KR102601787B1 - Method for producing a bonded structure, and a bonded structure, and a film structure, and a method for manufacturing a film structure - Google Patents

Abstract

A method of manufacturing a connection structure capable of mounting electronic components having a plurality of terminal rows on a mounting surface using existing equipment, a connection structure, a film structure, and a method of manufacturing the film structure are provided. From a film structure including a tape-shaped substrate 21 and a connection film formed on the substrate 21, a predetermined length 21L is formed in the longitudinal direction of the substrate 21 and a predetermined width 21W is formed in the width direction of the substrate 21. A sticking process of attaching the connection films 22 and 23 having a unit area to a first electronic component or a second electronic component having a plurality of terminal rows, and the connection films 22 and 23 being interposed. Thus, there is a connection process for connecting the terminal of the first electronic component and the terminal of the second electronic component, and the film structure has a non-attached portion where the connection film is not attached in addition to the corresponding points of the plurality of terminal rows in the unit area.

Description

Method for producing a bonded structure, and a bonded structure, and a film structure, and a method for manufacturing a film structure

This technology relates to a method of manufacturing a connection structure that connects electronic components, a connection structure, a film structure, and a method of manufacturing the film structure. This application is based on Japanese Patent Application No. 2019-043203, filed on March 8, 2019 in Japan, and Japanese Patent Application No. 2019-100787, filed on May 29, 2019. By claiming priority on the basis of this application, this application is hereby incorporated by reference.

Conventionally, ACF (Anisotropic Conductive Film), NCF (Non Conductive Film), etc. are known as connection films for connecting various electronic components, etc., and the use of connection films to mount camera modules, etc. has been practiced (e.g. For example, see Patent Document 1).

Japanese Patent Publication No. 2015-130426

Recently, electronic components having a concave portion at the center of the mounting surface are known. For example, in a camera module, in order to accommodate an image sensor, the central portion of the ceramic substrate is extruded, a concave portion is formed at the center of the mounting surface, and a row of terminals is formed at the peripheral portion of the mounting surface. Additionally, electronic components having a plurality of terminal rows on a mounting surface, electronic components whose mounting surface is made of a plurality of convex portions, and having terminal rows in the convex portions are considered similar to those having concave portions.

When mounting electronic components having a plurality of terminal rows on such a mounting surface using a connection film, significant improvements in mounting equipment are required. For example, when attaching a connection film to each of a plurality of terminal rows on a mounting surface, it is necessary to attach the connection film multiple times. In addition, when mounting a connection film by attaching it to the entire surface of the electronic component mounting surface having a concave portion in the center of the mounting surface, there is concern that the concave portion may be filled with gas and the reliability of the connection may deteriorate.

The present technology was proposed in consideration of the existing situation, and includes a method of manufacturing a connection structure capable of mounting electronic components having a plurality of terminal rows on a mounting surface using existing equipment, a connection structure, and A film structure and a method of manufacturing the film structure are provided.

The method for manufacturing a connected structure related to the present technology is to form a unit area of a predetermined length in the longitudinal direction of the substrate and a predetermined width in the width direction of the substrate from a film structure including a tape-like substrate and a connecting film formed on the substrate. A sticking process of attaching a connection film to a first electronic component or a second electronic component having a plurality of terminal rows, and connecting a terminal of the first electronic component and a terminal of the second electronic component through the connection film. It has a connection process for connecting, and the film structure has a non-attached portion to which the connection film is not attached, other than the corresponding points of the plurality of terminal rows in the unit area.

A connection structure related to the present technology includes a first electronic component having a plurality of terminal rows, a second electronic component, and a predetermined length and a predetermined width between the first electronic component and the second electronic component in plan view. In addition to the corresponding points of the plurality of terminal rows in the unit area, a cured film is provided in which a connection film having a gap is cured, and the terminal of the first electronic component is connected to the terminal of the second electronic component.

A film structure related to the present technology includes a tape-like substrate and a connection film formed on the substrate, and has a unit area of a predetermined length in the longitudinal direction of the substrate and a predetermined width in the width direction of the substrate when viewed in plan. and has a non-attached portion in the direction from the periphery of the unit area to the center of the unit area.

A method for producing a film structure according to the present technology has a processing step of processing a film fabric including a tape-shaped substrate and a connecting film formed on the substrate, and in the processing step, the length of the substrate in a planar view is A film structure is formed, which has a unit area of a predetermined length in a direction and a predetermined width in the width direction of the substrate, and has a non-attached portion in the direction from the periphery of the unit area to the center of the unit area.

According to the present technology, the connection film has a non-attached portion where the connection film is not attached in addition to the corresponding points of the plurality of terminal rows in the unit area, thereby having a plurality of terminal rows on the mounting surface using existing mounting equipment. Electronic components can be mounted.

1 is a plan view showing the mounting surface of the camera module.
FIG. 2 is a cross-sectional view taken along the cutting line II-II shown in FIG. 1.
Figure 3 is a plan view showing a unit area of the film structure.
FIG. 4 is a cross-sectional view taken along the section line IV-IV shown in FIG. 3.
Fig. 5 is a cross-sectional view showing the sticking process of sticking the connection film to the camera module.
Figure 6 is a cross-sectional view showing the state in which the base material is peeled from the connection film in the sticking process.
Figure 7 is a cross-sectional view showing a mounting process for mounting a flexible substrate on a camera module.
Fig. 8 is a cross-sectional view showing the connection process of connecting the terminal of the camera module and the terminal of the flexible substrate through a connection film.
Fig. 9 is a cross-sectional view showing a connection structure on which a camera module is mounted.
Fig. 10 is a cross-sectional view showing a configuration example of a connection structure in which a camera module is mounted.
Fig. 11 is a perspective view showing a film roll.
Fig. 12 is a plan view showing the film structure of Modification Example 1.
Figure 13 is a plan view showing the film structure of Modification Example 2.
Fig. 14 is a plan view showing the film structure of Modification Example 3.
Fig. 15 is a plan view showing the film structure of Modification Example 4.
Fig. 16 is a plan view showing the mounting surface of another example of a camera module.
FIG. 17 is a plan view showing a first example of a film structure corresponding to the mounting surface shown in FIG. 16.
FIG. 18 is a plan view showing a second example of a film structure corresponding to the mounting surface shown in FIG. 16.
FIG. 19 is a plan view showing a third example of a film structure corresponding to the mounting surface shown in FIG. 16.
Fig. 20 is a plan view showing an example of a mounting surface of a camera module according to another embodiment.
FIG. 21 is a plan view showing an example of a connection film corresponding to the mounting surface of the camera module shown in FIG. 20.
FIG. 22 is a perspective view showing an example of a tape-like film structure for winding the connection film shown in FIG. 21.
Figure 23 is a cross-sectional view in the width direction including the non-attached portion of the film structure.

Hereinafter, embodiments of the present invention will be described in detail in the following order with reference to the drawings.

1. Manufacturing method of connection structure

2. Connection structure

3. Film structure

4. Method of manufacturing film structure

5. Variation example

6. Examples

<1. Manufacturing method of connection structure>

The method of manufacturing a connected structure according to the present embodiment includes a film structure comprising a tape-like substrate and a connecting film formed on the substrate, and a unit area having a predetermined length in the longitudinal direction of the substrate and a predetermined width in the width direction of the substrate. A sticking process of attaching a connection film to a first electronic component or a second electronic component having a plurality of terminal rows, and a connection process of connecting a terminal of the first electronic component to a terminal of a second electronic component through the connection film. The film structure has a non-attached portion where the connection film is not affixed other than the corresponding points of the plurality of terminal rows in the unit area. As a result, electronic components having a plurality of terminal rows can be mounted on the mounting surface using existing mounting equipment. In addition, in the sticking process, the connection films can be attached all at once, rather than sticking the connection films multiple times corresponding to a plurality of single rows.

Here, the “unit area” has a predetermined length in the longitudinal direction of the substrate and represents, for example, a rectangular area. In addition, “non-attached area” refers to an area in a unit area where the connection film is not attached to the electronic component, for example, a gap where the connection film does not exist, a connection film not attached by cut processing, etc. You can.

The first electronic component includes one whose mounting surface is comprised of a plurality of convex portions and having terminal rows on the convex portions, one having a plurality of terminal rows on a flat mounting surface, and one having a concave portion at the center of the mounting surface. Examples include those in which a single row is formed on the periphery of . The first electronic component having a concave portion at the center of the mounting surface has, for example, a rectangular mounting surface, with the mounting surface having two opposing sides of the periphery of the concave portion, two adjacent sides (L-shape), or the periphery of the concave portion. There are some that have single rows on three sides (コ-shaped, U-shaped, and C-shaped). Additionally, the single row may be located around the entire periphery. The peripheries and rows of these concave portions may be parallel or perpendicular, but are not limited to this and are adjusted appropriately depending on the object. Therefore, the shape of the unit area of the connection film is also appropriately adjusted accordingly.

In addition, the external shape of the mounting surface may be not only rectangular, but also, for example, curved, circular, or polygonal. Additionally, the external shape of the mounting surface may be composed of edges as described above, or may be a shape with the interior removed (extracted). Additionally, the shape of the mounting component having the mounting surface may or may not be the same as the mounting surface. This may be either the first electronic component or the second electronic component, or both (not shown).

When the first electronic component has a concave portion at the center of the mounting surface, the film structure preferably has a non-attached portion in the direction from the periphery of the unit area to the center of the unit area. As a result, it is possible to prevent the concave portion from being filled with gas and reducing the reliability of the connection.

When the unit area of the film structure is rectangular, the non-attached portion is preferably formed in the direction from the center of at least one side of the unit area to the center of the unit area. As a result, it is possible to mount the first electronic component having a mounting surface in which rows of terminals are formed on three sides (コ shape) around the periphery of the concave portion.

In addition, when the unit area of the film structure is rectangular, it is preferable that the non-attached portion is formed in the unit area from the central portion in the width direction of the base material in the longitudinal direction of the base material. As a result, it is possible to mount the first electronic component having a mounting surface on which a row of terminals is formed on two opposing sides of the periphery of the concave portion.

In addition, in the unit area of the film structure, the connection film is processed linearly to form an attachment part of, for example, a polygonal shape such as a hexagon, octagon, or dodecagon, a U-shaped shape, or a U-shaped shape made of a curve, C-shape, or cylindrical shape. You can do it. Additionally, the attached portion of the connection film may have a shape in which straight lines and curves are mixed. The polygon shape may be a regular polygon. Additionally, the corners of these shapes may be chamfered. Additionally, the attached portion of the connection film may be shaped so that a part of it is missing. For example, a rectangular corner may be missing, and the attached portion of the connection film may be shaped like a cross or similar shape. For example, when the unit area of the film structure is rectangular, the corners of the rectangular connection film may be chamfered with a straight line to form a non-attached part, and the attached part may be octagonal. Each corner of a square or rectangular connecting film can be made into an octagon by straight chamfering, or it can be made into a cross by missing the corners of a square or rectangular connecting film. This allows mounting with the connection film having an octagonal or cross shape. In addition, chamfering and defect processing are not limited to straight lines, and may be curved or may be a mixture of straight lines and curves. As an example, the octagonal or cross-shaped connection film may be one in which only part of the film has been chamfered or chipped. Additionally, the connection film may be in a shape in which part of the inner surface has been removed (extracted). In addition, the shape of the connection film is not limited to a straight line as above, and may be a curved shape or a mixture of straight lines and curves. In this case, as a film structure, only the connection film may be removed, or the connection film and the base material may be removed. As a result, when connecting using a connecting film, it is possible to prevent resin protruding from reaching the side of the mounting component to a large extent, especially at the corners of the mounting surface. Additionally, when assembling with other parts, unnecessary contact of the resin with other parts can be easily avoided, thereby contributing to preventing contamination. In particular, the more precise and small the shape, the more desirable it is to have a shape that has been chamfered or chipped (extracted processed).

In the film structure, it is preferable that in a unit area, at least a portion of the attachment portion has the same shape as the shape of the mounting surface of the first electronic component or the second electronic component. That is, the attached portion of the connection film may be, for example, rectangular, curved, circular, polygonal, etc. in accordance with the shape of the mounting surface, and may be U-shaped or U-shaped with some of these shapes missing. , C-shaped, etc. Additionally, the attached portion of the connection film may have a hollow shape with a portion of the inner surface removed. By matching the shape of the attachment portion of the connection film to the external shape of the mounting surface, part of the connection film can be prevented from protruding excessively from the mounting surface, making handling of the electronic components to be mounted easier and improving workability. This prevents disruption to the preceding and subsequent processes, and further reduces the overall manufacturing cost. For example, in connection, in the process of bonding the connection film to the substrate (temporary bonding), since the external shapes of the substrate and the connection film are similar, the effect of increasing workability can be expected.

In addition, in the film structure, in a unit area, the size of the outer periphery of the attachment portion may be small, the same, or large with respect to the size of the outer periphery of the mounting surface of the first electronic component or the second electronic component. Considering the suppression of excessive protrusion of the adhesive film, the lower limit of the size of the outer periphery of the attachment portion relative to the size of the outer periphery of the mounting surface is preferably 50% or more, and more preferably 80% or more. In addition, the upper limit for the size of the outer periphery of the mounting surface is preferably 110% or less, and is preferably 105% or less because it is desirable to have a margin for stable attachment when mounting is performed continuously if it is too small. It is more preferable, and it is more preferable that it is 100% or less. These require a connection film to sufficiently cover the terminals on the mounting surface, and can be adjusted appropriately according to the width and shape of the mounting surface. Additionally, the size of the attached portion may be adjusted taking into account the effective connection area and the influence of protrusion. In addition, it is desirable that the outer periphery of the attachment portion and the shape of the mounting surface of the first electronic component or the second electronic component match or resemble each other, but even if some different points exist, they are excluded from the scope of the present technology. no.

Additionally, the film structure preferably has a non-attached portion at the center of each unit area. This corresponds to a connection film having attached portions of shapes such as the U-shape, U-shape, and C-shape described above. Additionally, the non-attached portion may have a shape in which a part of the surface is removed and the inside is exposed. That is, in the film structure, the attached portion has an outer periphery and an inner periphery in a unit area. The attached portion of the connection film is required to have a sufficient effective connection area between the outer periphery and the inner periphery. Accordingly, when electronic components having concave portions on the mounting surface are mounted, unnecessary and excessive protrusion of the connection film can be prevented, and gas filling can be prevented. Additionally, the non-attached portion may be provided with slits or holes. Additionally, shapes such as a U-shaped shape, a U-shaped shape, and a C-shaped shape do not necessarily need to be connected. In this way, since it may be composed of sides, it may be a shape in which all sides forming the outer shape are connected and the inside is exposed. The film structure may be formed by separating the portions corresponding to the sides constituting these shapes to form an attached portion on the substrate. In the process of temporarily bonding and connecting the connection films, workability increases if performed all at once, and if performed on each side, equipment improvement is minimal, so introduction costs can be suppressed. In addition, since the connection film (attachment portion) of such sides is disposed on the base material, the film roll to be pulled out is contained as one, and it is expected that improvements from existing manufacturing equipment will be relatively minimal. The same effect can be expected even if all sides forming the outer shape are connected and the inner shape is exposed. It may be selected appropriately depending on conditions such as restrictions on equipment improvement for temporary bonding or compression of the connection film.

The first electronic component and the second electronic component are not particularly limited and can be appropriately selected depending on the purpose. Examples of the first electronic component include ceramic substrates, rigid substrates, flexible substrates (FPC: Flexible Printed Circuits), glass substrates, plastic substrates, resin multilayer substrates, IC (Integrated Circuit) modules, IC chips, etc. there is. Additionally, examples of the second electronic component include ceramic substrates, rigid substrates, flexible printed circuits (FPC), glass substrates, plastic substrates, and multilayer resin substrates.

In functional modules such as camera modules, ceramic substrates are sometimes used because of their excellent electrical and thermal insulation properties. Ceramic substrates have the advantage of excellent dimensional stability when miniaturized (for example, 1 cm 2 or less).

The connection film is not particularly limited and includes film-shaped anisotropic conductive film (ACF: Anisotropic Conductive Film), film-shaped adhesive film (NCF: Non Conductive Film), and the like. In addition, there is no particular limitation on the curing type of the connection film, and examples include heat curing type, light curing type, and light-heat combination curing type. Additionally, the connection film may be of a hot melt type using a thermoplastic resin. The connection film according to the present technology is formed on a base material (base film) and is separable from the release film. This is different from using the adhesive or curable resin integrally with the base material (using it without separating it). Therefore, advanced processing technology for the connection film is required.

In addition, this technology includes, for example, semiconductor devices (in addition to driver ICs, all those using semiconductors such as optical elements, thermoelectric conversion elements, and photoelectric conversion elements), display devices (monitors, televisions, head-mounted displays, etc.), Mobile devices (tablet terminals, smartphones, wearable terminals, etc.), game consoles, audio devices, imaging devices (those using image sensors such as camera modules), electrical mounting for vehicles (mobile devices), medical devices, sensor devices (touch) It can be used in the manufacturing method of all electronic devices that use electrical connections such as sensors, fingerprint authentication, iris authentication, etc.) and home appliances.

Hereinafter, as a specific example, a method of manufacturing a connection structure for mounting a camera module will be described. The manufacturing method of the connection structure shown as a specific example includes a sticking process of attaching a connection film to a camera module, a mounting process of mounting a flexible substrate on a camera module, and connecting the terminal of the camera module and the terminal of the flexible substrate through the connection film. There is a connection process for connecting.

[Camera module]

Fig. 1 is a plan view showing the mounting surface of the camera module, and Fig. 2 is a cross-sectional view taken along the cutting line II-II shown in Fig. 1. As shown in FIGS. 1 and 2, the camera module 10 includes a ceramic substrate 11 having a recess (cavity) in a rectangular mounting surface, and two opposing cavities around the periphery of the recess in the rectangular mounting surface. It is provided with a first string 12 and a second string 13 formed on each side, and an image sensor 14 accommodated in the concave portion. In addition, the camera module 10 has a mounting surface of a predetermined width (12W) on which the first string 12 is formed and a predetermined width on which the second string 13 is formed, in the cross section along the cutting line II-II. It has a mounting area of (13W).

[Film structure]

FIG. 3 is a plan view showing a unit area of the film structure, and FIG. 4 is a cross-sectional view taken along the cutting line IV-IV shown in FIG. 3. As shown in FIGS. 3 and 4, the film structure 20 includes a tape-like substrate 21 and connection films 22 and 23 formed on the substrate 21, and when viewed from the top, the substrate ( 21) has a rectangular unit area with a predetermined length 21L in the longitudinal direction and a predetermined width 21W in the width direction of the substrate 21. The film structure 20 has, in unit area, a gap 24 that is a non-attached portion in the longitudinal direction of the substrate 21 from the central portion in the width direction of the substrate 21. The voids 24 can be formed, for example, by extracting and processing an adhesive film from the central portion in the width direction of the substrate 21 in the longitudinal direction of the substrate 21. That is, the film structure 20 has a non-attached portion formed in the unit area from the central portion in the width direction of the substrate in the longitudinal direction of the substrate, and is formed in the first terminal row 12 and the second row of the ceramic substrate 11. In correspondence to the two terminal rows 13, a connection film 22 with a predetermined width (22W) and a connection film 23 with a predetermined width (23W) are formed spaced apart in the longitudinal direction of the base material 21.

The width (22W) of the connection film 22 and the width (23W) of the connection film 23 are the width (12W) of the mounting surface of the first terminal row 12 and the mounting surface of the second terminal row 13, respectively. Compared to the width (13W), it may be narrow, may be the same, or may be wide.

When the width of the connection film is narrower than the width of the mounting surface of the terminal row, excessive protrusion of the resin of the connection film from the film connection body can be suppressed. For this reason, it is possible to avoid excessively protruding resin from contacting the camera module or other mounted parts, and the workability of assembly can be improved. Additionally, it is effective when it is desirable to avoid contamination of mounted components. When the width of the connection film is wider than the width of the mounting surface of the terminal row, a sufficient amount of resin can be secured for the connection portion, and the peeling strength (connection strength) of the connection object can be improved. This is effective when it is desired to secure sufficient connection strength in a connection structure. When the width of the connection film is the same as the width of the mounting surface of the terminal row, the above two advantages can be achieved. The width of the connection film and the width of the mounting surface of the terminal row may be adjusted appropriately according to the specifications required for the mounting part.

From the viewpoint of the conduction characteristics and adhesion characteristics of the connection structure, the lower limits of the width 22W of the connection film 22 and the width 23W of the connection film 23 are the widths of the mounting surface of the first terminal row 12, respectively. (12W) and the width (13W) of the mounting surface of the second terminal row 13 is preferably 80% or more, more preferably 100% or more, and even more preferably 120% or more. From the perspective of shape processing, if it is too narrow, the difficulty increases. As an example, the width is 0.3 mm or more, preferably 0.4 mm or more, and more preferably 0.5 mm or more. Additionally, the upper limits of the width 22W of the connection film 22 and the width 23W of the connection film 23 are the width 12W of the mounting surface of the first row 12 and the width 12W of the second row 13, respectively. ) is preferably 280% or less of the width (13W) of the mounting surface, and is more preferably 240% or less.

Additionally, the lower limit of the width 24W of the gap 24 is 5% or more, preferably 10% or more, and more preferably 20% or more with respect to the width 21W of the substrate 21, and the gap 24 The upper limit of the width 24W is 80% or less, preferably 75% or less, and more preferably 60% or less with respect to the width 21W of the base material 21. If the width 24W of the gap 24 is too small, there is a concern that the concave portion may be sealed by the resin flow, and if the width 24W of the gap 24 is too large, the width of the connection film becomes narrow, so that it can be separated from the base material. There is concern that the connection film may peel off or that the adhesive strength of the connection body may become unsatisfactory depending on the case. As a specific example, the width 24W of the gap 24 is preferably 1.0 mm or more, and is preferably 1.2 mm or more. In this way, it is possible to prevent reliability from being reduced due to gas filling in the recessed portion, and high adhesive strength can be obtained. Moreover, since the amount of connection film used is reduced, it is also preferable in terms of environmental characteristics. Using the removed voids not only reduces environmental characteristics but also reduces material costs, thereby increasing economic efficiency. There is also a method of use, for example, storing the removed voids for verification purposes.

[Patching process]

FIG. 5 is a cross-sectional view showing the sticking process of attaching the connection film to the camera module, and FIG. 6 is a cross-sectional view showing the state in which the base material is peeled from the connection film in the sticking process. As shown in FIGS. 5 and 6 , in the sticking process, the connection films 22 and 23 of the unit area of the film structure 20 are electrodeposited on the camera module 10. For example, using a sticking device, the connection films 22 and 23 of each unit area are collectively affixed to the mounting surface of the camera module 10 on the stage by applying pressure from the substrate side of the film structure. The film structure on which the connection films 22 and 23 are electrodeposited is rolled up as only the base material.

[Mounting process]

Figure 7 is a cross-sectional view showing a mounting process for mounting a flexible substrate on a camera module. As shown in FIG. 7, the flexible substrate 30 is provided with a first string (12) and a second string (13) on the base material (31) of the camera module (10). 32) and a second terminal row (33). In the mounting process, the first terminal row 32 and the second terminal row 33 of the flexible substrate 30 and the first terminal row 12 and the second terminal row 13 of the camera module 10 are positioned. In alignment, the flexible substrate 30 is mounted on the camera module 10.

[Connection process]

Fig. 8 is a cross-sectional view showing the connection process of connecting the terminal of the camera module and the terminal of the flexible substrate through a connection film. As shown in FIG. 8, in the connection process, for example, the first terminal string 12 of the camera module 10 and the first terminal string 32 of the flexible substrate 31 are connected via the cushioning material 41. The image is pressed with the pressing tool 42, and the second terminal row 13 of the camera module 10 and the second terminal row 33 of the flexible substrate 30 are pressed with the pressing tool 43. . Additionally, depending on the curing type of the connection film, heating, light irradiation, etc. are performed to cure the connection film.

Fig. 9 is a cross-sectional view showing a connection structure on which a camera module is mounted. As shown in FIG. 9, the connection structure on which the camera module 10 is mounted has the first terminal string 12 of the camera module 10 and the first terminal string 32 of the flexible substrate 30 formed by a connection film. (22) is connected by the cured film 22A. In addition, the second row 13 of the camera module 10 and the second row 33 of the flexible substrate 30 are connected by a cured film 23A in which the connection film 23 is cured. In addition, in the case of a hot melt type connection film, the cured film 23 is a cured film connected by a hot melt type connection film.

According to the manufacturing method of such a bonded structure, the film structure has a non-attached portion in the direction from the periphery of the unit area to the center of the unit area when viewed in plan, so that a concave portion is formed at the center of the mounting surface using existing equipment. Electronic components having a groove can be mounted, and reliability can be prevented from being filled with gas in the concave portion.

＜2. Connection structure>

The connection structure according to the present embodiment includes a first electronic component having a concave portion at the center of the mounting surface, a second electronic component, and a predetermined length and a predetermined length in plan view between the first electronic component and the second electronic component. A connection film having a non-attached portion is provided in the direction from the periphery of the unit area of the width to the center of the unit area, and is provided with a cured film, and the terminal of the first electronic component is connected to the terminal of the second electronic component. As a result, it is possible to prevent reliability from being deteriorated due to gas filling in the concave portion.

As described above, the first electronic component and the second electronic component are not particularly limited and can be appropriately selected depending on the purpose. Additionally, the connection film and the curing type of the connection film are not particularly limited and can be appropriately selected depending on the purpose.

Hereinafter, as a specific example, a connection structure in which a camera module is mounted will be described. Fig. 10 is a cross-sectional view showing a configuration example of a connection structure in which a camera module is mounted. The same components as those shown in FIGS. 1 to 9 are given the same reference numerals and description is omitted. As shown in FIG. 10, the connection structure includes a camera module 10 having a first terminal row 12 and a second terminal row 13, and a first terminal row 32 and a second terminal row 33. A flexible substrate 30 having a cured film 22A in which a connection film 22 is cured between the first row 12 and the first row 32, and a second row 13. Between the second rows 33, a cured film 23A in which the connection film 23 is hardened is provided. Additionally, the connection structure has a protective glass 15 fixed on the ceramic substrate 11, and a lens 16 disposed on the image sensor 14 and installed in the casing. Additionally, in addition to the camera module mounting portion, a camera module driving IC 17 may be mounted on the flexible substrate 30.

According to the connection structure of such a configuration, it is difficult to optically shorten the distance T2 between the image sensor 14 and the lens 16, but the distance T1 between the lens 16 and the flexible substrate 30 ) can be shortened, making it thinner. In addition, in the connection structure, in the rectangular mounting surface, two opposing sides around the periphery of the concave portion of the ceramic substrate 11 are fixed with the cured film 22A and the cured film 23A, and a portion of the other two sides are not fixed. not. For this reason, the concave portion of the ceramic substrate 11 is blocked by the base material 31 of the flexible substrate 30, and the flexible substrate 30 can be prevented from expanding under the influence of the gas.

＜3. Film structure>

The film structure according to the present embodiment includes a tape-shaped base material and a connection film formed on the base material, has a unit area of a predetermined length in the longitudinal direction of the base material when viewed in plan, and has a unit area of a predetermined length from the periphery of the unit area. It has a non-attached area in the direction of the center. Additionally, the film structure can be in the form of a film reel recommended for the winding core.

Fig. 11 is a perspective view schematically showing a film rolling body. As shown in FIG. 11, the film winding body is formed by winding a film structure including a tape-like base material 21 and connection films 22 and 23 formed on the base material 21 to the core 25. The winding core 25 has an axial hole into which a rotating shaft for rotating the reel is inserted, and one end of the film structure in the longitudinal direction is connected to wind the film structure. The length of the film structure recommended for the film recommendation body is not particularly limited, but the lower limit of the length is 5 m or more, 10 m or more, and 50 m or more, and the upper limit of the length is 5000 m or less, 3000 m or less, and 1000 m or less. can be preferably used.

The base material 21 is a support film that is molded into a tape shape and supports the connection films 22 and 24. Examples of the substrate 21 include PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), and PTFE (Polytetrafluoroethylene). In addition, the base material 21 can preferably be one in which at least the surface on the side of the connection films 22 and 23 has been subjected to a peeling treatment with, for example, a silicone resin.

The thickness of the base material is not particularly limited. The lower limit of the thickness of the base material for separation is preferably 10 μm or more, more preferably 25 μm or more, and even more preferably 38 μm or more. The upper limit of the thickness of the base material is preferably 200 ㎛ or less, more preferably 100 ㎛ or less, and even more preferably 75 ㎛ or less, because there is concern that excessive pressure will be applied to the connection film if it is too thick. It may be 50 ㎛ or less. Additionally, since the present technology assumes that the base material and the connection film are separable, it is undesirable for the unit area to be extremely small because it causes unnecessary separation. Additionally, it is also undesirable for the same reason that the voids are too large.

Additionally, the width of the substrate is not particularly limited. When winding, the lower limit of the width of the base material is preferably 1 mm or more, more preferably 2 mm or more, and still more preferably 4 mm or more. The upper limit of the width of the base material may be 250 mm or less, preferably 120 mm or less, more preferably 60 mm or less, and even more preferably 10 mm or less, since there is concern that transportation and handling may become difficult if it is too large. The width of the substrate can be adjusted appropriately based on the size of the unit area and the gap. In addition, from consideration of productivity, it is preferable that a part of the connection film is in contact with the end of the width of the base film.

As described above, the connection film and the curing type of the connection film are not particularly limited and can be appropriately selected depending on the purpose. As described above, the curable type may be replaced with a hot melt type.

Hereinafter, an anisotropic conductive film containing conductive particles in an insulating binder will be described as an example. The lower limit of the thickness of the anisotropic conductive film may be, for example, the same as the conductive particle diameter, and is preferably 1.3 times or more or 10 μm or more than the conductive particle diameter. Additionally, the upper limit of the thickness of the anisotropic conductive film can be, for example, 40 μm or less or 2 times or less the conductive particle diameter. In addition, the anisotropic conductive film may be laminated with an adhesive layer or pressure-sensitive adhesive layer that does not contain conductive particles, and the number of layers and the lamination surface can be appropriately selected according to the object or purpose. Additionally, the same insulating resin as that for the anisotropic conductive film can be used as the insulating resin for the adhesive layer or pressure-sensitive adhesive layer. The conductive particles may be dispersed in the resin or may be arranged. Additionally, when the conductive particles are dispersed in the resin, they may be individually spaced apart in a non-contact manner. Additionally, the anisotropic conductive film preferably contains conductive particles so that the number of conductive particles trapped per terminal is preferably 5 or more, and more preferably 10 or more.

As the conductive particles, those used in known anisotropic conductive films can be appropriately selected and used. For example, metal particles such as nickel, copper, silver, gold, and palladium, and metal-coated resin particles in which the surfaces of resin particles such as polyamide and polybenzoguanamine are coated with a metal such as nickel. The surface may be insulated to a degree that does not impair conduction performance. Additionally, the surface shape may have protrusions.

The particle diameter of the conductive particles is not particularly limited, but the lower limit of the particle diameter is preferably 2 μm or more, and the upper limit of the particle diameter is, for example, 50 μm from the viewpoint of capture efficiency of the conductive particles in the bonded structure. It is preferable that it is ㎛ or less, and it is more preferable that it is 20 ㎛ or less. In addition, the particle diameter of the conductive particles can be a value measured by an image-type particle size distribution meter (as an example, FPIA-3000: manufactured by Malvern). This number is preferably 1000 or more, preferably 2000 or more.

As the insulating binder (insulating resin), a known insulating binder can be used. Examples of the curing type include heat curing type, light curing type, and light-heat combination curing type. For example, a photo radical polymerization type resin composition containing a (meth)acrylate compound and a photo radical polymerization initiator, a thermal radical polymerization type resin composition containing a (meth)acrylate compound and a thermal radical polymerization initiator, an epoxy compound and heat A thermal cationic polymerization type resin composition containing a cationic polymerization initiator, a thermal anionic polymerization type resin composition containing an epoxy compound and a thermal anionic polymerization initiator, etc. are mentioned. Additionally, a known adhesive composition may be used. Additionally, in the case of a hot melt type, the composition of Japanese Patent Publication No. 2014-060025 can be used.

Hereinafter, as a specific example, a thermal radical polymerization type insulating binder containing a film forming resin, an elastomer, a (meth)acrylic monomer, a polymerization initiator, and a silane coupling agent will be described. In addition, (meth)acrylic monomer refers to both acrylic monomer and methacrylic monomer.

There is no particular limitation on the film-forming resin, and examples include phenoxy resin, unsaturated polyester resin, saturated polyester resin, urethane resin, butadiene resin, polyimide resin, polyamide resin, and polyolefin resin. . Film forming resin may be used individually by 1 type, or may use 2 or more types together. Among these, it is particularly preferable to use phenoxy resin in terms of film forming properties, processability, and connection reliability. The phenoxy resin is a resin synthesized from bisphenol A and epichlorohydrin, and an appropriately synthesized resin may be used, or a commercially available product may be used. There is no particular limitation on the content of the film-forming resin, and for example, it is preferably 10% by mass to 60% by mass.

The elastomer is not particularly limited, and examples include polyurethane resin (polyurethane-based elastomer), acrylic rubber, silicone rubber, butadiene rubber, etc.

There is no particular limitation on the (meth)acrylic monomer, and for example, it may be a monofunctional (meth)acrylic monomer, or it may be a bifunctional or more polyfunctional (meth)acrylic monomer. From the viewpoint of stress relaxation of the polymer, it is preferable that 80% by mass or more of the (meth)acrylic monomers in the insulating binder are monofunctional (meth)acrylic monomers.

Moreover, from the viewpoint of adhesiveness, it is preferable that the monofunctional (meth)acrylic monomer has carboxylic acid. Moreover, the molecular weight of the monofunctional (meth)acrylic monomer having carboxylic acid is preferably 100 to 500, and more preferably 200 to 350. Moreover, the content of the monofunctional (meth)acrylic monomer having carboxylic acid in the insulating binder is preferably 3% by mass to 20% by mass, and more preferably 5% by mass to 10% by mass.

The polymerization initiator is not particularly limited as long as it can cure the (meth)acrylic monomer at a predetermined temperature during heat compression, and examples include organic peroxides. Examples of organic peroxides include lauroyl peroxide, butyl peroxide, benzyl peroxide, dilauroyl peroxide, dibutyl peroxide, peroxydicarbonate, and benzoyl peroxide. These may be used individually or in combination of two or more types. The content of the polymerization initiator in the insulating binder is not particularly limited, and is preferably, for example, 0.5% by mass to 15% by mass.

There is no particular limitation on the silane coupling agent, and examples include epoxy-based silane coupling agents, acrylic-based silane coupling agents, thiol-based silane coupling agents, and amine-based silane coupling agents. The content of the silane coupling agent in the insulating binder is not particularly limited, and is preferably, for example, 0.1% by mass to 5.0% by mass.

＜4. Manufacturing method of film structure>

The manufacturing method of the film structure has a processing step of processing a film fabric including a tape-shaped substrate and a connection film formed on the substrate, and in the processing step, a predetermined length and a thickness of the substrate are formed in the longitudinal direction of the substrate when viewed from a planar view. A film structure is formed that has a unit region of a predetermined width in the width direction and has a non-attached portion in the direction from the periphery of the unit region to the center of the unit region. In the processing process, the film fabric is subjected to slit processing, half-cut extraction processing, punching processing, punch press processing, etc. to form a connecting film of a desired shape in each unit area. Additionally, only the connection film on the base film may be processed and removed. Additionally, a step of forming a cover film on the connection film surface may be provided. Therefore, the above-described processing may be performed on the base material and the connection film, using the cover film as a support (replacement for the base material). As described above, since the base material and the connection film are peeled (separated) from the base material during use, the difficulty of the processing technology is high. The material of the cover film may be the same as that of the base material 21 described above. The thickness is preferably thinner than the base material 21.

For example, in the film structure shown in FIGS. 3 and 4, in the processing process, a full cut is performed to have a unit area of a predetermined width when viewed from the top, and a strip is cut from the periphery of the unit area to the center of the unit area. It can be obtained by performing a half cut to have a non-attached portion in the direction. Specifically, it can be obtained by fully cutting the film fabric to the width (21W) of the unit area and half-cutting it to the width (24W) that becomes the void 24, and extracting and processing a connection film of the width (24W). Since the film structure is processed to extract the connection film, the resin of the connection film can move into the voids of the non-attached area, so the protrusion and blocking that occur when reeled can be suppressed, and the mixing design as the connection film can be achieved. There is an advantage that the degree of freedom is increased. In addition, when a rolled body is formed after processing, traces of processing may remain on the connecting film when the connecting film and the processed area come into contact, making the appearance undesirable. To prevent this, a cover film may be formed.

The depth of the half cut is preferably 1% or more and 95% or less of the thickness of the base material. When the half cut is deep and the resin of the connecting film protrudes into the half cut part when it is reeled, protrusion and blocking can be suppressed. Additionally, when the half cut is shallow, it may not penetrate the connection film, so the depth of the half cut is preferably 5% or more of the thickness of the base material. This is also due to the thickness of the base material, but in order to perform a stable half cut, it is more preferable that it is 10% or more. When the viscosity of the adhesive film is high, it is preferably greater than 50%, more preferably 55% or more, and even more preferably 60% or more in order to obtain a reliable cut material. In addition, if the depth of the half cut is too deep, there is a risk of penetrating the substrate due to slight vibration during continuous half cuts, so the depth of the half cut is preferably 90% or less of the thickness of the substrate, and is preferably 80% or less. It is more preferable to set it to % or less, even more preferably to 50% or less, and in some cases to set it to 25% or less. This may be appropriately selected depending on the thickness of the substrate or the length of the film. Moreover, since such a half cut makes it easier to separate the connected film from the base material, improvement in manufacturing productivity of the connected structure can also be expected.

The processed film structure may be in a state in which the connection film formed on one side is half-cut, or a part of the connection film may be removed, so that the connection films may be individually present on the substrate. Moreover, from a manufacturing viewpoint, it is preferable that the connection film is supported on the base material, but the base material may be removed by using the cover film as a support. The choice may be made taking into account overall workability and economic feasibility from the manufacturing process of the film structure to the connection process using it. This wide range of choices increases convenience.

＜5. Modification example>

12 to 15 are plan views showing film structures of Modification Examples 1 to 4, respectively. As shown in FIG. 12, the film structure of Modification Example 1 has voids 241, which are non-attached portions, formed in each unit area from the center of the two longitudinal sides of the substrate to the entire width direction of the substrate, and is a rectangular thread. It can be used for electronic components that have a concave portion at the center of the scene and have a row of terminals on two opposing sides of the periphery of the concave portion.

Additionally, as shown in FIG. 13, in the film structure of Modification Example 2, voids 242, which are non-attached portions, are formed in a unit area from the center of one side in the longitudinal direction of the substrate to a part of the width direction of the substrate, and have a rectangular shape. It can be used for electronic components that have a concave portion at the center of the mounting surface of the image and have terminal rows on three sides around the concave portion.

In addition, as shown in FIG. 14, in the film structure of Modification Example 3, voids 243 and 244, which are non-attached portions, are formed in a portion of the width direction of the substrate from the center of two sides in the longitudinal direction of the substrate in a unit area. , It can be used for electronic components that have a concave portion in the center of a rectangular mounting surface and have terminal rows on two opposing sides of the periphery of the concave portion.

The film structures of such Modifications 1 to 3 can be formed, for example, by punching.

Additionally, as shown in FIG. 15, the film structure of Modification Example 4 has voids 245, which are non-attached portions, formed in a portion of the width direction of the substrate from the center of one side in the longitudinal direction of the substrate in a unit area, and has a rectangular shape. It can be used for electronic components that have a concave portion at the center of the mounting surface of the image and have terminal rows on three sides around the concave portion. In addition, the film structure of Modification Example 4 is a simple structure in which neither the base material nor the connection film is present in the non-attached portion by, for example, punch press processing, and the connection film is formed in a unit area length (21L) using a conventional sticking device. You can do a half cut.

Figure 16 is a plan view showing the mounting surface of the camera module. As shown in FIG. 16, the camera module 50 includes a ceramic substrate 51 having a recessed portion (cavity) in a rectangular mounting surface, and a ceramic substrate 51 formed on two opposing sides around the periphery of the recessed portion in the rectangular mounting surface. The first terminal row 52, the second terminal row 53, and the third terminal formed on one of the two sides that are not in contact with the two sides on which the first terminal row 52 and the second terminal row 53 are formed. It has a column 54 and an image sensor 55 accommodated in the concave portion. The mounting surface of this camera module 50 is rectangular, has a concave portion in the center, and has terminal rows on three sides (コ shape) around the periphery of the concave portion.

FIG. 17 is a plan view showing a first example of a film structure corresponding to the mounting surface shown in FIG. 16. The film structure shown in FIG. 17 has the periphery of the attached portion in the unit areas 21L and 21W having an octagonal shape. Accordingly, in the mounting of electronic components having a rectangular mounting surface, compared to the case where the peripheral shape of the attachment portion is rectangular, excessive protrusion of the resin after pressurization can be suppressed, and the side surfaces of the electronic components are prevented from being contaminated. can be prevented. Additionally, by chamfering the corners of the rectangular attachment portion with a straight line to form an octagonal attachment portion, the amount of connection film used can be reduced. Additionally, a non-attached portion may be formed in the center of the octagonal adhesive portion. Thereby, it is possible to prevent the concave portion of the camera module 50 from being sealed.

FIG. 18 is a plan view showing a second example of a film structure corresponding to the mounting surface shown in FIG. 16. In the film structure shown in FIG. 18, in the octagonal attached portion of the film structure shown in FIG. 17, a void 246, which is a non-attached portion, is formed in a portion of the width direction of the substrate from the center of one side in the longitudinal direction of the substrate. As a result, when mounting electronic components having the mounting surface shown in FIG. 16, sealing of the recessed portion of the camera module 50 can be prevented, and the amount of connection film used can be reduced. Additionally, by matching the external shape of the mounting surface and the film structure in necessary parts, excessive protrusion of unnecessary resin after bonding of the connection films can be suppressed.

FIG. 19 is a plan view showing a third example of a film structure corresponding to the mounting surface shown in FIG. 16. In the film structure shown in FIG. 19, the periphery of the attachment portion in unit areas 21L and 21W is shaped into a U-shape corresponding to the mounting surface shown in FIG. 16. In this, the corners of the rectangular attached portion are processed into curves, and a void 247, which is the non-attached portion, is formed in a part of the width direction of the substrate from the center of one side in the longitudinal direction of the substrate, and the corners are chamfered in a curved manner to form a U. It was made in the shape of a ruler. By having a curved shape at the attachment portion in this way, sharp parts are reduced, and thus it is possible to prevent the connection film from bending due to unnecessary contact.

The film structures shown as the first to third examples include, for example, a blade for cutting a base film (for example, polyethylene terephthalate) as a base material, a connection film for cutting into each shape, and cutting about half the thickness of the base material. It can be obtained by manufacturing a disk equipped with a half-cut blade, using this disk to punch a film fabric, and removing the non-attached portion. Additionally, the disk may have a connecting portion. In this case, in the longitudinal direction of the film structure, there may be some areas where the spacing between the attached portions of the connection film is different, but this is advantageous in terms of manufacturing management such as number measurement.

A method of manufacturing a bonded structure according to another embodiment includes a film structure comprising a tape-like substrate, a bonding film formed on the substrate, and a cover film attached to the bonding film, a predetermined length and a width of the substrate in the longitudinal direction of the substrate. A sticking process of attaching a connection film having a unit area of a predetermined width in a direction to a board component provided with an element and a plurality of electrodes formed around the element or an electronic component provided with an electrode corresponding to an electrode of the substrate component, and connection. It has a connection step of connecting the electrode of the substrate component and the electrode of the electronic component through a film, and the film structure has a non-attached portion made of a cover film at a corresponding point of the element in the unit area. Since the non-attached portion is made of a cover film, when the film structure is made into a rolled body wound around a core, it can be prevented from contacting the resin of the adhesive film with the processed substrate, etc., transferring its shape, and deteriorating its appearance. Additionally, excessive overflow of resin into the voids can be suppressed.

The cover film can be made of, for example, PET, OPP, PMP, PTFE, etc., in the same manner as the base material. Moreover, the thickness of the cover film is preferably thinner than the base material, preferably 8 to 38 μm, and more preferably 12 to 25 μm.

Moreover, in the sticking process, it is preferable to align the connection film and stick it to the board component or electronic component. As a result, it is possible to reliably prevent the adhesive film from adhering to the device.

Additionally, a connection structure according to another embodiment includes an element, a substrate component having a plurality of electrodes formed around the element, an electronic component including an electrode corresponding to an electrode of the substrate component, and a space between the substrate component and the electronic component. In a unit area having a predetermined length and a predetermined width, the element portion is provided with a cured film in which a connecting film having a void is cured, and the electrode of the substrate component and the electrode of the electronic component are connected. By using a connection film in which the element portion is void, it is possible to prevent the adhesive film from adhering to the element and deteriorating the function of the element. Additionally, since the connection film can be temporarily bonded to the substrate while avoiding the device, work efficiency during the connection process increases. Since such devices are often relatively expensive, it can be said that processing the connection film structure in advance is highly economical from a comprehensive perspective.

There are no particular restrictions on the board components and electronic components, and they can be appropriately selected depending on the purpose. Examples of substrate components include ceramic substrates, rigid substrates, flexible substrates (FPC: Flexible Printed Circuits), glass substrates, plastic substrates, resin multilayer substrates, IC (Integrated Circuit) modules, and IC chips. In addition, examples of electronic components include ceramic substrates, rigid substrates, flexible substrates (FPC: Flexible Printed Circuits), glass substrates, plastic substrates, and resin multilayer substrates.

In addition, it can be applied as a board component, for example, to one in which a semiconductor element is provided in the center of the mounting surface and electrodes are formed in the peripheral part of the mounting surface. For example, in the case of a board component having a semiconductor element at the center of a rectangular mounting surface, two opposing sides of the mounting surface, two adjacent sides (L-shape), or three sides around the periphery of the mounting surface (コ-shape, U-shape) , C-shaped), or have electrodes on four sides or all sides (in case of a pentagonal shape or more). The structure may be such that the connection film and the base material are penetrated and the inside is exposed (the middle of the noodle is exposed). In addition, the external shape of the mounting surface may be not only rectangular, but also, for example, curved, circular, or polygonal. In particular, as a substrate component, a camera module with an image sensor mounted at the center of a ceramic substrate is preferable from the viewpoint of excellent electrical insulation and thermal insulation.

Fig. 20 is a plan view showing an example of a mounting surface of a camera module according to another embodiment. As shown in FIG. 20, the camera module 60 includes a ceramic substrate 61, first electrodes 62A, 62B, and 62C respectively formed on two opposing sides of the periphery of the image sensor 65, and second electrodes 62A, 62B, and 62C. Electrodes (63A, 63B, 63C) and a third electrode (64) formed on one of the two sides that are not in contact with the two sides on which the first electrodes (62A, 62B, 62C) and the second electrodes (63A, 63B, 63C) are formed. ) and an image sensor 65 mounted on the central portion of the ceramic substrate 61. In other words, this camera module 60 has first to third electrodes on three peripheral sides (C shape) of the rectangular image sensor 65. In addition, the image sensor is not limited to the mounting surface shown in FIG. 20 and may have electrodes on all four sides of the image sensor.

FIG. 21 is a plan view showing an example of a connection film corresponding to the mounting surface of the camera module shown in FIG. 20. The connection film 70 has an attached portion 71 consisting of four sides around the image sensor 65, and a non-attached portion 72, which is a gap portion in which the portion corresponding to the image sensor 65 is exposed. Since the image sensor 65 portion is a void portion, it is possible to prevent the connection film 40 from adhering to the image sensor 65.

FIG. 22 is a perspective view showing an example of a tape-like film structure wound around the connection film shown in FIG. 21, and FIG. 23 is a cross-sectional view in the width direction including the non-attached portion of the film structure. The film structure 80 includes a tape-like substrate 81, a connection film 82 formed on the substrate 81, and a cover film 83 affixed on the connection film 82, and the substrate 81 ) has a rectangular unit area with a predetermined length L in the longitudinal direction and a predetermined width W in the width direction of the base material 81, and a rectangular non-attached portion 84 made of the cover film 83 in the center of the unit area. ) has. By attaching the cover film 83, even if the resin of the connection film penetrates into the non-attached portion 84, the film structure can be easily taken out from the recommended body. Moreover, the appearance of the connection film can also be maintained by attaching the cover film 83.

In addition, in the film structure shown in FIG. 22, a hollow portion where the base material 81 and the connection film 82 are punched out is formed in each rectangular unit area with a predetermined length (L) and a predetermined width (W). The cover film 83 in FIG. 22 is not penetrated, and the base material 81 and the connection film 82 are penetrated by punching. At this time, the connection film 82 may be half-cut at every predetermined length (L) to correspond to the portion to be used, or may be removed. When the cover film is used as a support, the base material 81 and the connection film 82 may be half-cut or removed at every predetermined length (L) to correspond to the portion to be used. Alternatively, it may be processed in advance into the shape shown in FIG. 21 and attached to the cover film.

The base material 81 and the cover film 83 are formed into a tape shape and are support films that support the connection film 82. The base material 81 and the cover film 83 are the same as in the above-described embodiment, for example, PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), PTFE. (Polytetrafluoroethylene), etc. Moreover, the base material 81 and the cover film 83 can preferably be used so that at least the surface on the connection film 82 side has been subjected to a peeling treatment with, for example, a silicone resin.

The connection film 81 is not particularly limited, as in the above-described embodiment, and examples include a film-shaped anisotropic conductive film (ACF: Anisotropic Conductive Film), a film-shaped adhesive film (NCF: Non Conductive Film), etc. . Additionally, there is no particular limitation on the curing type of the connection film 81, and examples include heat curing type, light curing type, and light-heat combination curing type. Additionally, the connection film 81 may be of a hot melt type using a thermoplastic resin.

In the winding body, the film structure is wound around the core so that the cover film 83 is on the outside or inside. Such a film structure has a processing step of processing a film fabric including a tape-shaped substrate and a connection film formed on the substrate, and a sticking step of attaching a cover film to the processed film fabric. In the processing step, the substrate is It can be manufactured by punching out the central portion of the base material and the connection film in a unit area having a predetermined length in the longitudinal direction and a predetermined width in the width direction of the base material. Additionally, if necessary, the film fabric can be fully cut into a predetermined width of a unit area, connected to each other, and wound on a core.

In the processing process, the predetermined length and predetermined width when punching out the base material and the connection film in the central portion of the unit area are, as an example, 0.3 mm or more, preferably 0.4 mm or more, and more preferably 0.5 mm or more. When the size at which the base material and the connection film are punched out is small, the resin of the connection film may protrude from the punched portion and a non-attached portion is not formed.

In addition, in the present technology, an adhesive film is attached to the corresponding point of the single row or electrode, but conductive particles may be formed only at the corresponding point of the single row or electrode. As a technology for forming conductive particles only at corresponding points of the terminal row or electrode, examples include Japanese Patent Application Laid-Open No. 2016-119306 and Japanese Patent Application Publication No. 2016-131152.

For example, by forming a resin mold with recesses arranged in a lattice at positions corresponding to single rows or electrodes, filling the recesses of the resin mold with conductive particles, and transferring the conductive particles from the resin mold to an insulating resin film. , it is possible to obtain a connection film in which conductive particles are arranged only at corresponding points of the terminal row or electrode. The conductive particles in the connection film are preferably arranged so that, for example, the number of conductive particles captured in one terminal or electrode is 5 or more, and the number of conductive particles captured in one terminal or electrode is 10 or more. It is more preferable to arrange them as much as possible. Additionally, the arrangement of the conductive particles can be used as an alignment mark for the connection film.

Example

＜6. Example>

Hereinafter, embodiments of the present technology will be described. In this example, a connection structure was manufactured using an anisotropic conductive film, and the conduction characteristics were evaluated.

[Manufacture of anisotropic conductive film]

5 parts by mass of resin core conductive particles (Ni (base)/Au (surface) plating, resin core) with an average particle diameter of 20 ㎛ and 95 parts by mass of an insulating binder consisting of the following components are mixed with a planetary stirring device (product name: Awatori Ren) Taro, manufactured by THINKY) and stirred for 1 minute to prepare an anisotropic conductive adhesive composition. Then, the anisotropic conductive adhesive composition was applied onto a PET film with a thickness of 50 μm, dried in an oven at 80° C. for 5 minutes, and an adhesive layer made of the anisotropic conductive adhesive composition was formed on the PET film, with a width of 6.0 mm and a thickness of 25 mm. An anisotropic conductive film of ㎛ thickness was manufactured. Additionally, the ratio of conductive particles and insulating binder was adjusted so that the number of traps after connection was 5 or more.

The insulating binder is 47 parts by mass of phenoxy resin (Product name: YP-50, manufactured by Shin-Nikka Epoxy Co., Ltd.), 3 parts by mass of monofunctional monomer (Product name: M-5300, manufactured by Toa Synthetic Co., Ltd.), and urethane resin (Product name: UR). -1400, manufactured by Toyo Seki Co., Ltd.) 25 parts by mass, rubber component (Product name: SG80H, manufactured by Nagase Chemtex Co., Ltd.) 15 parts by mass, silane coupling agent (Product name: A-187, manufactured by Momentive Performance Materials Japan) A mixed solution of ethyl acetate and toluene containing 2 parts by mass and 3 parts by mass of an organic peroxide (brand name: Naifer BW, manufactured by Nichiyu Co., Ltd.) so that the solid content was 50% by mass was prepared.

[Manufacture of connection structure]

Through an anisotropic conductive film, a substrate for camera module evaluation (ceramic substrate, width 6.0 mm, width of mounting surface of terminal row 1.0 mm, 200 μm pitch, line: space = 1:1, terminal thickness 10 μm, Ni (base) /Au (surface) plating, cavity structure, terminal rows on two opposing sides) and FPC (polyimide film, 200 ㎛ pitch, line: space = 1:1, terminal thickness 12 ㎛, Ni (base) /Au (surface) plating) was heat-compressed to produce a bonded structure. Thermocompression was performed by pressing the tool from the FPC side through a silicone rubber with a thickness of 200 μm under the conditions of temperature: 120°C, pressure: 1 MPa, and time: 6 sec. In practical terms, it is desirable that five or more capture numbers are obtained from each terminal. In addition, as a result of observing the indentations of the connected structure manufactured this time under a microscope from the FPC side, it was confirmed that the number of trapped conductive particles in the terminal was 5 or more.

[Evaluation of conduction characteristics]

Using a digital multimeter (manufactured by Yokogawa Electric Co., Ltd.), the initial conduction resistance value of the connection structure when a current of 1 mA was passed was measured by the four-terminal method. In addition, after the reliability evaluation test under the conditions of temperature 121°C, humidity 100%, and atmospheric pressure 2 atm, the conduction resistance value of the connection structure was measured (12 h, 24 h). For conduction characteristics, if the conduction resistance value after the reliability evaluation test is equivalent to the initial conduction resistance value (variation is 5% or less), it is evaluated as “A”, and if the conduction resistance value after the reliability evaluation test increases from the initial conduction resistance value, (variation exceeding 5%) was evaluated as “B”. The conduction resistance values of 20 samples of the connection structure were measured (N = 20), and the sample with the highest conduction resistance value was used for evaluation.

[Evaluation of adhesive properties]

For the bonded structure, a 90-degree peeling test was performed on the FPC at a peeling speed of 50 mm/min, and the force required for peeling was measured. The adhesive properties were evaluated by setting the peel strength of Comparative Example 1 to 1. The peel strength of 20 samples of the bonded structure was measured (N = 20) and evaluated using the sample with the lowest peel strength.

＜Experimental Example 1＞

An anisotropic conductive film with a width of 6.0 mm was attached to a substrate for camera module evaluation to prepare a connection structure. Table 1 shows the evaluation of the conduction characteristics and the adhesion characteristics of the connection structure.

<Example 1>

3 and 4, the width (22W) of the connection film 22 is 0.8 mm, the width (23W) of the connection film 23 is 0.8 mm, and the width (24W) of the gap 24 is 0.8 mm. A half-cut process to a depth of 20 μm (40% of the thickness of the base material) was performed on a PET film with a thickness of 50 μm to obtain a thickness of 4.4 mm, and an anisotropic conductive film was manufactured. Table 1 shows the evaluation of the conduction characteristics and the adhesion characteristics of the connection structure.

<Example 2>

3 and 4, the width 22W of the connection film 22 is 1.2 mm, the width 23W of the connection film 23 is 1.2 mm, and the width 24W of the gap 24 is 1.2 mm. An anisotropic conductive film was manufactured in the same manner as in Example 1, except that the thickness was set to 3.6 mm. Table 1 shows the evaluation of the conduction characteristics and the adhesion characteristics of the connection structure.

<Example 3>

3 and 4, the width (22W) of the connection film 22 is 2.4 mm, the width (23W) of the connection film 23 is 2.4 mm, and the width (24W) of the gap 24 is 2.4 mm. An anisotropic conductive film was manufactured in the same manner as in Example 1, except that the thickness was set to 1.2 mm. Table 1 shows the evaluation of the conduction characteristics and the adhesion characteristics of the connection structure.

＜Experimental Example 2＞

In the film structure shown in FIGS. 3 and 4, the width (22W) of the connection film 22 is 2.88 mm, the width (23W) of the connection film 23 is 2.6 mm, and the width (24W) of the gap 24 is 2.6 mm. An anisotropic conductive film was manufactured in the same manner as in Example 1, except that the thickness was set to 0.24 mm. Table 1 shows the evaluation of the conduction characteristics and the adhesion characteristics of the connection structure.

As shown in Table 1, in Experimental Example 1 in which an anisotropic conductive film was affixed to the entire substrate for camera module evaluation, the conduction resistance value increased after the reliability evaluation test. In addition, in Experimental Example 2 in which the width of the gap was 4% (0.24 mm) of the width of the camera module evaluation substrate, the conduction resistance value increased after the reliability evaluation test. In Experimental Example 2, since the gap width was narrow, the gap was clogged by the resin flow during connection, and in the reliability evaluation test, the FPC was expanded due to the expansion of the gas, and the resistance value was thought to be increased. In addition, even if the performance of Experimental Example 1 and Experimental Example 2 is satisfactory, there is no particular problem in practical use.

On the other hand, in Examples 1 to 3, where the width of the gap was 5% to 75% of the width of the camera module evaluation substrate, the conduction resistance value after the reliability evaluation test was equal to the initial conduction resistance value. Moreover, in Examples 2 and 3, in which the width of the anisotropic conductive film was 100% to 250% of the width of the mounting surface of the single row, the peeling strength was 1, similar to Experimental Example 1.

In addition, an anisotropic conductive film having an attached portion of the shape shown in FIG. 18 was used, and a camera module evaluation substrate (ceramic substrate, width 6.0 mm, 1st to 1st) having a U-shaped single row as shown in FIG. 16 was used. 3 Width of terminal row mounting surface 1.0 mm, 200 ㎛ pitch, line: space = 1:1, terminal thickness 10 ㎛, Ni (base)/Au (surface) plating, cavity structure, terminal row on each side of コ(equipped) and FPC (polyimide film, 200 ㎛ pitch, line: space = 1:1, terminal thickness 12 ㎛, Ni (base)/Au (surface) plating) were thermocompressed to prepare a connection structure. The anisotropic conductive film had the same formulation as above, and the ratio of the maximum film width to the width of the single row (1.0 mm) on the mounting surface of the first to third single rows was set to 100% (1.0 mm). Here, the film width is the width from the gap side to the outside in the attached portion of the shape shown in FIG. 18. And, as a result of evaluating the conduction properties and adhesion properties of the connection structure in the same manner as above, the conduction properties were A and the adhesion properties were 1, similar to Example 2.

In addition, an anisotropic conductive film having an attached portion of the shape shown in FIG. 17 was used, and a camera module evaluation substrate (ceramic substrate, width 6.0 mm, 1st to 1st) having a U-shaped single row as shown in FIG. 16 was used. 3 Width of terminal row mounting surface 1.0 mm, 200 ㎛ pitch, line: space = 1:1, terminal thickness 10 ㎛, Ni (base)/Au (surface) plating, cavity structure, terminal row on each side of コ(equipped) and FPC (polyimide film, 200 ㎛ pitch, line: space = 1:1, terminal thickness 12 ㎛, Ni (base)/Au (surface) plating) were thermocompressed to prepare a connection structure.

The anisotropic conductive film has corner portions chamfered in unit areas (21L, 21W), and the peripheral shape of the attached portion is octagonal, and the length (21L) and width (21W) of the attached portion are each evaluated by the camera module. It is the same as the length and width of the substrate. That is, the anisotropic conductive film is chamfered at a portion corresponding to the corner portion of the evaluation substrate. And, as a result of evaluating the conduction characteristics and adhesion characteristics of the connection structure in the same manner as above, the same results as in Experimental Example 1 were shown. The performance was not problematic in practical terms, excessive protrusion of the resin after connection was suppressed, and handling was excellent.

The base material and the anisotropic conductive material have the same square shape as in Figure 21 (the connection film and the base material are taken out), and the widths of all four sides are 0.8 mm, 1.2 mm, and 2.4 mm (same as Examples 1 to 3). The film was punched. As a cover film, a film structure with a width of 6.0 mm formed of a PET film with a thickness of 12 μm was produced. Using this film structure, a substrate for camera module evaluation (ceramic substrate, width 6.0 mm, width of mounting surface of first to third terminal rows 1.0 mm, 200 μm pitch, line: space = 1:1, terminal thickness 10 μm) , Ni (base)/Au (surface) plating, no cavity structure, terminal rows on each side of the コ character), and FPC (polyimide film, 200 ㎛ pitch, line: space = 1:1, terminal thickness 12 ㎛, Ni (base)/Au (surface) plating) was heat-compressed to produce a bonded structure. As a result of evaluating the conduction characteristics and adhesion characteristics of the connection structure in the same manner as above, it was found that no matter which anisotropic conductive film with a width of 0.8 mm, 1.2 mm, or 2.4 mm on all four sides was used, the conduction characteristic was A. and were all the same as Examples 1 to 3. Additionally, all adhesive properties were the same as Examples 1 to 3. In the same manner as above, the evaluation results showed no practical problems. In addition, since the base material and the anisotropic conductive film were processed to fit the outer shape of the substrate, manual alignment work was easy when bonding to the ceramic substrate. If carried out mechanically, it is expected to be more efficient.

In addition, for the above three types of samples, without forming a cover film on the anisotropic conductive film through which the core was extracted, 10 or more layers were manually wound on a core of ϕ150 mm, taken out, and inspected with the naked eye at 10 or more arbitrary points. Confirmed. In all three types of samples above, traces of punching remained on the surface of the connecting film. As a result of the same evaluation after forming the cover film, no traces of punching remained on the surface of the connection film. If the appearance is impaired, the cause of the defect becomes unclear when anisotropic connection is continuously performed. Therefore, in order to avoid this, it is found that it is preferable to form a cover film.

10: Camera module
11: Ceramic substrate
12: 1st terminal row
13: second terminal row
14: image sensor
15: protective glass
16: Lens
17: IC for driving camera module
20: film structure
21: Description
22: connection film
23: connection film
24: void
30: Flexible substrate
31: Description
32: first terminal row
33: second terminal row
41: cushioning material
42: Compression tool
43: Compression tool
50: Camera module
51: ceramic substrate
52: first terminal row
53: second terminal row
54: third terminal row
55: image sensor
60: Camera module
61: Ceramic substrate
62A ~ 62C: first electrode
63A ~ 63C: second electrode
64: third electrode
65: image sensor
70: connection film
71: Cheopbubu
72: Non-attached couple
80: film structure
81: Description
82: connection film
83: Cover film
84: Non-attached couple

Claims (30)

From a film structure including a tape-like substrate and a connection film formed on the substrate, a connection film having a unit area of a predetermined length in the longitudinal direction of the substrate and a predetermined width in the width direction of the substrate is provided, having a plurality of terminal rows. A sticking process of attaching to the first electronic component or the second electronic component,
A connection step of connecting the terminal of the first electronic component and the terminal of the second electronic component via the connection film,
A method of manufacturing a connected structure, wherein the film structure has a non-attached portion to which the connection film is not attached, in addition to the corresponding points of the plurality of terminal rows in the unit area. According to claim 1,
The first electronic component has a concave portion at the center of the mounting surface,
A method of manufacturing a bonded structure, wherein the film structure has the non-attached portion in the direction from the peripheral portion of the unit region to the center of the unit region. From a film structure including a tape-like substrate and a connection film formed on the substrate, a connection film having a unit area of a predetermined length in the longitudinal direction of the substrate and a predetermined width in the width direction of the substrate is provided, having a plurality of terminal rows. A sticking process of attaching to the first electronic component or the second electronic component,
A connection step of connecting the terminal of the first electronic component and the terminal of the second electronic component via the connection film,
The film structure has a non-attached portion to which the connection film is not attached, other than the corresponding points of the plurality of terminal rows in the unit area,
The first electronic component has a concave portion at the center of the mounting surface,
The film structure has the non-attached portion in a direction from the periphery of the unit area to the center of the unit area,
The unit area is rectangular,
A method of manufacturing a bonded structure in which the non-attached portion is formed in a direction from the center of at least one side of the unit area to the center of the unit area. From a film structure including a tape-like substrate and a connection film formed on the substrate, a connection film having a unit area of a predetermined length in the longitudinal direction of the substrate and a predetermined width in the width direction of the substrate is provided, having a plurality of terminal rows. A sticking process of attaching to the first electronic component or the second electronic component,
A connection step of connecting the terminal of the first electronic component and the terminal of the second electronic component via the connection film,
The film structure has a non-attached portion to which the connection film is not attached, other than the corresponding points of the plurality of terminal rows in the unit area,
The first electronic component has a concave portion at the center of the mounting surface,
The film structure has the non-attached portion in a direction from the periphery of the unit area to the center of the unit area,
The unit area is rectangular,
A method for producing a bonded structure, wherein the non-attached portion is formed in the unit area in the longitudinal direction of the substrate from the central portion in the width direction of the substrate. From a film structure including a tape-like substrate and a connection film formed on the substrate, a connection film having a unit area of a predetermined length in the longitudinal direction of the substrate and a predetermined width in the width direction of the substrate is provided, having a plurality of terminal rows. A sticking process of attaching to the first electronic component or the second electronic component,
A connection step of connecting the terminal of the first electronic component and the terminal of the second electronic component via the connection film,
The film structure has a non-attached portion to which the connection film is not attached, other than the corresponding points of the plurality of terminal rows in the unit area,
The first electronic component has a concave portion at the center of the mounting surface,
The film structure has the non-attached portion in a direction from the periphery of the unit area to the center of the unit area,
The first electronic component has a rectangular mounting surface,
A method of manufacturing a connection structure, wherein the mounting surface has a terminal row on two opposing sides, two adjacent sides, or three sides around the periphery of the concave portion. The method according to any one of claims 1 to 5,
A method of manufacturing a bonded structure in which the non-attached portion is a void. The method according to any one of claims 1 to 5,
The base material is half-cut into the shape of the non-attached portion,
A method for producing a bonded structure, wherein the depth of the half cut is 1% or more and 95% or less of the thickness of the base material. The method according to any one of claims 1 to 5,
A method for producing a connected structure in which the non-attached portion is formed by punching out the base material and the connection film at the center of the unit area. The method according to any one of claims 1 to 5,
A method for producing a bonded structure, wherein the bonded film is an anisotropic conductive film. The method according to any one of claims 1 to 5,
A method of manufacturing a connection structure wherein the first electronic component is a camera module. a first electronic component having a plurality of terminal strings;
a second electronic component;
Between the first electronic component and the second electronic component, a cured film is provided in which a connection film having voids is cured in addition to corresponding points of the plurality of terminal rows in a unit area of a predetermined length and a predetermined width in a plan view, ,
The terminal of the first electronic component is connected to the terminal of the second electronic component,
In the unit area, in addition to the corresponding points of the plurality of terminal rows, there is a non-attached portion where the connection film is not pasted,
The first electronic component has a concave portion at the center of the mounting surface,
A connected structure comprising the non-attached portion in the direction from the peripheral edge of the unit region to the center of the unit region. The description on the tape,
Provided with a connection film formed on the substrate,
In plan view, it has a unit area of a predetermined length in the longitudinal direction of the substrate and a predetermined width in the width direction of the substrate, and has a non-attached portion in the direction from the periphery of the unit area to the center of the unit area,
A film structure in which the substrate is half-cut into the shape of the non-attached portion. The description on the tape,
Provided with a connection film formed on the substrate,
In plan view, it has a unit area of a predetermined length in the longitudinal direction of the substrate and a predetermined width in the width direction of the substrate, and has a non-attached portion in the direction from the periphery of the unit area to the center of the unit area,
The base material is half-cut into the shape of the non-attached portion,
A film structure wherein the depth of the half cut is 1% or more and 95% or less of the thickness of the substrate. According to claim 12,
A film structure in which the non-attached portion is formed by punching out the base material and the connection film at the center of the unit area. A film roll body comprising the film structure according to any one of claims 12 to 14 rolled onto a winding core. a first electronic component having a concave portion at the center of the mounting surface;
a second electronic component;
Between the first electronic component and the second electronic component, a cured film is provided in which the connection film of the unit area of the film structure according to any one of claims 12 to 14 is cured,
A connection structure formed by connecting a terminal of the first electronic component and a terminal of the second electronic component. It has a processing process for processing a film fabric including a tape-shaped substrate and a connecting film formed on the substrate,
In the processing step, a unit area having a predetermined length in the longitudinal direction of the base material and a predetermined width in the width direction of the base material is provided in a planar view, and a non-attached portion is formed from the peripheral portion of the unit area toward the center of the unit area. Forming a film structure having,
In the processing step, a full cut is performed to have a unit area of a predetermined width when viewed from the top, and a half cut is performed to have a non-attached portion in the direction from the periphery of the unit area to the center of the unit area. Method of manufacturing the structure. delete According to claim 17,
A method for producing a film structure, wherein the depth of the half cut is 1% or more and 95% or less of the thickness of the substrate. According to claim 17,
In the processing step, the base material and the connection film in the central portion of the unit area are punched out to form the non-attached portion. A unit area of a predetermined length in the longitudinal direction of the substrate and a predetermined width in the width direction of the substrate is formed from a film structure comprising a tape-like substrate, a connection film formed on the substrate, and a cover film attached on the connection film. A sticking process of attaching a connection film having a connection film to a board component provided with an element and a plurality of electrodes formed around the element, or to an electronic component provided with electrodes corresponding to the plurality of electrodes of the substrate component;
A connection step of connecting the electrode of the substrate component and the electrode of the electronic component via the connection film,
The film structure has a non-attached portion made of a cover film at a corresponding point of the element in the unit area,
A method of manufacturing a bonded structure in which the base material is half-cut into the shape of the non-attached portion. According to claim 21,
In the pasting process, the connection film is aligned and attached to a board component or electronic component. A substrate component including an element and a plurality of electrodes formed around the element,
An electronic component having an electrode corresponding to the electrode of the substrate component,
Between the substrate component and the electronic component, a unit area having a predetermined length and a predetermined width is provided with a cured film in which a connection film having a gap in the portion of the element is cured,
It is formed by connecting the electrode of the board component and the electrode of the electronic component,
In the unit area, in addition to the corresponding points of the plurality of electrodes, there is a non-attached portion to which the connection film is not attached,
The board component has a concave portion at the center of the mounting surface,
A connected structure comprising the non-attached portion in the direction from the peripheral edge of the unit region to the center of the unit region. The description on the tape,
A connection film formed on the substrate,
Provided with a cover film affixed on the connection film,
It has a unit area of a predetermined length in the longitudinal direction of the substrate and a predetermined width in the width direction of the substrate, and has a non-attached portion made of the cover film at the center of the unit area,
A film structure in which the substrate is half-cut into the shape of the non-attached portion. According to claim 24,
The unit area is rectangular,
A film structure in which the non-attached portion is rectangular. The film structure according to claim 24 or 25 is recommended. A processing step of processing a film fabric including a tape-shaped substrate and a connecting film formed on the substrate,
It has a sticking process of attaching a cover film to the processed film fabric,
In the processing step, the base material and the connection film are punched out in a central portion of a unit area having a predetermined length in the longitudinal direction of the base material and a predetermined width in the width direction of the base material,
Having a non-attached portion made of the cover film at the center of the unit area,
A method for producing a film structure, wherein the substrate is half-cut into the shape of the non-attached portion. A sticking process of attaching the connection film of the film structure according to any one of claims 12 to 14, 24, and 25 to a first electronic component or a second electronic component having a plurality of terminal rows,
A method of manufacturing a connected structure, comprising a connection step of connecting the terminal of the first electronic component and the terminal of the second electronic component via the connection film. a first electronic component having a concave portion at the center of the mounting surface;
a second electronic component;
A cured film is provided between the first electronic component and the second electronic component, wherein the connection film of the unit area of the film structure according to claim 24 or 25 is cured,
A connection structure formed by connecting a terminal of the first electronic component and a terminal of the second electronic component. The method of claim 1 or 2,
A method of manufacturing a connection structure in which the connection film is not subjected to cut processing.