JP2006331980A - Connector cable - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connector cable using a flexible wiring board having an extremely thin thickness, sufficient flexibility, and bending reliability. <P>SOLUTION: This connector cable uses the extremely thin flexible wiring board having a portion formed by laminating a base film and copper foil through the cured product of an adhesive composition as a main body, and also having a connector connecting part at its end part, and the thickness of the laminated part comprising the base film, the cured product of the adhesive composition, and copper foil is not more than 20 μm on one side of the base film. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a connector cable using an ultra-thin flexible wiring board used for wiring of electrical equipment, electronic equipment, etc., and is particularly thin in thickness and excellent in bending during use. The present invention relates to a reliable connector cable.

  Conventionally, flexible wiring boards have high flexibility and are used as wiring for electrical equipment, electronic equipment, and the like. In particular, in recent years, it has been widely used as a wiring for movable members of computer peripheral devices such as HDDs, CD-ROMs, etc., and at the end of the wiring, a connector connecting part that can be inserted into and removed from the connector is provided. Connected with peripheral devices.

  In such a connector cable, the connector connecting portion is reinforced with a reinforcing plate to facilitate insertion / removal of the connector, but the flexible printed wiring board of the main body may be stressed due to bending and may be deteriorated or disconnected. It was.

In order to prevent such deterioration and disconnection, the connector is designed to reduce the stress concentration on the cable body by forming the end of the reinforcing plate to be wavy and increasing the flexibility in the direction of the tip. A cable has been known (for example, see Patent Document 1).
Japanese Patent Laid-Open No. 2003-3299

  However, the flexible printed wiring board used for the connector cable as in Patent Document 1 still has a thickness of the portion where the copper foil is laminated on the base film exceeds 25 μm. Therefore, it has been required to enable high-density arrangement.

  Therefore, an object of the present invention is to provide a connector cable that uses a very thin flexible printed wiring board that is more flexible and flexible than conventional connector cables, is less likely to cause stress concentration.

  As a result of intensive studies, the present inventors have found an ultrathin flexible printed wiring board in which the thickness of the laminated portion in which the copper film is laminated on the base film via an adhesive is 20 μm or less. As a result, the inventors have found that this has excellent bendability and bend reliability and is suitable for connector cables, thereby completing the present invention.

  The connector cable of the present invention is a connector having a flexible wiring board having a conductive layer on one side or both sides in which a copper foil and a cover lay are laminated on a base film via an adhesive, and having a connector connecting portion at an end thereof. The cable is characterized in that the thickness of the laminated portion in which the base film and the copper foil are bonded via an adhesive is 20 μm or less on at least one surface of the base film.

  According to the present invention, in at least one surface of the base film of the flexible printed wiring board portion, the thickness of the laminated portion made of the base film, adhesive and copper foil on one surface is 20 μm or less. Thus, a connector cable excellent in bendability and bend reliability can be provided.

  Moreover, workability is improved by providing the first reinforcing member at the connector connecting portion of the flexible printed wiring board of the present invention, and further, the end of the connector cable is broken by providing the second reinforcing member. Prevention can be performed effectively.

  Hereinafter, the connector cable of the present invention will be described in detail with reference to the drawings. FIG. 1 is a view showing an exemplary embodiment of the connector cable of the present invention.

  The connector cable 1 of the present invention comprises a flexible wiring board 2 having a conductive layer on one side or both sides as shown in FIG. 1, and a connector connecting portion 3 provided at the end thereof as constituent elements. The flexible wiring board has a predetermined thickness. In FIG. 1, the connector connecting portion 3 is inserted and connected to the connector 4.

  The flexible wiring board used in the present invention is formed by laminating a copper foil and a cover lay on a base film via an adhesive, and the copper foil is laminated only on one surface of the base film via an adhesive. It may have a single-sided structure, or may have a double-sided structure in which a copper foil is laminated on both sides of the base film via an adhesive.

  In the case of a single-sided structure, the thickness of the portion in which the copper foil is laminated on the base film via an adhesive may be 20 μm or less. In the case of the double-sided structure, the base is formed on at least one side of the base film. The thickness of the portion where the copper foil is laminated on the film via an adhesive may be 20 μm or less. Furthermore, in the case of a double-sided structure, it is more preferable that the thickness of the laminated portion is 20 μm or less on each surface side. This flexible wiring board can be bent and used as the main body of the connector cable of the present invention when the connector is connected.

  The base film used here preferably has a thickness of 2 μm or more and 13 μm or less, a film physical property of a tensile elastic modulus of 3.0 GPa or more, and a tensile strength of 200 MPa or more.

  If the thickness of the base film is less than 2 μm, reliability for pinholes, strength, etc. cannot be ensured. If the thickness exceeds 13 μm, the thickness of the entire ultra-thin flexible wiring board increases, resulting in a narrow housing space. This is not preferable because it is difficult to bend and mount, and the reliability of bending may be lowered. Moreover, it is not preferable that the tensile strength, which is a film physical property in the above thickness range, is less than 200 MPa because bending reliability in the above thickness range cannot be ensured.

  In the present invention, the base film preferably has a thickness of 4 μm to 6 μm, a tensile modulus of 10 GPa to 20 GPa, and a tensile strength of 350 MPa or more.

  The material of the base film is not particularly limited as long as it has the above tensile strength at least in the above thickness range, for example, polyimide film, polyparaphenylene terephthalamide film, polyether nitrile film, polyether sulfone film, Examples thereof include plastic films such as a polyethylene terephthalate film, a polyethylene naphthalate film, and a polyvinyl chloride film.

  Among these plastic films, a polyparaphenylene terephthalamide film is preferable from the viewpoints of heat resistance, dimensional stability, electrical characteristics, mechanical characteristics, chemical resistance, cost, and the like.

  The copper foil preferably has a thickness of 2 μm or more and 18 μm or less, and a tensile strength that is a physical property of the copper foil is preferably 400 MPa or more.

  If the thickness of the ultra-thin copper foil is less than 2 μm, the reliability against pinholes cannot be ensured. If the thickness exceeds 18 μm, the total thickness of the flexible wiring board increases and it is bent and mounted in a narrow housing space. This is not preferable because it is difficult to do this, and the bending reliability may be lowered.

  Moreover, since the bending reliability in the said thickness range cannot be ensured as the tensile strength in the said thickness range is less than 400 Mpa, it is unpreferable. The thickness and tensile strength of the ultrathin copper foil more preferable in the present invention are 3 μm or more and 6 μm or less and 430 MPa or more.

  As for the adhesive used here, it is preferable that the thickness of the hardened | cured material of the adhesive composition is 5 micrometers or more and less than 20 micrometers. If it is less than 5 μm, the heat resistance such as solder heat resistance of the flexible wiring board may be lowered, and if it is 20 μm or more, the bending resistance is remarkably lowered.

  Moreover, it is more preferable that the cured product of the adhesive composition has a tensile elastic modulus in the thickness range of 200 MPa to 2000 MPa. If the tensile elastic modulus is less than 200 MPa, a sufficient bending life may not be obtained, and if it exceeds 2000 MPa, the flexibility of the flexible wiring board may be reduced due to brittleness, and the bending resistance may be significantly reduced. This is not preferable.

  The adhesive composition for obtaining such a cured product preferably contains at least an elastomer, and more preferably contains 5% by mass or more and 80% by mass or less of the elastomer in the entire adhesive composition.

  When the content of the elastomer in the entire adhesive composition is less than 5% by mass, the tensile elastic modulus of the cured product of the adhesive composition in the above thickness range exceeds 2000 MPa, and the flexibility of the flexible wiring board due to brittleness If the amount exceeds 80% by mass, the tensile elastic modulus in the above thickness range is less than 200 MPa, and a sufficient bending life may not be obtained. This is not preferable.

  The more preferable tensile elastic modulus of the cured product of the adhesive composition is 5 to 10 μm and 500 to 1500 MPa. Moreover, the more preferable content of the elastomer in the whole adhesive composition is 10% by mass or more and 60% by mass or less.

  Examples of elastomers include various synthetic rubbers such as acrylic rubber, acrylonitrile butadiene rubber and carboxy-containing acrylonitrile butadiene rubber, rubber-modified polymer compounds, polymer epoxy resins, phenoxy resins, modified polyimides, modified polyamideimides, etc. They can be used alone or in combination of two or more. Preferably, synthetic rubber, rubber-modified polymer compound, and polymer epoxy resin are used.

  More preferably, the adhesive composition used in the present invention comprises (A) a polyepoxide compound, (B) an epoxy curing agent, (C) an epoxy curing accelerator, (D) an inorganic filler, and (E) an elastomer. It is contained as a component.

  (A) As a polyepoxide compound, a glycidyl ether epoxy resin is preferably used. As such a thing, bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolak type epoxy resin etc. are mention | raise | lifted, for example, These can be used individually or in mixture of 2 or more types.

  The glycidyl ether-based epoxy resin also includes a glycidyl ether-based modified epoxy resin. As the modified epoxy resin, for example, a BT resin (bismaleimide triazine resin), a urethane-modified resin, a phosphorus-modified epoxy resin, or the like can be used.

  (B) The epoxy curing agent can be used without particular limitation as long as it is a compound usually used for curing an epoxy resin. Examples of amine curing systems include dicyandiamide and aromatic diamine. A phenol novolak resin, a cresol novolak resin, a bisphenol A type novolak resin, a triazine-modified phenol novolak resin, and the like can be used, and these can be used alone or in combination.

  The content of the (B) epoxy curing agent is preferably 0.5 to 1.5 in terms of an equivalent ratio to the (A) polyepoxide compound. When the content of the (B) epoxy curing agent is less than 0.5 or more than 1.5 in terms of the equivalent ratio to the (A) polyepoxide compound, the tensile modulus of the cured product of the adhesive composition may not be a predetermined value. This is not preferable.

  (C) The curing accelerator for epoxy may be any one that is usually used as a curing accelerator for epoxy resins, and imidazole compounds such as 2-ethyl-4-methylimidazole and 1-benzyl-2-methylimidazole. , Boron trifluoride amine complex, triphenylphosphine and the like. These curing accelerators can be used alone or in combination of two or more. (C) The epoxy curing accelerator is preferably 0.01 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the (A) polyepoxide compound.

  (D) There is no restriction | limiting in particular as an inorganic filler, A talc, an alumina, aluminum hydroxide, magnesium hydroxide, a fused silica, a synthetic silica etc. are mentioned, These can be used individually or in mixture of 2 or more types. .

  (E) As described above, the elastomer includes various synthetic rubbers such as acrylic rubber, acrylonitrile butadiene rubber and carboxy-containing acrylonitrile butadiene rubber, rubber-modified polymer compounds, polymer epoxy resins, phenoxy resins, modified polyimides, modified polyamides. An imide etc. are mentioned, These can be used individually or in mixture of 2 or more types. Preferably, synthetic rubber, rubber-modified polymer compound, and polymer epoxy resin are used.

  Moreover, it is preferable that content of (E) elastomer is 5 to 80 mass% of the whole adhesive composition. When the content of the elastomer (E) in the adhesive composition is less than 5% by mass, the tensile modulus of the cured product of the adhesive composition exceeds 2000 MPa, and the flexibility of the flexible wiring board decreases due to brittleness. This is not preferable because folding resistance is remarkably lowered. Moreover, when the content of the elastomer in the adhesive composition exceeds 80% by mass, the tensile elastic modulus of the cured product of the adhesive composition is less than 200 MPa, which is not preferable because a sufficient bending life cannot be obtained.

  The adhesive composition used for the ultrathin flexible wiring board of the present invention comprises (A) a polyepoxide compound, (B) an epoxy curing agent, (C) an epoxy curing accelerator, (D) an inorganic filler, and (E ) Elastomer is contained as an essential component, but other fine powder inorganic or organic fillers, pigments, deterioration inhibitors and the like can be added and blended as necessary and within the limits not violating the object of the present invention. .

  The preparation of such an adhesive composition includes the above (A) polyepoxide compound, (B) epoxy curing agent, (C) epoxy curing accelerator, (D) inorganic filler and (E) elastomer, if necessary. Other additives may be easily added by adding them to a solvent such as NMP (N-methylpyrrolidone), methyl ethyl ketone, toluene, etc., and mixing and dissolving them uniformly.

  This ultrathin flexible wiring board can be manufactured, for example, by the following method. In addition, the manufacturing method of this ultra-thin flexible wiring board is not limited to the following.

  First, an adhesive composition as described above is applied and dried on a base film having a predetermined thickness and tensile strength so that the thickness after drying is 5 μm or more and 20 μm or less using a roll coater or the like. And the processing surface of the ultrathin copper foil which has predetermined thickness and tensile strength is piled up on the surface which applied and dried adhesive composition, and both are pasted up, applying pressure with a 60-200 ° C laminating roll. In combination, the adhesive composition is cured by heating at a temperature of 80 to 180 ° C. for 1 to 30 hours. Thereafter, for example, after pattern formation, a coverlay may be attached or a solder resist may be applied, and then terminal surface treatment such as plating may be performed.

  At this time, the coverlay preferably has a total thickness of 30 μm or less including the adhesive layer. If the total thickness exceeds 30 μm, the bending resistance is lowered, which is not preferable. Further, if the adhesive layer is less than 5 μm, it is not preferable because the heat resistance such as solder heat resistance as a flexible printed wiring board is deteriorated or the resin in the circuit portion is insufficiently embedded.

  Next, the connector connecting portion used in the present invention will be described. This is so that the connector can be inserted into and removed from the connector of the electronic device, for example, so that the electronic devices can be connected to each other by the connector cable of the present invention. It is configured.

  The connector connecting portion has a structure in which the end portion of the flexible printed wiring board exposes a copper foil which is a conductive layer, and this is in contact with an electronic device to be conducted. The main body portion of the flexible printed wiring board other than the connector connection portion is protected by a coverlay.

  The connector connecting portion is preferably formed by laminating and adhering a first reinforcing member that assists to facilitate insertion / removal to the connector on the base film or the coverlay, and the connector cable end therebetween. In order to prevent tearing of the portion, it is preferable to laminate and bond the second reinforcing member.

  The first reinforcing member may be in the form of a sheet having a thickness suitable for the connector to be used so that the insertion / removal operation to the connector can be performed smoothly, and the tensile elastic modulus is It is preferably 1.0 GPa or more, and the tensile strength is preferably 100 to 400 MPa.

  Examples of the material for the first reinforcing member include plastic films such as polyimide film, polyparaphenylene terephthalamide, polyether nitrile film, polyether sulfone film, polyethylene terephthalate film, polyethylene naphthalate film, and polyenka vinyl film. Examples thereof include fiber reinforced plastic (FRP) such as glass epoxy.

  The second reinforcing member is not particularly limited as long as it is flexible and can prevent tearing of the end portion of the connector cable. However, the thickness of the film to be used is not particularly limited. It is preferable that the film has a tensile modulus of 1.0 GPa or more and a tensile strength of 50 to 400 MPa.

  Examples of the material of the second reinforcing member include plastic films such as polyimide film, paraphenylene terephthalamide film, polyether nitrile film, polyether sulfone film, polyethylene terephthalate film, polyethylene naphthalate film, and polyvinyl chloride film. Can be mentioned.

  In the first and second reinforcing members, the second reinforcing member preferably has a lower tensile elastic modulus and higher flexibility than the first reinforcing member, and preferably has a lower tensile strength.

  When laminating these first and second reinforcing members, the flexible printed wiring board is arranged depending on the overlapping position of the reinforcing member laminated on one surface and the reinforcing member and / or coverlay laminated on the other surface. It is important because the strength differs, and it is preferable that the reinforcing member laminated on one surface and the reinforcing member and / or coverlay laminated on the other surface are laminated with an overlap of 1.0 mm or more. . Hereinafter, it demonstrates more concretely, referring FIGS.

  FIG. 2 is a partially enlarged cross-sectional view of a connector connecting portion of a connector cable using a flexible printed wiring board having a conductive layer on one side, and FIG. 3 is a perspective view of the connector connecting portion.

  This connector connection part 11 adheres the copper foil 13 to the single side | surface of the base film 12 via an adhesive agent, and also adheres the coverlay 14 via the adhesive agent on it. Moreover, the 2nd reinforcement member 15 and the 1st reinforcement member 16 are similarly laminated | stacked on the other surface of the base film 12 via the adhesive agent.

  At this time, let the overlapping part of the cover lay 14 and the first reinforcing member 16 overlap, and let the overlapping part of only the cover lay 14 and the second reinforcing member 15 overlap 2.

  Here, the overlapping margin 1 may not overlap, and is not particularly limited. However, the length of the overlapping margin is preferably 0 to 10 mm, and the provision of the overlapping margin can prevent the end face from being torn. And more preferable. Moreover, it is especially preferable that the length of the overlap is 1.0 to 6.0 mm. The length of the overlap 2 is not particularly limited as long as the coverlay and only the second reinforcing member 15 are formed with an overlap through the base film, but from the viewpoint of effectively preventing the tearing of the end face. 10 mm is preferable, and 4.0 to 6.0 mm is particularly preferable.

  4 is a partially enlarged cross-sectional view of a connector connecting portion of a connector cable using a flexible printed wiring board having conductive layers on both sides, and FIG. 5 is a perspective view of the connector connecting portion.

  The connector connecting portion 21 is obtained by bonding a copper foil 23 to both surfaces of a base film 22 via an adhesive, and further bonding a cover lay 24 thereon via an adhesive. Further, the first reinforcing member 26 is laminated and bonded on the cover lay 24 at the end of the connector connection portion on one surface, and the copper foil is first exposed on the end portion of the connector connection on the other surface. A terminal portion is formed, and then a reinforcing portion in which the second reinforcing member 25 and the first reinforcing member 26 are laminated and bonded is provided.

  At this time, overlap the overlapping portion of the first reinforcing member 26 on one surface and the first reinforcing member 26 on the other surface 3, and the cover lay 24 on one surface and the first and second on the other surface. Let the overlapping part of the reinforcing members 25 and 26 overlap 4, and let the overlapping part of the coverlay 24 on one side and the second reinforcing member 25 only on the other side overlap 5.

  The length of the overlap margin 3 is not particularly limited as long as it is formed with an overlap, but is preferably 1.0 to 10 mm, and preferably 2.0 to 6.0 mm from the viewpoint of effectively preventing the tearing of the end face. Is particularly preferred.

  Further, the overlap margin 4 may not overlap and is not particularly limited, but the length of the overlap margin is preferably 0 to 10 mm, and the provision of the overlap margin is more preferable in terms of preventing the end face from being torn. Moreover, it is especially preferable that the length of the overlap is 1.0 to 6.0 mm.

  The length of the overlap margin 5 is not particularly limited as long as it is formed so as to overlap with the coverlay 24 on the opposite surface via the base film 22, but is 1.0 to 10 mm from the viewpoint of effectively preventing the tearing of the end surface. It is preferably 4.0 to 6.0 mm.

  Hereinafter, the present invention will be described with reference to examples. In addition, this invention is not limited by these Examples.

Example 1
First, a thermosetting adhesive (trade name: TEY9968M, manufactured by Kyocera Chemical Co., Ltd.), an aramid film having a thickness of 4 μm (trade name: Aramika TM, manufactured by Teijin Advanced Film Co., Ltd .; tensile elastic modulus 14.7 GPa, tensile strength 392 MPa), and dried and coated on one side with a roll coater so that the adhesive layer thickness after drying is 10 μm, and 5 μm copper foil (Furukawa Electric Co., Ltd., trade name: F-DP5) is applied to this adhesive surface. A single-sided flexible copper-clad laminate having a total thickness of 19 μm was obtained by laminating.

  Next, a thermosetting adhesive (Kyocera Chemical Co., Ltd., trade name: TEY9978F) was added to a 4 μm thick aramid film (Teijin Advanced Films Co., Ltd., trade name: Aramika TM; tensile modulus 14.7 GPa, tensile strength. 392 MPa) and dried with a roll coater so that the adhesive layer thickness after drying was 10 μm, to obtain a coverlay with a total thickness of 14 μm.

  As the first reinforcing member, a commercially available reinforcing plate (manufactured by Kyocera Chemical Co., Ltd., trade name: TFA-991 50175; thickness 175 μm, tensile elastic modulus 12 GPa, tensile strength 150 MPa) was used.

  Furthermore, the adhesive thickness after drying a thermosetting adhesive (Kyocera Chemical Co., Ltd., trade name: TEY9978F) on a 12.5 μm thick polyimide film (Toray DuPont, trade name: Kapton) It was applied and dried with a roll coater so as to have a thickness of 10 μm to obtain a second reinforcing member having a layer thickness of 23 μm. The second reinforcing member obtained here had a tensile modulus of 3.4 GPa and a tensile strength of 245 MPa.

  The flexible copper-clad laminate, coverlay, first reinforcing member and second reinforcing member obtained in this way were overlaid as shown in FIG. 1 to produce a connector cable. At this time, the overlapping margin 1 was 5.0 mm and the overlapping margin 2 was 0.0 mm.

(Examples 2 to 5)
Using a single-sided flexible copper-clad laminate with the same configuration as in Example 1, the overlapping margins 1 were bonded to 2.0 mm, 1.0 mm, 0.5 mm, and 0.0 mm, respectively, to produce a connector cable.

(Example 6)
First, a thermosetting adhesive (manufactured by Kyocera Chemical Co., Ltd., trade name: TEY9968M), a 4 μm thick aramid film (manufactured by Teijin Advanced Films Ltd., trade name: Aramika TM, tensile elastic modulus 14.7 GPa, tensile strength 392MPa) and dried on both sides with a roll coater so that the adhesive layer thickness after drying is 10μm, and 5μm copper foil (Furukawa Electric Co., Ltd., trade name: F-DP5) is pasted on this adhesive surface. Thus, a double-sided flexible copper-clad laminate having a layer thickness of 34 μm was obtained.

  The coverlay, the first reinforcing member, and the second reinforcing member were the same as those in Example 1, and the connector cable was manufactured by overlapping as shown in FIG. At this time, the overlap margins 3 and 5 were bonded to 5.0 mm and the overlap margin 4 to 0.0 mm.

(Examples 7 to 10)
Using a double-sided flexible copper-clad laminate with the same configuration as in Example 6, the overlap margin 3 was bonded to 2.0 mm, 1.0 mm, 0.5 mm, and 0.0 mm, respectively, to produce a connector cable.

(Test example)
About the connector cable manufactured in Examples 1-10, edge crack resistance evaluation was performed about each part of the overlap 2, 3, 5. At this time, the evaluation of the end crack resistance evaluation was performed based on JIS C2111, and the results are shown in Table 1.

  In addition, evaluation at this time was performed on the basis of A: 2.0N or more, B: 1.0N or more and less than 2.0N, and C: less than 1.0N.

  Further, in this specification, the tensile modulus of the cured product of the adhesive composition is determined by ASTM D-882 by curing the adhesive composition into a film having the same thickness separately from the production of the flexible copper-clad laminate. The tensile strength of the base film and the ultrathin copper foil was measured based on IPC-TM-650.

It is a figure which shows the usage example of the connector cable of this invention. It is a partial expanded sectional view of the connector connection part provided in the edge part of the connector cable of this invention. It is a perspective view of the connector connection part in FIG. It is a partial expanded sectional view of the connector connection part provided in the edge part of the connector cable of this invention. It is a perspective view of the connector connection part in FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Connector cable, 2 ... Flexible wiring board, 3 ... Connector connection part, 4 ... Connector, 11 ... Connector connection part, 12 ... Base film, 13 ... Copper foil, 14 ... Coverlay, 15, 16 ... Reinforcement member, 21 ... Connector connection part, 22 ... Base film, 23 ... Copper foil, 24 ... Coverlay, 25,26 ... Reinforcing member

Claims (7)

A main body is a flexible wiring board having a conductive layer on one or both sides of a copper foil and a cover lay laminated on the base film via an adhesive, and a connector cable having a connector connecting portion at its end,
A connector cable characterized in that, on at least one surface of the base film, a thickness of a laminated portion in which the base film and the copper foil are bonded via an adhesive is 20 μm or less.   The connector cable according to claim 1, wherein the connector connecting portion includes a first reinforcing member that assists in insertion / removal of the connector connecting portion.   The connector cable according to claim 2, wherein the connector connecting portion includes a second reinforcing member that prevents tearing of the end portion.   4. The connector cable according to claim 2, wherein the reinforcing member on one surface is laminated with the reinforcing member and / or coverlay on the other surface with an overlap of 1.0 mm or more.   5. The connector cable according to claim 4, wherein the second reinforcing member on one surface is laminated with an overlap of 1.0 mm or more with the cover lay on the other surface.   The connector cable according to any one of claims 2 to 5, wherein the first reinforcing member has a tensile elastic modulus of 1.0 GPa or more and a tensile strength of 100 to 400 MPa.   The connector cable according to claim 3, wherein the second reinforcing member has a tensile elastic modulus of 1.0 GPa or more and a tensile strength of 50 to 400 MPa.

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