JP2015147828A5 - - Google Patents
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- Publication number
- JP2015147828A5 JP2015147828A5 JP2014020236A JP2014020236A JP2015147828A5 JP 2015147828 A5 JP2015147828 A5 JP 2015147828A5 JP 2014020236 A JP2014020236 A JP 2014020236A JP 2014020236 A JP2014020236 A JP 2014020236A JP 2015147828 A5 JP2015147828 A5 JP 2015147828A5
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- sensitive adhesive
- adhesive composition
- acrylic resin
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 22
- 239000000203 mixture Substances 0.000 claims 13
- 239000004925 Acrylic resin Substances 0.000 claims 8
- 229920000178 Acrylic resin Polymers 0.000 claims 8
- 239000011347 resin Substances 0.000 claims 6
- 229920005989 resin Polymers 0.000 claims 6
- 239000000463 material Substances 0.000 claims 4
- 239000003431 cross linking reagent Substances 0.000 claims 3
- -1 epoxy acrylate Chemical compound 0.000 claims 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000004721 Polyphenylene oxide Substances 0.000 claims 1
- 125000005396 acrylic acid ester group Chemical group 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive Effects 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 238000004132 cross linking Methods 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920000728 polyester Polymers 0.000 claims 1
- 229920000570 polyether Polymers 0.000 claims 1
Claims (9)
前記光硬化性樹脂が、エポキシアクリレート、ポリエステルアクリレート、ポリエーテルアクリレート、及びポリエチレンアクリレートからなる群より選択される少なくとも１種であり、
前記光硬化性樹脂が、前記アクリル系樹脂に対して５〜６０質量％の範囲で含まれてなることを特徴とする、粘着剤組成物。 An acrylic resin, a crosslinking agent for crosslinking the acrylic resin, a photocurable resin, Ri name contains a light curing agent for curing the photocurable resin,
The photocurable resin is at least one selected from the group consisting of epoxy acrylate, polyester acrylate, polyether acrylate, and polyethylene acrylate,
The pressure-sensitive adhesive composition , wherein the photocurable resin is contained in a range of 5 to 60% by mass with respect to the acrylic resin .
前記基材の一方の面に、請求項１〜５のいずれか一項に記載の粘着剤組成物を塗布し、
前記粘着剤組成物を加熱して前記アクリル系樹脂を架橋させ、かつ、前記粘着剤組成物に光照射を行い前記光硬化性樹脂を硬化させることによって、粘着剤層を形成する、
ことを含んでなることを特徴とする、方法。 A method for producing a pressure-sensitive adhesive sheet comprising a base material and a pressure-sensitive adhesive layer provided on one surface of the base material,
Applying the pressure-sensitive adhesive composition according to any one of claims 1 to 5 , on one surface of the substrate,
The pressure-sensitive adhesive composition is heated to crosslink the acrylic resin, and the pressure-sensitive adhesive composition is irradiated with light to cure the photocurable resin, thereby forming a pressure-sensitive adhesive layer.
A method comprising the steps of:
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014020236A JP5858347B2 (en) | 2014-02-05 | 2014-02-05 | Adhesive composition and adhesive film using the same |
| KR1020167019773A KR20160118239A (en) | 2014-02-05 | 2015-01-29 | Adhesive-agent composition and adhesive film using the same |
| CN201580004040.6A CN105899633A (en) | 2014-02-05 | 2015-01-29 | Adhesive-agent composition and adhesive film using the same |
| PCT/JP2015/052562 WO2015119042A1 (en) | 2014-02-05 | 2015-01-29 | Adhesive-agent composition and adhesive film using the same |
| TW104103431A TWI681026B (en) | 2014-02-05 | 2015-02-02 | Adhesive composition and adhesive film using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014020236A JP5858347B2 (en) | 2014-02-05 | 2014-02-05 | Adhesive composition and adhesive film using the same |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015247775A Division JP6288064B2 (en) | 2015-12-18 | 2015-12-18 | Adhesive composition and adhesive film using the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015147828A JP2015147828A (en) | 2015-08-20 |
| JP2015147828A5 true JP2015147828A5 (en) | 2015-11-05 |
| JP5858347B2 JP5858347B2 (en) | 2016-02-10 |
Family
ID=53777849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014020236A Active JP5858347B2 (en) | 2014-02-05 | 2014-02-05 | Adhesive composition and adhesive film using the same |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5858347B2 (en) |
| KR (1) | KR20160118239A (en) |
| CN (1) | CN105899633A (en) |
| TW (1) | TWI681026B (en) |
| WO (1) | WO2015119042A1 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10427388B2 (en) | 2015-09-24 | 2019-10-01 | Arakawa Chemical Industries, Ltd. | Emulsion composition and production method thereof, and laminate and production method thereof |
| KR102346869B1 (en) | 2016-03-29 | 2022-01-03 | 니폰 제온 가부시키가이샤 | Multilayer optical film and manufacturing method thereof |
| JP6813988B2 (en) * | 2016-08-12 | 2021-01-13 | ニッタ株式会社 | Temperature-sensitive adhesive tape and temperature-sensitive adhesive sheet |
| KR101924575B1 (en) * | 2017-07-28 | 2019-02-27 | 이명철 | Uv thermosetting resin composition for forming design pattern of a window |
| CN111527594B (en) * | 2017-12-28 | 2023-10-20 | 琳得科株式会社 | Pressure-sensitive adhesive sheet and method for manufacturing semiconductor device |
| JP6995033B2 (en) * | 2018-09-27 | 2022-01-14 | 日東電工株式会社 | Reinforcing film |
| JP7458374B2 (en) * | 2019-03-26 | 2024-03-29 | リンテック株式会社 | release sheet |
| WO2020226169A1 (en) * | 2019-05-08 | 2020-11-12 | 王子ホールディングス株式会社 | Adhesive sheet, method for producing multilayer body, and multilayer body |
| KR102401141B1 (en) * | 2019-11-12 | 2022-05-23 | 삼성에스디아이 주식회사 | Adhesive sheet, composition for adhesive for the same, optical member comprising the same and optical display comprising the same |
| JP2021095526A (en) * | 2019-12-18 | 2021-06-24 | ライオン・スペシャリティ・ケミカルズ株式会社 | Re-releasable adhesive composition and adhesive sheet |
| CN113480945A (en) * | 2021-07-23 | 2021-10-08 | 江苏斯迪克新材料科技股份有限公司 | Acrylate pressure-sensitive adhesive and preparation method thereof |
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| JP4969744B2 (en) * | 2001-09-03 | 2012-07-04 | ソマール株式会社 | Adhesive composition and adhesive sheet |
| JP2005307134A (en) | 2004-04-19 | 2005-11-04 | Hitachi Kasei Polymer Co Ltd | Composite material for temporary fixation of part |
| JP5164339B2 (en) * | 2005-04-28 | 2013-03-21 | 日本合成化学工業株式会社 | Optical laminate with adhesive layer |
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| JPWO2007099851A1 (en) * | 2006-02-28 | 2009-07-16 | リンテック株式会社 | Coating protective sheet |
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| JP5455362B2 (en) * | 2008-12-25 | 2014-03-26 | チェイル インダストリーズ インコーポレイテッド | Adhesive composition and optical member using the same |
| KR20110128808A (en) * | 2009-02-16 | 2011-11-30 | 소켄 케미칼 앤드 엔지니어링 캄파니, 리미티드 | Radiation curable adhesive composition for optical components and adhesive optical component |
| KR20120060782A (en) * | 2009-09-01 | 2012-06-12 | 소켄 케미칼 앤드 엔지니어링 캄파니, 리미티드 | Radiation-curable pressure-sensitive adhesive composition for optical members, and pressure-sensitive adhesion type optical members |
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| JP2012177084A (en) * | 2011-01-31 | 2012-09-13 | Dainippon Printing Co Ltd | Heat-resistant temporary adhesive composition and heat-resistant temporary adhesive tape |
| JP2012193321A (en) * | 2011-03-18 | 2012-10-11 | Furukawa Electric Co Ltd:The | Radiation-curable type adhesive composition, adhesive tape for wafer processing by using the same, and method for discriminating radiation-curable type adhesive composition |
| JP6225025B2 (en) * | 2011-08-03 | 2017-11-01 | リンテック株式会社 | Gas barrier pressure-sensitive adhesive sheet, method for producing the same, electronic member, and optical member |
| CN103890118B (en) * | 2011-10-24 | 2016-11-09 | 王子控股株式会社 | Bonding sheet and using method thereof and duplexer |
| JP2013142132A (en) * | 2012-01-11 | 2013-07-22 | Dainippon Printing Co Ltd | Laminate, transparent optical member using the same and image display device using the same |
| JP6093624B2 (en) * | 2012-05-24 | 2017-03-08 | 日東電工株式会社 | Adhesive layer for optical film, optical film with adhesive layer, and image display device |
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| JP5994445B2 (en) * | 2012-07-11 | 2016-09-21 | Dic株式会社 | UV-curable adhesive resin composition and adhesive |
| TWI586777B (en) * | 2012-10-24 | 2017-06-11 | Toagosei Co | Production method of active energy ray hardening type adhesive preparation and laminate |
-
2014
- 2014-02-05 JP JP2014020236A patent/JP5858347B2/en active Active
-
2015
- 2015-01-29 KR KR1020167019773A patent/KR20160118239A/en not_active Application Discontinuation
- 2015-01-29 WO PCT/JP2015/052562 patent/WO2015119042A1/en active Application Filing
- 2015-01-29 CN CN201580004040.6A patent/CN105899633A/en active Pending
- 2015-02-02 TW TW104103431A patent/TWI681026B/en not_active IP Right Cessation
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