JP2015110769A5 - - Google Patents

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Publication number
JP2015110769A5
JP2015110769A5 JP2014226400A JP2014226400A JP2015110769A5 JP 2015110769 A5 JP2015110769 A5 JP 2015110769A5 JP 2014226400 A JP2014226400 A JP 2014226400A JP 2014226400 A JP2014226400 A JP 2014226400A JP 2015110769 A5 JP2015110769 A5 JP 2015110769A5
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JP
Japan
Prior art keywords
conductive adhesive
wiring board
wiring
reinforcing plate
elastomer
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Application number
JP2014226400A
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Japanese (ja)
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JP2015110769A (en
JP5928556B2 (en
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Priority to JP2014226400A priority Critical patent/JP5928556B2/en
Priority claimed from JP2014226400A external-priority patent/JP5928556B2/en
Publication of JP2015110769A publication Critical patent/JP2015110769A/en
Publication of JP2015110769A5 publication Critical patent/JP2015110769A5/ja
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Publication of JP5928556B2 publication Critical patent/JP5928556B2/en
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Claims (9)

カルボキシル基を有する熱硬化性樹脂（Ａ）（ただし、反応性官能基を有するエラストマー（Ｃ）に該当する場合を除く）と、
エポキシ樹脂（Ｂ）と、
反応性官能基を有するエラストマー（Ｃ）と、
導電性フィラー（Ｄ）と、
硬化剤（Ｅ）とを含み、
前記反応性官能基を有するエラストマー（Ｃ）が、ポリアミド系エラストマーまたはアクリル酸エステル共重合体であることを特徴とする導電性接着剤。 A thermosetting resin having a carboxyl group (A) (except for a case where it corresponds to an elastomer (C) having a reactive functional group) , and
Epoxy resin (B);
An elastomer (C) having a reactive functional group;
A conductive filler (D);
Curing agent and (E) seen including,
The conductive adhesive, wherein the elastomer (C) having a reactive functional group is a polyamide-based elastomer or an acrylate copolymer . 当該導電性接着剤は、前記カルボキシル基を有する熱硬化性樹脂（Ａ）１００重量部に対して、３〜２００重量部の前記反応性官能基を有するエラストマー（Ｃ）を含む請求項１に記載の導電性接着剤。   The said conductive adhesive contains the elastomer (C) which has the said reactive functional group of 3-200 weight part with respect to 100 weight part of thermosetting resins (A) which have the said carboxyl group. Conductive adhesive. 剥離性シートと、
該剥離性シートの一方の面側に設けられ、請求項１または２に記載の導電性接着剤から形成した導電性接着剤層とを備えることを特徴とする導電性接着シート。 A peelable sheet;
A conductive adhesive sheet comprising: a conductive adhesive layer provided on one surface side of the peelable sheet and formed from the conductive adhesive according to claim 1. 前記導電性接着剤層のゲル分率は、６０〜９５％である請求項３に記載の導電性接着シート。   The conductive adhesive sheet according to claim 3, wherein a gel fraction of the conductive adhesive layer is 60 to 95%. 信号配線を備える配線板と、
該配線板の一方の面側に設けられた補強板と、
前記配線板と前記補強板との間に設けられ、これらを接合する接合層であって、請求項１または２に記載の導電性接着剤から形成した導電性接着剤層の硬化物で構成された接合層とを備えることを特徴とする配線デバイス。 A wiring board with signal wiring;
A reinforcing plate provided on one side of the wiring board;
It is a joining layer which is provided between the said wiring board and the said reinforcement board, and joins these, Comprising: It is comprised with the hardened | cured material of the conductive adhesive layer formed from the conductive adhesive of Claim 1 or 2. A wiring device comprising a bonding layer. 前記補強板は、導電性を有し、
前記配線板は、さらに、前記補強板に接続されたグランド配線を備える請求項５に記載の配線デバイス。 The reinforcing plate has conductivity,
The wiring device according to claim 5, wherein the wiring board further includes a ground wiring connected to the reinforcing plate. 前記配線板は、フレキシブルプリント配線板である請求項５または６に記載の配線デバイス。   The wiring device according to claim 5, wherein the wiring board is a flexible printed wiring board. 請求項５〜７に記載の配線デバイスの製造方法であって、
前記配線板と、前記導電性接着剤層と、前記補強板とを用意する工程と、
前記導電性接着剤層を介して前記配線板と前記補強板とを積層して、積層体を得る工程と、
該積層体を１３０〜２１０℃で加熱して、前記導電性接着剤層を硬化させることにより前記接合層を形成し、前記配線デバイスを得る工程とを備えることを特徴とする配線デバイスの製造方法。 It is a manufacturing method of the wiring device according to claim 5,
Preparing the wiring board, the conductive adhesive layer, and the reinforcing plate;
Laminating the wiring board and the reinforcing plate via the conductive adhesive layer to obtain a laminate;
The laminated body is heated at 130 to 210 ° C. to cure the conductive adhesive layer, thereby forming the bonding layer and obtaining the wiring device. . 前記積層体を加熱する工程において、前記積層体を０．２〜１２ＭＰａで加圧する請求項８に記載の配線デバイスの製造方法。   The method for manufacturing a wiring device according to claim 8, wherein in the step of heating the laminated body, the laminated body is pressurized at 0.2 to 12 MPa.
JP2014226400A 2013-11-07 2014-11-06 Conductive adhesive sheet, wiring device, and manufacturing method of wiring device Active JP5928556B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014226400A JP5928556B2 (en) 2013-11-07 2014-11-06 Conductive adhesive sheet, wiring device, and manufacturing method of wiring device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013231200 2013-11-07
JP2013231200 2013-11-07
JP2014226400A JP5928556B2 (en) 2013-11-07 2014-11-06 Conductive adhesive sheet, wiring device, and manufacturing method of wiring device

Publications (3)

Publication Number Publication Date
JP2015110769A JP2015110769A (en) 2015-06-18
JP2015110769A5 true JP2015110769A5 (en) 2015-12-24
JP5928556B2 JP5928556B2 (en) 2016-06-01

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Family Applications (1)

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JP2014226400A Active JP5928556B2 (en) 2013-11-07 2014-11-06 Conductive adhesive sheet, wiring device, and manufacturing method of wiring device

Country Status (3)

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JP (1) JP5928556B2 (en)
TW (1) TW201518471A (en)
WO (1) WO2015068611A1 (en)

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