the substrate adhesive layer is applied to the release treated surface under pressure, and then the release material is peeled off and the conductive pattern layer is transferred from the release material to the adhesive of the substrate adhesive layer. Manufacturing method of connection material.

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