TWI396022B - Anisotropic conductive film and reel - Google Patents
Anisotropic conductive film and reel Download PDFInfo
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- TWI396022B TWI396022B TW097118385A TW97118385A TWI396022B TW I396022 B TWI396022 B TW I396022B TW 097118385 A TW097118385 A TW 097118385A TW 97118385 A TW97118385 A TW 97118385A TW I396022 B TWI396022 B TW I396022B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
- Combinations Of Printed Boards (AREA)
Description
本發明係關於一種異方性導電連接用薄膜及捲軸體。The present invention relates to a film for an anisotropic conductive connection and a reel body.
以往,以將相對向的電路基板或電子零件加熱、加壓,且選擇性地將加壓方向的電極或端子間作電性連接的連接材料而言,係使用一種異方性導電性薄膜(以下稱之為ACF)、絕緣性接著薄膜(以下稱之為NCF)等電路連接材料。ACF係在將印刷配線基板、LCD用玻璃基板、可撓性印刷基板等基板、或IC、LSI等半導體元件或封裝體等進行連接時,配置在相對向的電極間,且藉由加熱及加壓,選擇性地連接電極或端子彼此。亦即,ACF及NCF係顯現兼顧相對向之電極或端子彼此的導電性、及相鄰接的電極或端子彼此的絕緣性的異方性導電連接。如此一來,該等接著薄膜係具有電路基板或電子零件間之電性連接及機械連接(接著)之雙方的功能。Conventionally, an anisotropic conductive film is used for a connecting material that electrically and presses a facing circuit board or an electronic component and selectively electrically connects electrodes or terminals in a pressurizing direction. Hereinafter, it is referred to as a circuit connecting material such as ACF) or an insulating adhesive film (hereinafter referred to as NCF). In the case of connecting a printed wiring board, a glass substrate for LCD, a substrate such as a flexible printed circuit board, or a semiconductor element such as an IC or an LSI, or a package, the ACF is disposed between the opposing electrodes, and is heated and added. Pressing, selectively connecting the electrodes or terminals to each other. That is, the ACF and the NCF show an anisotropic conductive connection that takes into consideration the electrical conductivity of the electrodes or the terminals and the insulation between the adjacent electrodes or terminals. In this way, the adhesive films have the functions of both electrical and mechanical connections (and subsequent) between the circuit board and the electronic components.
在具代表性的ACF及NCF係適於使用環氧樹脂系接著劑或丙烯酸系接著劑等接著劑成分。例如ACF係使視需要摻合在上述接著劑成分中的導電性粒子分散而成。該等接著薄膜係以疊層在PET(聚對苯二甲酸乙二酯)薄膜等支持薄膜上的帶狀態様予以製品化。此外,為了保護該等接著薄膜的表面免於受到外氣中的粉塵等影響,亦會有在接著薄膜之與支持薄膜相反之側的主面上另外疊層有保 護薄膜的情形(參照例如專利文獻1)。In the representative ACF and NCF, an adhesive component such as an epoxy resin adhesive or an acrylic adhesive is suitably used. For example, ACF is obtained by dispersing conductive particles which are blended in the above-mentioned adhesive component as needed. These adhesive films are produced by a state in which they are laminated on a support film such as a PET (polyethylene terephthalate) film. In addition, in order to protect the surface of the adhesive film from dust or the like in the external air, there is also a separate lamination on the main surface of the film opposite to the support film. In the case of a protective film (see, for example, Patent Document 1).
在第4圖顯示疊層有上述之支持薄膜、接著薄膜及保護薄膜之三層構造之異方性導電連接用薄膜的習知例。第4圖係顯示習知之異方性導電連接用薄膜之長邊方向中的端部。異方性導電連接用薄膜40係具有依序疊層有支持薄膜41、ACF等接著薄膜42、及保護薄膜43的構成。習知之異方性導電連接用薄膜40係在疊層上述各薄膜41、42及43之後,以成為預定長度的方式,以垂直於疊層方向的方式切斷而得。因此,該異方性導電連接用薄膜40之長度方向之端面4a係與疊層方向呈正交,而且各薄膜41、42及43之端面係彼此形成為一致的平面。Fig. 4 shows a conventional example of a film for anisotropic conductive connection in which a three-layer structure of the above-mentioned support film, adhesive film, and protective film is laminated. Fig. 4 is a view showing an end portion in the longitudinal direction of a conventional film for an anisotropic conductive connection. The film 40 for the anisotropic conductive connection has a structure in which a support film 41, an adhesive film 42 such as ACF, and a protective film 43 are laminated in this order. The conventional anisotropic conductive connecting film 40 is obtained by laminating the above-mentioned respective films 41, 42 and 43 so as to have a predetermined length so as to be perpendicular to the lamination direction. Therefore, the end faces 4a in the longitudinal direction of the anisotropic conductive connecting film 40 are orthogonal to the lamination direction, and the end faces of the respective films 41, 42 and 43 are formed to have a uniform plane.
使用如上所示之三層構造之異方性導電連接用薄膜40的電路基板或電子零件中之電極等的連接一般係以下述方式進行。首先,將保護薄膜43由異方性導電連接用薄膜40予以剝離去除。接著,使所露出之接著薄膜42之其中一主面接觸電路基板等被著體表面而進行暫時壓接。之後,將支持薄膜41剝離去除。接著,藉由使所露出之接著薄膜42之另一主面接觸其他被著體表面,一面在該等的疊層方向加壓一面加熱(正式壓接),使該等電路基板等所具備的電極等的連接完成。保護薄膜43的剝離去除係使用例如手指等而將接著薄膜42及保護薄膜43間進行剝離而進行。The connection of the circuit board of the anisotropic conductive connection film 40 or the electrode or the like in the electronic component using the three-layer structure as described above is generally performed in the following manner. First, the protective film 43 is peeled off by the anisotropic conductive connection film 40. Then, one of the main surfaces of the exposed adhesive film 42 is brought into contact with the surface of the substrate to be temporarily pressed, and the like. Thereafter, the support film 41 is peeled off and removed. Then, the other main surface of the exposed adhesive film 42 is brought into contact with the other surface of the object to be pressed, and heated in the lamination direction (main pressure bonding) to provide the circuit board or the like. The connection of the electrodes and the like is completed. The peeling removal of the protective film 43 is performed by peeling between the adhesive film 42 and the protective film 43 using, for example, a finger.
(專利文獻1)日本專利特開2004-211017號公報(Patent Document 1) Japanese Patent Laid-Open No. 2004-211017
但是,近年來隨著各種電子機器的小型化,其電子機器所配備的電路基板或電子零件亦逐漸小型化。由此,ACF等接著薄膜係需要隨著其薄膜化而將薄膜寬度更加狹窄化。However, in recent years, with the miniaturization of various electronic devices, circuit boards or electronic components provided in electronic devices have been gradually miniaturized. Therefore, the film of the ACF or the like needs to be thinned more narrowly as it is thinned.
但是,如第4圖所示之習知之異方性導電連接用薄膜40係隨著薄膜化及薄膜寬度的狹小化,選擇性地將保護薄膜43剝離去除乃變得逐漸困難。亦即,該異方性導電連接用薄膜40由於端面4a形成為如上所述之態樣,因此當膜厚變薄或薄膜寬度變狹時,藉由手指等而僅剝離保護薄膜43及接著薄膜42間乃變得較為困難。However, as the thin film 40 for the anisotropic conductive connection shown in FIG. 4 is thinned and the film width is narrowed, it is gradually difficult to selectively peel off the protective film 43. In other words, the film 4 for the anisotropic conductive connection is formed as described above, so that when the film thickness is reduced or the film width is narrowed, only the protective film 43 and the film are peeled off by fingers or the like. 42 rooms have become more difficult.
此外,亦已考慮一種方法係將接著片帶黏貼在保護薄膜43及支持薄膜41所露出的主面,藉由將該等彼此拉伸而將保護薄膜43剝離去除。當以該方法進行剝離時,必須使支持薄膜41及接著薄膜42間的剝離強度比保護薄膜43及接著薄膜42間的剝離強度高一定程度。但是,該等之剝離強度亦取決於接著薄膜42的構成材料,其構成材料係依接著薄膜42的用途而決定。因此,亦會有無法獲得藉由使用接著片帶的方法而選擇性地將保護薄膜43剝離去除所需的上述剝離強度的情形。Further, a method has been considered in which the adhesive tape is adhered to the main surface of the protective film 43 and the support film 41, and the protective film 43 is peeled off by stretching the layers. When peeling by this method, it is necessary to make the peeling strength between the support film 41 and the adhesive film 42 higher than the peeling strength between the protective film 43 and the adhesive film 42 to some extent. However, the peel strength of these films also depends on the constituent material of the adhesive film 42, and the constituent materials are determined depending on the use of the film 42. Therefore, there is a case where the above peel strength required for selectively removing the protective film 43 by using the method of using the adhesive tape is not obtained.
因此,本發明係鑑於上述情形而研創者,目的在提供一種可足夠確實地選擇性地僅將包夾接著薄膜之薄膜中之其中一方薄膜剝離去除的異方性導電連接用薄膜、及具備 該異方性導電連接用薄膜的捲軸體。Therefore, the present invention has been made in view of the above circumstances, and it is an object of the invention to provide a film for anisotropic conductive connection which can selectively and selectively remove only one of the films of the film which is bonded to the film, and The reel body of the film for the anisotropic conductive connection.
為了達成上述目的,本發明係提供一種異方性導電連接用薄膜,係具備依序疊層有第1薄膜、接著薄膜及第2薄膜之疊層體的帶狀異方性導電連接用薄膜,其特徵為:接著薄膜係在面內具有第2薄膜之長邊方向之端面與接著薄膜之主面的交叉部,而且從與接著薄膜的主面呈正交的基準面突出。In order to achieve the above object, the present invention provides a film for anisotropic conductive connection, comprising a film for a strip-shaped anisotropic conductive connection in which a first film, a film of a film, and a film of a second film are laminated in this order. The film is characterized in that the film has an intersection between the end surface of the second film in the longitudinal direction and the main surface of the film, and protrudes from a reference surface orthogonal to the main surface of the film.
若為習知之異方性導電連接用薄膜40,若在未觸及接著薄膜42及支持薄膜41的情形,要僅抓取保護薄膜43在實質上是不可能的。因此,選擇性地將如上所示之異方性導電連接用薄膜40的保護薄膜43剝離去除係極為困難的。In the case of the conventional anisotropic conductive connection film 40, it is substantially impossible to grasp only the protective film 43 without touching the adhesive film 42 and the support film 41. Therefore, it is extremely difficult to selectively peel off the protective film 43 of the anisotropic conductive connecting film 40 as described above.
另一方面,本發明之異方性導電連接用薄膜由於接著薄膜比上述之基準面更為突出,因而無須以手指等抓取第2薄膜,而可至少僅抓取接著薄膜。接著,依所抓取的接著薄膜及情形的不同,除此以外若將第1薄膜朝疊層方向的第1薄膜側彎曲,藉由第2薄膜之彎曲彈性的作用,在第2薄膜及接著薄膜彼此拉伸的方向施力。藉此,第2薄膜會由其長度方向的端面側剝離。之後,另外抓取第2薄膜的剝離部分,或者持有黏貼在第2薄膜及第1薄膜的接著片帶,朝將接著薄膜及第2薄膜彼此分離的方向拉伸,即可足夠確實地選擇性地僅將第2薄膜剝離去除。On the other hand, since the film for anisotropic conductive connection of the present invention protrudes more than the above-mentioned reference surface, it is not necessary to grasp the second film by fingers or the like, and at least only the film can be grasped. Then, depending on the film to be picked up and the case, the first film is bent toward the first film side in the lamination direction, and the second film is bonded to the second film by the action of the bending elasticity of the second film. The films are forced in a direction in which they are stretched from each other. Thereby, the second film is peeled off from the end surface side in the longitudinal direction. Thereafter, the peeling portion of the second film is additionally grasped, or the adhesive tape adhered to the second film and the first film is stretched, and the film is stretched in a direction in which the film and the second film are separated from each other. Only the second film was peeled off.
本發明之異方性導電連接用薄膜係最好另外具備用以指示第2薄膜之端面的指示手段。藉此,即使異方性導電連接用薄膜經小型化,亦可輕易地視認第2薄膜之端面,因此無須觸及第2薄膜,即可更加輕易地僅抓取接著薄膜等。結果,可更為確實且簡便地將第2薄膜予以剝離去除。It is preferable that the film for anisotropic conductive connection of the present invention further has an indicating means for indicating the end surface of the second film. Thereby, even if the film for anisotropic conductive connection is miniaturized, the end surface of the second film can be easily visually recognized, so that it is easier to grasp only the adhesive film or the like without touching the second film. As a result, the second film can be peeled off more reliably and easily.
此外,本發明係提供一種捲軸體,其特徵為具備:捲芯、及捲繞在該捲芯之上述之異方性導電連接用薄膜。由該捲軸體所拉出的異方性導電連接用薄膜係具備有上述之構成,因此可足夠確實地選擇性地僅將第2薄膜剝離去除。Further, the present invention provides a reel body comprising: a winding core; and the above-described anisotropic conductive connecting film wound around the winding core. Since the film for anisotropic conductive connection pulled out by the reel body has the above-described configuration, it is possible to selectively and selectively remove only the second film.
根據本發明,提供一種可十分確實地僅將包夾接著薄膜之薄膜中的其中一方薄膜選擇性地剝離去除的異方性導電連接用薄膜。According to the present invention, there is provided a film for anisotropic conductive connection which can selectively remove only one of the films of the film which is adhered to the film.
以下視需要,一面參照圖示,一面詳細說明本發明之較佳實施形態。其中,圖中,對於同一要素標註相同之元件符號,且省略重複說明。此外,上下左右等的位置關係若無特別指明,即根據圖示所示之位置關係。此外,圖示的尺寸比率並非侷限於圖示的比率。Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same components are denoted by the same reference numerals, and the description thereof will not be repeated. Further, the positional relationship such as up, down, left, right, and the like is based on the positional relationship shown in the drawing unless otherwise specified. Further, the illustrated size ratio is not limited to the illustrated ratio.
第1圖係以模式顯示本發明之較佳第1實施形態之帶 狀的異方性導電連接用薄膜的長邊方向端部的剖視圖。本實施形態之異方性導電連接用薄膜10係具備有依序疊層有作為第1薄膜的支持薄膜11、接著薄膜12、作為第2薄膜的保護薄膜13的疊層體15。此外,該異方性導電連接用薄膜10係在保護薄膜13之與接著薄膜12相反之側的主面上,具備用以指示保護薄膜13之端面13a的指示手段18。Fig. 1 is a view showing a preferred embodiment of the present invention in a mode A cross-sectional view of the end portion in the longitudinal direction of the film for an anisotropic conductive connection. The film 10 for anisotropic conductive connection according to the present embodiment includes a laminate 15 in which a support film 11 as a first film, a film 12, and a protective film 13 as a second film are laminated in this order. Further, the anisotropic conductive connecting film 10 is provided on the main surface of the protective film 13 opposite to the film 12, and includes an indicating means 18 for indicating the end surface 13a of the protective film 13.
異方性導電連接用薄膜10的寬度以0.3至320mm為佳,以0.5至10mm為更佳。藉此,可更加有效達到本發明所提供之僅選擇性地剝離去除保護薄膜的有利效果。The width of the film 10 for anisotropic conductive connection is preferably from 0.3 to 320 mm, more preferably from 0.5 to 10 mm. Thereby, the advantageous effect of selectively stripping and removing the protective film provided by the present invention can be more effectively achieved.
在該第1實施形態中,支持薄膜11、接著薄膜12及保護薄膜13之長邊方向L之端面11a、12a及13a係形成為與疊層體15之疊層方向S平行的面。該等端面中之支持薄膜11之端面11a及接著薄膜12之端面12a係彼此形成為一致的平面。此外,支持薄膜11及接著薄膜12係比保護薄膜13之端面13a更為突出,結果露出接著薄膜12之主面12b的一部分。In the first embodiment, the end faces 11a, 12a, and 13a of the support film 11, the adhesive film 12, and the protective film 13 in the longitudinal direction L are formed in a plane parallel to the lamination direction S of the laminate 15. The end faces 11a of the support film 11 and the end faces 12a of the film 12 in the end faces are formed in a plane conforming to each other. Further, the support film 11 and the adhesive film 12 are more protruded than the end surface 13a of the protective film 13, and as a result, a part of the main surface 12b of the film 12 is exposed.
保護薄膜13之端面13a係與本發明中的基準面16成為一致的平面,該基準面16亦即在面內具有保護薄膜之端面13a與接著薄膜12之主面12b的交叉部X,而且與接著薄膜12之主面12b呈正交的面。亦即,接著薄膜12係比基準面16更為突出。The end surface 13a of the protective film 13 is a plane that coincides with the reference surface 16 in the present invention, that is, the reference surface 16 has an intersection X of the protective film and an intersection X of the main surface 12b of the film 12, and Next, the major faces 12b of the film 12 are orthogonal faces. That is, the film 12 is then more prominent than the reference surface 16.
本實施形態之異方性導電連接用薄膜10,由於接著薄膜12比基準面16更為突出,因此無須以手指等抓取保 護薄膜13,即可選擇性地僅抓取支持薄膜11及接著薄膜12。接著,將所抓取的該等薄膜11及12朝疊層體15的疊層方向S支持薄膜11側彎曲,即藉由保護薄膜13之彎曲彈性的作用,對薄膜11及12與保護薄膜13彼此拉伸的方向施力。藉此使保護薄膜13由端面13a側剝離。之後,另外若抓取保護薄膜13的剝離部分等,而朝將薄膜11及12與保護薄膜13彼此分離的方向拉伸,即可足夠確實地選擇性地僅將保護薄膜13剝離去除。In the film 10 for anisotropic conductive connection of the present embodiment, since the film 12 is more protruded than the reference surface 16, it is not necessary to grasp with a finger or the like. The protective film 13 can selectively grasp only the support film 11 and the adhesive film 12. Then, the film 11 and 12 are grasped to support the film 11 side bending toward the lamination direction S of the laminate 15, that is, by the bending elasticity of the protective film 13, the films 11 and 12 and the protective film 13 are applied. Apply force in the direction of stretching. Thereby, the protective film 13 is peeled off from the side of the end face 13a. Thereafter, if the peeled portion of the protective film 13 or the like is grasped and stretched in a direction in which the films 11 and 12 and the protective film 13 are separated from each other, it is possible to selectively and selectively remove only the protective film 13 selectively.
接著薄膜12的主面12b最好係以可以手指等選擇地抓取接著薄膜12及支持薄膜11的程度露出。具體而言,保護薄膜13之端面13a及接著薄膜12之端面12a間的距離D最好係以1至100mm為佳,以5至80mm為較佳,以10至50mm為更佳的方式露出。當該距離D未達1mm,會有難以選擇地抓取支持薄膜11及接著薄膜12的傾向。另一方面,當距離D超過100mm,雖然保護薄膜13的剝離去除容易性幾乎沒有改變,但是會有應保護的接著薄膜12表面的露出部分變多、接著薄膜12的損失變大的傾向。Next, the main surface 12b of the film 12 is preferably exposed to such an extent that the film 12 and the support film 11 can be selectively grasped by fingers or the like. Specifically, the distance D between the end surface 13a of the protective film 13 and the end surface 12a of the film 12 is preferably 1 to 100 mm, preferably 5 to 80 mm, and more preferably 10 to 50 mm. When the distance D is less than 1 mm, there is a tendency that it is difficult to selectively grasp the support film 11 and the film 12 . On the other hand, when the distance D exceeds 100 mm, the ease of peeling removal of the protective film 13 hardly changes, but there is a tendency that the exposed portion of the surface of the adhesive film 12 to be protected is increased, and the loss of the film 12 tends to increase.
支持薄膜11可為單層,亦可為疊層2層以上的構成者。支持薄膜11最好具備選自由聚對苯二甲酸乙二酯(PET)薄膜、配向聚丙烯(OPP)薄膜、聚乙烯(PE)薄膜及聚醯亞胺薄膜所成群組之1種以上的薄膜。在該等之中,以耐熱性高且可降低成本的觀點來看,以PET薄膜及/或OPP薄膜為佳,以PET薄膜為更佳。The support film 11 may be a single layer or a laminate of two or more layers. The support film 11 is preferably one or more selected from the group consisting of a polyethylene terephthalate (PET) film, an oriented polypropylene (OPP) film, a polyethylene (PE) film, and a polyimide film. film. Among these, a PET film and/or an OPP film is preferable, and a PET film is more preferable from the viewpoint of high heat resistance and cost reduction.
此外,支持薄膜11可為視需要而以脫模處理劑處理設置有接著薄膜12之側之主面者,亦可為在其主面施行粗化處理者。以脫模處理劑而言,列舉如矽酮、矽酮醇酸(silicone alkyd)、胺基醇酸(Amino-alkyd)、烷基醇酸及三聚氰胺。此外,支持薄膜11亦可為以聚合物等塗覆(coating)其主面者。該等處理可為單獨1種或組合2種以上。Further, the support film 11 may be a main surface on which the side of the film 12 is provided by a release treatment agent as needed, or may be a roughened surface on the main surface thereof. Examples of the release treatment agent include anthrone, silicone alkyd, Amino-alkyd, alkyl alkyd, and melamine. Further, the support film 11 may be one in which a main surface is coated with a polymer or the like. These treatments may be used alone or in combination of two or more.
接著薄膜12係藉由在支持基材上塗佈接著劑組成物並予以乾燥而得。該接著薄膜12亦可藉由在支持薄膜11之主面上塗佈接著劑組成物並予以乾燥而形成在支持薄膜11上。或者,亦可在將在有別於支持薄膜11的支持基材上塗佈接著劑組成物且使其乾燥而得的薄膜由其支持基材剝離之後,藉由疊合在支持薄膜11之主面上而形成在支持薄膜11上。Next, the film 12 is obtained by applying an adhesive composition on a support substrate and drying it. The adhesive film 12 can also be formed on the support film 11 by applying an adhesive composition on the main surface of the support film 11 and drying it. Alternatively, the film obtained by applying and drying the adhesive composition on the support substrate different from the support film 11 may be laminated on the support film after being peeled off from the support substrate. The surface is formed on the support film 11.
接著薄膜12可為單層,亦可為具有疊層2層以上的構成者。此時,接著薄膜12係藉由將如上述所形成的接著薄膜作為基底層,而在其上另外形成接著薄膜而得。或者,亦可為使如上所述形成在支持薄膜11上的接著薄膜、及同樣地形成在保護薄膜13上的接著薄膜彼此相對向而進行壓接而得者。The film 12 may be a single layer or a laminate having two or more layers. At this time, the film 12 is obtained by separately forming a film which is formed as described above by using a film formed as described above as a base layer. Alternatively, the adhesive film formed on the support film 11 as described above and the adhesive film formed on the protective film 13 in the same manner may be pressed against each other.
作為接著薄膜12之原料的接著劑組成物最好為可進行異方性導電連接者。因此,該接著劑組成物亦可為含有熱可塑性樹脂、自由基聚合性化合物及自由基聚合起始劑者。或者,該接著劑組成物亦可為含有熱可塑性樹脂、熱 硬化性樹脂及潛在性硬化劑者。上述之接著劑組成物所含各成分若為習知之所謂的異方性導電性接著劑所含者即可。The adhesive composition which is the raw material of the film 12 is preferably an anisotropic conductive connection. Therefore, the adhesive composition may be a thermoplastic resin, a radically polymerizable compound, and a radical polymerization initiator. Alternatively, the adhesive composition may also contain a thermoplastic resin, heat A curable resin and a latent hardener. Each component contained in the above-mentioned adhesive composition may be contained in a so-called anisotropic conductive adhesive known in the art.
上述之接著劑組成物含有或未含有與習知之異方導電性接著劑所含有者相同的導電性粒子均可。由含有導電性粒子的接著劑組成物所形成的接著薄膜12係選擇性地將隔著導電性粒子而相對向的電極及/或端子間進行連接,並且接著具備該等構件的基板或裝置。由未含有導電性粒子的接著劑組成物所形成的接著薄膜12係使相對向的電極及/或端子間直接接觸,且接著具備該等構件的基板或裝置,藉此選擇性地連接該等電極及/或端子間。The above-mentioned adhesive composition may or may not contain the same conductive particles as those contained in a conventional anisotropic conductive adhesive. The adhesive film 12 formed of the adhesive composition containing conductive particles selectively connects the electrodes and/or the terminals facing each other via the conductive particles, and then includes a substrate or a device of the members. The adhesive film 12 formed of the adhesive composition containing no conductive particles is in direct contact with the opposing electrodes and/or terminals, and then a substrate or device having the members is provided, thereby selectively connecting the films 12 Between the electrodes and / or terminals.
此外,該接著劑組成物係除了上述各成分以外,亦可含有習知之異方導電性接著劑所含有的成分。Further, the adhesive composition may contain components other than the above-described respective components, which may be contained in a conventional anisotropic conductive adhesive.
當接著薄膜12具有疊層2層以上的構成時,各層可為彼此相同的組成,亦可為不同的組成。亦即,作為各層之原料的接著劑組成物的組成可為彼此相同或相異,亦可具備有含有導電性粒子之層及未含有導電性粒子之層之二者。例如,當接著薄膜12具備有疊層2層的構成時,支持薄膜11側之層可為未含有導電性粒子之層,保護薄膜13側之層可為含有導電性粒子之層。When the film 12 has a structure in which two or more layers are laminated, the layers may have the same composition or different compositions. That is, the composition of the adhesive composition as a raw material of each layer may be the same or different from each other, and may be provided with both a layer containing conductive particles and a layer not containing conductive particles. For example, when the adhesive film 12 has a structure in which two layers are laminated, the layer on the side of the support film 11 may be a layer containing no conductive particles, and the layer on the side of the protective film 13 may be a layer containing conductive particles.
保護薄膜13可為單層,亦可為具有疊層2層以上的構成者。以保護薄膜而言,最好具備例如選自由聚對苯二甲酸乙二酯(PET)薄膜、配向聚丙烯(OPP)薄膜、聚乙烯(PE)薄膜及聚醯亞胺薄膜所成群組之1種以上的薄 膜。在該等之中,以彎曲彈性高且降低成本的觀點來看,以OPP或PET薄膜最為適合,以PET薄膜為更佳。The protective film 13 may be a single layer or a laminate having two or more layers. In terms of the protective film, it is preferably provided, for example, selected from the group consisting of polyethylene terephthalate (PET) film, oriented polypropylene (OPP) film, polyethylene (PE) film, and polyimide film. More than one type of thin membrane. Among these, from the viewpoint of high flexural elasticity and cost reduction, an OPP or PET film is most suitable, and a PET film is more preferable.
以將保護薄膜13配置在接著薄膜12上的方法而言,係列舉另外以疊合裝置(laminator)等將保護薄膜13疊層在接著薄膜12表面的方法。或者,亦可為藉由使如上所述形成在支持薄膜11上的接著薄膜、及同樣地形成在保護薄膜13上的接著薄膜彼此相對向而進行壓接而得者。In order to arrange the protective film 13 on the adhesive film 12, a series of methods of laminating the protective film 13 on the surface of the film 12 by a laminator or the like are additionally employed. Alternatively, it may be obtained by pressure-bonding the adhesive film formed on the support film 11 as described above and the adhesive film formed on the protective film 13 in the same direction.
保護薄膜13係可視需要以脫模處理劑進行表面處理,亦可將其表面進行粗化處理。以脫模處理劑而言,係列舉矽硐、矽酮醇酸、胺基醇酸、烷基醇酸、三聚氰胺等。此外,亦可以聚合物等塗覆(coating)保護薄膜13的表面。該等係可為單獨1種或組合2種以上來進行。The protective film 13 may be surface-treated with a release agent as needed, or the surface may be roughened. In the case of the release treatment agent, a series of oxime, anthraquinone acid, amino alkyd, alkyl alkyd, melamine and the like are mentioned. Further, the surface of the protective film 13 may also be coated with a polymer or the like. These systems may be used alone or in combination of two or more.
以使支持薄膜11及接著薄膜12比基準面16更為突出的方法而言,係列舉在獲得支持薄膜11、接著薄膜12及保護薄膜13的疊層體之後,選擇性地僅將保護薄膜13的端部切斷的方法。或者,列舉在形成支持薄膜11及接著薄膜12的疊層體之後,以預先露出接著薄膜12之主面12b之一部分的方式配置保護薄膜13而進行疊合的方法。In order to make the support film 11 and the film 12 more prominent than the reference surface 16, the series of selective protective films 13 are selectively selected after obtaining the laminate of the support film 11, the film 12 and the protective film 13. The method of cutting the ends. Alternatively, after the laminate of the support film 11 and the adhesive film 12 is formed, the protective film 13 is placed in such a manner that a part of the main surface 12b of the film 12 is exposed in advance and laminated.
此外,支持薄膜11及接著薄膜12間之剝離強度與保護薄膜13及接著薄膜12間之剝離強度的差最好為0.001至10N/m。異方性導電連接用薄膜10係為了選擇性地將保護薄膜13剝離去除,支持薄膜11及接著薄膜12間比 保護薄膜13及接著薄膜間的剝離強度較強者為佳。另一方面,若考慮將接著薄膜12壓接在電路基板等被著體之後再將支持薄膜11剝離去除,被著體及接著薄膜12間比支持薄膜11及接著薄膜12間的剝離強度較強者為佳。若綜合考慮該等因素,以在上述數值範圍內之剝離強度差為佳。Further, the difference between the peeling strength between the support film 11 and the adhesive film 12 and the peel strength between the protective film 13 and the adhesive film 12 is preferably 0.001 to 10 N/m. The film 10 for anisotropic conductive connection is used to selectively peel off the protective film 13 and to support the ratio between the film 11 and the film 12 It is preferable that the peeling strength between the protective film 13 and the film is stronger. On the other hand, in consideration of peeling off the support film 11 after the adhesive film 12 is pressure-bonded to a substrate such as a circuit board, the peeling strength between the object and the film 12 is higher than that between the support film 11 and the film 12 It is better. If these factors are taken into consideration, the difference in peel strength within the above numerical range is preferred.
在習知之異方性導電連接用薄膜中,當剝離強度差在該數值範圍內時,會有難以選擇性地僅將保護薄膜剝離去除的傾向。但是,根據本發明,在如上所示之異方性導電連接用薄膜10中,亦可足夠確實地選擇性地僅將保護薄膜13剝離去除。In the conventional film for anisotropic conductive connection, when the peel strength difference is within the numerical range, it is difficult to selectively remove only the protective film. However, according to the present invention, in the anisotropic conductive connecting film 10 as described above, it is also possible to selectively and selectively remove only the protective film 13 selectively.
其中,本發明中的剝離強度係藉由流變儀(rheometer)予以測定者。Here, the peel strength in the present invention is measured by a rheometer.
上述之剝離強度差係藉由如下所述對支持薄膜11及接著薄膜12間的剝離強度、及/或保護薄膜13及接著薄膜12間的剝離強度進行調整,即可位於上述數值範圍內。具體而言,為了提高剝離強度,若減少作為接著薄膜12之原料的接著劑組成物中的樹脂(熱可塑性樹脂)的含有量、或降低該樹脂的玻璃轉移溫度(Tg)、或增加自由基聚合性化合物或熱硬化性樹脂的含有量、或將支持薄膜11及保護薄膜13的表面進行粗化處理即可。或者,為了提高剝離強度,當接著薄膜12含有導電性粒子或絕緣性固體粒子時,若減少該等之含有量即可。或者,為了降低剝離強度,亦可利用脫模處理劑來對支持薄膜11或保 護薄膜13進行表面處理,或將該等薄膜的厚度變薄即可。The peel strength difference described above can be adjusted within the above numerical range by adjusting the peel strength between the support film 11 and the adhesive film 12 and/or the peel strength between the protective film 13 and the adhesive film 12 as follows. Specifically, in order to increase the peel strength, the content of the resin (thermoplastic resin) in the adhesive composition as the raw material of the film 12 is reduced, or the glass transition temperature (Tg) of the resin is lowered, or the radical is increased. The content of the polymerizable compound or the thermosetting resin or the surface of the support film 11 and the protective film 13 may be roughened. Alternatively, in order to increase the peel strength, when the film 12 contains conductive particles or insulating solid particles, the content of the film may be reduced. Alternatively, in order to reduce the peel strength, the release film may be used to support the film 11 or The protective film 13 may be subjected to surface treatment or the thickness of the films may be reduced.
支持薄膜11、接著薄膜12及保護薄膜13的厚度若依其用途等予以調整即可,並未特別有所限制。但是,如上所述,支持薄膜11及保護薄膜13的厚度係以平均單位寬度的拉伸延展率的差異變小的方式予以調整為佳,以剝離強度差在上述數值範圍內的方式予以調整較為合適。The thickness of the support film 11, the adhesive film 12, and the protective film 13 is not particularly limited as long as it is adjusted depending on the use or the like. However, as described above, the thicknesses of the support film 11 and the protective film 13 are preferably adjusted so that the difference in the tensile elongation of the average unit width becomes small, and the peel strength difference is adjusted within the above numerical range. Suitable.
指示手段18係用以指示保護薄膜13之端面13a者。尤其當保護薄膜13為透明或半透明時,難以以目測確認其端面13a。因此,若藉由指示手段18可確認出端面13a的位置,即可更加輕易地進行保護薄膜13的剝離去除處理。該指示手段18若為可以目視進行確認者即可,例如為黑色帶狀構件,以其長邊方向軸與保護薄膜13之端面13a平行,而設在圖示之位置者為佳。The indicating means 18 is for indicating the end face 13a of the protective film 13. In particular, when the protective film 13 is transparent or translucent, it is difficult to visually confirm the end face 13a thereof. Therefore, if the position of the end surface 13a can be confirmed by the indicating means 18, the peeling removal process of the protective film 13 can be performed more easily. The indicator means 18 may be visually confirmed, for example, a black strip-shaped member, and the longitudinal direction axis is parallel to the end surface 13a of the protective film 13, and it is preferable to provide it in the position shown in the figure.
本實施形態之異方性導電連接用薄膜10係捲繞在捲芯(未圖示)而形成捲軸體。藉由如上所示構成捲軸體,使異方性導電連接用薄膜10的處理性提高。The anisotropic conductive connecting film 10 of the present embodiment is wound around a winding core (not shown) to form a reel body. By forming the reel body as described above, the handleability of the anisotropic conductive connection film 10 is improved.
第2圖係以模式顯示本發明之較佳第2實施形態之帶狀異方性導電連接用薄膜之長邊方向端部的剖視圖。本實施形態之異方性導電連接用薄膜20係具備有依序疊層支持薄膜21、接著薄膜22、保護薄膜23的疊層體25。Fig. 2 is a cross-sectional view showing the end portion in the longitudinal direction of the film for an anisotropic conductive connection according to a preferred embodiment of the present invention. The anisotropic conductive connection film 20 of the present embodiment includes a laminate 25 in which the support film 21, the adhesive film 22, and the protective film 23 are sequentially laminated.
在該第2實施形態中,支持薄膜21、接著薄膜22及保護薄膜23之長邊方向L的端面21a、22a及23a係形成為與疊層體25的疊層方向S平行的面。支持薄膜11係比 接著薄膜22之端面22a更為突出,接著薄膜22係比保護薄膜23之端面23a更為突出。結果露出支持薄膜21之主面21b及接著薄膜22之主面22b的一部分。In the second embodiment, the end faces 21a, 22a, and 23a of the support film 21, the adhesive film 22, and the protective film 23 in the longitudinal direction L are formed in a plane parallel to the lamination direction S of the laminate 25. Support film 11 system ratio Then, the end face 22a of the film 22 is more protruded, and then the film 22 is more protruded than the end face 23a of the protective film 23. As a result, a part of the main surface 21b of the support film 21 and the main surface 22b of the subsequent film 22 are exposed.
保護薄膜23之端面23a係與本發明中的基準面26形成為一致的面、該基準面26亦即在面內具有保護薄膜23之端面23a與接著薄膜22之主面22b之交叉部X,而且與接著薄膜22之主面22a呈正交的面。亦即,接著薄膜22係比基準面26更為突出。The end surface 23a of the protective film 23 is formed to face the reference surface 26 of the present invention, and the reference surface 26, that is, the intersection portion 23a of the protective film 23 and the intersection X of the main surface 22b of the film 22, Further, it faces a plane orthogonal to the main surface 22a of the film 22. That is, the film 22 is then more prominent than the reference surface 26.
此外,接著薄膜22之端面22a係與基準面27形成為一致的面、該基準面27亦即在面內具有接著薄膜22之端面22a與支持薄膜21之主面21b之交叉部Y,而且與支持薄膜21之主面21b呈正交的面。亦即,支持薄膜21係比基準面27更為突出。Further, the end surface 22a of the film 22 is formed to face the reference surface 27, that is, the reference surface 27, that is, the intersection portion Y of the end surface 22a of the film 22 and the main surface 21b of the support film 21 in the plane, and The main surface 21b of the support film 21 has orthogonal faces. That is, the support film 21 is more prominent than the reference surface 27.
本實施形態之異方性導電連接用薄膜20由於接著薄膜22比基準面26更為突出,因而無須以手指等抓取保護薄膜23,即可選擇性地僅抓取支持薄膜21及接著薄膜22。接著,若將所抓取之該等薄膜21及22朝疊層體25的疊層方向S支持薄膜21側彎曲,則藉由保護薄膜23之彎曲彈性的作用,朝向薄膜21及22與保護薄膜23彼此拉伸的方向施力。藉此使保護薄膜23由端面23a側剝離。之後,若另外抓取保護薄膜23之剝離部分等,而朝薄膜21及22與保護薄膜23彼此分離的方向拉伸,即可足夠確實地選擇地性僅將保護薄膜23剝離去除。Since the film 22 for the anisotropic conductive connection of the present embodiment protrudes more than the reference surface 26, the protective film 23 can be selectively grasped only by grasping the protective film 23 with a finger or the like, and only the support film 21 and the film 22 can be selectively grasped. . Then, when the film 21 and 22 which are grasped are bent toward the film 21 side in the lamination direction S of the laminate 25, the films 21 and 22 and the protective film are oriented by the bending elasticity of the protective film 23. 23 Apply force in the direction of stretching. Thereby, the protective film 23 is peeled off from the end surface 23a side. Thereafter, if the peeled portion or the like of the protective film 23 is additionally gripped and stretched in a direction in which the films 21 and 22 and the protective film 23 are separated from each other, it is possible to selectively and selectively remove only the protective film 23 by peeling off.
此外,本實施形態之異方性導電連接用薄膜20由於 接著薄膜21比基準面27更為突出,因而無須以手指等抓取保護薄膜23及接著薄膜22,即可選擇性地僅抓取支持薄膜21。接著,若將所抓取的支持薄膜21朝疊層體25的疊層方向S支持薄膜21側彎曲,則藉由保護薄膜23之彎曲彈性的作用,朝向薄膜21及22與保護薄膜23彼此拉伸的方向施力。藉此使保護薄膜23由端面23a側剝離。之後,若另外抓取保護薄膜23之剝離部分等,而朝薄膜21及22與保護薄膜23彼此分離的方向拉伸,即可足夠確實地選擇地性僅將保護薄膜23剝離去除。尤其當支持薄膜21及接著薄膜22間的剝離強度大於保護薄膜23及接著薄膜22間的剝離強度時,該剝離去除可更加確實地進行。Further, the anisotropic conductive connecting film 20 of the present embodiment is Then, the film 21 protrudes more than the reference surface 27, so that the support film 21 can be selectively grasped only without grasping the protective film 23 and the film 22 with a finger or the like. Then, when the gripping support film 21 is bent toward the film 21 side in the lamination direction S of the laminate 25, the film 21 and 22 and the protective film 23 are pulled toward each other by the bending elasticity of the protective film 23. Apply force in the direction of extension. Thereby, the protective film 23 is peeled off from the end surface 23a side. Thereafter, if the peeled portion or the like of the protective film 23 is additionally gripped and stretched in a direction in which the films 21 and 22 and the protective film 23 are separated from each other, it is possible to selectively and selectively remove only the protective film 23 by peeling off. In particular, when the peeling strength between the support film 21 and the adhesive film 22 is larger than the peel strength between the protective film 23 and the adhesive film 22, the peeling removal can be performed more reliably.
支持薄膜21之主面21b及接著薄膜22之主面22b係以可利用手指等選擇性地抓取支持薄膜21及接著薄膜22的程度露出為佳。具體而言,接著薄膜22之端面22a及支持薄膜21之端面21a間的距離D1最好以1至100mm為佳,以5至80mm為較佳,以10至50mm為更佳的方式露出。此外,保護薄膜23之端面23a及接著薄膜22之端面22a間的距離D2最好以10至200cm為佳,以50至150cm為較佳的方式露出。It is preferable that the main surface 21b of the support film 21 and the main surface 22b of the adhesive film 22 are exposed so that the support film 21 and the film 22 can be selectively grasped by a finger or the like. Specifically, the distance D1 between the end surface 22a of the film 22 and the end surface 21a of the support film 21 is preferably 1 to 100 mm, preferably 5 to 80 mm, and more preferably 10 to 50 mm. Further, the distance D2 between the end surface 23a of the protective film 23 and the end surface 22a of the film 22 is preferably 10 to 200 cm, preferably 50 to 150 cm.
關於本實施形態之除此以外的技術內容,係與第1實施形態相同。The other technical contents of the present embodiment are the same as those of the first embodiment.
第3圖係以模式顯示本發明之較佳第3實施形態之帶狀異方性導電連接用薄膜之長邊方向端部的剖視圖。本實 施形態之異方性導電連接用薄膜30係具備有依序疊層支持薄膜31、接著薄膜32、保護薄膜33的疊層體35。Fig. 3 is a cross-sectional view showing the end portion in the longitudinal direction of the film for an anisotropic conductive connection according to a preferred embodiment of the present invention. Real The film 30 for anisotropic conductive connection is provided with a laminate 35 in which the support film 31, the film 32, and the protective film 33 are sequentially laminated.
在該第3實施形態中,支持薄膜31、接著薄膜32及保護薄膜33之長邊方向L的端面31a、32a及33a係形成為相對於疊層體35的疊層方向S呈傾斜的面。該傾斜係以支持薄膜31比接著薄膜32之端面32a更為突出,且接著薄膜32比保護薄膜33之端面33a更為突出的方式所形成。In the third embodiment, the end faces 31a, 32a, and 33a of the support film 31, the adhesive film 32, and the protective film 33 in the longitudinal direction L are formed to be inclined with respect to the lamination direction S of the laminate 35. This inclination is formed such that the support film 31 protrudes more than the end surface 32a of the film 32, and then the film 32 is protruded more than the end surface 33a of the protective film 33.
保護薄膜33之端面33a係與本發明中的基準面36形成為一致的面、該基準面36亦即在面內具有接著薄膜33之端面33a與接著薄膜32之主面32b之交叉部X,而且與接著薄膜32之主面32b呈正交的面。亦即,接著薄膜32係比基準面36更為突出。The end surface 33a of the protective film 33 is formed to face the reference surface 36 of the present invention, and the reference surface 36 has an intersection X between the end surface 33a of the film 33 and the main surface 32b of the film 32 in the plane. Further, it faces a plane orthogonal to the main surface 32b of the film 32. That is, the film 32 is then more prominent than the reference surface 36.
接著薄膜32之端面32a係與基準面37形成為一致的面、該基準面37亦即在面內具有接著薄膜32之端面33a與支持薄膜31之主面31b之交叉部Y,而且與支持薄膜31之主面31b呈正交的面。亦即,支持薄膜31係比基準面37更為突出。Then, the end surface 32a of the film 32 is formed to face the reference surface 37, that is, the reference surface 37, that is, the intersection Y of the end surface 33a of the film 32 and the main surface 31b of the support film 31, and the support film. The main faces 31b of 31 are orthogonal faces. That is, the support film 31 is more protruded than the reference surface 37.
本實施形態之異方性導電連接用薄膜30係由於接著薄膜32比基準面36更為突出,因此無須以手指等抓取保護薄膜33,即可選擇性地僅抓取支持薄膜31及接著薄膜32。接著,若將所抓取之該等薄膜31及32朝疊層體35的疊層方向S支持薄膜31側彎曲,即藉由保護薄膜33之彎曲彈性的作用,朝薄膜31及32與保護薄膜33彼此拉 伸的方向施力。藉此,保護薄膜33由端面33a側剝離。之後,另外若抓取保護薄膜33之剝離部分等,朝薄膜31及32與保護薄膜33彼此分離的方向拉伸,即可足夠確實地選擇性地僅將保護薄膜33剝離去除。In the film for anisotropic conductive connection 30 of the present embodiment, since the adhesive film 32 protrudes more than the reference surface 36, it is possible to selectively grasp only the support film 31 and the adhesive film without grasping the protective film 33 with a finger or the like. 32. Next, when the film 31 and 32 are grasped, the film 31 side is bent toward the lamination direction S of the laminate 35, that is, by the bending elasticity of the protective film 33, toward the films 31 and 32 and the protective film. 33 pull each other Apply force in the direction of extension. Thereby, the protective film 33 is peeled off from the side of the end surface 33a. After that, if the peeled portion of the protective film 33 or the like is grasped and stretched in a direction in which the films 31 and 32 and the protective film 33 are separated from each other, it is possible to selectively and selectively remove only the protective film 33.
此外,本實施形態之異方性導電連接用薄膜30由於支持薄膜31比基準面37更為突出,因此無須以手指等抓取保護薄膜33及接著薄膜32,即可選擇性地僅抓取支持薄膜31。接著,若將所抓取之支持薄膜31朝疊層體35的疊層方向S支持薄膜31側彎曲,即藉由保護薄膜33之彎曲彈性的作用,朝薄膜31及32與保護薄膜33彼此拉伸的方向施力。藉此,保護薄膜33由端面33a側剝離。之後,另外抓取保護薄膜33之剝離部分等,朝薄膜31及32與保護薄膜33彼此分離的方向拉伸,即可足夠確實地選擇性地僅將保護薄膜33剝離去除。尤其當支持薄膜31及接著薄膜32間的剝離強度大於保護薄膜33及接著薄膜32間的剝離強度時,該剝離去除更可確實地進行。Further, in the film for anisotropic conductive connection 30 of the present embodiment, since the support film 31 protrudes more than the reference surface 37, it is possible to selectively grasp only the support film 33 without grasping the protective film 33 and the adhesive film 32 with a finger or the like. Film 31. Then, if the grasped support film 31 is bent toward the film 31 side in the lamination direction S of the laminate 35, that is, by the bending elasticity of the protective film 33, the films 31 and 32 and the protective film 33 are pulled toward each other. Apply force in the direction of extension. Thereby, the protective film 33 is peeled off from the side of the end surface 33a. Thereafter, the peeling portion or the like of the protective film 33 is additionally gripped, and the film 31 and 32 are stretched in a direction in which the protective film 33 is separated from each other, so that only the protective film 33 can be selectively and selectively removed. In particular, when the peeling strength between the support film 31 and the adhesive film 32 is larger than the peel strength between the protective film 33 and the adhesive film 32, the peeling removal can be performed more reliably.
上述端面的傾斜最好係以可利用手指等選擇性地抓取支持薄膜31及接著薄膜32的程度露出。具體而言,保護薄膜33之端面33a與接著薄膜32之主面32b之交叉部X、及接著薄膜32之端面32a與支持薄膜31之主面31b之交叉部Y之間的距離D1最好係以1至100mm為佳,以5至80mm為較佳,以10至50mm為更佳的方式予以傾斜。此外,接著薄膜32之端面32a與支持薄膜31之主面31b之交叉部Y、及支持薄膜31之端面31a的下端部 Z之間的距離D2最好以1mm至200cm為佳,以5mm至150cm為較佳的方式予以傾斜。It is preferable that the inclination of the end face is exposed to such an extent that the support film 31 and the film 32 can be selectively grasped by a finger or the like. Specifically, the distance D1 between the end surface 33a of the protective film 33 and the intersection X of the main surface 32b of the film 32, and the intersection D of the end surface 32a of the film 32 and the main surface 31b of the support film 31 is preferably It is preferably 1 to 100 mm, preferably 5 to 80 mm, and preferably 10 to 50 mm. Further, the intersection of the end surface 32a of the film 32 with the main surface 31b of the support film 31 and the lower end portion of the end surface 31a of the support film 31 are provided. The distance D2 between Z is preferably from 1 mm to 200 cm, and is preferably inclined from 5 mm to 150 cm.
關於本實施形態之除此以外的技術內容,係與第1實施形態相同。The other technical contents of the present embodiment are the same as those of the first embodiment.
以上係就本發明之較佳實施形態加以說明,惟本發明並非限定於上述實施形態。本發明在未脫離其要旨的範圍內可為各種變形。The above is a description of the preferred embodiments of the present invention, but the present invention is not limited to the above embodiments. The present invention may be variously modified without departing from the spirit and scope of the invention.
例如,在本發明第2及第3實施形態中,與第1實施形態相同地,亦可在與保護薄膜之與接著薄膜側相反之側的主面上具備有指示手段。其中,在第3實施形態中,為了指示保護薄膜33之端面33a的下端(X),亦可在端面33a上具備有指示手段。此外,指示手段亦可利用油性油墨等直接書寫在保護薄膜。For example, in the second and third embodiments of the present invention, as in the first embodiment, an instruction means may be provided on the main surface on the side opposite to the film side of the protective film. In the third embodiment, in order to indicate the lower end (X) of the end surface 33a of the protective film 33, an indication means may be provided on the end surface 33a. Further, the indicating means can also be directly written on the protective film using an oily ink or the like.
此外,亦可取代指示手段,而藉由將保護薄膜的一部分或全部著色,以目測來確認其端面。或者,當保護薄膜為聚對苯二甲酸乙二酯薄膜時,若為對該保護薄膜照射紫外線的狀態,即可以目測來確認其端面。Further, instead of the indicating means, the end surface of the protective film may be visually confirmed by coloring a part or all of the protective film. Alternatively, when the protective film is a polyethylene terephthalate film, the end face can be visually confirmed by irradiating the protective film with ultraviolet rays.
10、20、30、40‧‧‧異方性導電連接用薄膜10, 20, 30, 40‧‧‧ anisotropic conductive film
11、21、31、41‧‧‧支持薄膜11, 21, 31, 41‧‧‧ Support film
4a、11a、12a、13a、21a、22a、23a、31a、32a、33a‧‧‧端面4a, 11a, 12a, 13a, 21a, 22a, 23a, 31a, 32a, 33a‧‧‧ end faces
12、22、32、42‧‧‧接著薄膜12, 22, 32, 42‧‧‧ followed by film
12b、21b、22b、32b‧‧‧主面12b, 21b, 22b, 32b‧‧‧ main faces
13、23、33、43‧‧‧保護薄膜13, 23, 33, 43‧ ‧ protective film
15、25、35‧‧‧疊層體15, 25, 35‧‧ ‧ laminate
16、26、27、36、37‧‧‧基準面16, 26, 27, 36, 37‧‧ ‧ datum
18‧‧‧指示手段18‧‧‧Instructions
D、D1、D2‧‧‧距離D, D1, D2‧‧‧ distance
X‧‧‧交叉部X‧‧‧Intersection
Y‧‧‧交叉部Y‧‧‧Intersection
Z‧‧‧下端部Z‧‧‧Bottom
第1圖係顯示本發明第1實施形態之異方性導電連接用薄膜之一部分的模式剖視圖。Fig. 1 is a schematic cross-sectional view showing a part of the film for anisotropic conductive connection according to the first embodiment of the present invention.
第2圖係顯示本發明第2實施形態之異方性導電連接用薄膜之一部分的模式剖視圖。Fig. 2 is a schematic cross-sectional view showing a part of the film for anisotropic conductive connection according to the second embodiment of the present invention.
第3圖係顯示本發明第3實施形態之異方性導電連接 用薄膜之一部分的模式剖視圖。Figure 3 is a diagram showing the anisotropic conductive connection of the third embodiment of the present invention. A schematic sectional view of a portion of the film.
第4圖係顯示習知之異方性導電連接用薄膜之一部分的模式剖視圖。Fig. 4 is a schematic cross-sectional view showing a part of a conventional film for anisotropic conductive connection.
10‧‧‧異方性導電連接用薄膜10‧‧‧Amorphous film for conductive connection
11‧‧‧支持薄膜11‧‧‧Support film
11a、12a、13a‧‧‧端面End faces 11a, 12a, 13a‧‧
12‧‧‧接著薄膜12‧‧‧Next film
12b‧‧‧主面12b‧‧‧Main face
13‧‧‧保護薄膜13‧‧‧Protective film
15‧‧‧疊層體15‧‧‧Laminated body
16‧‧‧基準面16‧‧‧ datum
18‧‧‧指示手段18‧‧‧Instructions
D‧‧‧距離D‧‧‧Distance
X‧‧‧交叉部X‧‧‧Intersection
Claims (25)
Applications Claiming Priority (1)
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JP2007136982A JP5104034B2 (en) | 2007-05-23 | 2007-05-23 | Anisotropic conductive connection film and reel body |
Publications (2)
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TW200912491A TW200912491A (en) | 2009-03-16 |
TWI396022B true TWI396022B (en) | 2013-05-11 |
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TW101145098A TWI456322B (en) | 2007-05-23 | 2008-05-19 | Thin film and reel body for anisotropic conductive connection |
TW097118385A TWI396022B (en) | 2007-05-23 | 2008-05-19 | Anisotropic conductive film and reel |
Family Applications Before (1)
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TW101145098A TWI456322B (en) | 2007-05-23 | 2008-05-19 | Thin film and reel body for anisotropic conductive connection |
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JP (1) | JP5104034B2 (en) |
KR (3) | KR20110126189A (en) |
CN (4) | CN102324272A (en) |
TW (2) | TWI456322B (en) |
WO (1) | WO2008142985A1 (en) |
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JP4596089B2 (en) * | 2009-03-26 | 2010-12-08 | 日立化成工業株式会社 | Adhesive reel |
JP5459099B2 (en) * | 2010-06-24 | 2014-04-02 | デクセリアルズ株式会社 | Manufacturing method of semiconductor device |
JP5759168B2 (en) * | 2010-12-24 | 2015-08-05 | デクセリアルズ株式会社 | Reel body and method for manufacturing reel body |
JP5737134B2 (en) * | 2011-10-21 | 2015-06-17 | Tdk株式会社 | Adhesive sheet, display part and adhesive sheet manufacturing method |
WO2014024478A1 (en) * | 2012-08-07 | 2014-02-13 | パナソニック株式会社 | Production method for joined body, and joined body |
JP6170290B2 (en) * | 2012-10-11 | 2017-07-26 | 日東電工株式会社 | Laminate |
JP2016096308A (en) * | 2014-11-17 | 2016-05-26 | 日東電工株式会社 | Semiconductor device manufacturing method |
JP6677966B2 (en) * | 2014-11-17 | 2020-04-08 | 日東電工株式会社 | Sealing sheet with separator and method of manufacturing semiconductor device |
JP6689135B2 (en) * | 2016-05-20 | 2020-04-28 | デクセリアルズ株式会社 | Adhesive tape structure |
JP6829998B2 (en) * | 2017-01-25 | 2021-02-17 | 日東シンコー株式会社 | Adhesive sheet with base material and semiconductor module |
JP6641338B2 (en) * | 2017-11-02 | 2020-02-05 | 積水化学工業株式会社 | Laminated film and method for producing laminated film |
CN109341909B (en) * | 2018-11-20 | 2020-11-10 | 郑州大学 | Multifunctional flexible stress sensor |
KR102103745B1 (en) * | 2020-02-06 | 2020-05-29 | (주)에이치케이 | Apparatus for attaching release film for EMI shielding film and thereof method |
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- 2008-05-02 KR KR1020097016729A patent/KR101183299B1/en active IP Right Grant
- 2008-05-02 WO PCT/JP2008/058430 patent/WO2008142985A1/en active Application Filing
- 2008-05-02 CN CN2011102086234A patent/CN102324272A/en active Pending
- 2008-05-02 CN CN201110208628.7A patent/CN102352194B/en active Active
- 2008-05-02 CN CN2011102086395A patent/CN102354816A/en active Pending
- 2008-05-02 CN CNA2008800048234A patent/CN101606282A/en active Pending
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WO2007015372A1 (en) * | 2005-08-04 | 2007-02-08 | Hitachi Chemical Co., Ltd. | Anisotropic conductive film and method for producing same |
Also Published As
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KR101183299B1 (en) | 2012-09-14 |
WO2008142985A1 (en) | 2008-11-27 |
CN102352194A (en) | 2012-02-15 |
KR20110126189A (en) | 2011-11-22 |
TW200912491A (en) | 2009-03-16 |
CN102354816A (en) | 2012-02-15 |
KR101180619B1 (en) | 2012-09-06 |
CN102324272A (en) | 2012-01-18 |
TW201314329A (en) | 2013-04-01 |
KR20110126188A (en) | 2011-11-22 |
JP2008293751A (en) | 2008-12-04 |
JP5104034B2 (en) | 2012-12-19 |
CN102352194B (en) | 2015-11-25 |
TWI456322B (en) | 2014-10-11 |
KR20090122923A (en) | 2009-12-01 |
CN101606282A (en) | 2009-12-16 |
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