JPWO2024029249A1 - - Google Patents
Info
- Publication number
- JPWO2024029249A1 JPWO2024029249A1 JP2024538866A JP2024538866A JPWO2024029249A1 JP WO2024029249 A1 JPWO2024029249 A1 JP WO2024029249A1 JP 2024538866 A JP2024538866 A JP 2024538866A JP 2024538866 A JP2024538866 A JP 2024538866A JP WO2024029249 A1 JPWO2024029249 A1 JP WO2024029249A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022122951 | 2022-08-01 | ||
| PCT/JP2023/024230 WO2024029249A1 (ja) | 2022-08-01 | 2023-06-29 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024029249A1 true JPWO2024029249A1 (https=) | 2024-02-08 |
| JPWO2024029249A5 JPWO2024029249A5 (https=) | 2025-04-16 |
Family
ID=89849062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024538866A Pending JPWO2024029249A1 (https=) | 2022-08-01 | 2023-06-29 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024029249A1 (https=) |
| WO (1) | WO2024029249A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4471967B2 (ja) * | 2006-12-28 | 2010-06-02 | 株式会社ルネサステクノロジ | 双方向スイッチモジュール |
| US20150268261A1 (en) * | 2014-03-18 | 2015-09-24 | Trw Automotive U.S. Llc | Circuit mounting apparatus and method using a segmented lead-frame |
| DE112021002909T5 (de) * | 2020-06-23 | 2023-03-09 | Rohm Co., Ltd. | Halbleiterbauteil |
| JP7758673B2 (ja) * | 2020-07-28 | 2025-10-22 | ローム株式会社 | 半導体装置 |
| JP2022025587A (ja) * | 2020-07-29 | 2022-02-10 | ローム株式会社 | 半導体装置 |
-
2023
- 2023-06-29 JP JP2024538866A patent/JPWO2024029249A1/ja active Pending
- 2023-06-29 WO PCT/JP2023/024230 patent/WO2024029249A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024029249A1 (ja) | 2024-02-08 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241226 |