JPH0379443U - - Google Patents

Info

Publication number
JPH0379443U
JPH0379443U JP1990123163U JP12316390U JPH0379443U JP H0379443 U JPH0379443 U JP H0379443U JP 1990123163 U JP1990123163 U JP 1990123163U JP 12316390 U JP12316390 U JP 12316390U JP H0379443 U JPH0379443 U JP H0379443U
Authority
JP
Japan
Prior art keywords
insulator
lead
external
heat sink
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990123163U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0349399Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990123163U priority Critical patent/JPH0349399Y2/ja
Publication of JPH0379443U publication Critical patent/JPH0379443U/ja
Application granted granted Critical
Publication of JPH0349399Y2 publication Critical patent/JPH0349399Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/541Dispositions of bond wires
    • H10W72/5449Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1990123163U 1990-11-22 1990-11-22 Expired JPH0349399Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990123163U JPH0349399Y2 (https=) 1990-11-22 1990-11-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990123163U JPH0349399Y2 (https=) 1990-11-22 1990-11-22

Publications (2)

Publication Number Publication Date
JPH0379443U true JPH0379443U (https=) 1991-08-13
JPH0349399Y2 JPH0349399Y2 (https=) 1991-10-22

Family

ID=31671154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990123163U Expired JPH0349399Y2 (https=) 1990-11-22 1990-11-22

Country Status (1)

Country Link
JP (1) JPH0349399Y2 (https=)

Also Published As

Publication number Publication date
JPH0349399Y2 (https=) 1991-10-22

Similar Documents

Publication Publication Date Title
JPH0379443U (https=)
JPS6371548U (https=)
JPS59112954U (ja) 絶縁物封止半導体装置
JPS59117160U (ja) 絶縁物封止半導体装置
JPS6371547U (https=)
JPH03122543U (https=)
JPH0379442U (https=)
JPH03106755U (https=)
JPS63182538U (https=)
JPH0233442U (https=)
JPH02116740U (https=)
JPS61192447U (https=)
JPH02138435U (https=)
JPH0330436U (https=)
JPH0436251U (https=)
JPS63152249U (https=)
JPH0298649U (https=)
JPH0451145U (https=)
JPH038445U (https=)
JPH0262734U (https=)
JPS6416636U (https=)
JPH0338647U (https=)
JPS63142849U (https=)
JPS63201346U (https=)
JPS63128745U (https=)