JP2000100872A - Electronic component device and repair method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To repair connection failures that occur in an electronic part device due to oppositely faced electrodes of the part device not being aligned with each other, by a method wherein the opposed electrodes are electrically connected together through the intermediary of a sheet-like cured body of an adhesive agent composition that contains polyhydroxy polyether resin, synthetic rubber, epoxy resin, and adhesive agent. SOLUTION: A transparent electrode 4 and the outer lead 7 of a tape carrier package are connected electrically, together through the intermediary of a sheet-like cured body 6 of adhesive agent composition that contains polyhydroxy polyether resin whose main integral component is brominated phenoxy resin as polymer obtained by making epichlorohydrin react with bifunctional phenol, such as brominated bisphenol A, brominated bisphenol F, brominated bisphenol S or the like and a non-brominated bifunctional phenol, synthetic rubber such as butyl rubber, isoprene rubber, chloroplane rubber or the like, an epoxy resin such as phenolic novolak or naphthalene types, and microcapsule type latent curing agent.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component device in which opposing electrodes are electrically connected to each other via a cured product of a specific sheet-like adhesive composition, and a method for repairing the same.

[0002]

2. Description of the Related Art In recent years, a direct chip attach method using a bare chip such as a flip chip has attracted particular attention as a high-density mounting method for semiconductor elements in various electronic component devices such as small portable devices. This flip
In the chip-type connection method, a sheet-like adhesive (or film-like adhesive) is placed between the electrode part of the opposing wiring board and the flip chip, and these are heated and pressurized to form a gap between the opposing electrodes. Electrical connection.
As a forming material such as the sheet-like adhesive, a thermosetting resin composition having excellent connection reliability is mainly used. Further, an anisotropic conductive sheet adhesive (or film adhesive) in which conductive particles are mixed and dispersed in the thermosetting resin composition may be used. The anisotropic conductive sheet adhesive or the like provides an electrical connection between an electrode portion of the liquid crystal circuit board and a lead of a tape carrier package (TCP) or a chip-on-glass (COG) connection. It is used for electrical connection between the bump portion of the flip chip and the electrode portion of the liquid crystal circuit board in the construction method.

[0003]

However, since the above-mentioned sheet adhesive mainly contains a thermosetting resin composition, it has an extremely high adhesive strength after being cured by heating and pressurizing. If a connection failure occurs due to misalignment between the electrodes, the sheet adhesive or the like cannot be peeled from the electrodes. Therefore, there is a problem that the electronic component device cannot be repaired and the electronic component device has to be discarded. Similarly, even if a failure or the like occurs in a connection portion after the electronic device incorporating the electronic component device is marketed, the electronic component device cannot be repaired, and the electronic device must be discarded. Problems arise. Particularly, in recent years, while recycling is required for global environmental protection, it is necessary to avoid producing waste.

The present invention has been made in view of such circumstances, and can repair (repair) even if a connection failure occurs due to a displacement between opposing electrodes of an electronic component device or the like. An object of the present invention is to provide an electronic component device excellent in recyclability without discarding the component device and a repair method thereof.

[0005]

Means for Solving the Problems In order to achieve the above-mentioned object, the present invention provides a method for forming an electrode which is opposed to a cured product of a sheet-like adhesive composition containing the following components (A) to (D). A first gist is an electronic component device whose electrical connection is established. (A) Polyhydroxy polyether resin. (B) Synthetic rubber. (C) Epoxy resin. (D) a curing agent.

The present invention also provides a method for repairing an electronic component device, comprising swelling a cured product of the above-mentioned sheet-like adhesive composition with an organic solvent and then peeling the cured product of the sheet-like adhesive composition from an electrode. This is the second point.

The sheet-like adhesive composition of the present invention usually has a thickness of 10 to 200 μm.
Above all, the thickness is as thin as 10 to 50 μm, and the meaning includes a film generally called a film.

In the method for repairing an electronic component device of the present invention (the second aspect), the term "peeling the cured product of the sheet-shaped adhesive composition from the electrode" means that the wiring circuit board including the electrode portion or the electrode portion is included. This is intended to include peeling from the liquid crystal circuit board.

In other words, the present inventors can repair (repair) even if a connection failure occurs due to a displacement between opposing electrodes of an electronic component device, etc., without discarding the electronic component device. And intensive research to obtain electronic component devices with excellent recyclability. First, the present inventors focused on the above-mentioned sheet-shaped adhesive composition, and conceived that repair could be performed if it could be solvated with a specific organic solvent even after curing of the adhesive composition. As a result of continuing research and development on the forming material of the sheet-like adhesive composition, polyhydroxy polyether resin (component A)
Has excellent solubility in a specific organic solvent. Further studies have shown that the use of the above polyhydroxy polyether resin (component A) together with the above synthetic rubber (component B), epoxy resin (component C) and curing agent (component D) results in a sheet-like adhesive. Since the cured product of the composition was solvated by a specific organic solvent and swelled, and the strength of the cured product was significantly reduced, it was found that the composition could be easily peeled off from the adherend (electrode) and repaired. As a result, via the cured product of the sheet-shaped adhesive composition,
An electronic component device formed by electrically connecting opposing electrodes can be repaired even when a connection failure occurs due to a positional shift between the opposing electrodes, without discarding the electronic component device. The present inventors have found that the present invention has excellent recyclability, and have reached the present invention.

By the way, after the sheet adhesive or the like is semi-cured (so-called B-stage state) during the connection process, the connection is temporarily interrupted, and after the electrical inspection of the electronic component device or the like is performed, the good connection product is obtained. It is also known that a post-curing is performed to obtain a finished product, while a defective connection is repaired by wiping with a soluble organic solvent in a B-stage state. However, it is extremely difficult to increase the connection reliability at the time of the above-mentioned electrical inspection and the like, and there are problems that the repairable heating and pressurizing conditions are very narrow and the connection process is complicated. Moreover, after the electronic component device has been incorporated into the electronic device, the sheet adhesive or the like has already been post-cured, so that repair with the organic solvent or the like is impossible.

[0011]

Next, embodiments of the present invention will be described in detail.

[0012] The electronic component device of the present invention is configured such that opposing electrodes are electrically connected via a cured body of a specific sheet-like adhesive composition. The specific sheet-like adhesive composition uses a polyhydroxypolyether resin (A component), a synthetic rubber (B component), an epoxy resin (C component), and a curing agent (D component). Obtainable.

The above polyhydroxy polyether resin (A)
Component) is not particularly limited, but is preferably one that is dissolved at room temperature by a specific organic solvent described later.
Specifically, a phenoxy resin containing a repeating unit represented by the following general formula (1) as a main component is preferable, and a repeating unit represented by the following general formula (2) is particularly preferably used as a main component. Is a partially brominated phenoxy resin. The partially brominated phenoxy resin is a copolymer obtained by reacting a bifunctional phenol such as brominated bisphenol A, brominated bisphenol F, brominated bisphenol S, and a non-brominated bifunctional phenol with epichlorohydrin. , A random copolymer or a block copolymer.

[0014]

Embedded image

[0015]

Embedded image

The above polyhydroxy polyether resin (A)
The molecular weight of the component (A) is not particularly limited, but preferably has a number average molecular weight of 2,000 to 50,000 and a weight average molecular weight of 6,000 to 200,000, and particularly preferably has a number average molecular weight of 6,6. 000-20,000
The weight average molecular weight is from 20,000 to 100,000.
That is, by setting the molecular weight of the component A higher than that of a normal epoxy resin, it is possible to handle the thermoplastic resin as a thermoplastic resin. As a result, after being dissolved in an organic solvent, it can be extremely easily formed into a sheet or film by a casting coating method, a melt extrusion molding method, or the like. When an oxirane ring (epoxy group) is present at the terminal of the polymer of the component A, a cross-linking reaction is caused by using the oxirane ring, and it can be used as a thermosetting resin. The molecular weight is measured by gel permeation chromatography (GPC) and calculated in terms of polystyrene.

The polyhydroxy polyether resin (A)
The glass transition temperature (Tg) of the component (A) is not particularly limited, but is preferably from 110 to 160 ° C, particularly preferably from 125 to 160 ° C. That is, by setting the glass transition temperature (Tg) of the component A higher than that of a conventionally known phenoxy resin, excellent heat resistance can be obtained.

The above polyhydroxy polyether resin (A)
Component) is usually used in an amount of 15 to 45% by weight of the entire sheet-shaped adhesive composition (the weight of the organic solid content excluding the solvent).
(Hereinafter abbreviated as “%”), preferably 20 to 40
%, More preferably 25 to 35%. That is,
If the amount of the component A is less than 15%, the repairability tends to be poor, and if it exceeds 45%, the sheet formability and the film formability (self-supporting film formability) may be poor. is there.

The above polyhydroxy polyether resin (A)
The synthetic rubber (component B) used together with the component (A) is not particularly limited as long as it is generally used as an adhesive composition, and examples thereof include acrylonitrile-butadiene rubber (NBR) and carboxylated NBR. Among them, NBR having a repeating unit represented by the following general formula (3) as a main constituent component, and NBR having the following constitution in terms of excellent compatibility with the epoxy resin (C component) and the curing agent (D component), Carboxylated NBR containing a repeating unit represented by the general formula (4) as a main component is preferable, and the above-mentioned carboxyl group is preferred because it can form a crosslinked structure with the adhesive composition by utilizing the reaction of carboxyl groups. NBR is particularly preferred. The carboxylated NBR can be obtained by copolymerizing an NBR with an allylic acid monomer or a methacrylic acid monomer.

[0020]

Embedded image

[0021]

Embedded image

The molecular weight of the synthetic rubber (component (B)) is not particularly limited, but the number average molecular weight is 100,00.
0 to 300,000 is preferred. That is, when only the low molecular weight substance such as the epoxy resin (C component) is used, the flexibility when the adhesive composition is formed into a sheet tends to be inferior, but the high molecular weight synthetic rubber (B By using the component (2), the adhesive composition can be easily formed into a sheet or a film. In addition, the said molecular weight is measured by GPC and calculated | required in polystyrene conversion.

On the other hand, as the synthetic rubber (component B), acrylic rubber is also useful in the present invention, like the above-mentioned NBR.
Ethyl acrylate or butyl acrylate is generally used as a monomer and is made by an emulsion polymerization method.Acrylic monomers such as acrylonitrile, epoxy monomers, diene monomers, etc. are also used for crosslinking as copolymer components. ing. In the present invention, an acrylic rubber containing a repeating unit represented by the following general formula (5) as a main component is preferable. In comparison with a synthetic rubber, heat resistance and adhesiveness are improved as compared with the above-mentioned NBR. There are features.

[0024]

Embedded image

The molecular weight of the acrylic rubber (component B) is as follows:
Although not particularly limited, the number average molecular weight is 100,
000-600,000 is preferred.

The proportion of the synthetic rubber (component (B)) used is usually 5 to 30%, preferably 7 to 20% of the whole sheet-shaped adhesive composition (weight of organic solids excluding solvent).
More preferably, it is 9 to 15%. That is, B
If the amount of the component is less than 5%, the sheet formability and the film formability (self-supporting film formability) may be poor, and if it exceeds 30%, the repairability tends to be poor.

In the present invention, the above synthetic rubber (component (B)) and other rubber components are used together with the synthetic rubber (component (B)) as long as it can be dissolved in the specific organic solvent used for dissolving the adhesive composition. Is also possible. As the rubber component used in combination, for example, natural rubber (N
R), butyl rubber, isoprene rubber (IR), chloroprene rubber (CR), ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer and the like. Used in combination of more than one species.

The above polyhydroxy polyether resin (A
The epoxy resin (component C) used together with the synthetic rubber (component B) and the synthetic rubber (component B) are not particularly limited as long as they are generally used as an adhesive composition. For example, bisphenol A type, bisphenol F type, bisphenol S
Type, brominated bisphenol A type, hydrogenated bisphenol A
Type, bisphenol AF type, biphenyl type, naphthalene type, fluorene type, phenol novolak type, orthocresol novolak type, trifunctional type, trishydroxyphenylmethane type, tetraphenylolethane type and other bifunctional epoxy resins and polyfunctional epoxy resins , And hydantoin type, trisglycidyl isocyanurate (TGI
An epoxy resin such as a glycidylamine type such as C) type (see Practical Plastics Dictionary, pages 211 to 217) is used. These may be used alone or in combination of two or more.

Above all, a novolak type epoxy resin represented by the following general formula (6) and a general formula (7) represented by the following general formula (6) in terms of being rich in the reaction with the curing agent (D component) and excellent in heat resistance and the like. Particularly preferred are a biphenyl type epoxy resin represented by the following formula, a trishydroxyphenylmethane type epoxy resin represented by the following general formula (8), and a tetraphenylolethane type epoxy resin represented by the following general formula (9).

[0030]

Embedded image

[0031]

Embedded image

[0032]

Embedded image

[0033]

Embedded image

The above polyhydroxy polyether resin (A
The curing agent (component D) used together with the (component), the synthetic rubber (component B) and the epoxy resin (component C) is not particularly limited, but examples thereof include imidazole, 2-methylimidazole, 2-ethylimidazole, -Ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-ethylimidazole, 1-benzyl-2-ethyl-5- Methylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-
Dihydroxymethylimidazole, 2-methylimidazoleazine, 2-heptadecylimidazole, 2-undecylimidazole, 2,4-diamino-6 {2'-methylimidazolyl- (1) '} ethyl-triazine / isocyanuric acid adduct, N, N '-{2-methylimidazolyl- (1) -ethyl} dodecandioyldiazide;
Imidazole compounds such as N, N '-{2-methylimidazolyl- (1) -ethyl} -aiconsandioildiazide; microcapsule-type latent curing agents; dicyandiamide; phenol novolak resins; phenol aralkyl resins; These may be used alone or in combination of two or more.

Among them, a phenol novolak resin represented by the following general formula (10) and a phenol novolak resin represented by the following general formula (1) can improve the connection reliability of an electronic component device.
The phenol aralkyl resin represented by 1) is particularly preferred.

[0036]

Embedded image

[0037]

Embedded image

The proportion of the curing agent (component D) used is not particularly limited, but it is preferable to use the curing agent (D component) in such a ratio that a desired curing rate can be obtained with respect to the epoxy resin (C component). For example, the amount used can be easily determined as an index of the curing speed while measuring the gel time with a hot plate.
Specifically, when the phenolic resin-based curing agent represented by the general formula (10) or (11) is used as the curing agent (component D), the proportion of the epoxy resin (component C) The hydroxyl group equivalent in the phenolic resin-based curing agent is preferably set in the range of 0.8 to 1.2 times, more preferably 0.9 to 1.2 times, relative to 1 equivalent of the epoxy group therein.
It is 1.1 times.

As a material for forming the sheet-like adhesive composition used in the electronic component device of the present invention, a curing accelerator can be further used in addition to the above-mentioned components A to D. For example, when a phenol resin-based curing agent represented by the above general formula (10) or (11) is used as the curing agent (D component), when a curing accelerator is used in combination, the epoxy resin (C component) Is more preferable because the reaction between the epoxy group and the phenolic hydroxyl group in the phenolic resin-based curing agent is promoted.

Examples of the curing accelerator include phosphine compounds such as triphenylphosphine (TPP), tributylphosphine, tris (dimethoxyphenyl) phosphine, tris (hydroxypropyl) phosphine and tris (cyanoethyl) phosphine, and tetraphenylphosphonium tetraphenyl. Phosphonium salts such as borate, methyltributylphosphonium tetraphenylborate, methyltricyanoethylphosphonium tetraphenylborate, imidazole, 2-methylimidazole, 2-
Ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-
Methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-ethylimidazole, 1-
Benzyl-2-ethyl-5-methylimidazole, 2-
Phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-methylimidazoleazine, 2-heptadecylimidazole, 2-undecylimidazole,
2,4-diamino-6 ｛2′-methylimidazolyl-
(1) '-Ethyl-triazine isocyanuric acid adduct, N, N'-{2-methylimidazolyl- (1) -ethyl} dodecandioyldiazide, N, N '-{2-methylimidazolyl- (1) Imidazole compounds such as -ethyl} -aconsandioildiazide, dicyandiamide, 1,5-diazabicyclo (5,4,0) -7-undecene, 1,5-diazabicyclo (4,3,0) -5
And diazabicyclo compounds such as 1,4-diazabicyclo (2,2,2) -octane, tetraphenylborate salts, phenol novolak salts and 2-ethylhexane salts of the diazabicyclo compounds.
These may be used alone or in combination of two or more.

The proportion of the curing accelerator used is not particularly limited, but is used in such a proportion that a desired curing rate can be obtained with respect to the mixture of the epoxy resin (component C) and the curing agent (component D). Is preferred. For example, the amount used can be easily determined as an index of the curing speed while measuring the gel time with a hot plate.

The epoxy resin (C component) and the curing agent (D
Component) or the total amount of the epoxy resin (component C), the curing agent (component D), and the curing accelerator is usually the total amount of the sheet-shaped adhesive composition (the organic solid content excluding the solvent). 25-80% by weight, preferably 40
~ 73%, more preferably 50 ~ 66%. That is, if the used amount is less than 25%, the connection reliability in the connection method of an electronic component device such as a flip chip may be significantly reduced, and if it exceeds 80%, the repairability tends to be poor. .

As the material for forming the sheet-like adhesive composition used in the electronic component device of the present invention, conductive particles can be used in combination with the above-mentioned components A to D, or the components A to D and the curing accelerator. is there. When the conductive particles are used in combination as described above, the sheet-shaped adhesive composition can be provided with anisotropic conductivity, and the sheet-shaped adhesive composition having anisotropic conductivity can be obtained. The anisotropically conductive sheet-shaped adhesive composition is used, for example, for electrical connection between a liquid crystal circuit board and a tape carrier package (TCP) of a driver IC, and a chip-on-glass (COG) connection method. Also, it can be used for a high-density semiconductor element mounting technology for small portable devices. As described above, when the anisotropic conductive sheet adhesive composition is used, the conductive particles are microscopically and isotropically dispersed in the adhesive composition, and a plurality of opposing electrodes can be connected collectively. In addition, the productivity of the electronic component device can be improved.

The conductive particles are not particularly limited. For example, gold, silver, nickel, copper, zinc, tin,
Metal particles such as tin-lead solder, solder of various compositions, indium, and palladium, and those obtained by subjecting these metal particles to gold plating, nickel plating, or the like. In addition, gold plating, nickel plating, etc. (shell) are applied to a crosslinked polymer core such as a crosslinked polystyrene resin, a crosslinked epoxy resin, a crosslinked phenol resin, a crosslinked urethane resin, a crosslinked polyester resin, a crosslinked silicone resin, a crosslinked acrylic resin, etc. ) Can be used.

The size of the conductive particles is not particularly limited, but is preferably set so that the maximum particle size of the conductive particles is equal to or less than the thickness of the sheet adhesive composition. Specifically, the maximum particle size of the conductive particles,
0.01 to the thickness of the sheet-like adhesive composition
It is preferably set to 1.0 times, and particularly preferably 0.05 to 0.5 times. That is, by setting the maximum particle diameter of the conductive particles as described above, when the sheet-shaped adhesive composition is heated and pressed, the melt-flow can be easily performed.

The amount of the conductive particles to be filled is not particularly limited, but the electrodes used in the electronic component device have a gorge pitch, and the average particle size of the conductive particles used for micro connection is a single. Considering that it is preferable to be close to dispersion, the amount is preferably 0.1 to 10 parts by volume, more preferably 0.5 to 5 parts by volume, per 100 parts by volume of the sheet-shaped adhesive composition (solid). That is, if the filling amount is less than 0.1 part by volume, the connection reliability of the electronic component device may be deteriorated. If the filling amount exceeds 10 parts by volume, there is a danger of short-circuit (short circuit) between the conductive particles. Is larger.

The material for forming the sheet-like adhesive composition used in the electronic component device of the present invention includes an adherend (electrode).
It is also possible to use a silane coupling agent together with the above-mentioned components A to D for the purpose of promoting the adhesion with the inorganic filler and enhancing the interfacial adhesion with various inorganic fillers. The silane coupling agent is not particularly limited. For example, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldimethoxysilane Ethoxysilane and the like can be mentioned. The silane coupling agent may be added and mixed together with the A to D components, or may be separately reacted in advance with a phenol resin-based curing agent as a curing agent (D component).

The sheet adhesive composition used in the electronic component device of the present invention includes a flame retardant such as antimony trioxide, antimony pentoxide, and a brominated epoxy resin, a flame retardant auxiliary, polyethylene wax, carnauba wax, and the like. A release agent such as a montansan-based wax or an amide-based wax, a low-stressing agent such as a silicone compound, a colorant, and the like can be appropriately compounded without departing from the spirit of the present invention.

The sheet adhesive composition used in the electronic component device of the present invention can be produced, for example, as follows. That is, first, a predetermined amount of each of the components A to D and other components such as a curing accelerator and conductive particles, if necessary, is blended, and this is dissolved in a conventionally known organic solvent, and uniformly mixed using a dissolution apparatus. Then, an adhesive composition solution such as a liquid varnish (a dispersion in the case of using conductive particles) is prepared. On the other hand, a support is prepared in advance, and the adhesive composition solution is coated on the support using a conventionally known coating machine or the like, and then dried. Then, by peeling the adhesive composition formed on the support from the support, a desired sheet-like adhesive composition can be produced. When the adhesive composition formed on the support is used for connection between electrodes facing each other in the electronic component device, the adhesive composition is preferably peeled off from the support and used.

Examples of the dissolving device include a flask device and a homomixer device, and the coating device is preferably a device having a hot air circulation type drying device. Then, it is preferable to perform an operation by attaching an exhaust device, a solvent recovery device, and the like to the above-described dissolving device and the coating machine in terms of safety and environmental protection.

The support is not particularly limited, and examples thereof include a plastic film substrate whose surface is treated with silicone, a plastic film substrate whose surface is not treated with silicone, and a fluororesin film substrate. I can give it. In addition, as the plastic film substrate, polyethylene terephthalate (P
ET) film substrates are preferred.

The organic solvent is not particularly limited as long as it can dissolve each component which is a material for forming the adhesive composition, but it is preferable to use a low boiling point solvent. Examples of the organic solvent include ketone solvents, glycol diether solvents, and nitrogen-containing solvents. These may be used alone or in combination of two or more. Further, a part thereof may be replaced with a hydrocarbon solvent, an ester solvent or a polyhydric alcohol derivative as long as the solubility of each component of the adhesive composition is not impaired.

The ketone solvent is not particularly limited. For example, methyl ethyl ketone (MEK), diethyl ketone, methyl-n-butyl ketone, methyl isobutyl ketone (MIBK), methyl-n-propyl ketone, di-ketone
Examples thereof include n-propyl ketone, cyclohexanone, acetophenone and the like, and these are used alone or in combination of two or more. Above all, methyl ethyl ketone (MEK) and methyl isobutyl ketone (M
IBK), cyclohexanone, and acetophenone are preferably used.

The above-mentioned glycol diether solvent is not particularly limited. For example, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether,
Triethylene glycol dimethyl ether and the like can be mentioned, and these are used alone or in combination of two or more.

The nitrogen-containing solvent is not particularly limited. For example, N, N'-dimethylformamide (DM
F), N, N'-dimethylacetamide, N-methyl-
2-pyrrolidone, N, N'-dimethylsulfoxide, hexamethylphosphortriamide and the like are used, and these are used alone or in combination of two or more.

The hydrocarbon solvent is not particularly limited, and examples thereof include toluene and xylene. The ester solvent is not particularly limited, and examples thereof include ethyl acetate and butyl acetate. The polyhydric alcohol derivative is not particularly limited, and includes, for example, propylene glycol monomethyl ether acetate. These may be used alone or in combination of two or more.

The specific sheet-like adhesive composition used in the electronic component device of the present invention has a thickness of 10 to 200 μm, but is particularly thin, having a thickness of 10 to 50 μm, and includes those generally called films. In addition, the said sheet-shaped adhesive composition can also be made into tape form using a slitter etc.

The electronic component device of the present invention can be manufactured, for example, as follows using the specific sheet-like adhesive composition described above. That is, an electrode member for an electronic component device is prepared, and these are positioned so as to face each other, and then the specific sheet-shaped adhesive composition is disposed between the electrodes. Then, these are heated and pressurized under predetermined conditions to cure the above-mentioned sheet-like adhesive composition and electrically connect the opposing electrodes, whereby a desired electronic component device can be obtained. The electrode member is not particularly limited, and may be, for example, a connection electrode portion of a printed circuit board, a connection bump portion of a semiconductor element flip chip, a lead of a tape carrier package, and a connection electrode of a liquid crystal circuit board. Department.

The repair method of the electronic component device of the present invention is performed, for example, as follows. First, when a plurality of IC chips are to be repaired collectively, the entire electronic component device (hereinafter, a circuit board on which the IC chips are mounted) is immersed in a specific organic solvent. Then, after about 1 to 5 minutes, the cured product of the sheet-like adhesive composition is whitened. It can be confirmed that the cured product swells and is solvated by the whitening. Then, after the electronic component device is pulled up from the organic solvent, it can be repaired by wiping the entire IC chip. When a specific IC chip is to be repaired from a plurality of IC chips, the IC chip portion of the circuit board on which the IC chip is mounted is connected to the glass transition temperature (T
The IC chip is heated to a temperature about 50 ° C. higher than g), and the IC chip is peeled from the circuit board. At this time, the cured body is usually attached to the circuit board side and the IC chip side to break. Then, after cooling the circuit board to room temperature, several drops of the above organic solvent are dropped with a dropper or the like so as to cover the remaining portion of the cured body film. After confirming that the cured product has whitened and solvated as described above, the organic solvent can be wiped off with a cotton swab or the like to perform repair. Alternatively, a specific organic solvent is dropped around the IC chip, and after confirming that the cured product has whitened and solvated,
It is also possible to repair by removing every C chip. This method requires a little time compared to the case where the IC chip is peeled by heating as described above.

As the specific organic solvent used for repairing the electronic component device, a ketone solvent, a glycol diether solvent, and a nitrogen-containing solvent are preferable. These may be used alone or in combination of two or more.

Examples of the ketone solvents include acetophenone, isophorone, ethyl-n-butyl ketone, diisobutyl ketone, diisopropyl ketone, diethyl ketone,
Cyclohexanone, di-n-propyl ketone, methyl oxide, methyl-n-amyl ketone, methyl isobutyl ketone, methyl ethyl ketone, methyl cyclohexanone, methyl-n-butyl ketone, methyl-n-propyl ketone, methyl-n-hexyl ketone, methyl-n Heptyl ketone, holone is preferred. These may be used alone or in combination of two or more.

As the glycol diether solvent, ethylene glycol diethyl ether, ethylene glycol dibutyl ether, ethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol diethyl ether, diethylene glycol dibutyl ether, diethylene glycol dimethyl ether, and triethylene glycol dimethyl ether are preferable. These may be used alone or in combination of two or more.

As the nitrogen-containing solvent, N, N'-dimethylformamide, N, N'-dimethylacetamide, N-methyl-2-pyrrolidone, N, N'-dimethylsulfoxide and hexamethylphosphortriamide are preferred. . These may be used alone or in combination of two or more.

FIG. 1 schematically shows a cross section of the sheet adhesive composition (containing conductive particles) used in the electronic component device of the present invention. In the figure, reference numeral 1 denotes conductive particles, and 2 denotes an anisotropic conductive sheet adhesive composition. FIG. 2 is a schematic view showing a cross section of an electronic component device in which outer leads 7 of a tape carrier package and transparent electrodes 4 on an LCD panel (glass substrate) 5 are opposed to each other. ,
6 is a cured product of the anisotropic conductive sheet adhesive composition 2, 8 is an IC chip, and 9 is a sealing resin. As shown in the figure, in this electronic component device, an outer lead 7 and a transparent electrode 4 facing each other are connected via a cured body 6 of the sheet-like adhesive composition. The electrical connection is made via the conductive particles 1 in the cured body 6 of the above-mentioned sheet-like adhesive composition.

Next, another example of the electronic component device of the present invention is shown in FIG. FIG. 3 shows a semiconductor device (flip chip) 1
1 metal bump 10 and LCD panel (glass substrate) 5
FIG. 3 is a schematic diagram showing a cross section of a chip-on-glass (COG) mounted electronic component device in which an upper transparent electrode 4 is opposed, and the same parts as those in FIG. 2 are denoted by the same reference numerals. As shown in the figure, in this electronic component device, a metal bump 10 and a transparent electrode 4 facing each other are connected via a cured body 6 of the sheet-like adhesive composition. The connection is performed via the conductive particles 1 in the cured body 6 of the above-mentioned sheet-shaped adhesive composition.

FIG. 4 shows still another example of the electronic component device of the present invention. FIG. 4 shows a semiconductor device (flip chip) 12.
Metal bump 13 and electrode pad 1 of printed circuit board 15
6 is a schematic view showing a cross section of an electronic component device in which 6 faces each other, and 14 shows a cured product of the sheet-shaped adhesive composition. As shown in the figure, the electronic component device is provided with a metal bump 13
And the electrode pad 16 are electrically connected. In addition,
The conductive material is not contained in the cured product 14 of the sheet-shaped adhesive composition, and the metal bumps 13 and the electrode pads 16 penetrating the cured product 14 of the sheet-shaped adhesive composition are in direct contact with each other, so Connected.

FIG. 5 shows another example of the electronic component device of the present invention. FIG. 5 is a schematic diagram showing a cross section of an electronic component device in which the metal bumps 19 of the semiconductor element (flip chip) 12 and the electrode pads 20 of the printed circuit board 15 face each other.
Reference numeral 17 denotes a conductive particle, and reference numeral 18 denotes a cured product of an anisotropic conductive sheet adhesive composition. As shown in the figure, in this electronic component device, a metal bump 19 and an electrode pad 20 are connected via a cured body 18 of the above-mentioned sheet-like adhesive composition.
The electrical connections 9 and 20 are made via the conductive particles 17 in the cured product 18 of the sheet-like adhesive composition.

Next, examples will be described together with comparative examples.

First, prior to Examples and Comparative Examples, the following components were prepared.

[Polyhydroxypolyether resin (component A) * 1] A polyhydroxypolyether resin containing a repeating unit represented by the following structural formula (2 ') as a main component.

Embedded image

[Polyhydroxypolyether resin (component A) * 2] A polyhydroxypolyether resin containing a repeating unit represented by the following structural formula (2 '') as a main component.

Embedded image

[Synthetic rubber (component B) * 3] Carboxylated NBR containing a repeating unit represented by the following structural formula (4 ') as a main component.

Embedded image

[Synthetic rubber (component B) * 4] An NBR containing a repeating unit represented by the following structural formula (3 ') as a main component.

Embedded image

[Synthetic rubber (component B) * 5] An acrylic rubber containing a repeating unit represented by the following structural formula (5 ') as a main component.

Embedded image

[Epoxy resin (component C) * 6] A trishydroxyphenylmethane type epoxy resin represented by the following structural formula (8 ').

Embedded image

[Epoxy resin (component C) * 7] A novolak type epoxy resin represented by the following structural formula (6 ').

Embedded image

[Epoxy resin (component C) * 8] A biphenyl type epoxy resin represented by the following structural formula (7 ').

Embedded image

[Epoxy resin (component C) * 9] A tetraphenylolethane type epoxy resin represented by the following structural formula (9 ').

Embedded image

[Curing agent (D component) * 10] A phenol novolak resin represented by the following structural formula (10 ').

Embedded image

[Curing agent (D component) * 11] A phenol aralkyl resin represented by the following structural formula (11 ').

Embedded image

[Curing accelerator] Triphenylphosphine (TPP) represented by the following structural formula (12).

Embedded image

[Conductive Particles] Nickel particles (average particle diameter 3.5 μm, maximum particle diameter 12
μm)

[0083]

Examples 1 to 23 and Comparative Examples 1 to 4 The components prepared above were mixed in the proportions shown in Tables 1 to 5 below, and N, N'-dimethylformamide (DMF) was placed in a glass flask equipped with a stirrer. ) To prepare an adhesive composition solution. Then, this adhesive composition solution was applied on a PET film substrate (thickness: 50 μm) whose surface was silicone-treated, using a doctor blade type coating machine, and heated and dried. Then, the adhesive composition formed on the PET film substrate was peeled off from the substrate to prepare a film adhesive composition having a thickness of 40 μm.

[0084]

[Table 1]

[0085]

[Table 2]

[0086]

[Table 3]

[0087]

[Table 4]

[0088]

[Table 5]

Using the thus obtained film-form adhesive compositions of Examples 1 to 23 and Comparative Examples 1 to 4,
In accordance with the criteria shown below, evaluation of self-supporting film forming property, defective conduction rate and repairability were performed. The results are shown in Tables 6 to 10 below.

[Self-Standing Film Formability] Each film-like adhesive composition was bent at 180 degrees and subjected to a bending resistance test for judging the presence or absence of cracks. ◎: No damage at all, ○: Bending scratches but not cracks, ○: Cracked but not continuous cracks, Δ: Cracked and broken displayed.

[Conduction Failure Rate] An FR-4 glass epoxy wiring board having 64 copper wiring pads (board-side electrodes) having a diameter of 300 μm was prepared. The adhesive composition was bonded together. On the other hand, a silicon chip having a gold bump electrode having a diameter of 100 μm (thickness: 370 μm, size: 10 mm × 10 m)
m) was prepared. Then, after positioning the copper wiring pad (board-side electrode) of the glass epoxy wiring board and the gold bump electrode of the silicon chip so as to face each other, this is adjusted to 20 by using a bonding apparatus having a heating head.
The sample was crimped at 0 ° C. × 5 minutes under a load of 20 kg to prepare a sample for connection reliability test. Then, using a thermal test apparatus,
A temperature cycle test was performed at 50 ° C./10 minutes２５ + 125 ° C./10 minutes, and electrical continuity after 500 cycles had elapsed was checked.
The conduction failure rate (%) for all 64 copper wiring pads (board-side electrodes) of the glass epoxy wiring board was calculated.

[Repairability] After measuring the above-mentioned conduction failure rate, the silicon chip was peeled off from the test sample on a hot plate heated to 200 ° C., and the adhesive remaining at the connection portion of the test sample returned to room temperature. After dropping diethylene glycol dimethyl ether on the cured body and leaving it at room temperature for a predetermined time, a peeling test of the adhesive cured body is performed, and the peelable test sample is again mounted with a silicon chip in the same manner to examine electrical conductivity, The repairability was evaluated. And when the adhesive cured body can be completely peeled off, and the electrical connection is perfect, the adhesive cured body can be peeled off with a small amount remaining,
When the electrical connection is complete, the adhesive cured body can be peeled off with a small amount of the cured adhesive, but when the electrical connection is incomplete, the adhesive cured body can hardly be peeled off. Incomplete cases were indicated as x.

[0093]

[Table 6]

[0094]

[Table 7]

[0095]

[Table 8]

[0096]

[Table 9]

[0097]

[Table 10]

From the results of Tables 6 to 10, the sheet adhesive compositions of the examples are all excellent in self-supporting film forming property, and the electronic component device using the cured product of the sheet adhesive composition is as follows. It can be seen that it has excellent conductivity and repairability. On the other hand, the sheet adhesive composition of the comparative example is inferior in self-supporting film forming property, and the electronic component device using the cured product of the sheet adhesive composition is inferior in repairability.

[0099]

As described above, in the electronic component device of the present invention, the opposing electrodes are electrically connected to each other via the cured product of the specific sheet-like adhesive composition containing the components A to D. It has been formed. Since the polyhydroxy polyether resin (component A) is excellent in solubility in a specific organic solvent, the cured product of the sheet-form adhesive composition containing the polyhydroxy polyether resin (component A) also has the same characteristics. Then, it swells by solvation with a specific organic solvent. As a result, the strength of the cured product is significantly reduced, and the cured product is easily peeled off from the adherend (electrode), so that the cured product is excellent in repairability. Therefore, the electronic component device of the present invention has excellent connection reliability and can repair even if a connection failure occurs due to a positional shift between the electrodes or the like. Therefore, unlike the conventional case, the electronic component device is excellent in recyclability without being discarded. Further, even if a connection failure occurs due to a positional shift between the electrodes after the market distribution of the electronic device incorporating the electronic component device, the repair can be performed for the same reason. Therefore, unlike the past, without disposing of electronic devices,
Excellent recyclability.

[Brief description of the drawings]

FIG. 1 is a schematic view showing a sheet-like adhesive composition used for an electronic component device of the present invention.

FIG. 2 is a schematic view showing an example of the electronic component device of the present invention.

FIG. 3 is a schematic view showing another example of the electronic component device of the present invention.

FIG. 4 is a schematic view showing still another example of the electronic component device of the present invention.

FIG. 5 is a schematic view showing another example of the electronic component device of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Conductive particle 4 Transparent electrode 6 Cured body of sheet adhesive composition 7 Outer lead of tape carrier package

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kazuma Igarashi 1-1-2 Shimohozumi, Ibaraki-shi, Osaka Nitto Denko Corporation F-term (reference) 4J004 AA02 AA05 AA11 AA12 AA13 AA17 AB05 BA02 FA05 5E077 BB28 DD04 JJ30 5F044 KK01 LL09 MM03 QQ01

Claims (26)

[Claims] An electronic component wherein opposing electrodes are electrically connected via a cured product of a sheet-like adhesive composition containing the following components (A) to (D): apparatus. (A) Polyhydroxy polyether resin. (B) Synthetic rubber. (C) Epoxy resin. (D) a curing agent. 2. The electronic component device according to claim 1, wherein one of the opposed electrodes is a connection electrode portion of a printed circuit board, and the other of the opposed electrodes is a connection bump portion of a semiconductor element flip chip. . 3. The electronic component device according to claim 1, wherein one of the opposed electrodes is a connection electrode portion of a printed circuit board, and the other of the opposed electrodes is a lead of a tape carrier package. 4. The electronic component device according to claim 1, wherein one of the opposed electrodes is a connection electrode portion of a liquid crystal circuit board, and the other of the opposed electrodes is a connection bump portion of a semiconductor element flip chip. . 5. The composition according to claim 1, wherein the content of the polyhydroxypolyether resin as the component (A) is 15 to 45% by weight of the whole sheet-shaped adhesive composition (weight of organic solids).
The electronic component device according to any one of claims 1 to 4. 6. The content of the synthetic rubber as the component (B) is 5% of the whole sheet-shaped adhesive composition (weight of organic solid content).
The electronic component device according to any one of claims 1 to 5, wherein the content is from 30 to 30% by weight. 7. The electronic component device according to claim 1, wherein the sheet-shaped adhesive composition contains a curing accelerator. 8. The polyhydroxypolyether resin as the component (A) is a phenoxy resin containing a repeating unit represented by the following general formula (1) as a main component. An electronic component device according to claim 1. Embedded image 9. The polyhydroxypolyether resin as the component (A) is a partially brominated phenoxy resin containing a repeating unit represented by the following general formula (2) as a main component. The electronic component device according to claim 1. Embedded image 10. The synthetic rubber as the component (B) is an acrylonitrile-butadiene rubber having a repeating unit represented by the following general formula (3) as a main component. Electronic component device according to the item. Embedded image 11. The synthetic rubber as the component (B) is a carboxylated acrylonitrile-butadiene rubber containing a repeating unit represented by the following general formula (4) as a main component. The electronic component device according to claim 1. Embedded image 12. The synthetic rubber as the component (B) is an acrylic rubber containing a repeating unit represented by the following general formula (5) as a main component. Electronic component device according to the above. Embedded image 13. The method according to claim 1, wherein the epoxy resin as the component (C) is mainly composed of a novolak type epoxy resin represented by the following general formula (6). Electronic component device according to the above. Embedded image 14. The epoxy resin according to claim 1, wherein the epoxy resin as the component (C) is mainly composed of a biphenyl type epoxy resin represented by the following general formula (7). Electronic component device according to the above. Embedded image 15. The epoxy resin as the component (C), which is mainly composed of a trishydroxyphenylmethane type epoxy resin represented by the following general formula (8). An electronic component device according to claim 1. Embedded image 16. The epoxy resin as the component (C), which comprises a tetraphenylolethane-type epoxy resin represented by the following general formula (9) as a main component. An electronic component device according to claim 1. Embedded image 17. The electronic component device according to claim 1, wherein the curing agent as the component (D) is a phenol novolak resin represented by the following general formula (10). Embedded image 18. The electronic component device according to claim 1, wherein the curing agent as the component (D) is a phenol aralkyl resin represented by the following general formula (11). Embedded image 19. The electronic component device according to claim 1, wherein the sheet-shaped adhesive composition contains conductive particles. 20. The electronic component device according to claim 19, wherein the maximum particle size of the conductive particles is equal to or less than the thickness of the sheet-shaped adhesive composition. 21. The method for repairing an electronic component device according to claim 1, wherein the cured sheet of the sheet-like adhesive composition is swollen with an organic solvent, and then the sheet-like adhesive is cured. A method for repairing an electronic component device, comprising peeling a cured product of the adhesive composition from an electrode. 22. The method according to claim 21, wherein the organic solvent dissolves the polyhydroxy polyether resin as the component (A) at room temperature. 23. The organic solvent according to claim 21, wherein the organic solvent is at least one selected from the group consisting of ketone solvents, glycol diether solvents and nitrogen-containing solvents.
3. The method for repairing an electronic component device according to item 2. 24. The ketone-based solvent may be acetophenone, isophorone, ethyl-n-butyl ketone, diisobutyl ketone, diisopropyl ketone, diethyl ketone,
Cyclohexanone, di-n-propyl ketone, methyl oxide, methyl-n-amyl ketone, methyl isobutyl ketone, methyl ethyl ketone, methyl cyclohexanone, methyl-n-butyl ketone, methyl-n-propyl ketone, methyl-n-hexyl ketone, methyl-n 24. The repair method for an electronic component device according to claim 23, wherein the repair method is at least one selected from the group consisting of heptyl ketone and holone. 25. The glycol diether-based solvent,
Ethylene glycol diethyl ether, ethylene glycol dibutyl ether, ethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether,
24. The repair method of an electronic component device according to claim 23, wherein the method is at least one selected from the group consisting of diethylene glycol diethyl ether, diethylene glycol dibutyl ether, diethylene glycol dimethyl ether, and triethylene glycol dimethyl ether. 26. The nitrogen-containing solvent, wherein N, N′-dimethylformamide, N, N′-dimethylacetamide,
The method for repairing an electronic component device according to claim 23, wherein the method is at least one selected from the group consisting of N-methyl-2-pyrrolidone, N, N'-dimethylsulfoxide and hexamethylphosphortriamide.