JPH0379442U - - Google Patents
Info
- Publication number
- JPH0379442U JPH0379442U JP1990123162U JP12316290U JPH0379442U JP H0379442 U JPH0379442 U JP H0379442U JP 1990123162 U JP1990123162 U JP 1990123162U JP 12316290 U JP12316290 U JP 12316290U JP H0379442 U JPH0379442 U JP H0379442U
- Authority
- JP
- Japan
- Prior art keywords
- external
- lead
- insulator
- external lead
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990123162U JPH0349400Y2 (https=) | 1990-11-22 | 1990-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990123162U JPH0349400Y2 (https=) | 1990-11-22 | 1990-11-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0379442U true JPH0379442U (https=) | 1991-08-13 |
| JPH0349400Y2 JPH0349400Y2 (https=) | 1991-10-22 |
Family
ID=31671152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990123162U Expired JPH0349400Y2 (https=) | 1990-11-22 | 1990-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0349400Y2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2899754A3 (en) * | 2014-01-27 | 2015-10-07 | Samsung Electronics Co., Ltd | Semiconductor device |
-
1990
- 1990-11-22 JP JP1990123162U patent/JPH0349400Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2899754A3 (en) * | 2014-01-27 | 2015-10-07 | Samsung Electronics Co., Ltd | Semiconductor device |
| US9711435B2 (en) | 2014-01-27 | 2017-07-18 | Samsung Electronics Co., Ltd. | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0349400Y2 (https=) | 1991-10-22 |