JPH0379443U - - Google Patents

Info

Publication number
JPH0379443U
JPH0379443U JP12316390U JP12316390U JPH0379443U JP H0379443 U JPH0379443 U JP H0379443U JP 12316390 U JP12316390 U JP 12316390U JP 12316390 U JP12316390 U JP 12316390U JP H0379443 U JPH0379443 U JP H0379443U
Authority
JP
Japan
Prior art keywords
insulator
lead
external
heat sink
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12316390U
Other languages
English (en)
Other versions
JPH0349399Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12316390U priority Critical patent/JPH0349399Y2/ja
Publication of JPH0379443U publication Critical patent/JPH0379443U/ja
Application granted granted Critical
Publication of JPH0349399Y2 publication Critical patent/JPH0349399Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Description

【図面の簡単な説明】
第１図〜第５図は従来の絶縁物封止半導体装置
を示す。第６図〜第１１図は本考案に係る絶縁物
封止半導体装置を示す。なお、第１図、第２図、
第６図および第７図の破線は、絶縁物の外形を示
している。 １……パワートランジスタチツプ（半導体素子
）、２……放熱板、２ａ……放熱板の肉厚部、２
ｂ……放熱板の肉薄部、３，４，５……外部リー
ド、３ａ，４ａ，５ａ……外部リードの幅広部、
３ｂ，４ｂ，５ｂ……外部リードの幅狭部、４ｃ
，５ｃ……外部リードの内部リード線用端子部、
６，７……内部リード線、８……樹脂体（絶縁物
）、９……放熱板の孔９、８ａ……孔９の周囲に
形成された樹脂体、１０……取付け孔、１１，１
２……放熱板連結部の残存部、１３……放熱板の
凹部、１４……リード連結部の残存部、１５，１
６……樹脂体の段差部、１７……樹脂体の凹部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 放熱板と、該放熱板の一方の端部側に配設され
    た第１、第２および第３の外部リードと、前記放
    熱板の上面に載置された半導体素子と、該半導体
    素子を被覆する絶縁物とを具備し、前記放熱板の
    前記一方の端部側に対向する他方の端部側は前記
    放熱板の前記半導体素子が載置された部分の下面
    よりも上方に偏位した位置において前記絶縁物か
    ら露出する露出部を有し、前記第１、第２および
    第３の外部リードは前記放熱板の前記半導体素子
    が載置された部分の下面よりも上方に偏位した位
    置において前記絶縁物から導出された導出部を有
    し、前記放熱板および前記第１、第２および第３
    の外部リードは前記露出部および導出部以外では
    前記絶縁物から露出しておらず、前記第１、第２
    および第３の外部リードは前記第１の外部リード
    を中心にして並列配置されており且つ前記第１、
    第２および第３の外部リードの前記導出部は前記
    絶縁物からの導出側と前記絶縁物から離間した先
    端側にそれぞれ幅広部と幅狭部とを有し、前記第
    １の外部リードの幅広部は前記第１の外部リード
    の幅狭部を前記絶縁物まで延長した部分の両側に
    張出しており、前記第２および第３の外部リード
    の幅広部はそれぞれ電気第２および第３の外部リ
    ードの幅狭部を前記絶縁物まで延長した部分の前
    記第１の外部リードに対面する側と反対側にのみ
    張出しており、前記第２および第３の外部リード
    の前記第１の外部リードに対面する側は前記絶縁
    物から前記先端側まで略直線状に延びた形状であ
    ることを特徴とする絶縁物封止半導体装置。
JP12316390U 1990-11-22 1990-11-22 Expired JPH0349399Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12316390U JPH0349399Y2 (ja) 1990-11-22 1990-11-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12316390U JPH0349399Y2 (ja) 1990-11-22 1990-11-22

Publications (2)

Publication Number Publication Date
JPH0379443U true JPH0379443U (ja) 1991-08-13
JPH0349399Y2 JPH0349399Y2 (ja) 1991-10-22

Family

ID=31671154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12316390U Expired JPH0349399Y2 (ja) 1990-11-22 1990-11-22

Country Status (1)

Country Link
JP (1) JPH0349399Y2 (ja)

Also Published As

Publication number Publication date
JPH0349399Y2 (ja) 1991-10-22

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