JP3921452B2 - Method for producing laminated tape of anisotropic conductive film - Google Patents

Method for producing laminated tape of anisotropic conductive film Download PDF

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Publication number
JP3921452B2
JP3921452B2 JP2003056659A JP2003056659A JP3921452B2 JP 3921452 B2 JP3921452 B2 JP 3921452B2 JP 2003056659 A JP2003056659 A JP 2003056659A JP 2003056659 A JP2003056659 A JP 2003056659A JP 3921452 B2 JP3921452 B2 JP 3921452B2
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film
anisotropic conductive
conductive film
laminated
width
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JP2004262161A (en
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保博 須賀
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Dexerials Corp
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Sony Chemical and Information Device Corp
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Priority to JP2003056659A priority Critical patent/JP3921452B2/en
Priority to PCT/JP2004/002493 priority patent/WO2004078472A1/en
Priority to TW093105274A priority patent/TWI282561B/en
Priority to KR1020057016324A priority patent/KR100787768B1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B32B7/14—Interconnection of layers using interposed adhesives or interposed materials with bonding properties applied in spaced arrangements, e.g. in stripes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は異方導電性フィルムの技術分野にかかり、特に、異方導電性フィルムを二枚のフィルムで挟んだ積層フィルムの技術分野に関する。
【０００２】
【従来の技術】
図６(ａ)の符号１１０は、積層テープであり、導電性粒子を含有する異方導電性フィルム１１２が、ベースフィルム１１１とカバーフィルム１１３で挟み込まれて構成されている。
【０００３】
この積層テープ１１０は、図６(ｂ)に示すようなナイフスリット１１８等で、幅広の原反１１９を幅方向に切断して製造されており、１枚の原反１１９から複数本の積層テープ１１０が得られている。
【０００４】
そして、原反１１９の切断後、得られた積層テープ１１０を数十ｍ程度の長さでロール状に巻き取って保管・移動させている。
【０００５】
異方導電性フィルム１１２を用いて半導体チップを基板に貼付する際には、必要量だけロールから繰り出し、先ず、カバーフィルム１１３を剥離し、異方導電性フィルム１１２の片面を露出させてその面を基板等に貼付し、切断した後、ベースフィルム１１１を剥離し、半導体チップ等を異方導電性フィルム１１２上に乗せ、押圧して貼付している。
【０００６】
ところが、積層フィルム１１０のロールを長時間保管した場合には、異方導電性フィルム１１２がベースフィルム１１１とカバーフィルム１１３の間からはみ出してしまう。
【０００７】
図６(ａ)の符号１１５は、そのはみ出し部分を示しており、このようなはみ出し部分１１５が存在すると、カバーフィルム１１３を異方導電性フィルム１１２から剥がせなくなったり、異方導電性フィルム１１２をベースフィルム１１１からきれいに剥がせなくなるという問題がある。
【０００８】
従来では、はみ出しが生じる原因は、原反１１９の切断工程に存在すると考えられており、上刃１１８の形状や、切断条件等の工夫がなされていた。
【０００９】
なお、原反１１９等の積層体を切断する技術は、異方導電性フィルムの分野以外にも広く用いられており、上刃と下刃の形状を工夫する試みがなされている。
【特許文献１】
特開２００１−１９８８７９号
【００１０】
【発明が解決しようとする課題】
本発明は上記従来技術の不都合を解決するために創作されたものであり、その目的は、異方導電性フィルムの端面が基材フィルムからはみ出さない積層テープを提供することにある。
【００１１】
【課題を解決するための手段】
本発明の発明者等は、上記のようにはみ出し部分１１５が生じる原因は、積層フィルムをロール状に巻き取る際、又は巻き取った後に異方導電性フィルムが押圧されるためであると考えた。ロールの巻き取り条件や保管条件を管理すれば、はみ出しは防止できると予想されるが、むしろ、積層フィルムの構造を改善することや、用いる異方導電性フィルムの粘度を変えることで改善できることを見出した。
【００１２】
本発明は上記知見に基いて創作されたものであり、請求項１記載の発明は、接着性を有する軟性樹脂中に導電性粒子が分散された異方導電性フィルムが、ベースフィルムとカバーフィルムで挟まれた積層構造の原反を裁断して複数本の積層テープを作成し、前記積層テープを巻き取る積層テープ製造方法であって、前記軟性樹脂に、３０℃における粘度が１０8ｍＰａ・ｓｅｃ以下のものを用い、裁断の際に前記原反に刃を押し当てて前記異方導電性フィルムを後退させ、巻き取る前の前記積層テープの前記異方導電性フィルムの幅をＷA(ｍｍ)、厚みをｔ(ｍｍ)、及び前記ベースフィルムの幅と前記カバーフィルムの幅の狭い方をＷP(ｍｍ)としたときに、前記幅ＷAを、ＷP×(ｔ−０．００２)／ｔ以下の大きさにする積層テープ製造方法である。
【００１３】
【発明の実施の形態】
図３の符号１０は、本発明の一例の積層テープであり、接着性を有する軟性樹脂中に導電性粒子が分散された異方導電性フィルム１２が、ポリエチレンテレフタレート製のベースフィルム１１とカバーフィルム１３に挟まれている。
【００１４】
異方導電性フィルムの幅をＷA(ｍｍ)、厚みをｔ(ｍｍ)とし、ベースフィルムの幅と前記カバーフィルムの幅のうちの狭い方の幅をＷP(ｍｍ)とし、巻き取られて異方導電性フィルム１２が圧縮したときの圧縮量をＱ(ｍｍ)としたときに、異方導電性フィルムの幅ＷAが、
ＷA ≦ ＷP×(ｔ−Ｑ)／ｔ……(１)
を満たす大きさにされている。
【００１５】
積層テープ１０をロール状に巻きとった場合、圧縮量Ｑは最大で２μｍであることが実験により観察されているから、異方導電性フィルム１２の幅ＷAは、最大でもＷP×(ｔ−０．００２)／ｔ以下の大きさでなければならない。即ち、上記(１)式中のＱは０．００２であり、異方導電性フィルムの幅ＷAは下記(２)式を満たさなければならない。
ＷA ≦ ＷP×(ｔ−０．００２)／ｔ……(２)
【００１６】
図４(ａ)の符号１０1、１０2は、本発明の積層テープであり、４ｍｍ×１０ｍｍの平面形状である。ここで用いたベースフィルム１１、異方導電性フィルム１２、カバーフィルム１３の厚みは、それぞれ５０μｍ、４５μｍ、２５μｍであり、異方導電性フィルム１２は３０℃における粘度が１０8ｍＰａ・ｓｅｃ以下の軟性樹脂に、導電性微粒子が所定量分散されて構成されている
この積層テープ１０1、１０2をガラスの底板３１上に配置し、図４(ｂ)に示すように、ガラスの天板３２を乗せた後、１ｋｇの重り３５で荷重をかけ、２４時間放置すると、異方導電性フィルム１２は、荷重によって広がり、幅が大きくなる。
【００１７】
図４(ｃ)の符号ＬAは、２３℃で２４時間放置後の異方導電性フィルム１２の幅であり、また、符号ＬBは、各試料のカバーフィルム１３の４ｍｍ部分の幅である。２３℃、２４時間経過後の幅ＬAは、積層フィルム１０をロール状にして保管したときの異方導電性フィルム１２の幅と等しいと予想される。
【００１８】
荷重をかける前の異方導電性フィルムの幅ＷAが３．９ｍｍの場合を試料１、３．８ｍｍの場合を試料２として、上記幅ＬA、Ｌbを測定した。その測定結果を下記表１に示す。表１中、比較例とあるのは上記(２)式を満足しない従来技術の試料の測定結果であり、異方導電性フィルムの幅ＷAが４．０ｍｍの場合である。
【００１９】
【表１】

Figure 0003921452
【００２０】
試料１では、ＬA−ＬBがゼロよりも大きくなっており、異方導電性フィルム１２が、ベースフィルム１１とカバーフィルム１３の縁から外部にはみ出しているが、カバーフィルム１３を簡単に剥離することができた。従って、実際の使用上問題がない。
【００２１】
それに対し、比較例では、カバーフィルム１３を剥がすときに、異方導電性フィルム１２とベースフィルム１１との間に隙間が生じてしまい、カバーフィルム１３だけを剥がすことは困難であった。
【００２２】
これらのことから、実際の使用上、はみ出し量は０．１ｍｍ以下であれば実使用上問題がないと予想される。
【００２３】
【実施例】
次に、上記の積層フィルム１０の製造工程を説明する。
図１(ａ)、(ｂ)及び図２(ａ)、(ｂ)の符号１９は原反であり、図１(ｃ)、(ｄ)及び図２(ａ)の符号１０は積層フィルムである。
【００２４】
原反１９は、幅広の異方導電性フィルム１２が、幅広のベースフィルム１１とカバーフィルム１３とで挟まれた状態で図２(ａ)に示すように、ロール状に巻かれており、この原反１９から積層フィルム１０を得る場合には、ロールから原反１９を繰り出し、列設された複数の下刃１７上を一定速度で走行させ、原反１９上に位置する上刃１８を、先ず、図１(ｂ)に示すように、カバーフィルム１３上に押し当てる。
【００２５】
ここでは上刃１８は円盤状であり、原反１９の走行方向に沿って配置され、原反１９の走行方向と同方向に、原反１９の速度に対して等速度で回転するように構成されている。
【００２６】
上刃１８をカバーフィルム１３に当接させ、カバーフィルム１３を押圧すると、軟性樹脂で構成される異方導電性フィルム１２は、カバーフィルム１３によって押圧され、上刃１８で押圧された部分の両側に押し退けられる。
【００２７】
上刃１８の縁は鋭利に成形されており、上刃１８を原反１９に強く押しつけると、図１(ｃ)に示すように、異方導電性フィルム１２がカバーフィルム１３によって押し退けられた状態で切断される。
【００２８】
図１(ｃ)のように、一旦上刃１８が原反１９に食い込み、ベースフィルム１１まで切断された状態になった後、上刃１８が回転しながら原反１９が一定速度で走行を続けると、異方導電性フィルム１２は、上刃１８による切断部分の両側に押し退けられながら、カバーフィルム１３やベースフィルム１１と共に切断される。
【００２９】
符号１６は、カバーフィルム１３の切断部分であり、この切断部分が異方導電性フィルム１２を押し退ける結果、異方導電性フィルム１２の切断された端面は、カバーフィルム１３やベースフィルム１１の切断された端面よりも後退する。
【００３０】
図１(ｄ)の符号Ｗsは、ベースフィルム１１の切断端面と異方導電性フィルム１２の切断端面との間の距離、又はカバーフィルム１３の切断端面と異方導電性フィルム１２の切断面との間の距離のうち、短い方の距離である。
【００３１】
ここで用いた異方導電性フィルム１２を構成する軟性樹脂は、熱硬化性のエポキシ樹脂であり、３０℃のときの粘度は１０8ｍＰａ・ｓｅｃ以下であった。同じ温度(３０℃)雰囲気下で上刃１８をカバーフィルム１３又はベースフィルム１１の表面に当接し、積層フィルム１０を切断すると、距離Ｗsは５０μｍ以上となった。
【００３２】
用いた軟性樹脂の温度と粘度の関係は、図５に示す通りである。二種類のサンプルを測定した平均結果では、粘度は１００．１℃のとき最低値５．３１５×１０5ｍＰａ・ｓｅｃとなった。
【００３３】
【発明の効果】
異方導電性フィルムがベースフィルムやカバーフィルムの端部からはみ出さないので、容易に剥離することが出来る。
【図面の簡単な説明】
【図１】(ａ)〜(ｄ)：原反を切断して積層フィルムを製造する工程を説明する図
【図２】(ａ)、(ｂ)：原反の切断状態を説明するための図面
【図３】本発明の一例の積層フィルム
【図４】(ａ)〜(ｃ)：はみ出し量を測定した実験方法を説明するための図
【図５】本発明の積層フィルムの異方導電性フィルムを構成する軟性樹脂の粘度特性の一例
【図６】(ａ)：従来技術の積層フィルム (ｂ)：原反を切断する状態を説明するための図
【符号の説明】
１１……ベースフィルム
１２……異方導電性フィルム
１３……カバーフィルム
１９……原反[0001]
BACKGROUND OF THE INVENTION
The present invention relates to the technical field of anisotropic conductive films, and more particularly to the technical field of laminated films in which an anisotropic conductive film is sandwiched between two films.
[0002]
[Prior art]
Reference numeral 110 in FIG. 6A denotes a laminated tape, and an anisotropic conductive film 112 containing conductive particles is sandwiched between a base film 111 and a cover film 113.
[0003]
The laminated tape 110 is manufactured by cutting a wide original 119 in the width direction with a knife slit 118 or the like as shown in FIG. 6B, and a plurality of laminated tapes from one original 119. 110 is obtained.
[0004]
Then, after the raw fabric 119 is cut, the obtained laminated tape 110 is wound into a roll with a length of about several tens of meters and stored / moved.
[0005]
When sticking the semiconductor chip to the substrate using the anisotropic conductive film 112, the semiconductor chip is fed out from the roll by a necessary amount, first, the cover film 113 is peeled off, and one surface of the anisotropic conductive film 112 is exposed to the surface. Is attached to a substrate or the like and cut, and then the base film 111 is peeled off, and a semiconductor chip or the like is placed on the anisotropic conductive film 112 and attached by pressing.
[0006]
However, when the roll of the laminated film 110 is stored for a long time, the anisotropic conductive film 112 protrudes from between the base film 111 and the cover film 113.
[0007]
Reference numeral 115 in FIG. 6A indicates the protruding portion. When such protruding portion 115 exists, the cover film 113 cannot be peeled off from the anisotropic conductive film 112 or the anisotropic conductive film 112. There is a problem that the film cannot be removed cleanly from the base film 111.
[0008]
Conventionally, the cause of the protrusion is considered to exist in the cutting process of the original fabric 119, and the shape of the upper blade 118, cutting conditions, and the like have been devised.
[0009]
In addition, the technique which cut | disconnects laminated bodies, such as raw fabric 119, is widely used besides the field | area of an anisotropic conductive film, and the trial which devises the shape of an upper blade and a lower blade is made | formed.
[Patent Document 1]
JP 2001-198879 A
[Problems to be solved by the invention]
The present invention was created to solve the above-described disadvantages of the prior art, and an object thereof is to provide a laminated tape in which the end surface of the anisotropic conductive film does not protrude from the base film.
[0011]
[Means for Solving the Problems]
The inventors of the present invention considered that the reason why the protruding portion 115 is generated as described above is that the anisotropic conductive film is pressed when the laminated film is wound in a roll shape or after winding. . By controlling the roll winding and storage conditions, it is expected that protrusion can be prevented, but rather, it can be improved by improving the structure of the laminated film and changing the viscosity of the anisotropic conductive film used. I found it.
[0012]
The present invention was created based on the above knowledge, and the invention according to claim 1 is characterized in that an anisotropic conductive film in which conductive particles are dispersed in a flexible resin having adhesive properties includes a base film and a cover film. A laminated tape manufacturing method for cutting a raw material of a laminated structure sandwiched between two layers to produce a plurality of laminated tapes and winding the laminated tape, wherein the soft resin has a viscosity at 30 ° C. of 10 8 mPa · used as following sec, the pressing a blade into raw during cutting retracting the anisotropic conductive film, the width of the anisotropic conductive film before the lamination tape for winding W a ( mm), when the thickness t (mm), and the narrower the width of the width and the cover film of the base film was W P (mm), the width W a, W P × (t -0. 002) / t with a method of manufacturing a laminated tape with a size of less than That.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Reference numeral 10 in FIG. 3 is a laminated tape as an example of the present invention. An anisotropic conductive film 12 in which conductive particles are dispersed in a flexible resin having adhesive properties is a base film 11 made of polyethylene terephthalate and a cover film. 13.
[0014]
The anisotropic conductive film has a width W A (mm), a thickness t (mm), and the width of the base film and the width of the cover film is W P (mm). the amount of compression when the anisotropic conductive film 12 is compressed when the Q (mm) Te, the width W a of the anisotropic conductive film,
W A ≦ W P × (t−Q) / t (1)
It is sized to meet.
[0015]
If the laminated tape 10 O'been wound into a roll, because it compression amount Q is 2μm in the maximum has been observed experimentally, the width W A of the anisotropic conductive film 12 is at most W P × (t Must be less than -0.002) / t. That is, Q in the above equation (1) is 0.002, and the width W A of the anisotropic conductive film must satisfy the following equation (2).
W A ≦ W P × (t−0.002) / t (2)
[0016]
Reference numerals 10 1 and 10 2 in FIG. 4 (a) denote the laminated tape of the present invention, which has a planar shape of 4 mm × 10 mm. The thicknesses of the base film 11, the anisotropic conductive film 12, and the cover film 13 used here are 50 μm, 45 μm, and 25 μm, respectively, and the anisotropic conductive film 12 has a viscosity at 30 ° C. of 10 8 mPa · sec or less. The laminated tapes 10 1 , 10 2 , in which a predetermined amount of conductive fine particles are dispersed in a soft resin, are placed on a glass bottom plate 31, and as shown in FIG. 4B, a glass top plate 32. When the load is applied with a weight 35 of 1 kg and left for 24 hours, the anisotropic conductive film 12 expands due to the load and becomes wider.
[0017]
The symbol L A in FIG. 4C is the width of the anisotropic conductive film 12 after being left for 24 hours at 23 ° C., and the symbol L B is the width of the 4 mm portion of the cover film 13 of each sample. . 23 ° C., the width L A of after 24 hours, the laminated film 10 is expected to be equal to the width of the anisotropic conductive film 12 when stored in a roll.
[0018]
A case where the width W A of the anisotropic conductive film before applying the load is of 3.9mm samples 1,3.8mm as Sample 2, was the width L A, the L b is measured. The measurement results are shown in Table 1 below. In Table 1, there Comparative Example above (2) the measurement results of the prior art the samples which did not satisfy the expression, a case where the width W A of the anisotropic conductive film of 4.0 mm.
[0019]
[Table 1]
Figure 0003921452
[0020]
Sample 1 has L A -L B is larger than zero, the anisotropic conductive film 12, but protrudes to the outside from the edge of the base film 11 and cover film 13, easily peeled off the cover film 13 We were able to. Therefore, there is no problem in actual use.
[0021]
On the other hand, in the comparative example, when the cover film 13 was peeled off, a gap was generated between the anisotropic conductive film 12 and the base film 11, and it was difficult to peel only the cover film 13.
[0022]
From these facts, in actual use, if the amount of protrusion is 0.1 mm or less, it is expected that there will be no problem in actual use.
[0023]
【Example】
Next, the manufacturing process of said laminated film 10 is demonstrated.
1 (a), 1 (b) and 2 (a), 2 (b) is an original fabric, and 10 (c), 1 (d) and 2 (a) is a laminated film. is there.
[0024]
The raw fabric 19 is wound in a roll shape as shown in FIG. 2A with the wide anisotropic conductive film 12 sandwiched between the wide base film 11 and the cover film 13. if the raw 19 to obtain a laminated film 10 out repeatedly the original fabric 19 from a roll, arrayed by a plurality of the upper lower blade 17 is traveling at a constant speed, the upper blade 18 positioned on the raw 19 First, as shown in FIG.1 (b), it presses on the cover film 13. FIG.
[0025]
Here, the upper blade 18 has a disk shape, is arranged along the traveling direction of the original fabric 19, and is configured to rotate at the same speed as that of the original fabric 19 in the same direction as the original fabric 19. Has been.
[0026]
When the upper blade 18 is brought into contact with the cover film 13 and the cover film 13 is pressed, the anisotropic conductive film 12 made of a soft resin is pressed by the cover film 13 and both sides of the portion pressed by the upper blade 18. Is pushed away.
[0027]
The edge of the upper blade 18 is sharply shaped, and when the upper blade 18 is strongly pressed against the original fabric 19, the anisotropic conductive film 12 is pushed away by the cover film 13 as shown in FIG. It is cut at.
[0028]
As shown in FIG. 1C, once the upper blade 18 bites into the original fabric 19 and is cut to the base film 11, the original fabric 19 continues to travel at a constant speed while the upper blade 18 rotates. Then, the anisotropic conductive film 12 is cut together with the cover film 13 and the base film 11 while being pushed away to both sides of the cut portion by the upper blade 18.
[0029]
Reference numeral 16 denotes a cut portion of the cover film 13. As a result of the cut portion pushing away the anisotropic conductive film 12, the cut end surface of the anisotropic conductive film 12 is cut from the cover film 13 or the base film 11. Retreat from the end face.
[0030]
The symbol W s in FIG. 1D indicates the distance between the cut end surface of the base film 11 and the cut end surface of the anisotropic conductive film 12, or the cut end surface of the cover film 13 and the cut surface of the anisotropic conductive film 12. The shorter of the distances between and.
[0031]
The soft resin constituting the anisotropic conductive film 12 used here was a thermosetting epoxy resin, and the viscosity at 30 ° C. was 10 8 mPa · sec or less. When the upper blade 18 was brought into contact with the surface of the cover film 13 or the base film 11 under the same temperature (30 ° C.) atmosphere and the laminated film 10 was cut, the distance W s was 50 μm or more.
[0032]
The relationship between the temperature and viscosity of the soft resin used is as shown in FIG. In the average result of measuring two kinds of samples, the viscosity was a minimum value of 5.315 × 10 5 mPa · sec when the viscosity was 100.1 ° C.
[0033]
【The invention's effect】
Since the anisotropic conductive film does not protrude from the end of the base film or the cover film, it can be easily peeled off.
[Brief description of the drawings]
1A to 1D are diagrams for explaining a process for producing a laminated film by cutting an original fabric. FIGS. 2A and 2B are diagrams for explaining a cutting state of the original fabric. Drawing [FIG. 3] Laminated film of an example of the present invention [FIG. 4] (a) to (c): A diagram for explaining an experimental method for measuring the amount of protrusion [FIG. 5] Anisotropic conductivity of the laminated film of the present invention Example of viscosity characteristics of soft resin constituting conductive film [Fig. 6] (a): Laminated film of prior art (b): Diagram for explaining the state of cutting the original fabric [Explanation of symbols]
11 ... Base film 12 ... Anisotropic conductive film 13 ... Cover film 19 ... Original fabric

Claims (1)

接着性を有する軟性樹脂中に導電性粒子が分散された異方導電性フィルムが、ベースフィルムとカバーフィルムで挟まれた積層構造の原反を裁断して複数本の積層テープを作成し、前記積層テープを巻き取る積層テープ製造方法であって、
前記軟性樹脂に、３０℃における粘度が１０8ｍＰａ・ｓｅｃ以下のものを用い、
裁断の際に前記原反に刃を押し当てて前記異方導電性フィルムを後退させ、
巻き取る前の前記積層テープの前記異方導電性フィルムの幅をＷA(ｍｍ)、厚みをｔ(ｍｍ)、及び前記ベースフィルムの幅と前記カバーフィルムの幅の狭い方をＷP(ｍｍ)としたときに、前記幅ＷAを、ＷP×(ｔ−０．００２)／ｔ以下の大きさにする積層テープ製造方法。An anisotropic conductive film in which conductive particles are dispersed in a flexible resin having adhesive properties, a plurality of laminated tapes are prepared by cutting an original fabric of a laminated structure sandwiched between a base film and a cover film, A laminated tape manufacturing method for winding a laminated tape,
The soft resin having a viscosity at 30 ° C. of 10 8 mPa · sec or less,
When cutting, the blade is pressed against the original fabric to retract the anisotropic conductive film,
Reeling width W A of the anisotropic conductive film before the laminated tape (mm), the thickness t (mm), and width as the narrow and W P (mm of the cover film of the base film ), The width W A is set to a size of W P × (t−0.002) / t or less.
JP2003056659A 2003-03-04 2003-03-04 Method for producing laminated tape of anisotropic conductive film Expired - Lifetime JP3921452B2 (en)

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JP2003056659A JP3921452B2 (en) 2003-03-04 2003-03-04 Method for producing laminated tape of anisotropic conductive film
PCT/JP2004/002493 WO2004078472A1 (en) 2003-03-04 2004-03-01 Laminated tape of anisotropic conductive film and method of manufacturing the same
TW093105274A TWI282561B (en) 2003-03-04 2004-03-01 A laminate tape of anisotropic conductive films and a manufacturing method thereof
KR1020057016324A KR100787768B1 (en) 2003-03-04 2004-03-01 Laminated Tape of Anisotropic Conductive Film and Method of Manufacturing the Same

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