WO2007015372A1 - Anisotropic conductive film and method for producing same - Google Patents

Anisotropic conductive film and method for producing same Download PDF

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Publication number
WO2007015372A1
WO2007015372A1 PCT/JP2006/314267 JP2006314267W WO2007015372A1 WO 2007015372 A1 WO2007015372 A1 WO 2007015372A1 JP 2006314267 W JP2006314267 W JP 2006314267W WO 2007015372 A1 WO2007015372 A1 WO 2007015372A1
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WO
WIPO (PCT)
Prior art keywords
anisotropic conductive
support
layer
conductive film
width
Prior art date
Application number
PCT/JP2006/314267
Other languages
French (fr)
Japanese (ja)
Inventor
Takashi Tatsuzawa
Original Assignee
Hitachi Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co., Ltd. filed Critical Hitachi Chemical Co., Ltd.
Priority to JP2007529209A priority Critical patent/JP4650490B2/en
Priority to CN2006800282694A priority patent/CN101233655B/en
Publication of WO2007015372A1 publication Critical patent/WO2007015372A1/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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Definitions

  • the present invention relates to an anisotropic conductive film. More specifically, the anisotropic conductive adhesive is formed in a film-like support on a film-like support, and the anisotropic conductivity is suppressed by preventing the adhesive from seeping out from the side edge of the adhesive.
  • the present invention relates to a film and its manufacturing method.
  • An anisotropic conductive film (hereinafter sometimes referred to as ACF) is used as a connection material for connecting connected members having a large number of opposing electrodes.
  • the ACF keeps the conductive state between the opposing electrodes when connecting substrates such as printed wiring boards, glass substrates for LCDs, flexible printed boards, etc., and semiconductor elements such as ICs and LSIs, and packages.
  • It is a connecting material that performs electrical connection and mechanical fixation so as to maintain insulation between the electrodes.
  • ACF includes an adhesive component containing a thermosetting resin and conductive particles blended as necessary, and is formed into a film on a support (separator) such as a PET (polyethylene terephthalate) film.
  • a support such as a PET (polyethylene terephthalate) film.
  • the product has been commercialized as a reel-shaped narrow and long tape (coiled body) wound around the core material in the same concentric shape.
  • ACF narrow width products for example, widths of 0.8 mm or less
  • the ACF width and thickness are close to each other, resulting in a problem of poor recognition.
  • the present invention has been made in view of the above-described problems, and suppresses the seepage of the adhesive component constituting the ACF in the width direction, reduces blocking during the feeding of the ACF, and reduces the width of the narrow product.
  • the purpose is to provide an ACF that prevents elongation and breakage due to insufficient strength of the support and improves recognition in the thickness direction and width direction.
  • an anisotropic conductive film in which a support and an anisotropic conductive adhesive layer are laminated, the width direction of the support being An anisotropic conductive film having an anisotropic conductive region on which the anisotropic conductive adhesive layer is formed at both ends is provided.
  • the width of the support is wider than the width of the anisotropic conductive adhesive layer.
  • the adhesive component exudes from the end in the width direction beyond the width of the support. Can be suppressed. Therefore, blocking during use of the anisotropic conductive film can be reduced.
  • the support has a first support layer having the same width as the anisotropic conductive adhesive layer, and a width of the anisotropic conductive adhesive layer.
  • An anisotropic conductive film having a structure in which a second support layer having a wider width is laminated is provided.
  • the support body has a laminated structure of the first support layer and the second support layer, so that the conventional manufacturing method of the anisotropic conductive film described above can be utilized to An anisotropic conductive film having a width wider than that of the anisotropic conductive adhesive layer can be obtained.
  • the strength of the support can be improved by forming the support in a laminated structure, it is possible to prevent elongation and breakage due to insufficient strength of the support, particularly in the case of a narrow product.
  • the anisotropic conductive adhesive layer at both ends in the width direction of the support.
  • the width of each region is different.
  • the frame portion to be connected is narrow, by forming the anisotropic conductive adhesive 14 close to one end side of the support, the handleability of the anisotropic conductive film can be improved.
  • a method for producing an anisotropic conductive film comprising a step of laminating the first support layer and the adhesive layer so as to contact each other, and bonding the first support layer and the second support layer.
  • the conventional anisotropic conductive film having the same width of the support and the anisotropic conductive adhesive layer can be used as the first laminate, the conventional anisotropic conductive film The manufacturing method can be used effectively.
  • the second laminate can also be produced in the same manner as the first laminate, except that the adhesive used is different.
  • the first laminate and the second laminate thus obtained are laminated so that the first support layer and the adhesive layer are in contact with each other, and the first support layer and the second support layer are combined. By adhering, the anisotropic conductive film of the present invention can be easily produced.
  • a first slit step of cutting the stack original fabric of the first laminate into a predetermined width, and a stack original fabric of the second laminate A second slit step for cutting wider than the cutting width of the first laminate, a first laminate cut in the first slit step, and a second laminate cut in the second slit step are stacked.
  • a method for producing an anisotropic conductive film comprising: a step of bonding the first support layer and the second support layer by brazing to the same core material.
  • the first laminate having a predetermined width and the second laminate having a width wider than the cutting width of the first laminate are cut from the two kinds of raw materials, respectively, and the same.
  • the first support layer and the second support layer are bonded together by being attached to the core material.
  • the anisotropic conductive adhesive layer of the present invention even if the adhesive component of the anisotropic conductive adhesive layer flows out of the adhesive layer, the anisotropic conductive adhesive layer is formed at the end in the width direction of the support. Since there is a large area, the amount of the edge extruding in the width direction beyond the width of the support can be reduced. Therefore, blocking during use of the anisotropic conductive film can be reduced. Furthermore, since the strength of the support can be improved, it is possible to prevent the support from being stretched and cut, and to improve the recognition in the thickness direction and the width direction.
  • FIG. 1 is a diagram showing an anisotropic conductive film according to a first embodiment of the present invention, in which (a) is an external perspective view of the anisotropic conductive film, and (b) is a width of the anisotropic conductive film.
  • FIG. 1 is a diagram showing an anisotropic conductive film according to a first embodiment of the present invention, in which (a) is an external perspective view of the anisotropic conductive film, and (b) is a width of the anisotropic conductive film.
  • FIG. 2 is a cross-sectional view in the width direction of an anisotropic conductive film according to a second embodiment of the present invention.
  • FIG. 3 is a view showing an example of use of the anisotropic conductive film of the present invention.
  • FIG. 4 is a schematic view showing a method for producing an anisotropic conductive film of the present invention.
  • FIG. 1 is a view showing an anisotropic conductive film according to a first embodiment of the present invention, (a) is an external perspective view of the anisotropic conductive film, and (b) is a cross-sectional view in the width direction of the anisotropic conductive film. It is.
  • An anisotropic conductive film 10 according to the present embodiment is formed by stacking a support 13 and an anisotropic conductive adhesive layer 14 by concentrically overlapping a core material 12 having a reel side plate 11 to form a stacked body.
  • Have An anisotropic conductive adhesive layer 14 is formed on both ends in the width direction of the support 13 to form a!
  • the anisotropic conductive adhesive layer 14 is heated and pressurized at the time of use, and flows and solidifies to connect a substrate or the like as an adherend member.
  • the anisotropic conductive adhesive layer 14 of the anisotropic conductive film which is in the form of a double layer, forms the anisotropic conductive adhesive layer 14 due to pressure applied during the winding process, dimensional variation due to changes over time, etc.
  • a part of the adhesive may flow in the width direction of the support. As a result, the adhesive sometimes oozes out to the side of the stack beyond the width of the support. Therefore, the anisotropic conductive film 10 is stuck on the reel side plate 11.
  • the anisotropic conductive film 10 is blocked when the anisotropic conductive film 10 is rolled out.
  • the non-formed region 14 ′ even if the adhesive component flows, it remains in the non-formed region 14 ′, so that it is prevented from exuding from the end in the width direction beyond the width of the support 13. it can. Thereby, generation
  • the width of the unformed region 14 ' is appropriately adjusted according to the total width of the support 13 and the type and thickness of the adhesive constituting the anisotropic conductive adhesive layer 14.
  • FIG. 2 is a cross-sectional view in the width direction of the anisotropic conductive film according to the second embodiment of the present invention.
  • the support 13 has a structure in which a first support layer 13-1 and a second support layer 13-2 wider than this are stacked. This is the same as the first embodiment described above.
  • the support 13 a laminated structure of the first support layer 13-1 and the second support layer 132, the general manufacturing method of the anisotropic conductive film is utilized, An anisotropic conductive film 20 in which the width of the support 13 is wider than the width of the anisotropic conductive adhesive layer 14 can be obtained.
  • the strength of the support can be improved by forming the support 13 in a laminated structure, it is possible to prevent elongation and breakage due to insufficient strength of the support, particularly in the case of a narrow product. .
  • the adhesive used for the adhesive layer 15 is an anisotropic conductive adhesive. Unlike layer 14, there is no need to flow when the substrate is connected. Therefore, even if the adhesive is applied to the entire surface of the first support layer 13-1, it does not ooze out.
  • FIG. 3 shows a cross-sectional view of the state in which the anisotropic conductive film is transferred to the glass substrate on which the liquid crystal color filter 52 is formed.
  • the anisotropic conductive adhesive layer 14 may be formed close to one end of the support 13 such as when the frame portion 51-1 is narrow.
  • a support for example, a polyethylene terephthalate film, a polyethylene naphthalate film, a polyethylene isophthalate film, a polyethylene isophthalate film, a polybutylene terephthalate film, a polyol, which are generally commercially available are subjected to release treatment.
  • a release treatment agent may be coated on the surface of the support so that the anisotropic conductive adhesive layer provided on the support can be easily removed.
  • the thickness of the support is not particularly limited, but is preferably 4 ⁇ m to 200 ⁇ m.
  • the width of the support may be set wider than the width of the anisotropic conductive adhesive layer. For example, 500 / ⁇ ⁇ to 3 Omm is preferable.
  • the support When the support has a laminated structure of the first support layer and the second support layer, it is in contact with each adhesive layer 15 in order to improve the adhesive strength of their adhesive surfaces.
  • Various treatments can be applied to the surface.
  • a primer layer may be formed between the adhesive layer 15 and each surface, the support layer surface may be subjected to plasma treatment, or a physical roughening treatment may be performed.
  • the anisotropic conductive adhesive a material exhibiting curability by heat or light can be widely applied. It is preferable to use a crosslinkable material because of its excellent heat resistance and moisture resistance after connection. Among them, the epoxy adhesive is preferable because it can be cured for a short time and has a good workability in terms of molecular structure and excellent adhesion.
  • Epoxy adhesives include, for example, high molecular weight epoxy, solid epoxy and liquid epoxy, urethane, polyester, acrylic rubber, NBR, Generally, an epoxy resin modified with a pyrone or the like is used as a main component, and a curing agent, a catalyst, a coupling agent, a filler, or the like is added.
  • the conductive particles used as the conductive material in the connection member include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, and carbon, and these conductive particles are used as a core material.
  • it may be a non-conductive glass, ceramic, plastic or other high molecular weight core material that is covered with a conductive layer having the above material strength! / ⁇ .
  • insulating coating particles formed by coating a conductive material with an insulating layer, or a combination of conductive electrons and insulating particles.
  • the thickness of the anisotropic conductive adhesive layer is not particularly limited, and is appropriately selected according to the adhesive to be used and the object to be adhered, but 5 111 to 100 111 is preferable.
  • the width of the anisotropic conductive adhesive layer may be adjusted according to the intended use, but in general 0.5mn! About 5mm.
  • the adhesive strength between the first support layer and the second support layer is the first support layer.
  • the peel force may be made smaller than the adhesive strength between the second support layer and the first support layer.
  • the thickness of the first support layer and the second support layer is not particularly limited, but it is preferable that the total thickness of the two layers be between 0 ⁇ m and 300 ⁇ m! / ⁇ .
  • FIG. 4 is a schematic view showing a method for producing the anisotropic conductive film of the present invention.
  • the production method of the present invention includes a first laminate 31 in which a first support layer 13-1 and an anisotropic conductive adhesive layer 14 are laminated, a second support layer 13-2, A second laminate 32 having a structure in which a support layer and an adhesive layer 15 for adhering the second support layer are laminated, and wider than the width of the first laminate 31, The support layer 13-1 and the adhesive layer 15 are laminated so as to be in contact with each other, and the first support layer 13-1 and the second support layer 13-2 are bonded.
  • the first laminate 31 and the second laminate 32 can be produced by a general method for producing an anisotropic conductive film. That is, an anisotropic conductive adhesive or an adhesive that bonds the first support layer 13-1 and the second support layer 13-2 on a wide support (separator) is applied to a roll coater or the like. Using various coaters, apply to a width of about 10 to 50cm and dry. Then, the raw fabric may be continuously cut into a width of about 0.5 to 5 mm using a blade of an unwinding cutter or the like.
  • first laminate 31 and the second laminate 32 are laminated so that the first support layer 13-1 and the adhesive layer 15 are in contact with each other, and the first support layer 13-1 Glue the second support layer 13-2.
  • the first laminate 31 and the second laminate 32 are bonded to the same core material.
  • a method of bonding using the pressure at the time of brazing that occurs is mentioned.
  • the pressure during brazing is the tension applied to the first laminated body 31 and the second laminated body 32, that is, the feeding speed of the first laminated body 31 and the second laminated body 32 and the winding speed to the core material.
  • the anisotropic conductive film of the present invention can suppress the seepage of the anisotropic conductive adhesive in the width direction, reduce blocking when the anisotropic conductive film is fed, and support in the case of a narrow product. It is possible to prevent elongation and breakage due to insufficient strength of the steel and to improve recognition in the thickness direction and width direction. For this reason, since the handling property when using the anisotropic conductive film is good, it is possible to improve the yield when mounting components such as an IC chip, an LSI chip, a resistor and a capacitor on the circuit board.

Abstract

Disclosed is an anisotropic conductive film (10) wherein a supporting body (13) and an anisotropic conductive adhesive layer (14) are arranged in layers. The supporting body (13) has a region (14'), where no anisotropic conductive adhesive layer (14) is formed, in both edge portions in the width direction.

Description

明 細 書  Specification
異方導電フィルム及びその製造方法  Anisotropic conductive film and manufacturing method thereof
技術分野  Technical field
[0001] 本発明は、異方導電フィルムに関する。さらに詳しくは、フィルム状の支持体に異方 導電性接着剤をフィルム状に形成した卷重体であって、この卷重体の側端部からの 接着剤の染み出しによるブロッキングを抑制した異方導電フィルム及びその製造方 法に関する。  [0001] The present invention relates to an anisotropic conductive film. More specifically, the anisotropic conductive adhesive is formed in a film-like support on a film-like support, and the anisotropic conductivity is suppressed by preventing the adhesive from seeping out from the side edge of the adhesive. The present invention relates to a film and its manufacturing method.
背景技術  Background art
[0002] 相対する多数の電極を有する被接続部材を接続するための接続材料として、異方 導電フィルム（以下、 ACFということがある）が使用されている。 ACFはプリント配線基 板、 LCD用ガラス基板、フレキシブルプリント基板等の基板や、 IC、 LSI等の半導体 素子やパッケージ等の被接続部材を接続する際、相対する電極同士の導通状態を 保ち、隣接する電極同士の絶縁を保つように電気的接続と機械的固着を行う接続材 料である。  An anisotropic conductive film (hereinafter sometimes referred to as ACF) is used as a connection material for connecting connected members having a large number of opposing electrodes. The ACF keeps the conductive state between the opposing electrodes when connecting substrates such as printed wiring boards, glass substrates for LCDs, flexible printed boards, etc., and semiconductor elements such as ICs and LSIs, and packages. It is a connecting material that performs electrical connection and mechanical fixation so as to maintain insulation between the electrodes.
[0003] ACFは、熱硬化性榭脂を含有する接着剤成分と、必要により配合される導電性粒 子とを含み、 PET (ポリエチレンテレフタレート）フィルム等の支持体（セパレーター） 上に、フィルム状に形成され、芯材に同一円心状に巻き付けたリール形状の細幅長 尺テープ (卷重体)として製品化されて 、る。  [0003] ACF includes an adhesive component containing a thermosetting resin and conductive particles blended as necessary, and is formed into a film on a support (separator) such as a PET (polyethylene terephthalate) film. The product has been commercialized as a reel-shaped narrow and long tape (coiled body) wound around the core material in the same concentric shape.
[0004] ところで、リール形状にした細幅長尺テープにおいては、ラジカル アタリレート接 着剤のような低粘度成分 (モノマー等)を含む ACFを使用した場合、長尺テープの幅 方向端部から低粘度成分が支持体の外部に染み出すことがある。このため、長尺テ ープを保持するリール側板に接着剤が付着 ·結合し、 ACFの施工時にブロッキング を引き起こす原因となっていた。  [0004] By the way, in a narrow and long tape having a reel shape, when an ACF containing a low-viscosity component (monomer or the like) such as a radical acrylate adhesive is used, the width direction end of the long tape is used. Low viscosity components may ooze out of the support. For this reason, adhesive adhered to and bonded to the reel side plate holding the long tape, causing blocking during ACF construction.
また、 ACFの狭幅製品（例えば、幅 0. 8mm以下）においては、リールの巻き崩れ、 支持体の強度不足による伸び、切れ等によって、生産性が低下する問題があった。 さらに、狭幅製品の場合、 ACFの幅と厚みが近い値となるので、認識性が悪いという 問題があった。 [0005] 本発明は、上記の課題に鑑みなされたものであり、 ACFを構成する接着成分の幅 方向への染み出しを抑制し、 ACFの繰り出し時のブロッキングを低減するとともに、 狭幅製品の場合における支持体の強度不足による伸び、切れの防止及び厚み方向 と幅方向の認識性を向上した ACFの提供を目的とする。 In addition, ACF narrow width products (for example, widths of 0.8 mm or less) have had the problem of reduced productivity due to reel collapse, elongation and breakage due to insufficient strength of the support. Furthermore, in the case of narrow-width products, the ACF width and thickness are close to each other, resulting in a problem of poor recognition. [0005] The present invention has been made in view of the above-described problems, and suppresses the seepage of the adhesive component constituting the ACF in the width direction, reduces blocking during the feeding of the ACF, and reduces the width of the narrow product. In this case, the purpose is to provide an ACF that prevents elongation and breakage due to insufficient strength of the support and improves recognition in the thickness direction and width direction.
発明の開示  Disclosure of the invention
[0006] 上記目的を達成するため、本発明の第一の態様によれば、支持体と、異方導電性 接着剤層とを積層した異方導電フィルムであって、前記支持体の幅方向両端部に前 記異方導電性接着剤層の形成されて!ヽな ヽ領域がある異方導電フィルムが提供さ れる。  [0006] In order to achieve the above object, according to a first aspect of the present invention, there is provided an anisotropic conductive film in which a support and an anisotropic conductive adhesive layer are laminated, the width direction of the support being An anisotropic conductive film having an anisotropic conductive region on which the anisotropic conductive adhesive layer is formed at both ends is provided.
[0007] 従来、 ACFの製造方法としては、支持体上に異方導電性接着剤層を幅 10〜50c m程度に形成した後、一且卷き取って原反を作製し、この原反を巻きだしカッターの 刃等を用いて連続的に幅 0. 5〜5mm程度の細幅に裁断して再度巻き取る方法が 一般的である。このため、支持体と異方導電性接着剤層の幅は同じであり、支持体 上の一面の全面に異方導電性接着剤層が形成されていた。  [0007] Conventionally, as a method for producing ACF, after forming an anisotropic conductive adhesive layer with a width of about 10 to 50 cm on a support, it is scraped off to produce an original fabric. A method is generally used in which the blade is continuously cut into a thin width of about 0.5 to 5 mm using a cutter blade or the like and wound up again. For this reason, the width | variety of a support body and an anisotropic conductive adhesive layer is the same, and the anisotropic conductive adhesive layer was formed in the whole surface of the one surface on a support body.
一方、本発明においては、支持体の幅を異方導電性接着剤層の幅よりも広くしてあ る。このように、支持体の幅方向端部に異方導電性接着剤層を形成していない領域 を設けることにより、接着剤成分が支持体の幅を超えて幅方向端部から染み出すこと を抑制できる。従って、異方導電フィルムの使用時のブロッキングを低減できる。  On the other hand, in the present invention, the width of the support is wider than the width of the anisotropic conductive adhesive layer. In this way, by providing a region where the anisotropic conductive adhesive layer is not formed at the end in the width direction of the support, the adhesive component exudes from the end in the width direction beyond the width of the support. Can be suppressed. Therefore, blocking during use of the anisotropic conductive film can be reduced.
[0008] 上記の異方導電フィルムの一例として、前記支持体が、前記異方導電性接着剤層 の幅と同じ幅を有する第一の支持体層と、前記異方導電性接着層の幅より広い幅を 有する第二の支持体層とを積層した構造を有する異方導電フィルムが提供される。 このように、支持体を第一の支持体層と第二の支持体層の積層構造とすることによ り、上述した異方導電フィルムの、従来の製造方法を活用して、支持体の幅を異方導 電性接着剤層の幅よりも広くした異方導電フィルムを得ることができる。 [0008] As an example of the anisotropic conductive film, the support has a first support layer having the same width as the anisotropic conductive adhesive layer, and a width of the anisotropic conductive adhesive layer. An anisotropic conductive film having a structure in which a second support layer having a wider width is laminated is provided. In this way, the support body has a laminated structure of the first support layer and the second support layer, so that the conventional manufacturing method of the anisotropic conductive film described above can be utilized to An anisotropic conductive film having a width wider than that of the anisotropic conductive adhesive layer can be obtained.
また、支持体を積層構造とすることによって、支持体の強度を向上することができる ので、特に、狭幅製品の場合における支持体の強度不足による伸び、切れを防止で きる。  Further, since the strength of the support can be improved by forming the support in a laminated structure, it is possible to prevent elongation and breakage due to insufficient strength of the support, particularly in the case of a narrow product.
[0009] 本発明にお ヽて、前記支持体の幅方向の両端部にある前記異方導電性接着剤層 の形成されて ヽな 、領域の幅がそれぞれ異なって 、てもよ 、。 [0009] In the present invention, the anisotropic conductive adhesive layer at both ends in the width direction of the support. The width of each region is different.
例えば、被接続対象の額縁部が狭い場合等、異方導電性接着剤 14を支持体のど ちらか一端側に寄せて形成することにより、異方導電フィルムのハンドリング性を向上 できる。  For example, when the frame portion to be connected is narrow, by forming the anisotropic conductive adhesive 14 close to one end side of the support, the handleability of the anisotropic conductive film can be improved.
[0010] 本発明の第二の態様によれば、第一の支持体層と異方導電性接着剤層とを積層し た第一積層体と、第二の支持体層と、前記第一の支持体層と第二の支持体層とを接 着する接着剤層とを積層した構造を有し、前記異方導電性接着剤層の幅よりも幅広 である第二積層体とを、前記第一支持体層と前記接着剤層が接するように積層し、 前記第の一支持体層と第二の支持体層とを接着する工程を有する異方導電フィルム の製造方法が提供される。  [0010] According to the second aspect of the present invention, a first laminate in which a first support layer and an anisotropic conductive adhesive layer are laminated, a second support layer, and the first support layer, A second laminated body having a structure in which the support layer and the adhesive layer that adheres the second support layer are laminated, and wider than the width of the anisotropic conductive adhesive layer, There is provided a method for producing an anisotropic conductive film, comprising a step of laminating the first support layer and the adhesive layer so as to contact each other, and bonding the first support layer and the second support layer. .
[0011] この製造方法においては、第一積層体として、支持体と異方導電性接着剤層の幅 が同じである、従来の異方導電フィルムが使用できるので、従来の異方導電フィルム の製造方法を有効に活用することができる。尚、第二積層体も、使用する接着剤が 異なる他は、第一積層体と同様に製造できる。このようにして得られた第一積層体と 第二積層体とを、第一支持体層と接着剤層が接するように積層し、第の一支持体層 と第二の支持体層とを接着することにより、本発明の異方導電フィルムを容易に製造 することができる。  In this manufacturing method, since the conventional anisotropic conductive film having the same width of the support and the anisotropic conductive adhesive layer can be used as the first laminate, the conventional anisotropic conductive film The manufacturing method can be used effectively. The second laminate can also be produced in the same manner as the first laminate, except that the adhesive used is different. The first laminate and the second laminate thus obtained are laminated so that the first support layer and the adhesive layer are in contact with each other, and the first support layer and the second support layer are combined. By adhering, the anisotropic conductive film of the present invention can be easily produced.
[0012] 上記の異方導電フィルムの製造方法の一例として、前記第一積層体の卷重体原反 を所定幅に裁断する第一スリット工程と、前記第二積層体の卷重体原反を、前記第 一積層体の裁断幅よりも幅広に裁断する第二スリット工程と、前記第一スリット工程で 裁断された第一積層体と前記第二スリット工程で裁断された第二積層体とを積層し、 同一の芯材に卷付けることにより前記第一の支持体層と第二の支持体層とを接着す る工程と、を有する異方導電フィルムの製造方法が提供される。  [0012] As an example of the method for producing the anisotropic conductive film, a first slit step of cutting the stack original fabric of the first laminate into a predetermined width, and a stack original fabric of the second laminate, A second slit step for cutting wider than the cutting width of the first laminate, a first laminate cut in the first slit step, and a second laminate cut in the second slit step are stacked. There is also provided a method for producing an anisotropic conductive film, comprising: a step of bonding the first support layer and the second support layer by brazing to the same core material.
[0013] 本発明の製造方法では、上記二種の原反から、所定幅の第一積層体と第一積層 体の裁断幅よりも幅広の第二積層体をそれぞれに裁断し、これらを同一の芯材に卷 付けることにより、第一の支持体層と第二の支持体層とを接着する。  [0013] In the production method of the present invention, the first laminate having a predetermined width and the second laminate having a width wider than the cutting width of the first laminate are cut from the two kinds of raw materials, respectively, and the same. The first support layer and the second support layer are bonded together by being attached to the core material.
このように、一般に行なわれて 、る異方導電フィルムの製造方法 (原反から一定幅 の積層体を裁断する工程と再卷取り工程)を有効に活用することによって、新たな設 備投資を抑制することができる。 In this way, a new method has been established by effectively utilizing a method for manufacturing an anisotropic conductive film (a process of cutting a laminated body having a certain width from a raw fabric and a re-staking process). Capital investment can be suppressed.
[0014] 本発明の異方導電フィルムでは、異方導電接着剤層の接着剤成分が接着剤層か ら流出したとしても、支持体の幅方向端部に異方導電接着剤層が形成されて ヽな 、 領域があるので、支持体の幅を超えて幅方向端部力 染み出す量を低減できる。従 つて、異方導電フィルムの使用時のブロッキングを低減できる。さらに、支持体の強度 を向上できるので、支持体の伸び、切れを防止でき、厚み方向と幅方向の認識性も 向上できる  [0014] In the anisotropic conductive film of the present invention, even if the adhesive component of the anisotropic conductive adhesive layer flows out of the adhesive layer, the anisotropic conductive adhesive layer is formed at the end in the width direction of the support. Since there is a large area, the amount of the edge extruding in the width direction beyond the width of the support can be reduced. Therefore, blocking during use of the anisotropic conductive film can be reduced. Furthermore, since the strength of the support can be improved, it is possible to prevent the support from being stretched and cut, and to improve the recognition in the thickness direction and the width direction.
図面の簡単な説明  Brief Description of Drawings
[0015] [図 1]本発明の第一実施形態である異方導電フィルムを示す図であり、（a)は、異方 導電フィルムの外観斜視図、 (b)は異方導電フィルムの幅方向断面図である。  FIG. 1 is a diagram showing an anisotropic conductive film according to a first embodiment of the present invention, in which (a) is an external perspective view of the anisotropic conductive film, and (b) is a width of the anisotropic conductive film. FIG.
[図 2]本発明の第二実施形態である異方導電フィルムの幅方向断面図である。  FIG. 2 is a cross-sectional view in the width direction of an anisotropic conductive film according to a second embodiment of the present invention.
[図 3]本発明の異方導電フィルムの使用例を示す図である。  FIG. 3 is a view showing an example of use of the anisotropic conductive film of the present invention.
[図 4]本発明の異方導電フィルムの製造方法を示す概略図である。  FIG. 4 is a schematic view showing a method for producing an anisotropic conductive film of the present invention.
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0016] 以下、本発明の異方導電フィルムを、図面を参照して説明する。 Hereinafter, the anisotropic conductive film of the present invention will be described with reference to the drawings.
[第一実施形態]  [First embodiment]
図 1は、本発明の第一実施形態である異方導電フィルムを示す図であり、（a)は、 異方導電フィルムの外観斜視図、 (b)は異方導電フィルムの幅方向断面図である。 本実施形態の異方導電フィルム 10は、リール側板 11を有する芯材 12に同心円状 に重ね合わせて卷重体を形成しており、支持体 13及び異方導電性接着剤層 14を 積層した構成を有する。支持体 13の幅方向両端部には、異方導電性接着剤層 14を 形成して!/ヽな!ヽ未形成領域 14'が形成されて!、る。  FIG. 1 is a view showing an anisotropic conductive film according to a first embodiment of the present invention, (a) is an external perspective view of the anisotropic conductive film, and (b) is a cross-sectional view in the width direction of the anisotropic conductive film. It is. An anisotropic conductive film 10 according to the present embodiment is formed by stacking a support 13 and an anisotropic conductive adhesive layer 14 by concentrically overlapping a core material 12 having a reel side plate 11 to form a stacked body. Have An anisotropic conductive adhesive layer 14 is formed on both ends in the width direction of the support 13 to form a!
[0017] 異方導電性接着剤層 14は、使用時に加熱'加圧され、流動、固化することにより、 被接着部材である基板等を接続する。使用前、卷重体状である異方導電フィルムの 異方導電性接着剤層 14では、巻き取り工程時にかかる圧力や、経時変化による寸 法変動等によって、異方導電性接着剤層 14を形成する接着剤の一部が支持体の幅 方向に流動することがある。その結果、接着剤が支持体の幅を超えて卷重体側面に 染み出すことがあった。このため、異方導電フィルム 10がリール側板 11に貼り付いた り、巻き重ねられた異方導電フィルム 10同士が染み出した接着剤を介して貼り付くた め、異方導電フィルム 10を卷重体力も繰り出すときにブロッキングを生じていた。 本実施形態では、未形成領域 14'を設けることにより、接着剤成分が流動しても未 形成領域 14'に留まるため、支持体 13の幅を超えて幅方向端部から染み出すことを 抑制できる。これにより、接着剤成分の染み出しに起因する異方導電フィルム 10の 繰り出し時のブロッキングの発生を抑制できる。 The anisotropic conductive adhesive layer 14 is heated and pressurized at the time of use, and flows and solidifies to connect a substrate or the like as an adherend member. Before use, the anisotropic conductive adhesive layer 14 of the anisotropic conductive film, which is in the form of a double layer, forms the anisotropic conductive adhesive layer 14 due to pressure applied during the winding process, dimensional variation due to changes over time, etc. A part of the adhesive may flow in the width direction of the support. As a result, the adhesive sometimes oozes out to the side of the stack beyond the width of the support. Therefore, the anisotropic conductive film 10 is stuck on the reel side plate 11. In other words, since the rolled anisotropic conductive films 10 are stuck together through an adhesive, the anisotropic conductive film 10 is blocked when the anisotropic conductive film 10 is rolled out. In the present embodiment, by providing the non-formed region 14 ′, even if the adhesive component flows, it remains in the non-formed region 14 ′, so that it is prevented from exuding from the end in the width direction beyond the width of the support 13. it can. Thereby, generation | occurrence | production of the blocking at the time of unwinding of the anisotropic conductive film 10 resulting from the oozing-out of an adhesive component can be suppressed.
[0018] 尚、未形成領域 14'の幅は、支持体 13の全幅、及び異方導電性接着剤層 14を構 成する接着剤の種類及び厚さによって適宜調整する。 [0018] The width of the unformed region 14 'is appropriately adjusted according to the total width of the support 13 and the type and thickness of the adhesive constituting the anisotropic conductive adhesive layer 14.
[0019] [第二実施形態] [Second Embodiment]
図 2は、本発明の第二実施形態である異方導電フィルムの幅方向断面図である。 本実施形態の異方導電フィルム 20では、支持体 13が、第一の支持体層 13— 1と、 これよりも幅広な第二の支持体層 13— 2とを積層した構造を有する他は、上述した第 一実施形態と同じである。  FIG. 2 is a cross-sectional view in the width direction of the anisotropic conductive film according to the second embodiment of the present invention. In the anisotropic conductive film 20 of the present embodiment, the support 13 has a structure in which a first support layer 13-1 and a second support layer 13-2 wider than this are stacked. This is the same as the first embodiment described above.
このように、支持体 13を第一の支持体層 13- 1と第二の支持体層 13 2の積層構 造とすることにより、異方導電フィルムの一般的な製造方法を活用して、支持体 13の 幅を異方導電性接着剤層 14の幅よりも広くした異方導電フィルム 20を得ることができ る。  In this way, by making the support 13 a laminated structure of the first support layer 13-1 and the second support layer 132, the general manufacturing method of the anisotropic conductive film is utilized, An anisotropic conductive film 20 in which the width of the support 13 is wider than the width of the anisotropic conductive adhesive layer 14 can be obtained.
[0020] また、支持体 13を積層構造とすることによって、支持体の強度を向上することがで きるので、特に、狭幅製品の場合における支持体の強度不足による伸び、切れを防 止できる。  [0020] Further, since the strength of the support can be improved by forming the support 13 in a laminated structure, it is possible to prevent elongation and breakage due to insufficient strength of the support, particularly in the case of a narrow product. .
尚、第一の支持体層 13- 1と第二の支持体層 13― 2とを接着する方法としては、 第一の支持体層 13— 1と第二の支持体層 13— 2の間に接着層 15を形成する方法 がある。  As a method of bonding the first support layer 13-1 and the second support layer 13-2, there is a method between the first support layer 13-1 and the second support layer 13-2. There is a method for forming the adhesive layer 15.
[0021] 第一の支持体層 13— 1と第二の支持体層 13— 2の間に接着層 15を形成する場合 、接着層 15に使用される接着剤は、異方導電性接着剤層 14と異なり、基板等の接 続時には流動する必要がない。従って、第一の支持体層 13— 1の全面に接着剤が 塗布されても染み出すことはない。  [0021] When the adhesive layer 15 is formed between the first support layer 13-1 and the second support layer 13-2, the adhesive used for the adhesive layer 15 is an anisotropic conductive adhesive. Unlike layer 14, there is no need to flow when the substrate is connected. Therefore, even if the adhesive is applied to the entire surface of the first support layer 13-1, it does not ooze out.
[0022] 尚、上述した実施形態の異方導電フィルムでは、支持体 13の両端部に同じ幅の未 形成領域 14'を形成しているが、本発明はこれに限られない。図 3に液晶カラーフィ ルタ 52が形成されたガラス基板に異方導電フィルムを転写する様子の断面図を示す 。例えば、（a)に示すように、被接続対象であるガラス基板 51の額縁部 51— 1が広い 場合、支持体 13の両端部に同じ幅の未形成領域を形成してもよいが、図 3 (b)に示 すように、額縁部 51— 1が狭い場合等、異方導電性接着剤層 14を支持体 13のどち らか一端側に寄せて形成してもよ 、。 [0022] In the anisotropic conductive film of the above-described embodiment, the both ends of the support 13 are not yet equal in width. Although the formation region 14 'is formed, the present invention is not limited to this. FIG. 3 shows a cross-sectional view of the state in which the anisotropic conductive film is transferred to the glass substrate on which the liquid crystal color filter 52 is formed. For example, as shown in (a), when the frame portion 51-1 of the glass substrate 51 to be connected is wide, unformed regions having the same width may be formed at both ends of the support 13. 3 As shown in (b), the anisotropic conductive adhesive layer 14 may be formed close to one end of the support 13 such as when the frame portion 51-1 is narrow.
[0023] 本発明の異方導電フィルムでは、支持体として、例えば、一般に市販されている離 型処理がなされたポリエチレンテレフタレートフィルム、ポリエチレンナフタレートフィ ルム、ポリエチレンイソフタレートフィルム、ポリブチレンテレフタレートフィルム、ポリオ レフイン系フィルム、ポリアセテートフィルム、ポリカーボネートフィルム、ポリフエ-レン サルファイドフィルム、ポリアミドフィルム、エチレン '酢酸ビュル共重合体フィルム、ポ リ塩化ビュルフィルム、ポリ塩化ビ-リデンフィルム、合成ゴム系フィルム、液晶ポリマ 一フィルム等の各種フィルムを使用することが可能である。支持体上に設けられた異 方導電性接着剤層が容易に除去できるように、支持体表面に剥離処理剤をコーティ ングしてもよい。 In the anisotropic conductive film of the present invention, as a support, for example, a polyethylene terephthalate film, a polyethylene naphthalate film, a polyethylene isophthalate film, a polyethylene isophthalate film, a polybutylene terephthalate film, a polyol, which are generally commercially available are subjected to release treatment. Refin film, Polyacetate film, Polycarbonate film, Polyphenylene sulfide film, Polyamide film, Ethylene butyl acetate copolymer film, Poly chloride film, Polyvinyl chloride film, Synthetic rubber film, Liquid crystal polymer Various films such as a film can be used. A release treatment agent may be coated on the surface of the support so that the anisotropic conductive adhesive layer provided on the support can be easily removed.
支持体の厚さは、特に限定はないが、 4 μ m〜200 μ mが好ましい。また、支持体 の幅は、異方導電性接着剤層の幅よりも広く設定すればよぐ例えば、 500 /ζ πι〜3 Ommが好ましい。  The thickness of the support is not particularly limited, but is preferably 4 μm to 200 μm. The width of the support may be set wider than the width of the anisotropic conductive adhesive layer. For example, 500 / ζ πι to 3 Omm is preferable.
[0024] 支持体として、第一の支持体層及び第二の支持体層の積層構造とする場合には、 それらの接着面の接着強度を向上するために、それぞれの接着剤層 15と接触する 面に各種処理を施すことができる。例えば、接着剤層 15と各面の間にプライマー層 を形成したり、支持体層表面をプラズマ処理したり、物理的に粗面とする処理を施し たりすることが挙げられる。  [0024] When the support has a laminated structure of the first support layer and the second support layer, it is in contact with each adhesive layer 15 in order to improve the adhesive strength of their adhesive surfaces. Various treatments can be applied to the surface. For example, a primer layer may be formed between the adhesive layer 15 and each surface, the support layer surface may be subjected to plasma treatment, or a physical roughening treatment may be performed.
[0025] 異方導電性接着剤としては、熱や光により硬化性を示す材料が広く適用できる。接 続後の耐熱性や耐湿性に優れていることから、架橋性材料の使用が好ましい。なか でもエポキシ系接着剤は、短時間硬化が可能で接続作業性がよぐ分子構造上接着 性に優れている等の特徴力も好ましい。エポキシ系接着剤は、例えば高分子量ェポ キシ、固形エポキシと液状エポキシ、ウレタンやポリエステル、アクリルゴム、 NBR、ナ ィロン等で変性したエポキシを主成分とし、硬化剤や触媒、カップリング剤、充填剤等 を添加してなるものが一般的である。接続部材における導電材料として用いられる導 電粒子としては、 Au, Ag, Pt, Ni, Cu, W, Sb, Sn,はんだ等の金属粒子やカーボ ン等があり、またこれら導電粒子を核材とするか、あるいは非導電性のガラス、セラミツ ク、プラスチック等の高分子等力 なる核材に前記したような材質力 なる導電層を被 覆形成したものでもよ!/ヽ。さらに導電材料を絶縁層で被覆してなる絶縁被覆粒子や、 導粒電子と絶縁粒子の併用等の適用も可能である。 [0025] As the anisotropic conductive adhesive, a material exhibiting curability by heat or light can be widely applied. It is preferable to use a crosslinkable material because of its excellent heat resistance and moisture resistance after connection. Among them, the epoxy adhesive is preferable because it can be cured for a short time and has a good workability in terms of molecular structure and excellent adhesion. Epoxy adhesives include, for example, high molecular weight epoxy, solid epoxy and liquid epoxy, urethane, polyester, acrylic rubber, NBR, Generally, an epoxy resin modified with a pyrone or the like is used as a main component, and a curing agent, a catalyst, a coupling agent, a filler, or the like is added. The conductive particles used as the conductive material in the connection member include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, and carbon, and these conductive particles are used as a core material. Alternatively, it may be a non-conductive glass, ceramic, plastic or other high molecular weight core material that is covered with a conductive layer having the above material strength! / ヽ. Furthermore, it is also possible to apply insulating coating particles formed by coating a conductive material with an insulating layer, or a combination of conductive electrons and insulating particles.
異方導電性接着層の厚さは、特に限定はなぐ使用する接着剤及び被着対象に合 わせて適宜選択するが、 5 111〜100 111が好ましぃ。また、異方導電性接着層の 幅は、使用用途に合わせて調整すればよいが、一般には 0. 5mn！〜 5mm程度であ る。  The thickness of the anisotropic conductive adhesive layer is not particularly limited, and is appropriately selected according to the adhesive to be used and the object to be adhered, but 5 111 to 100 111 is preferable. The width of the anisotropic conductive adhesive layer may be adjusted according to the intended use, but in general 0.5mn! About 5mm.
[0026] 第一の支持体層と第二の支持体層の間の接着剤としては、第一の支持体層と第二 の支持体層の間の接着強度が、第一の支持体層 13— 1と異方導電性接着剤層の間 の接着強度よりも大きくなるものを使用するか、第一の支持体層と異方導電性接着剤 層の間に強い離型処理を行い、第二の支持体層と第一の支持体層の間の接着強度 よりも剥離力を小さくすればよい。  [0026] As the adhesive between the first support layer and the second support layer, the adhesive strength between the first support layer and the second support layer is the first support layer. Use a material that is greater than the adhesive strength between 13-1 and the anisotropic conductive adhesive layer, or perform a strong release treatment between the first support layer and the anisotropic conductive adhesive layer. The peel force may be made smaller than the adhesive strength between the second support layer and the first support layer.
第一の支持体層と第二の支持体層の厚さは、特に限定はないが、二層の合計厚さ 力^ 0 μ m〜300 μ mとなることが好まし!/ヽ。  The thickness of the first support layer and the second support layer is not particularly limited, but it is preferable that the total thickness of the two layers be between 0 μm and 300 μm! / ヽ.
[0027] 続いて、本発明の異方導電フィルムの製造方法について説明する。  [0027] Next, a method for producing the anisotropic conductive film of the present invention will be described.
図 4は、本発明の異方導電フィルムの製造方法を示す概略図である。  FIG. 4 is a schematic view showing a method for producing the anisotropic conductive film of the present invention.
本発明の製造方法は、第一の支持体層 13— 1と異方導電性接着剤層 14とを積層 した第一積層体 31と、第二の支持体層 13— 2と、第一の支持体層と第二の支持体 層とを接着する接着剤層 15とを積層した構造を有し、第一積層体 31の幅よりも幅広 である第二積層体 32とを、第一の支持体層 13— 1と接着剤層 15が接するように積層 し、第一の支持体層 13- 1と第二の支持体層 13― 2とを接着する工程を有する。  The production method of the present invention includes a first laminate 31 in which a first support layer 13-1 and an anisotropic conductive adhesive layer 14 are laminated, a second support layer 13-2, A second laminate 32 having a structure in which a support layer and an adhesive layer 15 for adhering the second support layer are laminated, and wider than the width of the first laminate 31, The support layer 13-1 and the adhesive layer 15 are laminated so as to be in contact with each other, and the first support layer 13-1 and the second support layer 13-2 are bonded.
[0028] 第一積層体 31及び第二積層体 32は、一般的な異方導電フィルムの製造方法によ り作製できる。即ち、幅広の支持体 (セパレータ)上に異方導電性接着剤又は第一の 支持体層 13— 1と第二の支持体層 13— 2とを接着する接着剤を、ロールコーター等 の各種コーターを使用して、幅 10〜50cm程度に塗布 '乾燥した後、卷重体とした原 反を作製する。そして、この原反から、巻きだしカッターの刃等を用いて、連続的に幅 0. 5〜5mm程度の細幅に裁断すればよい。 [0028] The first laminate 31 and the second laminate 32 can be produced by a general method for producing an anisotropic conductive film. That is, an anisotropic conductive adhesive or an adhesive that bonds the first support layer 13-1 and the second support layer 13-2 on a wide support (separator) is applied to a roll coater or the like. Using various coaters, apply to a width of about 10 to 50cm and dry. Then, the raw fabric may be continuously cut into a width of about 0.5 to 5 mm using a blade of an unwinding cutter or the like.
[0029] 続いて、第一積層体 31及び第二積層体 32を、第一の支持体層 13— 1と接着剤層 15が接するように積層し、第一の支持体層 13— 1と第二の支持体層 13— 2とを接着 する。 Subsequently, the first laminate 31 and the second laminate 32 are laminated so that the first support layer 13-1 and the adhesive layer 15 are in contact with each other, and the first support layer 13-1 Glue the second support layer 13-2.
第一の支持体層 13 - 1と第二の支持体層 13 - 2とを接着する方法として、例えば、 第一積層体 31及び第二積層体 32を、同一の芯材に卷付けることにより生じる、卷付 け時の圧力を利用して接着する方法が挙げられる。卷付け時の圧力は、第一積層体 31及び第二積層体 32にかけるテンション (張力）、即ち、第一積層体 31及び第二積 層体 32の繰り出し速度と芯材への巻き取り速度を制御することによって調整できる。 産業上の利用可能性  As a method for adhering the first support layer 13-1 and the second support layer 13-2, for example, the first laminate 31 and the second laminate 32 are bonded to the same core material. A method of bonding using the pressure at the time of brazing that occurs is mentioned. The pressure during brazing is the tension applied to the first laminated body 31 and the second laminated body 32, that is, the feeding speed of the first laminated body 31 and the second laminated body 32 and the winding speed to the core material. Can be adjusted by controlling. Industrial applicability
[0030] 本発明の異方導電フィルムでは、異方導電接着剤の幅方向への染み出しを抑制 でき、異方導電フィルムの繰り出し時のブロッキングを低減するとともに、狭幅製品の 場合における支持体の強度不足による伸び、切れの防止し、さらに、厚み方向と幅 方向の認識性を向上できる。このため、異方導電フィルム使用時のハンドリング性が よいため、 ICチップ、 LSIチップ、抵抗、コンデンサ等の部品を回路基板上に実装す る際の歩留まりを向上できる。 [0030] The anisotropic conductive film of the present invention can suppress the seepage of the anisotropic conductive adhesive in the width direction, reduce blocking when the anisotropic conductive film is fed, and support in the case of a narrow product. It is possible to prevent elongation and breakage due to insufficient strength of the steel and to improve recognition in the thickness direction and width direction. For this reason, since the handling property when using the anisotropic conductive film is good, it is possible to improve the yield when mounting components such as an IC chip, an LSI chip, a resistor and a capacitor on the circuit board.

Claims

請求の範囲 The scope of the claims
[1] 支持体と、異方導電性接着剤層とを積層した異方導電フィルムであって、前記支持 体の幅方向両端部に前記異方導電性接着剤層の形成されていない領域がある異方 導電フィルム。  [1] An anisotropic conductive film in which a support and an anisotropic conductive adhesive layer are laminated, and regions where the anisotropic conductive adhesive layer is not formed at both ends in the width direction of the support. An anisotropic conductive film.
[2] 前記支持体が、前記異方導電性接着剤層の幅と同じ幅を有する第一の支持体層 と、前記異方導電性接着層の幅より広い幅を有する第二の支持体層とを積層した構 造を有する請求項 1に記載の異方導電フィルム。  [2] The support has a first support layer having the same width as the anisotropic conductive adhesive layer, and a second support having a width wider than the anisotropic conductive adhesive layer. 2. The anisotropic conductive film according to claim 1, having a structure in which layers are laminated.
[3] 前記支持体の幅方向の両端部にある前記異方導電性接着剤層の形成されていな[3] The anisotropic conductive adhesive layer at both ends in the width direction of the support is not formed.
V、領域の幅が、それぞれ異なる請求項 1又は 2に記載の異方導電フィルム。 The anisotropic conductive film according to claim 1 or 2, wherein V and the width of the region are different from each other.
[4] 第一の支持体層と異方導電性接着剤層とを積層した第一積層体と、 [4] a first laminate in which a first support layer and an anisotropic conductive adhesive layer are laminated;
第二の支持体層と、前記第一の支持体層と第二の支持体層とを接着する接着剤層 とを積層した構造を有し、前記異方導電性接着剤層の幅よりも幅広である第二積層 体とを、  It has a structure in which a second support layer and an adhesive layer that bonds the first support layer and the second support layer are laminated, and the width of the anisotropic conductive adhesive layer The second laminate, which is wide,
前記第一支持体層と前記接着剤層が接するように積層し、前記第一の支持体層と 第二の支持体層とを接着する工程を有する異方導電フィルムの製造方法。  The manufacturing method of an anisotropic conductive film which has a process of laminating | stacking so that said 1st support body layer and the said adhesive bond layer may contact | connect, and bonding said 1st support body layer and a 2nd support body layer.
[5] 前記第一積層体の卷重体原反を所定幅に裁断する第一スリット工程と、 [5] a first slitting step of cutting the stack of raw material of the first laminate into a predetermined width;
前記第二積層体の卷重体原反を、前記第一積層体の裁断幅よりも幅広に裁断す る第二スリット工程と、  A second slitting step of cutting the substrate of the second laminated body wider than the cutting width of the first laminated body;
前記第一スリット工程で裁断された第一積層体と前記第二スリット工程で裁断され た第二積層体とを積層し、同一の芯材に卷付けることにより前記第一の支持体層と 第二の支持体層とを接着する工程と、  The first laminated body cut in the first slit step and the second laminated body cut in the second slit step are laminated, and are attached to the same core material, whereby the first support layer and the first laminated body Bonding the second support layer;
を有する請求項 4に記載の異方導電フィルムの製造方法。  The method for producing an anisotropic conductive film according to claim 4, comprising:
PCT/JP2006/314267 2005-08-04 2006-07-19 Anisotropic conductive film and method for producing same WO2007015372A1 (en)

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JP2011029207A (en) * 2010-11-02 2011-02-10 Sony Chemical & Information Device Corp Film laminate, pasting method of film laminate, connection method and connection structure using film laminate
JP2011058007A (en) * 2010-12-24 2011-03-24 Sony Chemical & Information Device Corp Reel body and manufacturing method for reel body
JP2012077305A (en) * 2011-11-07 2012-04-19 Hitachi Chemical Co Ltd Film for anisotropically conductive connection and reel body
US20130077266A1 (en) * 2010-10-28 2013-03-28 Dexerials Corporation Connection method and connection structure of electronic component
KR20140053298A (en) 2011-08-18 2014-05-07 히타치가세이가부시끼가이샤 Adhesive material reel, blocking suppression method, method for exchanging adhesive material reels, method for feeding adhesive material tape, method for producing adhesive material reel, reel kit, and package
JP2015187221A (en) * 2014-03-26 2015-10-29 デクセリアルズ株式会社 Adhesive film, film wound body, and method for manufacturing connected body
JP2018135517A (en) * 2018-02-21 2018-08-30 デクセリアルズ株式会社 Adhesive film, film wound body and method for manufacturing connection body
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JP5982159B2 (en) 2012-04-06 2016-08-31 デクセリアルズ株式会社 Reel member, adhesive film winding method, adhesive film unwinding method
JP5982158B2 (en) 2012-04-06 2016-08-31 デクセリアルズ株式会社 Reel member
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JP6661997B2 (en) * 2015-11-26 2020-03-11 デクセリアルズ株式会社 Anisotropic conductive film
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WO2008142985A1 (en) * 2007-05-23 2008-11-27 Hitachi Chemical Company, Ltd. Film and reel for anisotropic electroconductive connection
JP2008293751A (en) * 2007-05-23 2008-12-04 Hitachi Chem Co Ltd Film for anisotropic conductive connection, and reel body
TWI396022B (en) * 2007-05-23 2013-05-11 Anisotropic conductive film and reel
US20130077266A1 (en) * 2010-10-28 2013-03-28 Dexerials Corporation Connection method and connection structure of electronic component
JP2011029207A (en) * 2010-11-02 2011-02-10 Sony Chemical & Information Device Corp Film laminate, pasting method of film laminate, connection method and connection structure using film laminate
JP2011058007A (en) * 2010-12-24 2011-03-24 Sony Chemical & Information Device Corp Reel body and manufacturing method for reel body
WO2012086770A1 (en) * 2010-12-24 2012-06-28 ソニーケミカル＆インフォメーションデバイス株式会社 Reel body and process for production of reel body
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JP2012077305A (en) * 2011-11-07 2012-04-19 Hitachi Chemical Co Ltd Film for anisotropically conductive connection and reel body
JP2015187221A (en) * 2014-03-26 2015-10-29 デクセリアルズ株式会社 Adhesive film, film wound body, and method for manufacturing connected body
CN109689816A (en) * 2016-09-27 2019-04-26 迪睿合株式会社 The manufacturing method of body, adhesive film package body is wrapped in adhesive film
JP2018135517A (en) * 2018-02-21 2018-08-30 デクセリアルズ株式会社 Adhesive film, film wound body and method for manufacturing connection body

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CN101233655B (en) 2010-08-18
JP4650490B2 (en) 2011-03-16
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TW200708587A (en) 2007-03-01
JP2010257983A (en) 2010-11-11
KR101025369B1 (en) 2011-03-28
CN101233655A (en) 2008-07-30
KR20100117680A (en) 2010-11-03
JPWO2007015372A1 (en) 2009-02-19

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