JPWO2024029249A5 - - Google Patents

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Publication number
JPWO2024029249A5
JPWO2024029249A5 JP2024538866A JP2024538866A JPWO2024029249A5 JP WO2024029249 A5 JPWO2024029249 A5 JP WO2024029249A5 JP 2024538866 A JP2024538866 A JP 2024538866A JP 2024538866 A JP2024538866 A JP 2024538866A JP WO2024029249 A5 JPWO2024029249 A5 JP WO2024029249A5
Authority
JP
Japan
Prior art keywords
outer portion
base end
semiconductor device
resin
terminal lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024538866A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024029249A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/024230 external-priority patent/WO2024029249A1/ja
Publication of JPWO2024029249A1 publication Critical patent/JPWO2024029249A1/ja
Publication of JPWO2024029249A5 publication Critical patent/JPWO2024029249A5/ja
Pending legal-status Critical Current

Links

JP2024538866A 2022-08-01 2023-06-29 Pending JPWO2024029249A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022122951 2022-08-01
PCT/JP2023/024230 WO2024029249A1 (ja) 2022-08-01 2023-06-29 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024029249A1 JPWO2024029249A1 (https=) 2024-02-08
JPWO2024029249A5 true JPWO2024029249A5 (https=) 2025-04-16

Family

ID=89849062

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024538866A Pending JPWO2024029249A1 (https=) 2022-08-01 2023-06-29

Country Status (2)

Country Link
JP (1) JPWO2024029249A1 (https=)
WO (1) WO2024029249A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4471967B2 (ja) * 2006-12-28 2010-06-02 株式会社ルネサステクノロジ 双方向スイッチモジュール
US20150268261A1 (en) * 2014-03-18 2015-09-24 Trw Automotive U.S. Llc Circuit mounting apparatus and method using a segmented lead-frame
DE112021002909T5 (de) * 2020-06-23 2023-03-09 Rohm Co., Ltd. Halbleiterbauteil
JP7758673B2 (ja) * 2020-07-28 2025-10-22 ローム株式会社 半導体装置
JP2022025587A (ja) * 2020-07-29 2022-02-10 ローム株式会社 半導体装置

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