DE4008624A1 - Verfahren zur herstellung einer hybriden halbleiterstruktur und nach dem verfahren hergestellte halbleiterstruktur - Google Patents
Verfahren zur herstellung einer hybriden halbleiterstruktur und nach dem verfahren hergestellte halbleiterstrukturInfo
- Publication number
- DE4008624A1 DE4008624A1 DE4008624A DE4008624A DE4008624A1 DE 4008624 A1 DE4008624 A1 DE 4008624A1 DE 4008624 A DE4008624 A DE 4008624A DE 4008624 A DE4008624 A DE 4008624A DE 4008624 A1 DE4008624 A1 DE 4008624A1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- pads
- substrates
- connection pads
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H10W72/00—
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- H10W20/4473—
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- H10W70/09—
-
- H10W74/012—
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- H10W74/15—
-
- H10W70/60—
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- H10W70/655—
-
- H10W72/07236—
-
- H10W72/07251—
-
- H10W72/073—
-
- H10W72/07331—
-
- H10W72/20—
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- H10W72/252—
-
- H10W72/325—
-
- H10W72/351—
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- H10W72/352—
-
- H10W72/354—
-
- H10W72/856—
-
- H10W90/724—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4008624A DE4008624A1 (de) | 1989-04-05 | 1990-03-17 | Verfahren zur herstellung einer hybriden halbleiterstruktur und nach dem verfahren hergestellte halbleiterstruktur |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3910910 | 1989-04-05 | ||
| US07/452,110 US5068714A (en) | 1989-04-05 | 1989-12-14 | Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made |
| DE4008624A DE4008624A1 (de) | 1989-04-05 | 1990-03-17 | Verfahren zur herstellung einer hybriden halbleiterstruktur und nach dem verfahren hergestellte halbleiterstruktur |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE4008624A1 true DE4008624A1 (de) | 1990-10-11 |
| DE4008624C2 DE4008624C2 (enExample) | 1992-04-16 |
Family
ID=25879520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE4008624A Granted DE4008624A1 (de) | 1989-04-05 | 1990-03-17 | Verfahren zur herstellung einer hybriden halbleiterstruktur und nach dem verfahren hergestellte halbleiterstruktur |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5068714A (enExample) |
| JP (1) | JP2871800B2 (enExample) |
| KR (1) | KR100196242B1 (enExample) |
| DE (1) | DE4008624A1 (enExample) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1992007378A1 (de) * | 1990-10-12 | 1992-04-30 | Robert Bosch Gmbh | Verfahren zur herstellung einer hybriden halbleiterstruktur und nach dem verfahren hergestellte halbleiterstruktur |
| DE4327560A1 (de) * | 1993-08-17 | 1995-02-23 | Hottinger Messtechnik Baldwin | Verfahren zum Kontaktieren von Leiterbahnanordnungen und Kontaktanordnung |
| WO1996036991A1 (de) * | 1995-05-20 | 1996-11-21 | Robert Bosch Gmbh | Verfahren zum verbinden eines elektrischen anschlusses eines unverpackten ic-bauelements mit einer leiterbahn auf einem substrat |
| WO1997007538A1 (en) * | 1995-08-21 | 1997-02-27 | Mitel Corporation | Method of making electrical connections to integrated circuit |
| WO1999030362A1 (en) * | 1997-12-08 | 1999-06-17 | Minnesota Mining And Manufacturing Company | Method and apparatuses for making z-axis electrical connections |
| DE4339786C5 (de) * | 1993-11-18 | 2004-02-05 | Emi-Tec Elektronische Materialien Gmbh | Verfahren zur Herstellung einer Anordung zur Wärmeableitung |
| US6949270B2 (en) | 1993-06-14 | 2005-09-27 | Emi-Tec Elektronische Materialien Gbmh | Process for producing a casing providing a screen against electromagnetic radiation |
| US6969917B2 (en) | 2000-07-17 | 2005-11-29 | Infineon Technologies Ag | Electronic chip component with an integrated circuit and fabrication method |
Families Citing this family (76)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5611140A (en) * | 1989-12-18 | 1997-03-18 | Epoxy Technology, Inc. | Method of forming electrically conductive polymer interconnects on electrical substrates |
| US5074947A (en) * | 1989-12-18 | 1991-12-24 | Epoxy Technology, Inc. | Flip chip technology using electrically conductive polymers and dielectrics |
| US5866951A (en) * | 1990-10-12 | 1999-02-02 | Robert Bosch Gmbh | Hybrid circuit with an electrically conductive adhesive |
| JP2940269B2 (ja) * | 1990-12-26 | 1999-08-25 | 日本電気株式会社 | 集積回路素子の接続方法 |
| US5265329A (en) * | 1991-06-12 | 1993-11-30 | Amp Incorporated | Fiber-filled elastomeric connector attachment method and product |
| US5225966A (en) * | 1991-07-24 | 1993-07-06 | At&T Bell Laboratories | Conductive adhesive film techniques |
| US5140286A (en) * | 1991-08-02 | 1992-08-18 | Motorola, Inc. | Oscillator with bias and buffer circuits formed in a die mounted with distributed elements on ceramic substrate |
| FR2684804B1 (fr) * | 1991-12-06 | 1994-01-28 | Thomson Csf | Dispositif de montage de circuits integres monolithiques hyperfrequences a tres large bande. |
| JP2512258B2 (ja) * | 1992-03-11 | 1996-07-03 | 松下電器産業株式会社 | シ―ト給送装置 |
| US5266833A (en) * | 1992-03-30 | 1993-11-30 | Capps David F | Integrated circuit bus structure |
| US5434524A (en) * | 1992-09-16 | 1995-07-18 | International Business Machines Corporation | Method of clocking integrated circuit chips |
| US5383787A (en) * | 1993-04-27 | 1995-01-24 | Aptix Corporation | Integrated circuit package with direct access to internal signals |
| US5413489A (en) * | 1993-04-27 | 1995-05-09 | Aptix Corporation | Integrated socket and IC package assembly |
| US5543585A (en) * | 1994-02-02 | 1996-08-06 | International Business Machines Corporation | Direct chip attachment (DCA) with electrically conductive adhesives |
| US5750002A (en) * | 1994-10-04 | 1998-05-12 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Method for fabricating piezoelectric polymer acoustic sensors |
| US6093970A (en) * | 1994-11-22 | 2000-07-25 | Sony Corporation | Semiconductor device and method for manufacturing the same |
| JPH08167630A (ja) * | 1994-12-15 | 1996-06-25 | Hitachi Ltd | チップ接続構造 |
| KR0172000B1 (ko) * | 1995-08-11 | 1999-05-01 | 이대원 | 전도성 잉크를 이용한 반도체 패키지용 기판의 제조방법 |
| US5744383A (en) * | 1995-11-17 | 1998-04-28 | Altera Corporation | Integrated circuit package fabrication method |
| US5842273A (en) * | 1996-01-26 | 1998-12-01 | Hewlett-Packard Company | Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby |
| US5741430A (en) * | 1996-04-25 | 1998-04-21 | Lucent Technologies Inc. | Conductive adhesive bonding means |
| US5956601A (en) * | 1996-04-25 | 1999-09-21 | Kabushiki Kaisha Toshiba | Method of mounting a plurality of semiconductor devices in corresponding supporters |
| US5717246A (en) * | 1996-07-29 | 1998-02-10 | Micron Technology, Inc. | Hybrid frame with lead-lock tape |
| JPH10303352A (ja) * | 1997-04-22 | 1998-11-13 | Toshiba Corp | 半導体装置および半導体装置の製造方法 |
| US6143396A (en) * | 1997-05-01 | 2000-11-07 | Texas Instruments Incorporated | System and method for reinforcing a bond pad |
| US5920037A (en) * | 1997-05-12 | 1999-07-06 | International Business Machines Corporation | Conductive bonding design for metal backed circuits |
| DE69835747T2 (de) * | 1997-06-26 | 2007-09-13 | Hitachi Chemical Co., Ltd. | Substrat zur montage von halbleiterchips |
| US20070102827A1 (en) * | 1997-12-08 | 2007-05-10 | 3M Innovative Properties Company | Solvent Assisted Burnishing of Pre-Underfilled Solder-Bumped Wafers for Flipchip Bonding |
| US6118080A (en) * | 1998-01-13 | 2000-09-12 | Micron Technology, Inc. | Z-axis electrical contact for microelectronic devices |
| US6137063A (en) * | 1998-02-27 | 2000-10-24 | Micron Technology, Inc. | Electrical interconnections |
| US6300231B1 (en) | 1998-05-29 | 2001-10-09 | Tessera Inc. | Method for creating a die shrink insensitive semiconductor package and component therefor |
| US6139661A (en) | 1998-10-20 | 2000-10-31 | International Business Machines Corporation | Two step SMT method using masked cure |
| US6891110B1 (en) | 1999-03-24 | 2005-05-10 | Motorola, Inc. | Circuit chip connector and method of connecting a circuit chip |
| US6290881B1 (en) | 1999-04-14 | 2001-09-18 | Allied Photochemical, Inc. | Ultraviolet curable silver composition and related method |
| US7157507B2 (en) | 1999-04-14 | 2007-01-02 | Allied Photochemical, Inc. | Ultraviolet curable silver composition and related method |
| US6230400B1 (en) * | 1999-09-17 | 2001-05-15 | George Tzanavaras | Method for forming interconnects |
| JP2003529894A (ja) | 1999-10-06 | 2003-10-07 | ユーヴィ スペシャルティーズ インコーポレイテッド | 電圧発光被膜を造る為の紫外線硬化性組成物 |
| US6767577B1 (en) | 1999-10-06 | 2004-07-27 | Allied Photochemical, Inc. | Uv curable compositions for producing electroluminescent coatings |
| US6509389B1 (en) | 1999-11-05 | 2003-01-21 | Uv Specialties, Inc. | UV curable compositions for producing mar resistant coatings and method for depositing same |
| US6500877B1 (en) * | 1999-11-05 | 2002-12-31 | Krohn Industries, Inc. | UV curable paint compositions and method of making and applying same |
| CA2392990A1 (en) * | 1999-12-06 | 2001-06-07 | Roy C. Krohn | Uv curable lubricant compositions |
| US6805917B1 (en) | 1999-12-06 | 2004-10-19 | Roy C. Krohn | UV curable compositions for producing decorative metallic coatings |
| EP1252241A2 (en) | 1999-12-06 | 2002-10-30 | Krohn Industries, Inc. | Uv curable compositions for producing multilayer paint coatings |
| JP2001185845A (ja) * | 1999-12-15 | 2001-07-06 | Internatl Business Mach Corp <Ibm> | 電子部品の製造方法及び該電子部品 |
| MXPA02006735A (es) * | 2000-01-13 | 2002-10-11 | Uv Specialties Inc | Composiciones ferromagneticas que se pueden curar con luz uv. |
| AU2001227855A1 (en) | 2000-01-13 | 2001-07-24 | Uv Specialties, Inc. | Uv curable transparent conductive compositions |
| JP2001217279A (ja) * | 2000-02-01 | 2001-08-10 | Mitsubishi Electric Corp | 高密度実装装置 |
| US6555414B1 (en) * | 2000-02-09 | 2003-04-29 | Interuniversitair Microelektronica Centrum, Vzw | Flip-chip assembly of semiconductor devices using adhesives |
| JP3781610B2 (ja) * | 2000-06-28 | 2006-05-31 | 株式会社東芝 | 半導体装置 |
| WO2002020872A2 (en) | 2000-09-06 | 2002-03-14 | Allied Photochemical, Inc. | Uv curable silver chloride compositions for producing silver coatings |
| US7323499B2 (en) | 2000-09-06 | 2008-01-29 | Allied Photochemical, Inc. | UV curable silver chloride compositions for producing silver coatings |
| CA2332190A1 (en) | 2001-01-25 | 2002-07-25 | Efos Inc. | Addressable semiconductor array light source for localized radiation delivery |
| JP2004530249A (ja) * | 2001-06-08 | 2004-09-30 | シーゲイト テクノロジー エルエルシー | Z軸導電性接着フィルムを使用したヘッド・ジンバル・アセンブリのプリント回路板への取付け |
| US7158350B1 (en) * | 2002-11-05 | 2007-01-02 | Hutchinson Technology Incorporated | Ground interconnects |
| US6946628B2 (en) | 2003-09-09 | 2005-09-20 | Klai Enterprises, Inc. | Heating elements deposited on a substrate and related method |
| US7495179B2 (en) * | 2003-10-06 | 2009-02-24 | Tessera, Inc. | Components with posts and pads |
| US7462936B2 (en) | 2003-10-06 | 2008-12-09 | Tessera, Inc. | Formation of circuitry with modification of feature height |
| US7709968B2 (en) * | 2003-12-30 | 2010-05-04 | Tessera, Inc. | Micro pin grid array with pin motion isolation |
| US8207604B2 (en) * | 2003-12-30 | 2012-06-26 | Tessera, Inc. | Microelectronic package comprising offset conductive posts on compliant layer |
| JP4712633B2 (ja) * | 2005-08-04 | 2011-06-29 | 株式会社リコー | 自動原稿搬送装置 |
| US7928549B2 (en) * | 2006-09-19 | 2011-04-19 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated circuit devices with multi-dimensional pad structures |
| WO2009045371A2 (en) | 2007-09-28 | 2009-04-09 | Tessera, Inc. | Flip chip interconnection with double post |
| US20100044860A1 (en) * | 2008-08-21 | 2010-02-25 | Tessera Interconnect Materials, Inc. | Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layer |
| US8330272B2 (en) | 2010-07-08 | 2012-12-11 | Tessera, Inc. | Microelectronic packages with dual or multiple-etched flip-chip connectors |
| US8580607B2 (en) | 2010-07-27 | 2013-11-12 | Tessera, Inc. | Microelectronic packages with nanoparticle joining |
| US20120068342A1 (en) * | 2010-09-16 | 2012-03-22 | Lee Kevin J | Electrically conductive adhesive for temporary bonding |
| US8853558B2 (en) | 2010-12-10 | 2014-10-07 | Tessera, Inc. | Interconnect structure |
| JP5912616B2 (ja) * | 2012-02-08 | 2016-04-27 | 株式会社ジェイデバイス | 半導体装置及びその製造方法 |
| CN103474401B (zh) * | 2012-06-06 | 2016-12-14 | 欣兴电子股份有限公司 | 载板结构与芯片封装结构及其制作方法 |
| TWI532100B (zh) * | 2012-08-22 | 2016-05-01 | 國家中山科學研究院 | 三維半導體電路結構及其製法 |
| US10886250B2 (en) | 2015-07-10 | 2021-01-05 | Invensas Corporation | Structures and methods for low temperature bonding using nanoparticles |
| US9633971B2 (en) | 2015-07-10 | 2017-04-25 | Invensas Corporation | Structures and methods for low temperature bonding using nanoparticles |
| TWI822659B (zh) | 2016-10-27 | 2023-11-21 | 美商艾德亞半導體科技有限責任公司 | 用於低溫接合的結構和方法 |
| CN110544674A (zh) * | 2018-05-28 | 2019-12-06 | 浙江清华柔性电子技术研究院 | 芯片集成结构 |
| CN111796493B (zh) * | 2020-08-03 | 2024-08-23 | 沈阳芯源微电子设备股份有限公司 | 涂胶显影设备 |
| KR20230126736A (ko) | 2020-12-30 | 2023-08-30 | 아데이아 세미컨덕터 본딩 테크놀로지스 인코포레이티드 | 전도성 특징부를 갖는 구조 및 그 형성방법 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3292240A (en) * | 1963-08-08 | 1966-12-20 | Ibm | Method of fabricating microminiature functional components |
| US3303393A (en) * | 1963-12-27 | 1967-02-07 | Ibm | Terminals for microminiaturized devices and methods of connecting same to circuit panels |
| US3517279A (en) * | 1966-09-17 | 1970-06-23 | Nippon Electric Co | Face-bonded semiconductor device utilizing solder surface tension balling effect |
| DE1614374B2 (de) * | 1966-07-07 | 1971-12-30 | RCA Corp., New York, N.Y. (V.StA.) | Halbleiteranordnung und verfahren zu ihrer herstellung |
| DE2330161A1 (de) * | 1973-06-08 | 1974-12-19 | Minnesota Mining & Mfg | Verbesserte schaltkreise und verfahren zu deren herstellung |
| DE3414961A1 (de) * | 1983-04-21 | 1984-10-25 | Sharp K.K., Osaka | Verfahren zum bonden von lsi-chips auf einen anschlusssockel |
| DE3541427A1 (de) * | 1984-11-27 | 1986-06-05 | E.I. Du Pont De Nemours And Co., Wilmington, Del. | Dichromes verfahren zur herstellung einer leitfaehigen schaltung |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3795047A (en) * | 1972-06-15 | 1974-03-05 | Ibm | Electrical interconnect structuring for laminate assemblies and fabricating methods therefor |
| US4069791A (en) * | 1976-10-01 | 1978-01-24 | E. I. Du Pont De Nemours And Company | Automatic toning device |
| US4164005A (en) * | 1977-09-02 | 1979-08-07 | Sprague Electric Company | Solid electrolyte capacitor, solderable terminations therefor and method for making |
| US4234626A (en) * | 1978-02-01 | 1980-11-18 | E. I. Du Pont De Nemours And Company | Producing printed circuits by conjoining metal powder images |
| US4157407A (en) * | 1978-02-13 | 1979-06-05 | E. I. Du Pont De Nemours And Company | Toning and solvent washout process for making conductive interconnections |
| US4172547A (en) * | 1978-11-02 | 1979-10-30 | Delgrande Donald J | Method for soldering conventionally unsolderable surfaces |
| US4411980A (en) * | 1981-09-21 | 1983-10-25 | E. I. Du Pont De Nemours And Company | Process for the preparation of flexible circuits |
| US4469777A (en) * | 1983-12-01 | 1984-09-04 | E. I. Du Pont De Nemours And Company | Single exposure process for preparing printed circuits |
| US4572764A (en) * | 1984-12-13 | 1986-02-25 | E. I. Du Pont De Nemours And Company | Preparation of photoformed plastic multistrate by via formation first |
| JPS6290938A (ja) * | 1985-10-17 | 1987-04-25 | Matsushita Electric Ind Co Ltd | 半導体装置 |
| US4667401A (en) * | 1985-11-26 | 1987-05-26 | Clements James R | Method of making an electronic device using an uniaxial conductive adhesive |
| US4720740A (en) * | 1985-11-26 | 1988-01-19 | Clements James R | Electronic device including uniaxial conductive adhesive and method of making same |
| US4868637A (en) * | 1985-11-26 | 1989-09-19 | Clements James R | Electronic device including uniaxial conductive adhesive and method of making same |
| JPS63293894A (ja) * | 1987-05-26 | 1988-11-30 | Makuro Eng:Kk | 印刷配線板の製造方法 |
-
1989
- 1989-12-14 US US07/452,110 patent/US5068714A/en not_active Expired - Lifetime
-
1990
- 1990-03-17 DE DE4008624A patent/DE4008624A1/de active Granted
- 1990-04-02 KR KR1019900004476A patent/KR100196242B1/ko not_active Expired - Fee Related
- 1990-04-05 JP JP2089258A patent/JP2871800B2/ja not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3292240A (en) * | 1963-08-08 | 1966-12-20 | Ibm | Method of fabricating microminiature functional components |
| US3303393A (en) * | 1963-12-27 | 1967-02-07 | Ibm | Terminals for microminiaturized devices and methods of connecting same to circuit panels |
| DE1614374B2 (de) * | 1966-07-07 | 1971-12-30 | RCA Corp., New York, N.Y. (V.StA.) | Halbleiteranordnung und verfahren zu ihrer herstellung |
| US3517279A (en) * | 1966-09-17 | 1970-06-23 | Nippon Electric Co | Face-bonded semiconductor device utilizing solder surface tension balling effect |
| DE2330161A1 (de) * | 1973-06-08 | 1974-12-19 | Minnesota Mining & Mfg | Verbesserte schaltkreise und verfahren zu deren herstellung |
| DE3414961A1 (de) * | 1983-04-21 | 1984-10-25 | Sharp K.K., Osaka | Verfahren zum bonden von lsi-chips auf einen anschlusssockel |
| DE3541427A1 (de) * | 1984-11-27 | 1986-06-05 | E.I. Du Pont De Nemours And Co., Wilmington, Del. | Dichromes verfahren zur herstellung einer leitfaehigen schaltung |
Non-Patent Citations (4)
| Title |
|---|
| G.Weil: Digitale Integrierte Schaltungen, VDE-Verlag GmbH, Berlin, 1977, S. 54-56 * |
| Interconnection Structure for Liquid Crystal Display. In: IBM TDB, Bd. 31, Nr. 10, März 1989 * |
| Iwase, N.: Aluminum Nitride Substrates ... In: Solid State Technology, Okt. 1986, S. 135 * |
| Solderless Method for Polyimide Film Chip Carrier Attachment. In: IBM TDB, Bd. 30, Nr. 11, Apr. 1988, S. 35-36 * |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1992007378A1 (de) * | 1990-10-12 | 1992-04-30 | Robert Bosch Gmbh | Verfahren zur herstellung einer hybriden halbleiterstruktur und nach dem verfahren hergestellte halbleiterstruktur |
| US6949270B2 (en) | 1993-06-14 | 2005-09-27 | Emi-Tec Elektronische Materialien Gbmh | Process for producing a casing providing a screen against electromagnetic radiation |
| US7059844B2 (en) | 1993-06-14 | 2006-06-13 | EMI—TEC Elektronische Materialien GmbH | Process for producing a casing providing a screen against electromagnetic radiation |
| DE4327560A1 (de) * | 1993-08-17 | 1995-02-23 | Hottinger Messtechnik Baldwin | Verfahren zum Kontaktieren von Leiterbahnanordnungen und Kontaktanordnung |
| DE4339786C5 (de) * | 1993-11-18 | 2004-02-05 | Emi-Tec Elektronische Materialien Gmbh | Verfahren zur Herstellung einer Anordung zur Wärmeableitung |
| WO1996036991A1 (de) * | 1995-05-20 | 1996-11-21 | Robert Bosch Gmbh | Verfahren zum verbinden eines elektrischen anschlusses eines unverpackten ic-bauelements mit einer leiterbahn auf einem substrat |
| WO1997007538A1 (en) * | 1995-08-21 | 1997-02-27 | Mitel Corporation | Method of making electrical connections to integrated circuit |
| WO1999030362A1 (en) * | 1997-12-08 | 1999-06-17 | Minnesota Mining And Manufacturing Company | Method and apparatuses for making z-axis electrical connections |
| US6969917B2 (en) | 2000-07-17 | 2005-11-29 | Infineon Technologies Ag | Electronic chip component with an integrated circuit and fabrication method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR900017160A (ko) | 1990-11-15 |
| KR100196242B1 (ko) | 1999-06-15 |
| JPH0318040A (ja) | 1991-01-25 |
| DE4008624C2 (enExample) | 1992-04-16 |
| JP2871800B2 (ja) | 1999-03-17 |
| US5068714A (en) | 1991-11-26 |
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