JPH0154830B2 - - Google Patents
Info
- Publication number
- JPH0154830B2 JPH0154830B2 JP24850487A JP24850487A JPH0154830B2 JP H0154830 B2 JPH0154830 B2 JP H0154830B2 JP 24850487 A JP24850487 A JP 24850487A JP 24850487 A JP24850487 A JP 24850487A JP H0154830 B2 JPH0154830 B2 JP H0154830B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- adhesive layer
- flexible tape
- aramid paper
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004760 aramid Substances 0.000 claims description 18
- 229920003235 aromatic polyamide Polymers 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 11
- 239000012790 adhesive layer Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229910000906 Bronze Inorganic materials 0.000 claims description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 5
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 claims description 5
- 239000010974 bronze Substances 0.000 claims description 5
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 230000002787 reinforcement Effects 0.000 claims description 2
- 229920002379 silicone rubber Polymers 0.000 claims description 2
- 239000004945 silicone rubber Substances 0.000 claims description 2
- 230000001747 exhibiting effect Effects 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 238000002788 crimping Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920000784 Nomex Polymers 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000004763 nomex Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、フレキシブルテープコネクター部材
の製造法に係り、特に、プリント回路基板
（PCB）や可撓性プリント基板（FPC）と他方の
電子・電気機器の端子部やコネクターとを連結す
るためのフレキシブルテープコネクターの製造法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a flexible tape connector member, and particularly relates to a method for manufacturing a flexible tape connector member. The present invention relates to a method for manufacturing a flexible tape connector for connecting terminals and connectors of electrical equipment.
即ち、本発明は、PCBやFPCと他方のコネク
ターとを半田付けにて連結させるために、ベース
に耐熱性にすぐれているアラミド紙を用い、これ
をリン青銅又はベリリウム銅製の端子線と一体化
させ形成するための製造法に関するものである。 That is, in order to connect the PCB or FPC to the other connector by soldering, the present invention uses aramid paper with excellent heat resistance as the base, and integrates this with a terminal wire made of phosphor bronze or beryllium copper. The present invention relates to a manufacturing method for forming a laminate.
（従来技術とその問題点）
従来、この種のフレキシブルテープコネクター
部材を極めて簡単に製造できる製造法は見当らな
かつた。簡単な成形型を用いて、しかも信頼性を
保持しながら、簡単な操作で製造できる製造法が
この技術分野で強く求められていた。(Prior Art and its Problems) Conventionally, no manufacturing method has been found that can extremely easily manufacture this type of flexible tape connector member. There is a strong need in this technical field for a manufacturing method that uses simple molds, maintains reliability, and can be manufactured with simple operations.
本発明は、このような現状に鑑み、極めて高い
信頼性を保持しながら、しかも極めて簡単なフレ
キシブルテープコネクター部材の製造法を提供し
ようとするものである。 In view of the current situation, the present invention aims to provide a method for manufacturing a flexible tape connector member that is extremely simple while maintaining extremely high reliability.
（問題点を解決するための手段）
本発明のフレキシブルテープコネクター部材の
製造法は、その実施例が図面にもみられるよう
に、(a)一端部が線径0.3〜0.5mmの線状を呈する線
状端部１であつて、他端部が、該線状端部より幅
広の所望の長さ、幅、及び厚さを持つた薄板状を
呈する薄板部２であるフレキシブルテープ端子線
３を抜打型等（図示せず）によりリン青銅板又は
ベリリウム銅板から形成しかつこれをニツケル、
スズ、半田等でメツキして、フレキシブルテープ
コネクター端子線３を製作する工程と、(b)前記端
子線３の幅と、互いに隣接する間隔と、所望の並
列個数とに応じた幅と、前記端子線３の線状端部
１を除いた長さに相当する長さとを有する厚さ50
〜180μのアラミド紙４の片面に、フエノール樹
脂、エポキシ樹脂、ポリウレタン樹脂、シリコー
ンゴムの１種又は２種以上からなる熱硬化性接着
剤５を、スクリーン印刷又はロールコートによ
り、５〜50μの厚みに塗布被着させ、該接着剤層
５の表面を仮乾燥して半硬化させる工程と、(c)前
記(a)工程にて製作されたメツキ済みのフレキシブ
ルテープコネクター端子線３を、所望のピツチに
複数個の凹溝６を並設した金型７（第１ａ，１
ｂ；第２ａ，２ｂ；第３ａ，３ｂ図参照）に並べ
て収容し、その上から、前記(b)工程にて得られた
半硬化接着剤層５を片面に被着させたアラミド紙
４を、前記端子線３の線状端部１にかからないよ
うに、接着剤層５の面を向けて載置し、熱圧着機
又はアイロン（図示せず）にて一体に熱圧着する
工程と、(d)該(c)工程で熱圧着したフレキシブルテ
ープコネクター端子線３の熱圧着面に、補強のた
め、前記(b)工程で得た接着剤層５を被着させたア
ラミド紙４を、その長さを短かく切断し余分を除
去して端子線３の薄板部２を端子として露出でき
るよう形成したうえ、コネクター端子線３の両端
子部１及び２にかからないように、接着剤層５の
面を向けて載置し、熱圧着機又はアイロン（図示
せず）にて一体に熱圧着する工程（第４ａ，４
ｂ；第５ａ，第５ｂ図参照）との結合（ａ＋ｂ＋
ｃ＋ｄ）よりなることを特徴とする。(Means for Solving the Problems) The method for manufacturing a flexible tape connector member of the present invention is as follows: (a) one end has a wire shape with a wire diameter of 0.3 to 0.5 mm; A flexible tape terminal wire 3 has a linear end portion 1 and the other end is a thin plate portion 2 having a thin plate shape with a desired length, width, and thickness wider than the linear end portion. It is formed from a phosphor bronze plate or beryllium copper plate using a stamping die or the like (not shown), and is made of nickel or beryllium copper.
(b) manufacturing a flexible tape connector terminal wire 3 by plating with tin, solder, etc.; A length corresponding to the length of the terminal wire 3 excluding the linear end 1 and a thickness of 50
A thermosetting adhesive 5 made of one or more of phenolic resin, epoxy resin, polyurethane resin, and silicone rubber is applied to one side of aramid paper 4 of ~180 μm to a thickness of 5 to 50 μm by screen printing or roll coating. (c) applying the plated flexible tape connector terminal wire 3 produced in step (a) above to a desired shape; Mold 7 (No. 1a, 1
(b; see Figures 2a and 2b; Figures 3a and 3b), and from above the aramid paper 4 with the semi-cured adhesive layer 5 obtained in step (b) applied on one side. , placing the adhesive layer 5 with its surface facing so as not to cover the linear end 1 of the terminal wire 3, and thermocompressing them together using a thermocompression bonding machine or an iron (not shown); d) For reinforcement, the aramid paper 4 coated with the adhesive layer 5 obtained in step (b) is placed on the thermocompression bonded surface of the flexible tape connector terminal wire 3 that was thermocompression bonded in step (c). The thin plate portion 2 of the terminal wire 3 is formed by cutting it short and removing the excess so that the thin plate portion 2 of the terminal wire 3 can be exposed as a terminal, and the adhesive layer 5 is also Steps of placing the surfaces facing each other and thermocompressing them together using a thermocompression bonding machine or an iron (not shown) (Steps 4a and 4)
b; see Figures 5a and 5b) (a+b+
c+d).
次に、本発明における数量限定の理由は次の如
くである。 Next, the reason for limiting the quantity in the present invention is as follows.
(a)工程で形成したリン青銅又はベリリウム銅製
端子線３の線状端部１の線径が0.3mm未満では、
端子線３の強度が弱くなり、使用時に曲がつたり
してピツチ寸法がばらつくため不可であり、0.5
mmを越えると、寸法として幅広になり、又、コス
ト高になるために不可である。 If the wire diameter of the wire end portion 1 of the phosphor bronze or beryllium copper terminal wire 3 formed in the step (a) is less than 0.3 mm,
0.5
If it exceeds mm, it becomes too wide and the cost increases, so it is not possible.
又アラミド紙４の厚みが50μ未満では加熱時の
寸法の伸縮をコントロールするのが困難なため不
可であり、180μを越えると、アラミド紙４と端
子線３とを熱圧着する際に熱を通しにくく不可で
ある。強度的にもも180μを越える必要がない。
又、アラミド紙４上に塗布した接着剤層５の厚み
が、5μ未満では、接着剤としての接着性が不十
分なため不可であり、50μを越えると(b)工程で行
なわれる仮乾燥によつて接着剤５を半硬化させる
ことが難かしい。これは、半硬化が不十分な場合
には、(c)工程で端子線３と熱圧着する際に、接着
剤５がはみ出して、端子線３以外のものにもつい
てしまうため不可であり、又仮乾燥で硬化し過ぎ
ると、端子線３との接着力が悪くなるため使用不
可である。 Also, if the thickness of the aramid paper 4 is less than 50μ, it is difficult to control the expansion and contraction of dimensions during heating, and if it exceeds 180μ, it is difficult to pass through the heat when thermocompression bonding the aramid paper 4 and the terminal wire 3. It is difficult and impossible. In terms of strength, there is no need to exceed 180μ.
Furthermore, if the thickness of the adhesive layer 5 coated on the aramid paper 4 is less than 5 μm, it is not possible because the adhesive properties as an adhesive are insufficient, and if it exceeds 50 μm, the temporary drying performed in step (b) Therefore, it is difficult to semi-cure the adhesive 5. This is not possible because if the semi-curing is insufficient, the adhesive 5 will protrude and adhere to things other than the terminal wire 3 during thermocompression bonding with the terminal wire 3 in step (c). Moreover, if it is too hardened by temporary drying, the adhesive strength with the terminal wire 3 will deteriorate, making it unusable.
（実施例） 以下本発明をさらに実施例にて説明する。(Example) The present invention will be further explained below with reference to Examples.
実施例
第１ａ図ないし第５ｂ図について図解するとお
りの工程から成る。EXAMPLE Consists of the steps as illustrated with respect to Figures 1a to 5b.
先ず、(a)工程における端子線３の製作は、
(イ) リン青銅板から、線状端部１と、薄板部２と
を持たせて、図示しない所望の打抜型等を用い
て、成形する。 First, the manufacturing of the terminal wire 3 in step (a) is as follows: (a) A phosphor bronze plate is formed into a wire end portion 1 and a thin plate portion 2 using a desired punching die or the like (not shown). do.
(ロ) この端子線３をニツケルメツキして仕上げ
る。(b) Finish this terminal wire 3 with nickel plating.
次に、(b)工程におけるアラミド紙４への接着剤
５の塗布は、
(ハ) スクリーン印刷にて接着剤５を層厚５〜50μ
に塗布する。 Next, in step (b), the adhesive 5 is applied to the aramid paper 4 by (c) screen printing to a layer thickness of 5 to 50 μm.
Apply to.
(ニ) 仮乾燥は、温度100℃、30秒間、遠赤外線炉
に通した。(iv) Temporary drying was carried out in a far-infrared oven at a temperature of 100°C for 30 seconds.
この場合の使用材料は、接着剤は、ポリウレタ
ン系接着剤、アラミド紙は、デユポン社製商品名
ノーメツクス タイプ410、そのアラミド紙の
厚みは130μである。 The materials used in this case are: the adhesive is a polyurethane adhesive, the aramid paper is Nomex Type 410 manufactured by DuPont, and the thickness of the aramid paper is 130 μm.
次に、(c)工程及び(d)工程におけるフレキシブル
テープコネクター端子線３と、前記アラミド紙４
との熱圧着による接着は、
(ホ) 熱圧着機により行なう。 Next, the flexible tape connector terminal wire 3 and the aramid paper 4 in steps (c) and (d) are
(e) Adhesion using thermocompression bonding is performed using a thermocompression bonding machine.
(ヘ) 圧着条件は、圧着温度140℃、
(ト) 圧着時間３〜５秒、
(チ) 圧力30Kg／cm2、
かくして、得られた本実施例によるフレキシブ
ルテープコネクター部材は、実用に際し、信頼性
が高く、フレキシブル、すなわち可撓性がよくテ
ープ状であつてコネクターとして非常になじみ易
く使い易い。その上、前述のように製造方法は極
めて簡単であり、量産にも適する。材料も安価な
もので、又入手し易い。(f) The crimping conditions were: crimping temperature: 140°C; (g) crimping time: 3 to 5 seconds; It is flexible and tape-like, and is very adaptable and easy to use as a connector. Moreover, as mentioned above, the manufacturing method is extremely simple and suitable for mass production. The materials are also inexpensive and easily available.
（効 果）
以上述べたように、本発明は、極めて簡単に製
造することができ、信頼性が高く、広く実用に供
することができ、その上、安価であるフレキシブ
ルテープコネクター部材が得られる製造法を提供
することができる。(Effects) As described above, the present invention provides a flexible tape connector member that can be manufactured extremely easily, has high reliability, can be widely put to practical use, and is inexpensive. law can be provided.
第１ａ図は、本発明の一実施例に係る(c)工程に
て用いる金型を示す断面略図であり、第１ｂ図
は、同じくその金型の上面図であり、第２ａ図、
第２ｂ図、及び第３ａ図、第３ｂ図は、それぞれ
(c)工程において、所望の複数個のメツキ済みのフ
レキシブルテープコネクター端子線を金型の凹溝
中に並列収容した状態と、その上に、熱硬化性接
着剤を塗布したアラミド紙を載置して熱圧着した
状態を、それぞれ示す断面略図、及びそれらの上
面図であり、第４ａ図及び第４ｂ図は、それぞ
れ、(c)工程にてでき上つたアラミド紙の片面にフ
レキシブルテープコネクター端子線が、熱圧着さ
れた中間部品を示す断面略図及び上面図であり、
第５ａ図及び第５ｂ図は、それぞれ、(d)工程にて
でき上つた本発明の一実施例のフレキシブルテー
プコネクター部材の拡大断面略図及び上面略図で
ある。
１……線状端部（フレキシブルテープ端子線３
の）、２……薄板部（同上の）、３……フレキシブ
ルテープコネクター端子線、４……アラミド紙、
５……熱硬化性接着剤層、６……凹溝（金型の）、
７……所望のピツチの凹溝６を並設した金型。
FIG. 1a is a schematic cross-sectional view showing a mold used in step (c) according to an embodiment of the present invention, FIG. 1b is a top view of the mold, and FIG. 2a,
Figure 2b, Figure 3a and Figure 3b are respectively
(c) In the process, a plurality of desired plated flexible tape connector terminal wires are housed in parallel in the groove of the mold, and aramid paper coated with thermosetting adhesive is placed on top of them. FIGS. 4a and 4b are a schematic cross-sectional view and a top view of the state in which the aramid paper is bonded with heat and pressure, and FIGS. 4a and 4b each show a flexible tape connector terminal on one side of the aramid paper produced in step (c) The line is a cross-sectional schematic diagram and a top view showing a thermocompression bonded intermediate part,
FIGS. 5a and 5b are an enlarged schematic cross-sectional view and a schematic top view, respectively, of a flexible tape connector member according to an embodiment of the present invention produced in step (d). 1... Linear end (flexible tape terminal wire 3
), 2... Thin plate part (same as above), 3... Flexible tape connector terminal wire, 4... Aramid paper,
5...Thermosetting adhesive layer, 6... Groove (of the mold),
7...A mold in which concave grooves 6 of a desired pitch are arranged in parallel.
Claims (1)
線状端部であつて、他端部が、該線状端部より
幅広の所望の長さ、幅、及び厚さを持つた薄板
状を呈する薄板部であるフレキシブルテープ端
子線を抜打型等によりリン青銅板又はベリリウ
ム銅板から形成しかつこれをニツケル、スズ、
半田等でメツキして、フレキシブルテープコネ
クター端子線を製作する工程と、 (b) 前記端子線の幅と、互いに隣接する間隔と、
所望の並列個数とに応じた幅と、前記端子線の
線状端部を除いた長さに相当する長さとを有す
る厚さ50〜180μのアラミド紙の片面に、フエ
ノール樹脂、エポキシ樹脂、ポリウレタン樹
脂、シリコーンゴムの１種又は２種以上からな
る熱硬化性接着剤を、スクリーン印刷又はロー
ルコートにより、５〜50μの厚みに塗布被着さ
せ、該接着剤層の表面を仮乾燥して半硬化させ
る工程と、 (c) 前記(a)工程にて製作されたメツキ済みのフレ
キシブルテープコネクター端子線を、所望のピ
ツチに複数個の凹溝を並設した金型に並べて収
容し、その上から、前記(b)工程にて得られた半
硬化接着剤層を片面に被着させたアラミド紙
を、前記端子線の線状端部にかからないよう
に、接着剤層の面を向けて載置し、熱圧着機又
はアイロンにて一体に熱圧着する工程と、 (d) 該(c)工程で熱圧着したフレキシブルテープコ
ネクター端子線の熱圧着面に、補強のため、前
記(b)工程で得た接着剤層を被着させたアラミド
紙、その長さを短かく切断し余分を除去して端
子線の薄板部を端子として露出できるよう形成
したうえ、コネクター端子線の両端子部にかか
らないように、接着剤層の面を向けて載置し、
熱圧着機又はアイロンにて一体に熱圧着する工
程との結合（ａ＋ｂ＋ｃ＋ｄ）よりなることを
特徴とするフレキシブルテープコネクター部材
の製造法。[Scope of Claims] 1 (a) A linear end portion having a linear shape with a wire diameter of 0.3 to 0.5 mm, the other end having a desired length wider than the linear end portion; A flexible tape terminal wire, which is a thin plate portion exhibiting a thin plate shape with a width and thickness, is formed from a phosphor bronze plate or a beryllium copper plate using a stamping die or the like, and this is made of nickel, tin,
(b) determining the width of the terminal wires and the spacing between them,
Phenol resin, epoxy resin, polyurethane is coated on one side of aramid paper with a thickness of 50 to 180 μm and has a width corresponding to the desired number of parallel terminal wires and a length corresponding to the length excluding the linear ends of the terminal wires. A thermosetting adhesive made of one or more of resin and silicone rubber is applied to a thickness of 5 to 50μ by screen printing or roll coating, and the surface of the adhesive layer is temporarily dried to form a semi-solid adhesive. (c) The plated flexible tape connector terminal wires produced in step (a) above are placed side by side in a mold with a plurality of grooves arranged in parallel at the desired pitch, and then Then, place the aramid paper coated with the semi-hardened adhesive layer obtained in step (b) on one side with the adhesive layer facing so as not to cover the linear end of the terminal wire. (d) The thermocompression bonded surface of the flexible tape connector terminal wire that was thermocompression bonded in step (c) is subjected to the above step (b) for reinforcement. The aramid paper covered with the adhesive layer obtained in step 1 was cut into short lengths, the excess was removed, and the thin plate part of the terminal wire was formed so as to be exposed as a terminal. Place it with the adhesive layer facing up to prevent it from getting stuck.
1. A method for manufacturing a flexible tape connector member, comprising a step of thermocompression bonding (a+b+c+d) together using a thermocompression bonding machine or an iron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24850487A JPH0193081A (en) | 1987-10-01 | 1987-10-01 | Manufacture of flexible tape connector member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24850487A JPH0193081A (en) | 1987-10-01 | 1987-10-01 | Manufacture of flexible tape connector member |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0193081A JPH0193081A (en) | 1989-04-12 |
| JPH0154830B2 true JPH0154830B2 (en) | 1989-11-21 |
Family
ID=17179160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24850487A Granted JPH0193081A (en) | 1987-10-01 | 1987-10-01 | Manufacture of flexible tape connector member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0193081A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06216487A (en) * | 1993-01-18 | 1994-08-05 | Matsushita Electric Ind Co Ltd | Connecting terminal part of flexible pattern |
| DE19629171C2 (en) * | 1996-07-19 | 2002-10-24 | Audi Ag | Ignition arrangement for a spark ignition internal combustion engine |
| CN102340931B (en) * | 2010-07-20 | 2013-08-28 | 王定锋 | Method for making single-sided circuit board with flat wires arranged side by side |
| CN102340929B (en) * | 2010-07-20 | 2014-04-02 | 王定锋 | Single-sided circuit board made by respectively hot-pressing insulating layers on two sides of flat wires |
| TWI550981B (en) * | 2014-09-02 | 2016-09-21 | Connector manufacturing method and connector |
-
1987
- 1987-10-01 JP JP24850487A patent/JPH0193081A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0193081A (en) | 1989-04-12 |
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