KR100196242B1 - 하이브리드 반도체 구조 체 및 그 제조 방법 - Google Patents

하이브리드 반도체 구조 체 및 그 제조 방법 Download PDF

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Publication number
KR100196242B1
KR100196242B1 KR1019900004476A KR900004476A KR100196242B1 KR 100196242 B1 KR100196242 B1 KR 100196242B1 KR 1019900004476 A KR1019900004476 A KR 1019900004476A KR 900004476 A KR900004476 A KR 900004476A KR 100196242 B1 KR100196242 B1 KR 100196242B1
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South Korea
Prior art keywords
substrate
pads
adhesive
pad
layer
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Expired - Fee Related
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KR1019900004476A
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English (en)
Korean (ko)
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KR900017160A (ko
Inventor
사이플러 디에테르
Original Assignee
클라우스 포스, 게오르그 뮐러
로베르트 보쉬 게엠베하
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Publication of KR900017160A publication Critical patent/KR900017160A/ko
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Publication of KR100196242B1 publication Critical patent/KR100196242B1/ko
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    • H10W72/00—
    • H10W20/4473—
    • H10W70/09—
    • H10W74/012—
    • H10W74/15—
    • H10W70/60—
    • H10W70/655—
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/073—
    • H10W72/07331—
    • H10W72/20—
    • H10W72/252—
    • H10W72/325—
    • H10W72/351—
    • H10W72/352—
    • H10W72/354—
    • H10W72/856—
    • H10W90/724—

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  • Wire Bonding (AREA)
KR1019900004476A 1989-04-05 1990-04-02 하이브리드 반도체 구조 체 및 그 제조 방법 Expired - Fee Related KR100196242B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE3910910.0 1989-04-05
DE3910910 1989-04-05
DE452.110 1989-12-14
US07/452,110 US5068714A (en) 1989-04-05 1989-12-14 Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made

Publications (2)

Publication Number Publication Date
KR900017160A KR900017160A (ko) 1990-11-15
KR100196242B1 true KR100196242B1 (ko) 1999-06-15

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KR1019900004476A Expired - Fee Related KR100196242B1 (ko) 1989-04-05 1990-04-02 하이브리드 반도체 구조 체 및 그 제조 방법

Country Status (4)

Country Link
US (1) US5068714A (enExample)
JP (1) JP2871800B2 (enExample)
KR (1) KR100196242B1 (enExample)
DE (1) DE4008624A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130091624A (ko) * 2012-02-08 2013-08-19 가부시키가이샤 제이디바이스 반도체 장치 및 그 제조방법
CN103474401A (zh) * 2012-06-06 2013-12-25 欣兴电子股份有限公司 载板结构与芯片封装结构及其制作方法
KR101525653B1 (ko) * 2012-08-22 2015-06-03 국립 중산 과학 기술 연구원 3차원 집적회로 구조체

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130091624A (ko) * 2012-02-08 2013-08-19 가부시키가이샤 제이디바이스 반도체 장치 및 그 제조방법
KR101653856B1 (ko) * 2012-02-08 2016-09-02 가부시키가이샤 제이디바이스 반도체 장치 및 그 제조방법
CN103474401A (zh) * 2012-06-06 2013-12-25 欣兴电子股份有限公司 载板结构与芯片封装结构及其制作方法
CN103474401B (zh) * 2012-06-06 2016-12-14 欣兴电子股份有限公司 载板结构与芯片封装结构及其制作方法
KR101525653B1 (ko) * 2012-08-22 2015-06-03 국립 중산 과학 기술 연구원 3차원 집적회로 구조체

Also Published As

Publication number Publication date
KR900017160A (ko) 1990-11-15
JPH0318040A (ja) 1991-01-25
DE4008624C2 (enExample) 1992-04-16
DE4008624A1 (de) 1990-10-11
JP2871800B2 (ja) 1999-03-17
US5068714A (en) 1991-11-26

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