JPH0193081A - Manufacture of flexible tape connector member - Google Patents
Manufacture of flexible tape connector memberInfo
- Publication number
- JPH0193081A JPH0193081A JP24850487A JP24850487A JPH0193081A JP H0193081 A JPH0193081 A JP H0193081A JP 24850487 A JP24850487 A JP 24850487A JP 24850487 A JP24850487 A JP 24850487A JP H0193081 A JPH0193081 A JP H0193081A
- Authority
- JP
- Japan
- Prior art keywords
- flexible tape
- terminal
- wires
- wire
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 230000001070 adhesive effect Effects 0.000 claims abstract description 14
- 239000000853 adhesive Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000007747 plating Methods 0.000 claims abstract description 4
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 3
- 239000004760 aramid Substances 0.000 claims description 17
- 229920003235 aromatic polyamide Polymers 0.000 claims description 17
- 239000012790 adhesive layer Substances 0.000 claims description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 229910000906 Bronze Inorganic materials 0.000 claims description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 6
- 239000010974 bronze Substances 0.000 claims description 6
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920005749 polyurethane resin Polymers 0.000 claims description 2
- 230000002787 reinforcement Effects 0.000 claims description 2
- 229920002379 silicone rubber Polymers 0.000 claims description 2
- 239000004945 silicone rubber Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 230000001747 exhibiting effect Effects 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 238000002788 crimping Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000784 Nomex Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000004763 nomex Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、フレキシブルテープコネクター部材の製造法
に係り、特に、プリント回路基板（ＰＣＢ）や可撓性プ
リント基板（ＦＰＣ） と他方の電子・電気機器の端
子部やコネクターとを連結するためのフレキシブルテー
プコネクターの製造法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a flexible tape connector member, and particularly relates to a method for manufacturing a flexible tape connector member, and in particular a method for manufacturing a flexible tape connector member between a printed circuit board (PCB) and a flexible printed circuit board (FPC). The present invention relates to a method for manufacturing a flexible tape connector for connecting terminals and connectors of electrical equipment.
即ち、本発明は、ＰＣＢやＦＰＣと他方のコネクターと
を半田付けにて連結させるために、ベースに耐熱性にす
ぐれているアラミド紙を用い、これをリン青銅又はベリ
リウム銅製の端子線と一体化させ形成するための製造法
に関するものである。That is, in the present invention, in order to connect the PCB or FPC to the other connector by soldering, aramid paper with excellent heat resistance is used as the base, and this is integrated with a terminal wire made of phosphor bronze or beryllium copper. The present invention relates to a manufacturing method for forming a laminate.
（従来技術とその問題点）
従来、この種のフレキシブルテープコネクター部材を極
めて簡単に製造できる製造法は見当らなかった。簡単な
成形型を用いて、しかも信頼性を保持しながら、簡単な
操作で製造できる製造法がこの技術分野で強く求められ
ていた。(Prior Art and its Problems) Conventionally, no manufacturing method has been found that can extremely easily manufacture this type of flexible tape connector member. There is a strong need in this technical field for a manufacturing method that uses simple molds, maintains reliability, and can be manufactured with simple operations.
本発明は、このような現状に鑑み、極めて高い信頼性を
保持しながら、しかも極必で簡単なフレキシブルテープ
コネクター部材の製造法を提供しようとするものである
。In view of the current situation, the present invention aims to provide an extremely simple method of manufacturing a flexible tape connector member while maintaining extremely high reliability.
（問題点を解決するための手段）
本発明のフレキシブルテープコネクター部材の製造法は
、その実施例が図面にもみられるように、（ａ）一端部
が線径０．３〜０．５ｍｍの線状を呈する線状端部１で
あって、他端部が、該線状端部より幅広の所望の長さ、
幅、及び厚さを持った薄板状を呈する薄板部２であるフ
レキシブルテープ端子線３を抜打型等（図示せず）によ
りリン青銅板又はべＩＪ ＩＪウム銅板から形成しかつ
これをニッケノベスズ、半田等でメッキして、フレキシ
ブルテープコネクター端子線３を製作する工程と、（ｂ
）前記端子線３の幅と、互いに隣接する間隔と、所望の
並列個数とに応じた幅と、前記端子線３の線状端部１を
除いた長さに相当する長さとを有する厚さ５０〜１８０
μのアラミド紙４の片面に、フェノール樹脂、エポキ
シ樹脂、ポリウレタン樹脂、シリコーンゴムの１種又は
２種以上からなる熱硬化性接着剤５を、スクリーン印刷
又はロールコートにより、５〜５０μの厚みに塗布被着
させ、該接着剤層５の表面を仮乾燥して半硬化させる工
程と、（ｃ）前記（ａ）工程にて製作されたメッキ済み
のフレキシブルテープコネクター端子線３を、所望のピ
ッチに複数個の凹溝６を並設した金型７ （第１ａ、
ｌｂ；第２ａ、 ２ｂ；第３ａ、 ３ｂ図参照）に並べ
て収容し、その上から、前記（ｂ）工程にて得られた半
硬化接着剤層５を片面に被着させたアラミド紙４を、前
記端子線３の線状端部１にかからないように、接着剤層
５の面を向けて載置し、熱圧着機又はアイロン（図示せ
ず）にて一体に熱圧着する工程と、（ｄ）該（ｃ）工程
で熱圧着したフレキシブルテープコネクター端子線３の
熱圧着面に、補強のため、前記（ｂ）工程で得た接着剤
層５を被着させたアラミド紙４を、その長さを短かく切
断し余分を除去して端子線３の薄板部２を端子として露
出できるよう形成したうえ、コネクター端子線３の両端
子部１及び２にかからないように、接着剤層５の面を向
けて載置し、熱圧着機又はアイロン（図示せず）にて一
体に熱圧着する工程（第４ａ、４ｂ；第５ａ、 第５
ｂ図参照）との結合（ａ＋ｂ＋ｃ＋ｄ）よりなることを
特徴とする。(Means for Solving the Problems) As shown in the drawings, the method for manufacturing a flexible tape connector member of the present invention includes (a) a wire whose one end has a wire diameter of 0.3 to 0.5 mm; A linear end 1 having a shape, the other end having a desired length wider than the linear end,
A flexible tape terminal wire 3, which is a thin plate portion 2 having a thin plate shape with a width and thickness, is formed from a phosphor bronze plate or a copper plate using a stamping die or the like (not shown), and is made of a phosphor bronze plate or a copper plate. A process of plating with solder etc. to produce the flexible tape connector terminal wire 3, and (b)
) A thickness having a width corresponding to the width of the terminal wires 3, mutually adjacent intervals, a desired number of parallel wires, and a length corresponding to the length of the terminal wires 3 excluding the linear end portion 1. 50-180
A thermosetting adhesive 5 made of one or more of phenol resin, epoxy resin, polyurethane resin, and silicone rubber is applied on one side of μ aramid paper 4 to a thickness of 5 to 50 μ by screen printing or roll coating. (c) The plated flexible tape connector terminal wires 3 produced in the step (a) are arranged at a desired pitch. A mold 7 (No. 1a,
lb; see Figures 2a and 2b; Figures 3a and 3b), and from thereon, the aramid paper 4 with the semi-cured adhesive layer 5 obtained in step (b) covered on one side is placed on top of the sheets. , placing the adhesive layer 5 with its surface facing so as not to cover the linear end 1 of the terminal wire 3, and thermocompressing the terminal wire 3 together using a thermocompression bonding machine or an iron (not shown); d) For reinforcement, aramid paper 4 coated with the adhesive layer 5 obtained in step (b) is placed on the thermocompression bonded surface of the flexible tape connector terminal wire 3 that was thermocompression bonded in step (c). The thin plate portion 2 of the terminal wire 3 is formed by cutting it short and removing the excess so that the thin plate portion 2 of the terminal wire 3 can be exposed as a terminal, and the adhesive layer 5 is also Steps of placing them with their faces facing each other and thermocompressing them together using a thermocompression bonding machine or an iron (not shown) (Steps 4a, 4b; Steps 5a, 5th
(see figure b)) (a+b+c+d).
次に、本発明における数量限定の理由は次の如くである
。Next, the reason for limiting the quantity in the present invention is as follows.
（ａ）工程で形成したリン青銅又はベリリウム銅製端子
線３の線状端部１の線径が０．３ｍｍ未満では、端子線
３の強度が弱くなり、使用時に曲がったりしてピッチ寸
法がばらつくため不可であり、０．５岨を越えると、寸
法として幅広になり、又、コスト高になるために不可で
ある。(a) If the wire diameter of the linear end portion 1 of the phosphor bronze or beryllium copper terminal wire 3 formed in the process is less than 0.3 mm, the strength of the terminal wire 3 will be weakened, and the pitch dimension will vary due to bending during use. If it exceeds 0.5 in., it becomes too wide and the cost increases, so it is not possible.
又アラミド紙４の厚みが５０μ未満では加熱時の寸法の
伸縮をコントロールするのが困難なため不可であり、１
８０ μを越えると、アラミド紙４と端子線３とを熱圧
着する際に熱を通しにくく不可である。強度的にも１８
０ μを越える必要がない。又、アラミド紙４上に塗布
した接着剤層５の厚みが、５μ未満では、接着剤として
の接着性が不十分なため不可であり、５０μを越えると
（ｂ）工程で行なわれる仮乾燥によって接着剤５を半硬
化させることが難かしい。これは、半硬化が不十分な場
合には、（ｃ）工程で端子線３と熱圧着する際に、接着
剤５がはみ出して、端子線３以外のものにもついてしま
うため不可であり、又仮乾燥で硬化し過ぎると、端子線
３との接着力が悪くなるため使用不可である。In addition, if the thickness of the aramid paper 4 is less than 50μ, it is difficult to control the expansion and contraction of dimensions during heating, so it is not possible.
If it exceeds 80 μm, it will be difficult for heat to pass through when the aramid paper 4 and the terminal wire 3 are bonded together by thermocompression, making it impossible. 18 in terms of strength
There is no need to exceed 0 μ. Moreover, if the thickness of the adhesive layer 5 applied on the aramid paper 4 is less than 5 μm, it is not possible because the adhesive properties as an adhesive are insufficient, and if it exceeds 50 μm, it will be damaged by temporary drying in step (b). It is difficult to semi-cure the adhesive 5. This is not possible because if the semi-curing is insufficient, the adhesive 5 will protrude and adhere to things other than the terminal wire 3 during thermocompression bonding with the terminal wire 3 in step (c). Moreover, if it is too hardened by temporary drying, the adhesive strength with the terminal wire 3 will deteriorate, making it unusable.
（実施例） 以下本発明をさらに実施例にて説明する。(Example) The present invention will be further explained below with reference to Examples.
実施例：
第１ａ図ないし第５ｂ図について図解するとおりの工程
から成る。Example: Consists of the steps as illustrated with respect to Figures 1a to 5b.
先ず、（ａ）工程における端子線３の製作は、（イ）リ
ン青銅板から、線状端部１と、薄板部２とを持たせて、
図示しない所望の打抜型等を用いて、成形する。First, the manufacturing of the terminal wire 3 in step (a) is as follows: (a) From a phosphor bronze plate, a wire end portion 1 and a thin plate portion 2 are formed,
It is molded using a desired punching die or the like (not shown).
（ロ）この端子線３をニッケルメッキして仕上げる。(b) Finish this terminal wire 3 by plating it with nickel.
次に、（ｂ）工程におけるアラミド紙４への接着剤５の
塗布は、
（ハ）スクリーン印刷にて接着剤５を層厚５〜５０μに
塗布する。Next, in step (b), the adhesive 5 is applied to the aramid paper 4 as follows: (c) The adhesive 5 is applied to a layer thickness of 5 to 50 μm by screen printing.
（ニ）仮乾燥は、温度１００℃、３０秒間、遠赤外線炉
に通した。(d) Temporary drying was carried out in a far-infrared oven at a temperature of 100° C. for 30 seconds.
この場合の使用材料は、接着剤は、ポリウレタン系接着
剤、アラミド紙は、デュポン社製商品名ノーメックス
タイプ４１０、そのアラミド紙の厚みは１３０ μであ
る。The materials used in this case are: The adhesive is polyurethane adhesive, and the aramid paper is Nomex, a product manufactured by DuPont.
Type 410, the thickness of its aramid paper is 130 μ.
次に、（ｃ）工程及び（ｄ）工程におけるフレキシブル
テープコネクター端子線３と、前記アラミド紙４との熱
圧着による接着は、
（ホ）熱圧着機により行なう。Next, in steps (c) and (d), the flexible tape connector terminal wire 3 and the aramid paper 4 are bonded by thermocompression bonding using a (e) thermocompression bonding machine.
（へ）圧着条件は、圧着温度１４０℃、（ト）圧着時間
３〜５秒、
（チ）圧力 ３０ｋｇ／ ａｍ２、
かくして、得られた本実施例によるフレキシブルテープ
コネクター部材は、実用に際し、信頼性が高く、フレキ
シブル、すなわち可撓性がよくテープ状であってコネク
ターとして非常になじみ易く使い易い。その上、前述の
ように製造方法は極めて簡単であり、量産にも適する。(f) The crimping conditions were: crimping temperature: 140°C; (g) crimping time: 3 to 5 seconds; It is highly flexible and has a tape-like shape, making it very easy to adapt and use as a connector. Moreover, as mentioned above, the manufacturing method is extremely simple and suitable for mass production.
材料も安価なもので、又入手し易い。The materials are also inexpensive and easily available.
（効 果）
以上述べたように、本発明は、極めて簡単に製造するこ
とができ、信頼性が高く、広く実用に供することができ
、その上、安価であるフレキシブルテープコネクター部
材が得られる製造法を提供することができる。(Effects) As described above, the present invention provides a flexible tape connector member that can be manufactured extremely easily, has high reliability, can be widely put to practical use, and is inexpensive. law can be provided.
【図面の簡単な説明】
第１ａ図は、本発明の一実施例に係る（ｃ）工程にて用
いる金型を示す断面略図であり、
第１ｂ図は、同じくその金型の上面図であり、第２ａ図
、第２ｂ図、及び第３ａ図、第３ｂ図は、それぞれ（ｃ
）工程において、所望の複数個のメッキ済みのフレキシ
ブルテープコネクター端子線を金型の凹溝中に並列収容
した状態と、その上に、熱硬化性接着剤を塗布したアラ
ミド紙を載置して熱圧着した状態を、それぞれ示す断面
略図、及びそれらの上面図であり、
第４ａ図及び第４ｂ図は、それぞれ、（ｃ）工程にてで
き上ったアラミド紙の片面にフレキシブルテープコネク
ター端子線が、熱圧着された中間部品を示す断面略図及
び上面図であり、
第５ａ図及び第５ｂ図は、それぞれ、（ｄ）工程にてで
き上った本発明の一実施例のフレキシブルテープコネク
ター部材の拡大断面略図及び上面略図である。
１・・・線状端部（フレキシブルテープ端子線３の）２
・・・薄板部（同上の）
３・・・フレキシブルテープコネクター端子線４・・・
アラミド紙
５・・・熱硬化性接着剤層
６・パ・凹溝（金型の）[Brief Description of the Drawings] Figure 1a is a schematic cross-sectional view showing a mold used in step (c) according to an embodiment of the present invention, and Figure 1b is a top view of the mold. , FIGS. 2a and 2b, and FIGS. 3a and 3b, respectively (c
) In the process, a plurality of desired plated flexible tape connector terminal wires are housed in parallel in the groove of the mold, and aramid paper coated with thermosetting adhesive is placed on top of them. FIGS. 4a and 4b are cross-sectional diagrams and top views respectively showing the state of thermocompression bonding, and FIGS. 4a and 4b each show a flexible tape connector terminal wire on one side of the aramid paper produced in step (c). 5A and 5B are a schematic cross-sectional view and a top view showing the thermocompression-bonded intermediate part, respectively, and FIGS. 5a and 5b are respectively a flexible tape connector member of an embodiment of the present invention completed in step (d). FIG. 2 is an enlarged schematic cross-sectional view and a schematic top view. 1... Linear end (of flexible tape terminal wire 3) 2
...Thin plate part (same as above) 3...Flexible tape connector terminal wire 4...
Aramid paper 5...Thermosetting adhesive layer 6, pa, groove (of the mold)
Claims (1)
する線状端部であって、他端部が、該線状端部より幅広
の所望の長さ、幅、及び厚さを持った薄板状を呈する薄
板部であるフレキシブルテープ端子線を抜打型等により
リン青銅板又はベリリウム銅板から形成しかつこれをニ
ッケル、スズ、半田等でメッキして、フレキシブルテー
プコネクター端子線を製作する工程と、 （ｂ）前記端子線の幅と、互いに隣接する間隔と、所望
の並列個数とに応じた幅と、前記端子線の線状端部を除
いた長さに相当する長さとを有する厚さ５０〜１８０μ
のアラミド紙の片面に、フェノール樹脂、エポキシ樹脂
、ポリウレタン樹脂、シリコーンゴムの１種又は２種以
上からなる熱硬化性接着剤を、スクリーン印刷又はロー
ルコートにより、５〜５０μの厚みに塗布被着させ、該
接着剤層の表面を仮乾燥して半硬化させる工程と、 （ｃ）前記（ａ）工程にて製作されたメッキ済みのフレ
キシブルテープコネクター端子線を、所望のピッチに複
数個の凹溝を並設した金型に並べて収容し、その上から
、前記（ｂ）工程にて得られた半硬化接着剤層を片面に
被着させたアラミド紙を、前記端子線の線状端部にかか
らないように、接着剤層の面を向けて載置し、熱圧着機
又はアイロンにて一体に熱圧着する工程と、 （ｄ）該（ｃ）工程で熱圧着したフレキシブルテープコ
ネクター端子線の熱圧着面に、補強のため、前記（ｂ）
工程で得た接着剤層を被着させたアラミド紙を、その長
さを短かく切断し余分を除去して端子線の薄板部を端子
として露出できるよう形成したうえ、コネクター端子線
の両端子部にかからないように、接着剤層の面を向けて
載置し、熱圧着機又はアイロンにて一体に熱圧着する工
程との結合（ａ＋ｂ＋ｃ＋ｄ）よりなることを特徴とす
るフレキシブルテープコネクター部材の製造法。1. (a) One end is a linear end with a wire diameter of 0.3 to 0.5 mm, and the other end has a desired length, width, and thickness that is wider than the linear end. A flexible tape connector terminal wire is produced by forming a flexible tape terminal wire, which is a thin plate portion exhibiting a thin plate shape with a thickness, from a phosphor bronze plate or a beryllium copper plate by stamping, etc., and plating this with nickel, tin, solder, etc. (b) a width corresponding to the width of the terminal wires, the spacing between adjacent wires, the desired number of parallel wires, and a length corresponding to the length of the terminal wires excluding the linear ends; Thickness: 50-180μ
A thermosetting adhesive made of one or more of phenol resin, epoxy resin, polyurethane resin, and silicone rubber is applied to one side of the aramid paper to a thickness of 5 to 50μ by screen printing or roll coating. (c) The plated flexible tape connector terminal wire produced in step (a) is formed into a plurality of recesses at a desired pitch. The linear ends of the terminal wires are placed side by side in a mold with parallel grooves, and from above the aramid paper with the semi-cured adhesive layer obtained in step (b) applied on one side, (d) The process of placing the adhesive layer with its side facing up and heat-bonding them together using a thermo-compression bonding machine or an iron, so as not to damage the flexible tape connector terminal wires heat-bonded in step (c). The above (b) is applied to the thermocompression bonding surface for reinforcement.
The aramid paper coated with the adhesive layer obtained in the process was cut into short lengths and the excess removed to expose the thin plate part of the terminal wire as a terminal, and then both terminals of the connector terminal wire were cut. Production of a flexible tape connector member characterized by the following steps: (a + b + c + d): placing the adhesive layer with its surface facing up so that it does not overlap, and bonding the adhesive layer together using a thermocompression machine or an iron. Law.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24850487A JPH0193081A (en) | 1987-10-01 | 1987-10-01 | Manufacture of flexible tape connector member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24850487A JPH0193081A (en) | 1987-10-01 | 1987-10-01 | Manufacture of flexible tape connector member |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0193081A true JPH0193081A (en) | 1989-04-12 |
| JPH0154830B2 JPH0154830B2 (en) | 1989-11-21 |
Family
ID=17179160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24850487A Granted JPH0193081A (en) | 1987-10-01 | 1987-10-01 | Manufacture of flexible tape connector member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0193081A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5590465A (en) * | 1993-01-18 | 1997-01-07 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing connection terminals of flexible wiring pattern substrates |
| DE19629171A1 (en) * | 1996-07-19 | 1998-01-22 | Audi Ag | IC engine ignition system with device for generating a fuel cloud in combustion chamber |
| WO2012009838A1 (en) * | 2010-07-20 | 2012-01-26 | Wang Dingfeng | Method for fabricating single-sided circuit board using apposition wires |
| CN102340929A (en) * | 2010-07-20 | 2012-02-01 | 王定锋 | Single-sided circuit board made by respectively hot-pressing insulating layers on two sides of flat wires |
| TWI550981B (en) * | 2014-09-02 | 2016-09-21 | Connector manufacturing method and connector |
-
1987
- 1987-10-01 JP JP24850487A patent/JPH0193081A/en active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5590465A (en) * | 1993-01-18 | 1997-01-07 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing connection terminals of flexible wiring pattern substrates |
| DE19629171A1 (en) * | 1996-07-19 | 1998-01-22 | Audi Ag | IC engine ignition system with device for generating a fuel cloud in combustion chamber |
| DE19629171C2 (en) * | 1996-07-19 | 2002-10-24 | Audi Ag | Ignition arrangement for a spark ignition internal combustion engine |
| WO2012009838A1 (en) * | 2010-07-20 | 2012-01-26 | Wang Dingfeng | Method for fabricating single-sided circuit board using apposition wires |
| CN102340931A (en) * | 2010-07-20 | 2012-02-01 | 王定锋 | Method for making single-sided circuit board with flat wires arranged side by side |
| CN102340929A (en) * | 2010-07-20 | 2012-02-01 | 王定锋 | Single-sided circuit board made by respectively hot-pressing insulating layers on two sides of flat wires |
| TWI550981B (en) * | 2014-09-02 | 2016-09-21 | Connector manufacturing method and connector |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0154830B2 (en) | 1989-11-21 |
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