JP2012182442A - Display panel module assembly apparatus and anisotropic conductive material transport apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a display panel module assembly apparatus and an anisotropic conductive material transport apparatus which maintain stable tension and prevent a bond position of a thin ACF tape from moving when electronic components such as COFs on the ACF tape are mounted and compressively bonded.SOLUTION: An ACF tape is transported in such a manner that two tape clamps exchange their positions between an upstream and a downstream in the ACF tape transport direction, and tape tension is stabilized at positions where an ACF tape is bonded onto COFs 4.

Description

The present invention relates to a display panel module assembling apparatus and an anisotropic conductive material processing unit.
For example, electronic parts such as COF (Chip on film) and PCB (Printed Circuit Board) are attached to the edge of the display panel substrate (display cell substrate) of FPD (Flat Panel Display) such as liquid crystal and plasma by anisotropic conductive members The present invention relates to a bonding apparatus and a display panel module assembling apparatus using the bonding apparatus.

  The display panel module assembly apparatus performs a plurality of processing operations on the FPD display panel substrate such as liquid crystal or plasma in order, so that a COF (driving IC chip is mounted on the periphery of the display panel substrate and wiring is applied. A device for mounting a piece-like film substrate) and a PCB (printed wiring substrate). For mounting, a film-like anisotropic conductive member in which conductive particles are kneaded into an adhesive called ACF (Anisotropic Conductive Film) is used, and the display panel substrate and COF, and COF and PCB are connected via this ACF. They are connected (Patent Document 1).

  FIG. 1 is an example of a conventional display panel module assembly method (Patent Document 1). A wiring portion 2 formed of a material such as chrome is present around the panel substrate 1 (FIG. 1A). After the wiring part 2 is cleaned by the terminal cleaning device, the ACF 3 is attached by thermocompression bonding (FIG. 1B). Next, COF 4 is mounted at the position where ACF 3 is pasted on panel substrate 1 in accordance with the position of the panel substrate wiring, and thermocompression-bonded (FIG. 1C). In parallel with the above processing, the ACF 7 is attached to the terminal row 6 of the PCB 5 by thermocompression bonding (FIGS. 1D and 1E). The panel substrate 1 to which the COF 4 is fixed and the PCB 5 to which the ACF 7 is attached are transported into the same processing apparatus, and the panel substrate 1 and the COF 4 and the COF 4 and the PCB 5 are firmly connected via the ACF 7 ( FIG. 1 (f)).

  The example of FIG. 1 is an example in which the ACF is attached to the panel substrate 1 or the PCB 5 side. However, Patent Document 2 discloses an example in which the ACF is attached to the COF side and then the panel substrate and the COF are connected. Has been. The COF is placed on the ACF tape, and the ACF is attached to the terminal portion of the COF by thermocompression bonding. Thereafter, the COF is conveyed onto the panel substrate and is thermocompression bonded to fix the COF on the panel substrate.

  Patent Document 2 describes a method for transporting an ACF tape used in an apparatus for attaching a tape-shaped ACF to a COF. The ACF tape fed out from the reel is conveyed in the horizontal direction using a guide roller with the ACF surface facing upward. The conveyance of the ACF tape is performed by moving the two sets of conveyance chucks while sandwiching the ACF.

  In addition to Patent Document 2, Patent Document 3 can also be cited as an example of a method for transporting an ACF tape by two pairs of transport chucks.

Japanese Patent Laid-Open No. 2002-341786 JP 2009-26830 A JP 2000-340616 A

  Although there is no intention to limit the present invention, a point that is not considered in the prior art will be described. FIG. 2 shows a method of assembling the display panel module disclosed in Patent Document 2. As described with reference to FIG. 1A, the wiring portion 2 formed of a material such as chromium is present around the panel substrate 1 (FIG. 2A). After the wiring part 2 is cleaned by the terminal cleaning device, the COF 21 with the ACF attached on the terminal row is aligned on the panel substrate and thermocompression bonded (FIG. 2B). The PCB (FIG. 2C) whose terminal portion has been cleaned is transported into the same processing apparatus, and the panel substrate 1 and the COF 21 and the COF 21 and the PCB 5 are firmly connected via the ACF (FIG. 2D). ).

  The method described in Patent Document 2 described above has a merit that the size of the entire assembly apparatus can be reduced compared to the example of Patent Document 1 because the unit for attaching the ACF is only one place. .

  An anisotropic conductive member (ACF) sticking device disposed in an assembly device for a display panel module uses a tape-shaped ACF film having a width of 1 to 2 mm. Since the ACF film is an adhesive member having a thickness of 15 to 35 μm, it is integrated with a member called release paper having a thickness of 50 to 80 μm. The release paper-attached ACF is handled in a state wound on a reel. In Patent Document 2, the ACF with release paper wound around the reel is pulled out long, and a pair of transport clamps sandwich the ACF with release paper and move it.

  FIG. 3 shows a method of conveying the ACF with release paper disclosed in Patent Document 2. The release paper-attached ACF tape 61 fed out from the ACF reel 60 is horizontally conveyed using a guide roller 62 with the ACF surface facing upward. A conveyor belt 63 is stretched in parallel with the ACF tape 61 with release paper, and moves by the same amount as the ACF tape 61 with release paper. The conveyor belt 63 has a suction hole penetrating in the thickness direction, and can convey the COF 67 while sucking it. Further, tension is applied to the ACF tape with release paper and the conveyor belt by a tension roller so that no slack occurs. Then, the COF 67 is mounted and pressure-bonded on the ACF surface. The ACF tape 61 with release paper is transported by two sets of transport clamp units.

  Each time the COF 67 is mounted and pressure-bonded on the ACF surface, the first clamp portion 64 moves by a predetermined distance while sandwiching the conveyor belt and the release paper tape, and transports. Thereafter, the second clamp 65 is fixed by sandwiching the conveyor belt and the release paper tape. In this state, the first clamp part 64 opens and returns to the upstream side to prepare for the next conveyance. In order to stably transport the tape, it is considered that a mechanism for collecting the tape is also required on the downstream side of the transport clamp. However, Patent Document 2 does not consider this point.

  By transporting the tape as described above, the COF 67 can be sequentially mounted on the ACF surface. For example, the following undesirable phenomenon occurs. As described above, the ACF is very thin, and even when it is integrated with the release paper, the total thickness is 100 μm or less, so that it will be stretched when tension is applied to the tape. When the tension is 1 N, the ACF with release paper extends 2 to 3 mm per meter. When the tension exceeds 1N, due to the adhesiveness of the ACF part of the ACF with release paper wound around the reel, the release paper sticks to both sides, and the two-layer structure of ACF and release paper is destroyed. To do. For this reason, the tension is used to be 1N or less, but a minimum level of tension (about 0.2N or more) is necessary for stable transport of the tape. Therefore, the ACF with release paper is conveyed in an extended state, and the amount of extension is very large compared to the accuracy of the ACF attachment position on the electronic component.

  In the tape transport method of Patent Document 2, after the first clamp unit 64 moves and transports a predetermined distance while sandwiching the release paper tape, the second clamp 65 on the downstream side is fixed by sandwiching the release paper tape. Then, after that, the first clamp part 64 opens and returns to the upstream position. In order to stably recover the release paper tape, it is necessary to apply tension to the downstream side of the first clamp part 64. However, since there are a plurality of rollers on the upstream side of the first clamp portion 64 and the ACF with release paper is adsorbed, there is a conveyance resistance. Therefore, the tension of the tape when the tape conveyance by the first clamp portion 64 is finished is larger than the tension applied by the tension roller and is likely to fluctuate. Since the structure on the downstream side of the first clamp portion 64 is not complicated, a constant force suitable for recovery is applied to the tape tension. Therefore, at the moment when the first clamp part 64 is opened after the second clamp part 65 is closed, the tension fluctuation occurs in the upstream tape, and the tape elongation changes. The change becomes a change in the COF mounting position, which leads to a change in the ACF attachment position.

  The conveyor belt 63 is also conveyed by the same method. Since the conveyor belt 63 is used for a long period of time, it is not possible to use a member that generates elongation due to tension. Therefore, it is difficult to move the conveyor belt 63 where elongation does not occur and the ACF tape with release paper where elongation occurs in parallel and convey it straight without rotating the COF.

  Moreover, since the release paper peeling method in Patent Document 2 is performed by changing the direction of the release paper tape with the knife edge 66, the tension applied to the release paper tape varies. For this reason, the tension varies in the region from the first clamp part 64 to the knife edge 66, and the feed amount of the ACF tape with release paper becomes unstable.

  Further, since there are two terminal portions in the COF, it is necessary to attach the ACF to both at the same time. However, Patent Document 2 does not consider the attachment of the ACF to the two terminal portions.

  Patent Document 3 discloses a method of transporting an ACF tape using two sets of chucks. This document describes an example of a tape transport method focusing on the tension of the ACF tape. However, in the example of this document, attention is paid to release the release paper appropriately by releasing the tension of the ACF tape in the release paper peeling step, which is a time step after the ACF tape conveying step and the ACF attaching step. Therefore, no consideration is given to the tension fluctuation in the ACF tape transport process.

  Therefore, an object of the present invention is to provide an apparatus for attaching an ACF to a terminal portion of a COF with high accuracy in an ACF attaching apparatus existing in a display panel module assembling apparatus. Furthermore, another object of the present invention is to reduce the size of the entire display panel module assembling apparatus by providing the ACF adhering apparatus.

  The first feature of the present invention for achieving the above object is that two ACF tapes with release paper are arranged side by side in accordance with the width of the COF, and two tape clamps are used for each tape. Is to be intermittently sent with high accuracy in the feed direction. Specifically, one of the two tape clamps moves while sandwiching the tape to transport the tape, and the other tape clamp is fixed in place, and only the tape is fixed and released by opening and closing the clamp. The moving clamp that moves is moved past the fixed clamp where the open position is fixed while sandwiching the tape, and conveys a predetermined amount of tape. Thereafter, the fixing clamp is closed to fix the tape, and after the tape is fixed, the moving clamp is opened and the fixing clamp is passed over to return to the original position in the upstream direction to fix the tape. By repeating the above operation, a predetermined amount of tape feeding is performed with high accuracy.

  Further, the second feature of the present invention for achieving the above object is that the release means of the release paper is disposed in the feeding section of the ACF tape, and the ACF tape is fixed on the upstream side and the downstream side of the release means. The peeling operation is performed in a state, and the tension fluctuation of the ACF tape is not propagated to the preceding and subsequent processes. The peeling means is composed of one guide roller for guiding the feeding of the ACF tape and a traveling block. A peeling roller and a guide roller are attached to the traveling block, and are positioned directly under the ACF tape, and reciprocate a distance corresponding to the length of the ACF attached to the COF from the standby position to the peeling position. At this time, the COF is adsorbed and held so as not to shift its position. The guide roller is fixed downstream of the standby position of the traveling means in the ACF tape feeding direction and tens of mm below the position where the COF is sucked and held. When the moving means moves a distance corresponding to the length of the ACF attached to the COF from the standby position to the peeling position, the release paper is peeled off from the ACF. By performing the operation of peeling the release paper from the ACF that is pressure-bonded to the COF during the pressure-bonding operation on the upstream side of the COF, the ACF tape can be fixed by the thermo-compression means on the upstream side of the peeling means. . Further, the ACF fixing on the downstream side of the peeling means can be executed by a clamp used for tape feeding.

  The present invention has the following effects. It should be noted that at least one of the following effects may be played or may be played simultaneously.

  The present invention has an effect that the position where the ACF is attached to an electronic component such as COF is stabilized.

  The present invention has an effect of preventing the fluctuation in tension of the ACF tape from affecting the preceding and following processes.

  For example, in the present invention, the tape tension is stable at the position where the ACF is attached to the COF because the two tape clamps feed the tape in such a manner that the positions of the two tape clamps are switched between the upstream side and the downstream side. To do. Therefore, since the tape feed amount by the tape clamp is constant, there is an effect that the ACF attachment position on the COF is stabilized. At the same time, since the half-cut position is stabilized, the ACF tape attachment length is also stabilized.

  Also, for example, in the present invention, the release means of the release paper is disposed in the feeding section of the ACF tape, and the peeling operation is performed with the ACF tape fixed on the upstream side and the downstream side of the release means. There is an effect that the tension fluctuation is not propagated to the preceding and following processes.

The figure explaining the conventional display panel module assembly method. The figure explaining the other conventional display panel module assembly method. The figure explaining the conventional ACF tape conveyance method. 1 is a diagram illustrating an ACF attachment device according to Embodiment 1. FIG. FIG. 4 is a diagram illustrating a COF conveyance method according to the first embodiment. FIG. 3 is a block diagram illustrating an ACF attachment method according to the first embodiment. FIG. 6 is a diagram for explaining the operation of the ACF pasting apparatus according to the first embodiment. Operation | movement explanatory drawing following FIG. Operation | movement explanatory drawing following FIG. Operation | movement explanatory drawing following FIG. Operation explanatory diagram following FIG. 10 is an operation explanatory diagram following FIG. 8 of the operation of the ACF attaching apparatus. Operation | movement explanatory drawing following FIG. Operation | movement explanatory drawing following FIG. The figure explaining the ACF sticking apparatus of Example 1 from upper direction. FIG. 6 is a diagram for explaining a peeling operation of the release paper 11 in the first embodiment. FIG. 6 is a diagram illustrating Example 2. FIG. 6 is a diagram for explaining a third embodiment. 10 is a block diagram of Example 3. FIG.

  This will be described below with reference to the drawings.

  As described above, the display panel module assembly method includes 1) a method of attaching ACF to the terminal portion of the panel and the terminal portion of the PCB, and placing and fixing the COF on the ACF, and 2) two locations of the COF. There are two types of methods: a method in which ACF is attached to the terminal portion and COF is disposed and fixed on a panel or PCB.

  The present embodiment relates to a process of attaching ACF to two terminal portions of the COF, which is a part of the method 2) which is advantageous for downsizing of the apparatus. In this embodiment, COF will be described as an example. However, it is called a member called TCP (Tape Carrier Package) or an FPC (Flexible Printed Circuit) without an IC chip due to a difference in detailed shape and material. Electronic parts such as members may be used.

  FIG. 4 is a diagram showing a schematic configuration of an ACF adhering apparatus which is an example of an anisotropic conductive material processing unit. By rotating the supply roll 10 and the collection roll 50, the ACF tape 12 with the release paper 11 is conveyed horizontally on a support member to be described later via the guide rollers 13a and 13b. The conveyance of the ACF tape 12 with the release paper 11 is intermittently performed by a distance obtained by adding a certain length to the length of the COF. In the ACF adhering apparatus of this embodiment, since the ACF is applied to the two terminal portions of the COF, two ACF tapes 12 with the release paper 11 are arranged in parallel. Hereinafter, although the feeding mechanism of the ACF tape 12 with the release paper 11 will be described, the same transport mechanism performs the same operation at the same time.

  A predetermined tension is applied to the ACF tape 12 with the release paper 11 by the weight of the tension applying rolls 14 and 42 that are movable in the vertical direction. After the ACF tape 12 with the release paper 11 starts to move in the horizontal direction by the guide roller 13b, the ACF tape 12 is formed on the supporting member 16 by the half cutter unit 15 including a cutter blade and an adhesive tape disposed in the middle thereof. Two cuts are made in all of the tape 12 and part of the release paper 11. The ACF tape 12 between the cuts is collected by the adhesive tape in the half cutter unit 15. Hereinafter, the length of the collected ACF tape is referred to as a hollowing amount. The hollowing amount corresponds to a “constant length” corresponding to a distance obtained by adding a certain length to the length of the COF in the above-described portion of the transport amount of the ACF tape 12 with the release paper 11.

  When the ACF tape 12 with the release paper 11 is transported onto the next support member 18, the COF 19 sucked and transported by the pressure bonding member 17 is positioned and mounted on the ACF tape 12. Since the portion where the crimping member 17 adsorbs the COF 19 is heated, it is temporarily fixed when the adhesive force of the ACF tape 12 is generated.

  Further, when the ACF tape 12 with the release paper 11 is conveyed and the COF 19 mounted in the previous stage reaches the next support member 21, it is thermocompression bonded by the pressure bonding member 20.

  When the ACF tape 12 with the release paper 11 is further conveyed, the release paper 11 is peeled off by the peeling means 23 moving in the horizontal direction with the COF suction holding member 22 sucking the COF 19. This peeling operation will be described in detail later.

  The COF adsorption holding member 22 adsorbs the COF 19 and conveys the COF 19 to a COF mounting portion on a panel substrate (not shown).

  Next, details of a method for transporting the ACF tape 12 will be described.

A moving clamp 31 that is an example of a first gripping mechanism and a fixed clamp 32 that is an example of a second gripping mechanism are disposed downstream of the location where the ACF tape 12 is peeled from the release paper 11.
The movable clamp 31 and the fixed clamp 32 fix and release the release paper 11 by opening and closing. The moving clamp 31 moves from the position 31 a to the position 31 b in conjunction with the operation of the supply roll 10 and the operation of the collection roll 50 with the release paper 11 sandwiched therebetween. By the operation of the moving clamp 31, the ACF tape 12 with the release paper 11 is conveyed. The distance from the position 31a to the position 31b is the sum of the length of the COF 19 and the amount of hollowing out of the ACF tape 12 collected by the half-cut unit.

  When the moving clamp 31 moves while sandwiching the release paper 11, it moves so as to pass between the open fixed clamps 32. Further, the height position of the tension applying rolls 14 and 42 movable in the vertical direction is optically detected by a sensor, so that the supply roll 10 and the collection roll 50 are rotated so that the total length of the ACF tape 12 with the release paper 11 is increased. adjust. Since the tension applying rolls 14 and 42 are suspended by the ACF tape 12 with the release paper 11, a constant tension is applied to the ACF tape 12 with the release paper 11.

  FIG. 5 is a schematic view showing how the COF is conveyed in the above-described ACF sticking apparatus. Two ACF tapes 12a and 12b with release paper 11a are arranged in parallel. As described with reference to FIG. 1, the half cutter unit 15 makes two cuts in all of the ACF tapes 12a and 12b and part of the release papers 11a and 11b. Since the ACF tapes 12a and 12b between the cuts are collected by the adhesive tape in the half cutter unit 15, the release paper 11 is exposed. Thereafter, the COF 19 is mounted on the ACF tapes 12a and 12b. The ACF tape 12 is bonded to the terminal portion of the COF 19 by thermocompression bonding with a crimping member from above the COF at the crimping position.

  As described above, the moving clamp 31 moves relative to the fixed clamp 32 with the two release papers 11 interposed therebetween, so that the ACF tape 12 is attached to the two terminal portions on the COF one after another. be able to.

  Here, the ACF tape 12 with the release paper 11 is very thin, and the total thickness of the two layers is 100 μm or less. Therefore, the ACF tape 12 with the release paper 11 is used in an extended state during the operation of attaching the ACF tape 12. The amount of elongation is very large compared to the positional accuracy allowed for attaching the ACF tape 12 on the COF 19. For this reason, it is necessary to stabilize the tension fluctuation in the section where the COF 19 is conveyed. The biggest factor that the tension varies is the operation of peeling the release paper 11 from the ACF tape 12 with the release paper 11. The tension can be stabilized by appropriately fixing the ACF tape 12 with the release paper 11 during the peeling operation.

  Hereinafter, a method for stabilizing the tension of the ACF tape 12 with the release paper 11 will be described with reference to FIGS.

  FIG. 6 is a block diagram showing a series of operations related to the ACF pasting on the COF.

  First, in a state where the moving clamp 31 is closed, it moves between the open fixed clamps 32 by the length of the sum of the length of the COF 19 and the amount of hollowing out of the ACF tape while sandwiching the release paper 11 (401 in FIG. 4). ). By this operation, the COF 19 moves by one section (FIGS. 7 and 8). Here, the part where the moving clamp 31 grips the release paper 11 can also be expressed as a first part, for example.

  FIG. 14 is a view of the positions of the movable clamp 31 and the fixed clamp 32 shown in FIGS. 7 and 8 as viewed from above. FIG. 14A is a view of the positions of the movable clamp 31 and the fixed clamp 32 of FIG. 7 as viewed from above. The moving clamp 31 opens and closes when the opening and closing mechanism 34 is driven. The opening / closing mechanism 34 includes an actuator and a fixed block for fixing the actuator. The fixed block is movable along a guide rail 35 disposed between the two release papers 11 by a predetermined stroke. Similarly, the fixed clamp 32 opens and closes when the opening and closing mechanism 33 is driven. The opening / closing mechanism 33 is also composed of an actuator and a fixed block for fixing the actuator.

  FIG. 14B shows a state in which the moving clamp 31 is moving downstream from the position of the fixed clamp 32. As can be seen from FIGS. 14 (a) and 14 (b), in this embodiment, when a single ACF tape is transported, the moving clamp 31 and the fixed clamp 32 constitute a pair to constitute a set of transport system. Can be expressed as Therefore, if there are two pairs of the moving clamp 31 and the fixed clamp 32, it can be expressed that there are two transport systems.

  As shown in FIG. 4, a tension applying roll 42 is disposed downstream of the fixed clamp 32, and a predetermined tension is applied by its own weight, so that the release paper 11 is recovered without sagging. . Note that it is not necessary to consider the elongation of the release paper 11 on the collection side, and since one of the two clamps is always closed, there is a difference in the tension of the release paper 11 tape between the upstream side and the downstream side of the clamp. There is no problem even if there is. In order to recover the release paper 11 stably, the weight of the tension applying roll 42 is set larger than that of the tension applying roll 14.

  Thereafter, the fixed clamp 32 is closed with the moving clamp 31 closed (402 in FIGS. 9 and 6). Next, the crimping member 17 is lowered to thermally press the COF 19 (403 in FIGS. 9 and 6). Here, the place where the fixed clamp 32 is closed can be expressed as, for example, a second place upstream of the place where the moving clamp 31 is gripped.

  Next, the moving clamp 31 is opened, and the COF adsorption holding member 22 descends to adsorb COF (404 in FIGS. 10 and 6). At this time, the movable clamp 31 is opened, but the fixed clamp 32 and the pressure-bonding member 17 are lowered, so that the ACF tape 12 with the release paper 11 on the upstream side of the position of the movable clamp 31 is applied with tension in the entire region. The tension set by the roll 14 is maintained.

  Thereafter, in a state where the COF adsorption holding member 22 has adsorbed the COF 19, the release means 23 moves in the horizontal direction, whereby the release paper 11 is released (FIG. 11). During this peeling operation, the moving clamp 31 is opened and moves upstream via the outside of the fixed clamp 32 sandwiching the ACF tape 12 with the release paper 11 (405 in FIGS. 12 and 6). 406 in FIG.

  This peeling operation will be described in detail with reference to FIG.

  FIG. 15A shows a state before the peeling operation.

  The peeling means 23 is arranged on the upstream side of the moving clamp 31 and the fixed clamp 32, and includes a traveling block 24 to which a peeling roller 25 and a guide roller 26 are attached. The traveling block 24 is located immediately below the ACF tape, and reciprocates a distance corresponding to the length of the ACF attached to the COF 19 from the standby position to the peeling position. At this time, the COF 19 is adsorbed and held by the COF adsorbing / holding member 22 so as not to shift its position. The guide roller 27 that guides the feeding of the ACF tape exists downstream of the standby position of the traveling means in the ACF tape feeding direction, and is fixed several tens of mm below the position where the COF 19 is sucked and held. At this time, the pressure-bonding member 17 is lowered on the upstream side of the COF adsorption holding member 22, and the fixed clamp 32 is closed on the downstream side of the peeling means 23, so that the ACF tape 12 with the release paper 11 is provided. The tension fluctuation is limited to a closed region. Here, it can be expressed that the peeling means 23 is arranged in a surface direction facing the COF adsorption holding member 22, for example.

  FIG. 15B shows a state in the middle of the peeling operation, in which the peeling roller 25 attached to the travel block 24 has advanced to the position A in FIG. The length of the release paper 11 from the position A in FIG. 15A to the guide roller 27 is the same as the length of the release paper 11 from the peeling roller 25 to the guide roller 27 in FIG. In FIG. 15B, since the path of the release paper 11 is shorter, the tension becomes smaller, and the ACF tape 12 is peeled off from the release paper 11 only by the rigidity of the release paper 11. Therefore, an excessive force does not act, and the ACF tape 12 is not peeled off from the COF 19. Thereafter, when the traveling block 24 moves from the standby position to the peeling position by a distance corresponding to the ACF attachment length to the COF, the ACF tape 12 is completely peeled from the release paper 11.

  A half-cut operation is performed during the peeling operation (407 in FIG. 6). Since the pressure-bonding member 17 is lowered, the tension fluctuation of the ACF tape 12 with the release paper 11 in the peeling operation does not reach, so the cutter blade hits a desired position and the half-cut operation is performed. At the same time, the COF adsorption holding member 22 rises and conveys the COF 19 toward the position where the COF 19 is mounted on the panel (FIG. 13). Thereafter, the crimping member 17 is raised (408 in FIG. 6), and the fixed clamp 32 is opened (409 in FIG. 6). By repeating the above steps, the operation of attaching the ACF to the two terminal portions of the COF 19 can be continuously executed.

  With the above method, the moving clamp 31 and the fixed clamp 32 feed the ACF tape 12 with the release paper 11 in such a manner that the positions of the moving clamp 31 and the fixed clamp 32 are switched between the upstream side and the downstream side with respect to the feeding direction of the ACF tape 12 with the release paper 11. The tape tension at the position where the ACF tape 12 is attached to the COF 19 is stabilized. Therefore, since the feed amount of the ACF tape 12 with the release paper 11 by the two clamps is constant, the position where the ACF tape 12 is stuck on the COF 19 is stabilized. In addition, since the half-cut position is stable, the ACF tape attachment length is also stable.

  Then, although not shown, a subsequent processing unit arranges and fixes the COF 19 with the ACF tape 12 affixed on a panel or PCB. As a result, the display panel module is assembled.

  The process of attaching the ACF to the two terminal portions of the COF 19 has been described above. However, depending on the type of the display panel module to be manufactured, the ACF may be attached to only one terminal portion. In this case, instead of the ACF tape 12 with the release paper 11 on one side, a tape material such as a low friction guide may be disposed and the COF 19 may be conveyed with two tapes. Further, the low friction guide may not be a tape material as long as it has a relatively low friction, and may serve as a guide for defining the conveyance direction. Here, instead of the one ACF tape 12 with the release paper 11, for example, if a conveyance belt that does not perform adsorption is used, a small COF can also be conveyed. Here, the conveyance belt that does not perform adsorption can be expressed as a conveyance belt that allows the COF to move smoothly, for example.

  The movable clamp 31 and the fixed clamp 32 are, for example, a gripping system that grips two places having different positions, and transports a transport target such as the release paper 11 by relatively changing the two places to be gripped. It can be expressed as a system. Moreover, the moving clamp 31 and the fixed clamp 32 can also be expressed as a system that holds, for example, a first location and a second location upstream of the first location. Further, the tension of the object to be conveyed by this system (which can also be expressed as the tension upstream from the place gripped by at least one of the moving clamp 31 and the fixed clamp 32) is substantially constant. It can also be expressed as being kept in Here, the substantially constant tension means that, for example, the tension may be expressed as being constant even when there is a tension fluctuation that does not affect the conveyance of the ACF tape.

  Next, Example 2 will be described. FIG. 16 is a diagram for explaining the ACF conveying method of this embodiment. The difference between the present embodiment and the first embodiment is that the movable clamp 31 and the fixed clamp 32 can be retracted from the transport position of the release paper 11. In the second embodiment, parts different from the first embodiment will be mainly described. In FIG. 14 of the first embodiment, when the moving clamp 31 moves to the downstream side of the fixed clamp 32 with the release paper 11 interposed therebetween, the moving clamp 31 passes between the open fixed clamps 32. By adopting the configuration of FIG. 18 of the present embodiment, the fixed clamp 32 is retracted to the outside of the release paper 11, so that the opening / closing stroke of the fixed clamp 32 when the moving clamp 31 moves from the upstream side to the downstream side is performed. It can be made smaller than in the case of Example 1.

  Further, since the fixed clamp 32 is retracted when the moving clamp 31 moves upstream of the fixed clamp 32, the opening / closing stroke of the moving clamp 31 can be made smaller than that in the first embodiment.

  FIG. 16A shows a state immediately before the conveyance operation of the release paper 11 is started. The moving clamp 31 opens and closes when the opening and closing mechanism 34 is driven. The opening / closing mechanism 34 includes an actuator and a fixed block for fixing the actuator, and the opening / closing mechanism 34 is movable along the guide rail 35 by a predetermined stroke. Further, the guide rail 35 moves so that the moving clamp 31 can be retracted from the conveying position of the release paper 11.

  The fixed clamp 32 opens and closes when the opening and closing mechanism 33 is driven. The opening / closing mechanism 33 includes an actuator and a fixed block for fixing the actuator, and the fixed block is movable along the guide rail 36 by a predetermined stroke.

  After the moving clamp 31 is closed and the release paper 11 is sandwiched, the fixed clamp 32 releases the release paper 11 and moves to the outside of the release paper 11 along the guide rail 36. Thereafter, the moving clamp 31 conveys the release paper 11 by a predetermined length (state shown in FIG. 16B).

  Next, with the moving clamp 31 sandwiching the release paper 11, the fixed clamp 32 returns to the conveyance position of the release paper 11 and sandwiches the release paper 11. Next, the moving clamp 31 is opened, the guide rail 35 is retracted, and the moving clamp 31 is retracted from the conveyance position of the release paper 11 (FIG. 16C). Thereafter, the opening / closing mechanism 34 of the moving clamp 31 moves by a predetermined stroke along the guide rail 35 (FIG. 16D). Next, the guide rail 35 returns to the initial position and returns to the initial state shown in FIG. In this embodiment, there is an effect that the actuator used in the opening / closing mechanism 34 can be reduced in size.

  Next, Example 3 will be described. In Example 1 and Example 2, two ACF tapes 12 with release paper 11 are transported in parallel, a COF 19 is mounted on the ACF tape 12, and the ACF tape 12 is attached to the terminal portions of the two COFs 19 by thermocompression bonding. The configuration of the device for pasting was shown. In the first embodiment, the moving clamp 31 and the fixed clamp 32 are arranged on the downstream side of the peeling unit 23. That is, in Example 1, the peeling means 23 is on the upstream side of the moving clamp 31 and the fixed clamp 32. The present embodiment is different from the first and second embodiments in that the peeling means 23 is arranged on the downstream side in the direction of the ACF tape 12 with the release paper 11 from the positions of the moving clamp 31 and the fixed clamp 32.

  FIG. 17 is a diagram showing a schematic configuration of the ACF adhering apparatus of the present embodiment.

  The configuration in which the ACF tape 12 with the release paper 11 is transported horizontally on the support member by rotating the supply roll 10 and the collection roll 50 is the same as in the first embodiment. The configuration up to the position where the ACF tape 12 is thermocompression bonded to the terminal portion of the COF 19 by the pressure bonding member 20 is the same as that of the first embodiment. The operations of the moving clamp 31 and the fixed clamp 32 and the peeling method are different from those in the first embodiment, and will be described in detail below.

  FIG. 18 is a block diagram showing a series of operations relating to the ACF pasting on the COF of this embodiment.

  First, in a state in which the moving clamp 31 is closed, it moves by the sum of the length of the COF 19 and the amount of punching of the ACF tape while sandwiching the part of the release paper 11 that has been punched. In this position, there is a fixed clamp 32 in an opened state. That is, the moving clamp 31 stops inside the fixed clamp 32 in the opened state. Thereafter, the crimping member 17 is lowered and the COF 19 is thermocompression bonded. While the pressure bonding member 17 is lowered, there is no fluctuation in tension of the ACF tape 12 with the release paper 11 on the upstream side of the pressure bonding member 17, so that a half cut operation is performed. Until the pressure-bonding member 17 is raised, a peeling operation for peeling the ACF tape 12 from the release paper 11 is performed on the downstream side of the moving clamp 31. This peeling operation will be described later.

  Next, with the moving clamp 31 closed again, it moves by the length of the sum of the length of the COF 19 and the amount of punching of the ACF tape while sandwiching the part of the release paper 11 that has been punched, and then fixed. The clamp 32 is closed. In this state, the tension of the ACF tape 12 with the release paper 11 on the upstream side of the fixed clamp 32 is kept constant.

  Next, in the same manner as described above, the crimping member 17 is lowered and a half-cut operation is performed. During these operations, the moving clamp 31 is opened and returned to the upstream initial position, and the moving clamp 31 is closed at that position to hold the ACF tape 12 with the release paper 11. Next, the crimping member 17 is raised and the fixed clamp 32 is opened. Similarly to the above, while the pressure bonding member 17 is lowered, a peeling operation for peeling the ACF tape 12 from the release paper 11 is performed on the downstream side of the moving clamp 31.

  With the above method, the moving clamp 31 and the fixed clamp 32 feed the ACF tape 12 with the release paper 11 in such a manner that the positions of the moving clamp 31 and the fixed clamp 32 are switched between the upstream side and the downstream side with respect to the feeding direction of the ACF tape 12 with the release paper 11. The tape tension at the position where the ACF tape 12 is attached to the COF 19 is stabilized. Therefore, since the feed amount of the ACF tape 12 with the release paper 11 by the two clamps is constant, the position where the ACF tape 12 is stuck on the COF 19 is stabilized.

  Next, the peeling operation will be described. Since the peeling operation is separated from the operation of attaching the ACF to the terminal portion on the COF by the moving clamp 31 and the fixed clamp 32, the peeling operation does not participate in the tension fluctuation of the ACF tape 12 with the release paper 11. If the peeling operation is not performed in conjunction with the conveying operation of the ACF tape 12 with the release paper 11, it may be considered that the peeling operation cannot be performed appropriately.

  The COF 19 is held while being adsorbed by the COF adsorption holding member 22. On the downstream side of the position, the ACF tape 12 with the release paper 11 is guided by a guide roller 28 and a guide roller 29 to a lower conveyance height and is conveyed. The COF adsorption / holding member 22 moves in the horizontal direction at the same speed at the same time as the movement clamp 31 transports the ACF tape 12 with the release paper 11. At this time, the ACF tape 12 peels from the release paper 11.

  Also in this embodiment, the moving clamp 31 and the fixed clamp 32 feed the ACF tape 12 with the release paper 11 in such a manner that the positions of the moving clamp 31 and the fixed clamp 32 are switched between the upstream side and the downstream side with respect to the feeding direction of the ACF tape 12 with the release paper 11. Therefore, the tape tension at the position where the ACF tape 12 is attached to the COF 19 is stabilized. Therefore, since the feed amount of the ACF tape 12 with the release paper 11 by the two clamps is constant, the position where the ACF tape 12 is stuck on the COF 19 is stabilized. In addition, since the half-cut position is stable, the ACF tape attachment length is also stable. Moreover, since the peeling means can be simplified with two guide rolls, the cost can be reduced.

  Also in the present embodiment, as shown in the second embodiment, a configuration in which the moving clamp 31 and the fixed clamp 32 are retracted can be used.

  Although the embodiment of the present invention has been described above, one of the moving clamp 31 and the fixed clamp 32 may be fixed, or both may be configured to move.

Further, the contents disclosed in the present embodiment are not limited to the display panel module assembling apparatus.
The contents disclosed in the present embodiment may be applied to a transport device or an assembly device for assembling solar cell modules.

1 Panel substrate 3, 7 ACF
4,19 COF
5 PCB
12 ACF tape 15 Half cutter unit 17 Crimping member 22 COF adsorption holding member 23 Peeling means 24 Traveling block 25 Peeling rolls 26 and 27 Guide roll 31 Moving clamp 32 Fixed clamp

Claims (15)

In display panel module assembly equipment,
The first tape having the first anisotropic conductive material is gripped to transport the first tape, and the first tape is transported in a state where the first location is gripped. A first transport unit that transports the first tape by gripping a second location upstream of the location;
A pressure-bonding portion that pressure-bonds the first anisotropic conductive material and the electronic component upstream of the second location;
And a processing unit that connects the electronic component to the display panel via the first anisotropic conductive material. In the display panel module assembling apparatus according to claim 1,
The first transport unit includes a first clamp mechanism that can be opened and closed, and a second clamp mechanism that can be opened and closed,
The display panel module assembly apparatus, wherein the first clamp mechanism grips the first place, and the second clamp mechanism grips the second place. The display panel module assembling apparatus according to claim 2,
The display panel module assembly apparatus, wherein the first clamp mechanism grips the first tape and passes between the opened second clamp mechanisms. The display panel module assembling apparatus according to claim 2,
When the first clamp mechanism grips the first tape and moves downstream from the place where the second clamp mechanism is disposed, the second clamp mechanism has the first anisotropy. A display panel module assembling apparatus which is retracted from a conductive material. In the display panel module assembling apparatus according to claim 1,
A peeling portion for peeling the release paper attached to the first anisotropic conductive material;
The display panel module assembling apparatus, wherein the peeling unit is disposed between the first transport unit and the pressure-bonding unit or downstream of the first transport unit. In the display panel module assembling apparatus according to claim 1,
A cut part for making a cut in the adhesive part of the first anisotropic conductive material;
A display panel module assembling apparatus comprising: a mounting portion for mounting an electronic component on the first anisotropic conductive material. The display panel module assembling apparatus according to claim 6,
The display panel module assembling apparatus, wherein the cutting section, the mounting section, the crimping section, and the first transport section are arranged in this order. In the display panel module assembling apparatus according to claim 1,
Further, the second tape having the second anisotropic conductive material is grasped at the third place to convey the second tape, and after the third place is grasped and conveyed, A second transport unit that transports the second tape by gripping a fourth location upstream of the third location;
The display panel module assembling apparatus, wherein the crimping part crimps the electronic component against the first anisotropic conductive material and the second anisotropic conductive material. In the display panel module assembling apparatus according to claim 1,
An apparatus for assembling a display panel module, comprising a guide portion for transporting an electronic component to which the first anisotropic conductive material is crimped. In the display panel module assembling apparatus according to claim 1,
A tension applying unit that applies tension to the first tape on the upstream side and the downstream side of the first transport unit;
The display panel module assembling apparatus, wherein a tension applied downstream is greater than a tension applied upstream from the first transport unit. An anisotropic conductive material transfer device,
The first anisotropic conductive material was transported by gripping the first location of the first tape having the first anisotropic conductive material, and transported in a state where the first location was gripped. An anisotropic conductive material transport apparatus comprising a first transport unit that transports the first tape by gripping a second location upstream of the first location later. The anisotropic conductive material carrying device according to claim 11,
The first transport unit includes a first clamp mechanism that can be opened and closed, and a second clamp mechanism that can be opened and closed,
The anisotropic conductive material transport apparatus, wherein the first clamp mechanism grips the first place, and the second clamp mechanism grips the second place. In the anisotropic conductive material conveying apparatus according to claim 12,
The anisotropic conductive material transport device, wherein the first clamp mechanism grips the first tape and passes between the opened second clamp mechanisms. In the anisotropic conductive material conveying apparatus according to claim 12,
When the first clamp mechanism grips the first tape and moves downstream from the place where the second clamp mechanism is disposed, the second clamp mechanism has the first anisotropy. An anisotropic conductive material conveying device, wherein the anisotropic conductive material conveying device is retracted from the conductive material. The anisotropic conductive material carrying device according to claim 11,
Furthermore, the second anisotropic conductive material is conveyed by holding the third location of the second tape having the second anisotropic conductive material, and conveyed with the third location held. An anisotropic conductive material transport apparatus comprising: a second transport unit that transports the second tape by gripping a fourth location upstream of the third location after being performed .